JP2000186248A - Resin composition for flexible circuit over-coating - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an over-coating agent not liable to deterioration such as hardening of coating film and increase in the quantity of warpage in case it is left under high temp. for a long time. SOLUTION: This resin compsn. for flexible circuit over-coating employs a resin wherein double bonds in polybutadiene frame work are hydrogenated. Specifically, it contains a hydrogenated polybutadiene polyol having 2-10 hydroxide groups in a molecule and a number average mol.wt. of 1,000-8,000 (A) and a hydrogenated polybutadiene polyblockisocyanate having 2-10 blockisocyanate groups in a molecule and a number average mol.wt. of 1,000-8,000 (Xa), and the quantity of polyblockisocyanate is 0.8-3.5 times equivalent to the total equivalent of the hydroxide groups of the polyol.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention is excellent in flexibility and low shrinkage during curing, and hardly causes deterioration such as hardening of a coating film and increase in warpage even when left at high temperatures for a long time. The present invention relates to a resin composition for a flexible circuit overcoat, a film carrier coated with an overcoat agent containing the composition as a main component, and a carrier device using the film carrier.

[0002]

2. Description of the Related Art Conventionally, as a surface protective film of a flexible wiring circuit board, a mold called a coverlay film, which is made of a polyimide film in accordance with a pattern, is punched out, and then a bonding method using an adhesive is used. It has been formed by a method of applying and curing an overcoating agent mainly composed of an ultraviolet curable resin or a thermosetting resin provided with a screen printing method. However, the coverlay film method is not preferable in terms of workability, and the method using an overcoat agent is still insufficient in terms of warpage during curing and flexibility, and is flexible enough to satisfy required performance. A method for forming a surface protective film on a printed circuit board has not been found.

On the other hand, in recent years, a TAB method using a film carrier suitable for high-density and thinning as a package of a liquid crystal driving IC has been increasingly used. The basic structure of the film carrier mainly consists of a heat-resistant insulating film base material such as polyimide and a conductor such as copper foil bonded through an adhesive mainly composed of epoxy resin. The wiring pattern is formed by etching. In addition, film carrier devices are manufactured by connecting an IC to this tape carrier and sealing it with a sealing resin. However, before the IC connection, a pattern short circuit, corrosion, migration, generation of whiskers, or the like occurs during the process. In order to prevent a decrease in reliability, it is common to form a surface protective film on this film carrier with an overcoating agent. Epoxy-based or polyimide-based overcoating agents are used for film carriers. The former is warpage and flexibility of the coating when cured, and the latter is adhesion to IC sealing resin. At present, there is no material that is satisfactory in terms of workability and work characteristics, and a plurality of overcoat agents are used in combination to compensate for each other (Japanese Patent Laid-Open No. 6-283575).

On the other hand, the inventors of the present invention have conducted intensive studies to solve the above problems, and as a result, in Japanese Patent Application Nos. 9-219610 and 9-219611, the number average molecular weight was 1,000. ~ 8,000 and 2 per molecule
A polyol having 10 to 10 hydroxyl groups, or a polyol having a number average molecular weight of 200 to 600 and having 2 to 10 hydroxyl groups per molecule, and a number average molecular weight of 13,000 to
At 30,000, by mixing a polyol having 2 to 10 hydroxyl groups per molecule and polyblock isocyanate at a predetermined ratio, flexibility, low shrinkage during curing,
It has been found that a resin composition having a performance that can sufficiently satisfy various properties such as adhesion, electrical insulation, chemical resistance, and heat resistance can be obtained, and in particular, a polyol or polyblock isocyanate having a polybutadiene skeleton is used. Is more effective in terms of flexibility and low shrinkage during curing.

However, when a resin having a polybutadiene skeleton is used, it is easily oxidized. For example, if the resin is left in a high-temperature environment for a long time, deterioration such as hardening of the coating film and increase in the amount of warpage tends to occur. In particular, printed circuit boards such as flexible boards are required to pass through an environment of 150 ° C. or more for several times or a long time in the manufacturing process. It is feared that troubles such as increase will occur.

[0006]

SUMMARY OF THE INVENTION It is an object of the present invention to provide an overcoat agent which hardly undergoes deterioration such as hardening of a coating film and an increase in warpage even when left at a high temperature for a long time.

