WO2009030604A2 - Flammhemmende additive - Google Patents

Flammhemmende additive Download PDF

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Publication number
WO2009030604A2
WO2009030604A2 PCT/EP2008/061105 EP2008061105W WO2009030604A2 WO 2009030604 A2 WO2009030604 A2 WO 2009030604A2 EP 2008061105 W EP2008061105 W EP 2008061105W WO 2009030604 A2 WO2009030604 A2 WO 2009030604A2
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compounds
formula
general formula
preparation
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German (de)
English (en)
French (fr)
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WO2009030604A3 (de
Inventor
Manfred DÖRING
Ulrich Arnold
Marcel Roth
Emilie Barriau
Ulrike Schmidt-Freytag
Volker ALTSTÄDT
Felipe Wolff Fabris
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Henkel AG and Co KGaA
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Henkel AG and Co KGaA
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Priority to JP2010523473A priority Critical patent/JP2010538134A/ja
Priority to EP08787457A priority patent/EP2185643B1/de
Priority to AT08787457T priority patent/ATE543865T1/de
Priority to CN200880105891XA priority patent/CN102015869A/zh
Publication of WO2009030604A2 publication Critical patent/WO2009030604A2/de
Priority to US12/718,035 priority patent/US20100160476A1/en
Anticipated expiration legal-status Critical
Publication of WO2009030604A3 publication Critical patent/WO2009030604A3/de
Ceased legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/49Phosphorus-containing compounds
    • C08K5/50Phosphorus bound to carbon only
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins

