WO2009034915A1 - 蒸着装置 - Google Patents

蒸着装置 Download PDF

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Publication number
WO2009034915A1
WO2009034915A1 PCT/JP2008/065982 JP2008065982W WO2009034915A1 WO 2009034915 A1 WO2009034915 A1 WO 2009034915A1 JP 2008065982 W JP2008065982 W JP 2008065982W WO 2009034915 A1 WO2009034915 A1 WO 2009034915A1
Authority
WO
WIPO (PCT)
Prior art keywords
mask
contamination
organic
substrate
prevent
Prior art date
Application number
PCT/JP2008/065982
Other languages
English (en)
French (fr)
Inventor
Toshio Negishi
Original Assignee
Ulvac, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac, Inc. filed Critical Ulvac, Inc.
Priority to CN200880107079A priority Critical patent/CN101803459A/zh
Priority to KR1020107004773A priority patent/KR101167546B1/ko
Priority to EP08831052A priority patent/EP2190264A4/en
Priority to JP2009532157A priority patent/JP5282038B2/ja
Publication of WO2009034915A1 publication Critical patent/WO2009034915A1/ja
Priority to US12/718,350 priority patent/US20100170439A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/246—Replenishment of source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/811—Controlling the atmosphere during processing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

　有機ＥＬ装置の汚染を防止する。１色目の着色層８５ａを形成した後、位置合わせ装置６０が同じ真空槽１１内部で、基板８１とマスク１６とを相対的に移動させ、マスク１６の開口１７を、次の色の着色層８５ｂを形成すべき領域上に移動させる。従って、マスク１６を交換しなくても、２色以上の着色層８５ａ～８５ｃを形成可能であり、成膜中の基板８１の移動距離が短くなるから、ダストが発生せず、有機ＥＬ装置の汚染が防止される。
PCT/JP2008/065982 2007-09-10 2008-09-04 蒸着装置 WO2009034915A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN200880107079A CN101803459A (zh) 2007-09-10 2008-09-04 蒸镀装置
KR1020107004773A KR101167546B1 (ko) 2007-09-10 2008-09-04 증착 장치
EP08831052A EP2190264A4 (en) 2007-09-10 2008-09-04 EXPANSION UNIT
JP2009532157A JP5282038B2 (ja) 2007-09-10 2008-09-04 蒸着装置
US12/718,350 US20100170439A1 (en) 2007-09-10 2010-03-05 Vapor deposition apparatus

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007234441 2007-09-10
JP2007-234441 2007-09-10
JP2007259099 2007-10-02
JP2007-259099 2007-10-02

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/718,350 Continuation US20100170439A1 (en) 2007-09-10 2010-03-05 Vapor deposition apparatus

Publications (1)

Publication Number Publication Date
WO2009034915A1 true WO2009034915A1 (ja) 2009-03-19

Family

ID=40451924

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/065982 WO2009034915A1 (ja) 2007-09-10 2008-09-04 蒸着装置

Country Status (7)

Country Link
US (1) US20100170439A1 (ja)
EP (1) EP2190264A4 (ja)
JP (1) JP5282038B2 (ja)
KR (1) KR101167546B1 (ja)
CN (1) CN101803459A (ja)
TW (1) TWI412616B (ja)
WO (1) WO2009034915A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
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WO2012039383A1 (ja) * 2010-09-22 2012-03-29 株式会社アルバック 真空処理装置及び有機薄膜形成方法