[0007]

As a result of investigations for solving the above problems, it has been found that the use of a hydrogenated resin in a double bond portion in a polybutadiene skeleton results in hardening of a coating film and an increase in the amount of warpage. The present inventors have found that the occurrence of troubles is prevented, and completed the present invention based on such knowledge.

That is, the present invention relates to (A) a hydrogenated polybutadiene polyol having a number average molecular weight of 1,000 to 8,000 and having 2 to 10 hydroxyl groups per molecule, and (X) a polybutadiene polyblock isocyanate. A resin composition for a flexible circuit overcoat, or (A) having a number average molecular weight of 1,000 to 8,000
Hydrogenated polybutadiene polyol having 2 to 10 hydroxyl groups per molecule, and (Xa) hydrogenated having a number average molecular weight of 1,000 to 8,000 and having 2 to 10 blocked isocyanate groups per molecule A resin composition for a flexible circuit overcoat, comprising a polybutadiene polyblock isocyanate, wherein the amount of the polyblock isocyanate is 0.8 to 3.5 equivalents to the total number of hydroxyl equivalents of the polyol, or the number of (A) The average molecular weight is 1,000 to 8,000, and 2 to 1 per molecule.
Hydrogenated polybutadiene polyol having 0 hydroxyl groups,
(Xa) hydrogenated polybutadiene polyblock isocyanate having a number average molecular weight of 1,000 to 8,000 and having 2 to 10 blocked isocyanate groups per molecule, and (B) a number average molecular weight of 13,000 to 30, 000
A hydrogenated polybutadiene polyol having 2 to 10 hydroxyl groups per molecule, wherein the weight ratio of the two polyols is (A) :( B) = 40: 6 in solid content.
0 to 90:10, and the amount of the polyblock isocyanate is 0.8 to the total number of hydroxyl equivalents of the polyol.
A resin composition for a flexible circuit overcoat having a number of equivalents of 3.5 to 3.5 or (C) a number average molecular weight of 20
0 to 600, a polyol having 2 to 10 hydroxyl groups per molecule, (Xa) having a number average molecular weight of 1,000 to 8,
Hydrogenated polybutadiene polyblock isocyanate having from 2 to 10 blocked isocyanate groups per molecule, and (B) a number average molecular weight of 13,000
水 30,000 containing hydrogenated polybutadiene polyols having 2 to 10 hydroxyl groups per molecule, of which the weight ratio of the two polyols in solids is (C):
(B) = Resin composition for a flexible circuit overcoat in which the polyblock isocyanate is in the range of 20:80 to 50:50 and the amount of polyblock isocyanate is 0.8 to 3.5 equivalents to the total hydroxyl equivalents of the polyol. About things.

[0009]

DETAILED DESCRIPTION OF THE INVENTION The number average molecular weight is from 1,000 to 8,
The hydrogenated polybutadiene polyol (A) having 2 to 10 hydroxyl groups per molecule has a high cross-linking density such as heat resistance and chemical resistance, as well as flexibility and low shrinkage. It is important to provide both of the properties obtained at a low crosslink density such as in a well-balanced manner. When the molecular weight is smaller than this range, or when the number of hydroxyl groups per molecule is larger than this range, the crosslink density at the time of curing increases, resulting in a harder cured product and the flexibility of the cured coating film. Sufficient physical properties cannot be obtained with regard to low shrinkage during curing and curing. On the other hand, when the molecular weight is larger than this range, or when the number of hydroxyl groups per molecule is smaller than this range, the crosslinking density at the time of curing is low,
While a more flexible cured product is obtained, the heat resistance and chemical resistance of the cured coating film are significantly reduced.

