WO2009051092A1 - 電気部品用ソケット - Google Patents

電気部品用ソケット Download PDF

Info

Publication number
WO2009051092A1
WO2009051092A1 PCT/JP2008/068550 JP2008068550W WO2009051092A1 WO 2009051092 A1 WO2009051092 A1 WO 2009051092A1 JP 2008068550 W JP2008068550 W JP 2008068550W WO 2009051092 A1 WO2009051092 A1 WO 2009051092A1
Authority
WO
WIPO (PCT)
Prior art keywords
socket
electric component
terminals
main body
socket cover
Prior art date
Application number
PCT/JP2008/068550
Other languages
English (en)
French (fr)
Inventor
Takashi Morinari
Original Assignee
Enplas Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enplas Corporation filed Critical Enplas Corporation
Publication of WO2009051092A1 publication Critical patent/WO2009051092A1/ja
Priority to US12/757,646 priority Critical patent/US7997919B2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1007—Plug-in assemblages of components, e.g. IC sockets with means for increasing contact pressure at the end of engagement of coupling parts

Abstract

　本発明は、電気部品を着脱可能に収容する収容部（４）を有するソケット本体（１）と、該ソケット本体（１）に配設されて上記電気部品の端子に離接可能な複数のコンタクトピン（５）と、上記ソケット本体（１）に回動可能に取り付けられたソケットカバー（２）と、を有し、該ソケットカバー（２）が閉止されることにより、上記収容部（４）に収容された上記電気部品を押圧保持して該電気部品の端子を上記コンタクトピン（５）に接触させるようにした電気部品用ソケットにおいて、上記収容部（４）に収容され押圧保持される電気部品の厚さや端子の数に応じた所定の付勢力によって付勢することができるよう、上記ソケットカバー（２）を、その閉止時に上記ソケット本体（１）に対して近接又は離間する方向へ移動可能に設けたものである。 これにより、電気部品の厚さや端子の数が異なる場合でも所定の付勢力による付勢を可能とし、さらに放熱量の大きい高機能デバイスに対しても適用可能とする。
PCT/JP2008/068550 2007-10-17 2008-10-14 電気部品用ソケット WO2009051092A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/757,646 US7997919B2 (en) 2007-10-17 2010-04-09 Electrical component socket

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-270513 2007-10-17
JP2007270513A JP5041955B2 (ja) 2007-10-17 2007-10-17 電気部品用ソケット

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/757,646 Continuation US7997919B2 (en) 2007-10-17 2010-04-09 Electrical component socket

Publications (1)

Publication Number Publication Date
WO2009051092A1 true WO2009051092A1 (ja) 2009-04-23

Family

ID=40567356

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/068550 WO2009051092A1 (ja) 2007-10-17 2008-10-14 電気部品用ソケット

Country Status (3)

Country Link
US (1) US7997919B2 (ja)
JP (1) JP5041955B2 (ja)
WO (1) WO2009051092A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015098947A1 (ja) * 2013-12-27 2015-07-02 株式会社エンプラス 電気部品用ソケット
TWI701446B (zh) * 2018-10-10 2020-08-11 黃東源 用於測試ic的插座裝置