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US8349143B2 (en) * 2008-12-30 2013-01-08 Intermolecular, Inc. Shadow masks for patterned deposition on substrates
JP5328726B2 (ja) 2009-08-25 2013-10-30 三星ディスプレイ株式會社 薄膜蒸着装置及びこれを利用した有機発光ディスプレイ装置の製造方法
JP5677785B2 (ja) 2009-08-27 2015-02-25 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． 薄膜蒸着装置及びこれを利用した有機発光表示装置の製造方法
US8876975B2 (en) 2009-10-19 2014-11-04 Samsung Display Co., Ltd. Thin film deposition apparatus
KR101146982B1 (ko) * 2009-11-20 2012-05-22 삼성모바일디스플레이주식회사 박막 증착 장치 및 유기 발광 디스플레이 장치 제조 방법
KR101174874B1 (ko) * 2010-01-06 2012-08-17 삼성디스플레이 주식회사 증착 소스, 박막 증착 장치 및 유기 발광 표시 장치 제조 방법
KR101084184B1 (ko) 2010-01-11 2011-11-17 삼성모바일디스플레이주식회사 박막 증착 장치
KR101174875B1 (ko) 2010-01-14 2012-08-17 삼성디스플레이 주식회사 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
KR101193186B1 (ko) 2010-02-01 2012-10-19 삼성디스플레이 주식회사 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
KR101156441B1 (ko) 2010-03-11 2012-06-18 삼성모바일디스플레이주식회사 박막 증착 장치
KR101202348B1 (ko) 2010-04-06 2012-11-16 삼성디스플레이 주식회사 박막 증착 장치 및 이를 이용한 유기 발광 표시 장치의 제조 방법
US8894458B2 (en) 2010-04-28 2014-11-25 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
KR101723506B1 (ko) 2010-10-22 2017-04-19 삼성디스플레이 주식회사 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR101738531B1 (ko) 2010-10-22 2017-05-23 삼성디스플레이 주식회사 유기 발광 디스플레이 장치의 제조 방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
KR20120045865A (ko) 2010-11-01 2012-05-09 삼성모바일디스플레이주식회사 유기층 증착 장치
KR20120065789A (ko) 2010-12-13 2012-06-21 삼성모바일디스플레이주식회사 유기층 증착 장치
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KR101760897B1 (ko) 2011-01-12 2017-07-25 삼성디스플레이 주식회사 증착원 및 이를 구비하는 유기막 증착 장치
CN103328681B (zh) * 2011-01-20 2015-09-23 夏普株式会社 坩埚和蒸镀装置
KR101840654B1 (ko) 2011-05-25 2018-03-22 삼성디스플레이 주식회사 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR101852517B1 (ko) 2011-05-25 2018-04-27 삼성디스플레이 주식회사 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR101857249B1 (ko) 2011-05-27 2018-05-14 삼성디스플레이 주식회사 패터닝 슬릿 시트 어셈블리, 유기막 증착 장치, 유기 발광 표시장치제조 방법 및 유기 발광 표시 장치
KR101826068B1 (ko) 2011-07-04 2018-02-07 삼성디스플레이 주식회사 유기층 증착 장치
KR20130015144A (ko) 2011-08-02 2013-02-13 삼성디스플레이 주식회사 증착원어셈블리, 유기층증착장치 및 이를 이용한 유기발광표시장치의 제조 방법
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KR101994838B1 (ko) 2012-09-24 2019-10-01 삼성디스플레이 주식회사 유기층 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
CN103305798B (zh) * 2013-05-21 2015-08-26 上海和辉光电有限公司 蒸镀装置及利用该蒸镀装置进行的蒸镀工艺
CN103305794B (zh) * 2013-06-09 2016-03-02 京东方科技集团股份有限公司 一种有机镀膜装置及方法
WO2014208789A1 (ko) * 2013-06-25 2014-12-31 에스엔유 프리시젼 주식회사 공급유닛을 구비하는 박막증착장치
CN103741097B (zh) * 2013-12-30 2016-02-03 深圳市华星光电技术有限公司 真空蒸镀装置
KR102149172B1 (ko) * 2015-10-06 2020-08-28 가부시키가이샤 아루박 재료 공급 장치 및 증착 장치
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Also Published As

Publication number Publication date
US20100170439A1 (en) 2010-07-08
KR101167546B1 (ko) 2012-07-20
JP5282038B2 (ja) 2013-09-04
JPWO2009034915A1 (ja) 2010-12-24
CN101803459A (zh) 2010-08-11
KR20100040952A (ko) 2010-04-21
EP2190264A4 (en) 2011-11-23
TWI412616B (zh) 2013-10-21
TW200918680A (en) 2009-05-01
EP2190264A1 (en) 2010-05-26

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