The number average molecular weight is 1,000 to 8,000
Similarly, hydrogenated polybutadiene polyblock isocyanate (Xa) having 2 to 10 blocked isocyanate groups per molecule also has properties such as heat resistance and chemical resistance, which can be obtained at a high crosslinking density, and flexibility. It is important to impart both properties obtained at a low crosslink density such as low shrinkage in a well-balanced manner. When the molecular weight is smaller than this range, or when the number of hydroxyl groups per molecule is larger than this range, the crosslink density at the time of curing increases, resulting in a harder cured product and the flexibility of the cured coating film. Sufficient physical properties cannot be obtained with regard to low shrinkage during curing and curing. On the other hand, when the molecular weight is larger than this range, or when the number of blocked isocyanate groups per molecule is smaller than this range, the crosslink density at the time of curing is low, so that a more flexible cured product is obtained. In addition, the heat resistance and chemical resistance of the cured coating film are significantly reduced.

The number average molecular weight is 13,000 to 30,000
At 0, hydrogenated polybutadiene polyol (B) having 2 to 10 hydroxyl groups per molecule is important for further reducing the crosslink density and increasing properties such as improvement in flexibility and low shrinkage during curing. It is.

The polyol (C) having a number average molecular weight of 200 to 600 and having 2 to 10 hydroxyl groups per molecule serves to increase the crosslink density and improve heat resistance and chemical resistance.

When the polyol (A) and the blocked isocyanate (Xa) are cured, chemical resistance and heat resistance,
The balance between flexibility and low shrinkage during curing is relatively good, but in order to further reduce the flexibility of the coating and the warpage during curing, a polyol (B) is added and the crosslink density is reduced. Lower. In this case, due to the balance of the overall characteristics,
The weight ratio of the two polyols in solids is (A):
(B) = 40: 60-90: 10, and if the ratio of the polyol (B) is higher than this ratio, the crosslink density is too low, so that the heat resistance and chemical resistance of the coating film, etc. Characteristic is remarkably deteriorated.

On the other hand, when the polyol (C) is cured with the blocked isocyanate (Xa), the flexibility of the coating film and the warpage during curing are insufficient, and a combination with the polyol (B) is required. In this case, it is preferable to use a mixture of the two polyols in a solid content in the range of (C) :( B) = 20: 80 to 50:50 in terms of the solid content, from the balance of the entire properties. When the polyol (C) is small, the crosslinking density is too low.
When the properties such as heat resistance and chemical resistance of the coating film are remarkably reduced, and when the content of the polyol (C) is large, the crosslink density becomes too high, so that the flexibility of the coating film and the low shrinkage during curing are reduced.

Regarding the polyols (A) and (B) and the polyblock isocyanate (Xa), the double bond in the butadiene skeleton is hydrogenated because the reaction of the double bond at a high temperature hardens the coating film, This is to prevent an increase in the amount of warpage or the like.

The hydrogenated polybutadiene polyol (A) has a number average molecular weight of 1,000 to 8,000, has 2 to 10 hydroxyl groups per molecule, and hydrogenates a double bond in a butadiene skeleton. For example, "GI-1000", "GI-1000"
Existing products such as "3000" (all manufactured by Nippon Soda Co., Ltd.), or "G1000", "GQ1000"
(All manufactured by Nippon Soda Co., Ltd.), "R-45EPI"
(Made by Idemitsu Petrochemical Co., Ltd.) and the like.

The hydrogenated polybutadiene polyblock isocyanate (Xa) has a number average molecular weight of 1,000 to
8,000, any number of blocked isocyanate groups having 2 to 10 per molecule and hydrogenation of a double bond in a butadiene skeleton may be used.
For example, a polybutadiene polyisocyanate such as “TP1002” (manufactured by Nippon Soda Co., Ltd.) or “HTP-9” (manufactured by Idemitsu Petrochemical Co., Ltd.) blocked with a blocking agent and further hydrogenated, or “GI -1000 ",
A hydroxyl-terminated hydrogenated polybutadiene such as "GI-3000" (all manufactured by Nippon Soda Co., Ltd.) is reacted with a diisocyanate in an amount equivalent to twice the number of hydroxyl groups to form a terminal isocyanate, which is further blocked with a blocking agent. And so on. The blocking agent is preferably a compound having only one active hydrogen capable of reacting with an isocyanate group in one molecule, which dissociates again at a temperature of 170 ° C. or less even after reacting with the isocyanate group. Examples thereof include diethyl acid, ethyl acetoacetate, acetoxime, methyl ethyl ketoxime, phenol, and cresol.