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM370216U (en) * 2009-05-12 2009-12-01 Hon Hai Prec Ind Co Ltd Electrical connector assembly and heatsink module thereof
JP6005922B2 (ja) 2011-10-13 2016-10-12 株式会社エンプラス 電気部品用ソケット
US8953332B2 (en) 2012-04-10 2015-02-10 International Business Machines Corporation Positive pressure-applying compliant latch mechanism
US9433119B2 (en) 2014-02-12 2016-08-30 International Business Machines Corporation Positive pressure-applying latch mechanism
TWM491975U (zh) * 2014-05-28 2014-12-11 Hon Hai Prec Ind Co Ltd 電連接器組合
US9730351B2 (en) * 2014-07-01 2017-08-08 Foxconn Interconnect Technology Limited Electrical connector assembly with holding member
US9942999B2 (en) * 2014-07-01 2018-04-10 Foxconn Interconnect Technology Limited Electrical connector assembly with holding member
JP7170393B2 (ja) * 2017-12-27 2022-11-14 株式会社エンプラス 開閉体の開閉機構
JP7018309B2 (ja) * 2017-12-27 2022-02-10 株式会社エンプラス 電気部品用ソケット
JP7018310B2 (ja) * 2017-12-27 2022-02-10 株式会社エンプラス 電気部品用ソケット
KR102233780B1 (ko) * 2020-08-20 2021-03-30 주식회사 비아이피 칩셋 성능 테스트용 지그
JP2022112095A (ja) * 2021-01-21 2022-08-02 山一電機株式会社 ヒートシンクユニット、ｉｃソケット、半導体パッケージの製造方法、及び半導体パッケージ

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04169086A (ja) * 1990-10-31 1992-06-17 Chichibu Fuji:Kk Ｉｃソケット
JPH08203642A (ja) * 1995-01-26 1996-08-09 Toshiba Chem Corp Ｉｃソケット
JPH11251027A (ja) * 1998-02-27 1999-09-17 Enplas Corp Ｉｃソケット
JPH11251026A (ja) * 1998-02-27 1999-09-17 Enplas Corp Ｉｃソケット
JP2002231400A (ja) * 2001-02-02 2002-08-16 Enplas Corp 電気部品用ソケット
WO2003058768A1 (en) * 2001-12-28 2003-07-17 Nhk Spring Co., Ltd. Socket for inspection
JP2005149953A (ja) * 2003-11-17 2005-06-09 Enplas Corp 電気部品用ソケット

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001281295A (ja) 2000-03-28 2001-10-10 Ando Electric Co Ltd Ｉｃソケット
JP3803099B2 (ja) * 2002-12-17 2006-08-02 山一電機株式会社 半導体装置用ソケット
JP4471941B2 (ja) * 2005-03-10 2010-06-02 山一電機株式会社 半導体装置用ソケット
JP4495200B2 (ja) * 2007-09-28 2010-06-30 山一電機株式会社 半導体装置用ソケット

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04169086A (ja) * 1990-10-31 1992-06-17 Chichibu Fuji:Kk Ｉｃソケット
JPH08203642A (ja) * 1995-01-26 1996-08-09 Toshiba Chem Corp Ｉｃソケット
JPH11251027A (ja) * 1998-02-27 1999-09-17 Enplas Corp Ｉｃソケット
JPH11251026A (ja) * 1998-02-27 1999-09-17 Enplas Corp Ｉｃソケット
JP2002231400A (ja) * 2001-02-02 2002-08-16 Enplas Corp 電気部品用ソケット
WO2003058768A1 (en) * 2001-12-28 2003-07-17 Nhk Spring Co., Ltd. Socket for inspection
JP2005149953A (ja) * 2003-11-17 2005-06-09 Enplas Corp 電気部品用ソケット

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015098947A1 (ja) * 2013-12-27 2015-07-02 株式会社エンプラス 電気部品用ソケット
KR20160103015A (ko) * 2013-12-27 2016-08-31 가부시키가이샤 엔프라스 전기 부품용 소켓
US9853380B2 (en) 2013-12-27 2017-12-26 Enplas Corporation Electronic component socket
KR102276579B1 (ko) 2013-12-27 2021-07-13 가부시키가이샤 엔프라스 전기 부품용 소켓
TWI701446B (zh) * 2018-10-10 2020-08-11 黃東源 用於測試ic的插座裝置

Also Published As

Publication number Publication date
JP5041955B2 (ja) 2012-10-03
JP2009099415A (ja) 2009-05-07
US20100261371A1 (en) 2010-10-14
US7997919B2 (en) 2011-08-16

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