The hydrogenated polybutadiene polyol (B) has a number average molecular weight of 13,000 to 30,000, has 2 to 10 hydroxyl groups per molecule, and has a double bond in the butadiene skeleton hydrogenated. Any one may be used, for example, “GI-1000”, “GI
A hydrogenated polybutadiene polyol having a molecular weight of about 1,000 to 3,000 such as "-3000" (all manufactured by Nippon Soda Co., Ltd.) is reacted with diisocyanate to have a molecular weight of about 13,000 to 30,000. Or a polybutadiene polyol such as "G1000" (manufactured by Nippon Soda Co., Ltd.) or "R-45EPI" (manufactured by Idemitsu Petrochemical Co., Ltd.) reacted with diisocyanate to obtain a molecular weight. From 13,000 to 3
Hydrogenated ones after high molecular weight to about 000 are included.

The polyol (C) has a number average molecular weight of 200 to 600 and a number of hydroxyl groups of 2 to 10 per molecule.
The resin may have any structure, for example, EO-modified pentaerythritol “P
E555 "(manufactured by Toho Chemical Co., Ltd.), EO-modified trimethylolpropane" TP880 "(manufactured by Toho Chemical Co., Ltd.), polycaprolactone triol" Placcel 30 "
3 ”and“ 305 ”(both from Daicel Chemical Industries, Ltd.)
And the like).

Further, in the present invention, in addition to the above essential elements, a curing accelerator for polyol and isocyanate, a filler, an additive, a thixotropic agent, a solvent and the like may be added as necessary. In particular, it is preferable to add rubber fine particles in order to further improve the bending resistance, and also to improve the adhesion with the underlying copper circuit, the base material such as polyimide and polyester film, and the adhesive layer. Therefore, it is preferable to add polyamide fine particles.

As the rubber fine particles, those which are obtained by subjecting a resin exhibiting rubber elasticity such as acrylonitrile butadiene rubber, butadiene rubber, acrylic rubber or the like to chemical cross-linking treatment so as to be insoluble and infusible in an organic solvent. Anything may be used, for example, "XER-91"
(Manufactured by Nippon Synthetic Rubber Co., Ltd.), “Staphyroid AC3
355 "," AC3832 "," IM101 "(or more,
Takeda Pharmaceutical Co., Ltd.), “PARALOID EXL265
5 "and" EXL2602 "(all manufactured by Kureha Chemical Industry Co., Ltd.).

As the polyamide fine particles, any fine particles of a resin having an amide bond, such as an aliphatic polyamide such as nylon or an aromatic polyamide such as Kevlar, and polyamide imide having a size of 50 μm or less can be used. For example, “VESTOSINT 2070” (manufactured by Daicel Huls Co., Ltd.) and “SP500” (manufactured by Toray Industries, Inc.) can be mentioned.

[0023]

EXAMPLES Hereinafter, the present invention will be described in more detail with reference to production examples of polyols and blocked isocyanates used in the present invention and examples of the present invention along with comparative examples.

<Production of Resin E> Ethyl diglycol acetate (manufactured by Daicel Chemical Industries, Ltd.)
5 g, trimethylolpropane (OH equivalent = 44.72)
g / eq. ) 33 g and toluene-2,4-diisocyanate (NCO equivalent = 87.08 g / eq.) 132
g, the temperature was gradually raised to 80 ° C., and the reaction was continued at that temperature for 2 hours. The isocyanate group content after 2 hours was 10% (NCO equivalent = 420 g / eq.). This was followed by ethyl diglycol acetate 79.8
g, "GI-1000" (OH-terminated hydrogenated polybutadiene, Mn = about 1,500, OH equivalent = 801 g / e
q. Then, 139 g of solid content = 100 w% (manufactured by Nippon Soda Co., Ltd.) was added dropwise over 1 hour while maintaining the temperature at 80 ° C., and the addition reaction was performed at 80 ° C. for 4 hours thereafter. The isocyanate group content of this product is 4.7% (NCO equivalent = 89
4 g / eq. )Met. While maintaining at 80 ° C,
Methyl ethyl ketoxime (molecular weight 87.12) 63.
2 g was added dropwise over 2 hours, and the reaction was further continued for 1 hour.
2,250 from FT-IR (Fourier transform infrared spectroscopy)
When the disappearance of the NCO peak at cm ^-1 was confirmed, the temperature was lowered to obtain resin E. Properties of resin E: Mn = about 1,60
0, block NCO equivalent (including solvent) = 1,013 g / e
q. And solids content = 60 w%.

<Production of Resin F> [GI-10]
00 "(OH-terminated hydrogenated polybutadiene, Mn = about 1,5
00, OH equivalent = 801 g / eq. , And solids = 1
00 w%: 1,000 g of Nippon Soda Co., Ltd., 591 g of Ipsol 150 (manufactured by Idemitsu Petrochemical Co., Ltd.) and 0.1 g of dibutyltin dilaurate were added and mixed and uniformly dissolved. When the mixture became homogeneous, the temperature was raised to 70 ° C., and 97.8 g of toluene-2,4-diisocyanate (NCO equivalent = 87.08 g / eq.) Was added to 2 parts with further stirring.
The mixture was added dropwise over a period of time, kept for 1 hour, and cooled when the disappearance of the NCO peak at 2,250 cm ^-1 was confirmed by FT-IR. Properties of resin F: Mn =
About 17,000, OH equivalent (including solvent) = 13,521 g
/ Eq. And solids = 65% w.

<Production of Resin G>"TP1OO" was added to the reaction vessel.
2 "(NCO-terminated polybutadiene, Mn = about 1,50
0, OH equivalent = 1,050 g / eq. And solids =
50 w%: 1,000 g of Nippon Soda Co., Ltd.) and 0.1 g of dibutyltin dilaurate were charged and heated to 80 ° C., and then methyl ethyl ketoxime (molecular weight 87.12).
99.6 g was added dropwise over 2 hours, and the reaction was further continued for 1 hour. When the disappearance of the NCO peak at 2,250 cm ^-1 was confirmed by FT-IR, the temperature was lowered to obtain resin G.
Properties of resin G: Mn = about 1,500, block NCO equivalent (including solvent) = 1,154.5 g / eq. And solids = 54.5 w%.

<Production of Resin H> [G-100]
0 "(OH-terminated polybutadiene, Mn = about 1,600,
OH equivalent = 800 g / eq. , And solid content = 100w
%: 1,000 g of Nippon Soda Co., Ltd., 591 g of "Ipsol 150" (manufactured by Idemitsu Petrochemical Co., Ltd.), and 0.1 g of dibutyltin laurate were mixed and uniformly dissolved. When the temperature became uniform, the temperature was raised to 70 ° C., and while stirring, toluene-2,4-diisocyanate (NC
O equivalent = 87.08 g / eq. ) 97.8 g was added dropwise over 2 hours, and the mixture was held for another 1 hour.
When the disappearance of the NCO peak at 0 cm ^-1 was confirmed, the temperature was lowered to obtain resin H. Properties of resin H: Mn = about 17,
000, OH equivalent (including solvent) = 13,523 g / e
q. And solids = 65% w.

The components used in the following Examples and Comparative Examples are shown below. <Hydrogenated polybutadiene polyol (A)>-"GI-1000" (Mn = about 1,500, OH equivalent = 801 g / eq., And solid content = 100 w%: manufactured by Nippon Soda Co., Ltd.) <Hydrogenated polybutadiene Polyblock isocyanate (X
a)> Resin E (Mn = about 1,600, block NCO equivalent (including solvent) = 1,013 g / eq., solid content = 6
0w%) <Hydrogenated polybutadiene polyol (B)>-Resin F (Mn = about 17,000, OH equivalent (including solvent))
= 13,521 g / eq. , And solid content = 65 w%) <Polyol (C)> “PE555” (EO-modified pentaerythritol, M
n = about 550, OH equivalent = 138 g / eq. And solid content = 100 w%: manufactured by Toho Chemical Co., Ltd.) <Polyol (A ′): an unhydrogenated polybutadiene polyol equivalent to (A)> “G-1000” (Mn = about 1,600, OH equivalent) =
800 g / eq. And solid content = 100 w%: manufactured by Nippon Soda Co., Ltd. <Polyol (Xa ′): unhydrogenated polybutadiene polyblock isocyanate equivalent to (Xa)> Resin G (Mn = about 1,500, block NCO equivalent) (Including solvent) = 1,154.5 g / eq., And solid content = 54.5 w%) <Polyol (B ′): Unhydrogenated polybutadiene polyol corresponding to (B)> Resin H (Mn = about 17, 000, OH equivalent (including solvent)
= 13,523 g / eq. And solid content of 65 w%) <Polyamide fine particles>-"VENTSINT 2070" (manufactured by Daicel Huels Co., Ltd.)-Rubber fine particles-"EXR-91" (manufactured by Nippon Synthetic Rubber Co., Ltd.)

<Preparation of Curable Resin Composition> Examples 1 to 5 The above polyols (A), (B) and (C), polyblock isocyanate (Xa), rubber fine particles,
And polyamide fine particles as appropriate, dibutyltin laurate as a curing accelerator, "Aerosil 200" (manufactured by Nippon Aerosil Co., Ltd.) as a sagging inhibitor, and carbitol acetate as a viscosity adjusting solvent. The samples A1 to 5 were prepared by adding and mixing an appropriate amount for each, and kneading using three rolls. The contents and results of the composition of each example are shown in Table 1 below.

Comparative Examples 1 to 7 The polyols (A '), (B') and (C), the polyblock isocyanate (Xa '), the fine rubber particles and the fine polyamide particles were appropriately blended, and the other components were cured. Dibutyltin laurate as an accelerator and "Aerosil 200" as an anti-sagging agent (Nippon Aerosil Co., Ltd.)
And carbitol acetate as a viscosity adjusting solvent were added and mixed in an appropriate amount for each formulation, and kneaded using a three-roll mill to prepare Comparative Samples B1 to B5 in the same manner as in the Examples. As an example of an overcoating agent generally used for a current film carrier, “CCR-232G
F "(Epoxy based, manufactured by Asahi Chemical Laboratory) as Comparative Example B6
And "FS-100L" (a polyimide-based product made by Ube Industries, Ltd.) in Comparative Example B7. The contents and results of the composition of each comparative example are shown in Table 2 below.

<Preparation of Test Specimens> Each of the samples A1 to 5 and the comparative samples B1 to 7 prepared as described above was applied to an arbitrary substrate so as to have a thickness of about 25 μm at the time of curing.
Curing was performed for 60 minutes to prepare a test sample.

<Measurement of Coating Film Characteristics> The coating films prepared as described above were measured for the following characteristics.

Warpage due to curing shrinkage: 35 mm × 60
25mm × 3 on a polyimide film of mm × 75μm
Apply 5 mm x 25 µm and measure the amount of warpage after curing. Further, the amount of warpage when the test piece was further heat-treated at 150 ° C. for 7 hours was measured.

Bending resistance: A test piece coated and cured on a 75 μm polyimide film was bent at 180 °, and the presence or absence of cracks and whitening when being rubbed with a nail was observed. → ×: cracking, Δ: whitening, and ○: no abnormality.

Solder heat resistance: flux JS-6 applied to coating film
Apply 4MS-S and place it in a 260 ° C solder bath for 10 minutes.
Soak for seconds. → ：: No abnormality, ×: Swelling occurred.

Electric insulation: The composition was applied to a comb-shaped electrode having a conductor width of 0.318 mm, and the electric resistance was measured one hour after boiling.

Chemical resistance: The coating film is rubbed with a waste impregnated with isopropanol. → ○: No abnormality, ×: Deterioration of coating film.

Adhesion (copper / polyimide): JIS D
0202. The test was performed on copper or polyimide as a substrate. → ×: 0/100 to 50/100, Δ: 51/100 to
99/100, and ：: 100/100.

Adhesion (IC sealing resin): The copper is etched, and the resin composition is applied to a TAB tape having an exposed adhesive layer to a thickness of about 25 μm and cured. A test piece was prepared by applying an IC sealing resin to a thickness of about 200 μm on this coating and curing the resin. The test piece is bent by hand and the degree of peeling of the sealing resin is observed. IC encapsulating resin A: "XS8103" (Namics Corporation)
IC Sealing Resin B: “XS8107” (NAMICS CORPORATION)
→ ×: Interfacial peeling between the coating film and the sealing resin, Δ: Cohesive failure and interfacial peeling of the coating film and the sealing resin coexist, and the cohesive failure as a ratio <Interfacial peeling, ○: Composition Cohesive failure and interfacial peeling of the coating film and the sealing resin coexist, and the cohesive failure> interfacial peeling as a ratio. A: Cohesive failure of each of the composition coating film and the sealing resin.

Table 1 and Table 2 below show the test results of the film properties measured for the above items of the prepared film. Thus, the coating film of the curable resin composition of the present invention has a particularly small increase in the amount of warpage as compared with the conventional composition, even after being left at a high temperature for a long time, flexibility, chemical resistance, heat resistance, It has excellent electrical insulation, bending resistance, and adhesion, and each property is well balanced.

[0041]

[Table 1]

[0042]

[Table 2]

[0043]

The resin composition of the present invention has a particularly small increase in the amount of warpage even after being left at a high temperature for a long time, and has flexibility, chemical resistance, heat resistance, and electrical insulation properties. This is a thermosetting resin composition having excellent heat resistance and is suitable as an overcoating agent for a flexible circuit, and can be expected as an overcoating agent for a film carrier.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) // C08G 18/62 C08G 18/80 18/69 H01L 23/30 R 18/80

Claims (7)

[Claims] (A) The number average amount is 1,000 to 8,000.
0. A resin composition for a flexible circuit overcoat, comprising: a hydrogenated polybutadiene polyol having 2 to 10 hydroxyl groups per molecule; and (X) a polybutadiene polyblock isocyanate. 2. A flexible circuit overcoat comprising the following components (A) and (Xa), wherein the amount of the polyblocked isocyanate is 0.8 to 3.5 equivalents to the total hydroxyl equivalents of the polyol. Resin composition. (A) a hydrogenated polybutadiene polyol having a number average molecular weight of 1,000 to 8,000 and having 2 to 10 hydroxyl groups per molecule, (Xa) a number average molecular weight of 1,000 to 8,000
000, hydrogenated polybutadiene polyblock isocyanate having 2 to 10 blocked isocyanate groups per molecule. 3. It contains the following three components (A), (Xa) and (B), and the weight ratio of the two polyols is (A) :( B) = 40: 60-90: A resin composition for a flexible circuit overcoat in which the number of polyblock isocyanates is in the range of 10, and the amount of polyblock isocyanate is 0.8 to 3.5 times the number of equivalents of the total hydroxyl group of the polyol. (A) a hydrogenated polybutadiene polyol having a number average molecular weight of 1,000 to 8,000 and having 2 to 10 hydroxyl groups per molecule, (Xa) a number average molecular weight of 1,000 to 8,000
Hydrogenated polybutadiene polyblock isocyanate having 2 to 10 blocked isocyanate groups per molecule, (B) having a number average molecular weight of 13,000 to 3
A hydrogenated polybutadiene polyol having a molecular weight of 0.000 and having 2 to 10 hydroxyl groups per molecule. 4. A composition containing the following three components (C), (Xa) and (B), wherein the weight ratio of two polyols is (C) :( B) = 20: 80 to 50: 50. A resin composition for a flexible circuit overcoat, wherein the amount of polyblock isocyanate is 0.8 to 3.5 times the total number of hydroxyl equivalents of the polyol. (C) a polyol having a number average molecular weight of 200 to 600 and having 2 to 10 hydroxyl groups per molecule, and (Xa) a polyol having a number average molecular weight of 1,000 to 8,000 and 2 to 2
Hydrogenated polybutadiene polyblock isocyanate having 10 blocked isocyanate groups, (B) having a number average molecular weight of 13,000 to 30,000 and 2 per molecule
A hydrogenated polybutadiene polyol having from 10 to 10 hydroxyl groups. 5. A resin composition for a flexible circuit overcoat, wherein the resin composition according to claim 1 is added with rubber-like fine particles and / or polyamide fine particles. 6. A film carrier, characterized in that an overcoat agent comprising the resin composition according to claim 1 as a main component is applied to the wiring pattern surface side. 7. A film carrier device using the film carrier according to claim 6.