Definitions

  • phosphonium salts or reaction products obtained from phosphonium salts are used as flame retardants in many fields of technology.
  • Flame retardants based on tetrakis (hydroxymethyl) phosphonium salts are e.g. for the flame retardancy of cellulose, in particular for the impregnation of textiles (EP 595142 or WO 8900217) and wood (GB 2200363).
  • Reaction products of these salts with isocyanates or alkylene oxides are used as flame retardant additives for polyurethanes (DE 10304344).
  • phosphonium salts are described as flame retardants for polycarbonates (JP 2001288352) and as components for flame-retarded polyester fibers (JP 2000290834).
  • Phosphonium salts have also been described as flame retardants for polyethylene, polypropylene, polyacrylic acid and butadiene / acrylonitrile-acrylonitrile / styrene copolymers (US 3309425 to Gillham et al.).
  • a common flame retardant system is a combination of bromine-containing flame retardants and antimony oxide flame retardant synergists.
  • these compounds are environmental pollutants.
  • Antimony oxide is particularly problematic in terms of its partial solubility in water.
  • phosphorus-containing compounds are also added as flame retardant compounds to the respective epoxy resin systems.
  • Epoxy resin compositions as semiconductor encapsulants containing a phosphorus-containing flame retardant so as to avoid the use of antimony trioxide and brominated compounds.
  • Phosphonium salts as additives are described in US Patent Application Nos. 2004/0166241 to Gallo et al. and No. 2004/0217376 to Ahsan et al. described. Both claim an epoxy resin composition comprising an epoxy resin system, a suitable initiator, a flame retardant, preferably containing melamine cyanurate, and a quaternary Organophosphonium.
  • a synergistic effect is attributed to the quaternary organophosphonium salt in combination with the flame retardant and the initiator in that the salt positively influences both the curing rate and the flame retardancy of the resin.
  • an additional flame retardant is required and the curing of the epoxy resin composition takes place thermally, usually by anionic polymerization.
  • the quaternary Organophosphoniumsalzkationen used are further characterized in that the respective counterion is selected from the group of nucleophilic halide, acetate or phosphate anions.
  • Japanese Patent Application No. 2004083835 discloses the use of phosphonium salts having weakly coordinating anions as latent polymerization catalysts in thermosetting resin systems.
  • the aim of the present invention was therefore to provide efficient flame retardants for non-thermosetting resin systems, since no compatible and effective flame retardants were available for this type of curing. In order to achieve a sufficient flame retardant effect, flame retardants must often be added in amounts which lead to a deterioration of the material parameters. Another object of the invention was therefore to keep the required amounts of additive as small as possible in order to prevent a negative influence on the material properties.
  • Resin systems in the context of the invention are preferably resin systems selected from the group of epoxy resin systems, benzoxazine systems, polyurethane systems, acrylate resin systems, epoxyacrylate resin systems, cyanoacrylate resin systems, triazine resin systems, polyimide resin systems, ester acrylate resin systems and / or thermoplastic resin systems or any mixtures thereof non-thermosetting resin systems, very particularly preferably non-thermally curing epoxy resin systems, which can be regarded in the context of the invention as cationically curing epoxy resin systems.
  • weakly coordinating anions are preferably understood as meaning anions which, owing to their chemical structure, have little basic and hardly nucleophilic properties. Without the use of weakly coordinating anions as counterions, there is usually no or no complete curing of the respective resin system, since other counterions, such as halides, especially in cationic curing resin systems inhibit or significantly slow down the polymerization process.
  • a D epoxy resin system D is understood to mean a resin composition which is formed on the basis of epoxide compounds or epoxide-containing compounds.
  • a, b, and c in formula (XV) can represent both integers and number ranges, and a can not in addition represent integers.
  • c is preferably either 1 (monomeric metal complex) or is preferably in the range from 1 to 20,000,000 (monomeric, dimeric, trimeric, oligomeric and polymeric coordination compounds or mixtures of these), for example preferably 1 to 20,000, more preferably 1 to 1,000, most particularly preferably 1 to 500 or 1 to 300. Particularly preferred for e, however, is a number range between 1 and 20,000,000.
  • Another object of the present invention is the use of the inventive composition as an adhesive, composite material, sealant, material and / or for coating surfaces.
  • a process for curing the preparation according to the invention comprising the steps a. Providing a curable preparation, b. Irradiation of said preparation with radiation sufficient to cure said preparation and the cured product as such, obtained by non-thermal curing of the preparation according to the invention, preferably by the method mentioned above.
  • Flame retardants in the context of the present invention consist of mono-, di-, oligo- and / or polyphosphonium cations and the abovementioned weakly coordinating anions.
  • the monophosphonium cation is selected from compounds of the general formula (II)
  • R 1 , R 2 and R 3 are a substituted or unsubstituted phenyl group.
  • R 5 and R 6 independently represent a substituted or unsubstituted C-. 12 -alkyl, cycloalkyl, alkenyl, alkynyl, arylalkyl or aryl group
  • Y is a covalent bond or a substituted or unsubstituted C 1-12 alkylene, cycloalkylene, alkenylene, arylalkylene or arylene group.
  • R 5 and R 6 are a substituted or unsubstituted phenyl group.
  • the oligo- or polyphosphonium cation is selected from compounds of the general
  • R and R - 10 are each independently a substituted or unsubstituted C 1- 12 - alkyl, cycloalkyl, alkenyl, alkynyl, arylalkyl or aryl group, in particular a C ⁇ - io-aryl group
  • z is a covalent bond or a substituted or unsubstituted C 1 -12 -alkylene, cycloalkylene, alkenylene, arylalkylene or arylene group
  • n is an integer between 1 and 1,000,000, more preferably between 1 and 100,000 and most preferably between 1 and 10,000, between 1 and 1,000, between 1 and 300, between 1 and 100 and in particular between 1 and 10.
  • R 9 and R 10 is a substituted or unsubstituted phenyl group.
  • R 11 is a structure of the general formula (R 12 ⁇ P (CH 2 ) J -, where j is preferably 0, 1, 2 or 3, in particular 1 and / or R 12 is a substituted or unsubstituted phenyl group.
  • substituted in the context of the present invention means that the respective radical may carry at least one, preferably one, two or three substituents.
  • the substituents may be selected according to the invention in particular from alkyl, in particular C 1-22 -alkyl, preferably Trifluoromethyl, cycloalkyl, in particular Cs- ⁇ -cycloalkyl, cycloalkylalkyl, in particular C 3 . 8 cycloalkyl-Ci -12 alkyl, alkenyl, in particular C 2 .i 8 alkenyl, alkynyl, in particular C 2 i 8 alkynyl, heteroalkyl, heterocycloalkyl, alkoxy, especially C 1-18 -alkoxy, alkylsulfanyl, especially C 1-18 -alkylsulfanyl, alkylsulfinyl, especially Ci.
  • arylsulfonyl arylcarbonyl, in particular C ⁇ -io-arylcarbonyl, arylcarbonyloxy, in particular C ⁇ -io-Arylcarbonyloxy, aryloxycarbonyl, in particular Arylsulfanylcarbonyl, in particular C 1-10 -arylsulfanylcarbonyl, heteroaryl, heteroarylalkyl, in particular heteroarylC 1-12 -alkyl, heteroaryloxy, heteroarylamino, heteroarylsulfanyl, heteroarylsulfonyl, heteroarylsulfoxidyl, heteroarylcarbonyl, heteroarylcarbonyloxy, heteroaryloxycarbonyl, heteroarylaminocarbonyl, heteroarylsulfanylcarbonyl, alkoxysulfonyl, in particular C 1-18 Alkoxysulfonyl, alkoxycarbinol, in particular C 1-12 -alkoxycarbinol, ammonium
  • the substituents are in a preferred embodiment independently of one another hydrogen, alkyl, in particular C 1-22 -alkyl, preferably C 1-18 -alkyl, cycloalkyl, in particular Cs- ⁇ -cycloalkyl, cycloalkylalkyl, in particular alkenyl, in particular C 2 -- ⁇ 8 alkenyl, alkynyl, in particular C 2 -- ⁇ 8 alkynyl, heteroalkyl, heterocycloalkyl, alkanoyl, especially C 1-18 alkanoyl, alkoxycarbonyl, in particular C.
  • alkylaminocarbonyl in particular C 1-10 -alkylaminocarbonyl, alkylsulfanylcarbonyl, in particular C 1-18 -alkylsulfanylcarbonyl, aryl, in particular C 3-10 -aryl, arylalkyl, in particular C 6-10 -aryl-C 1-12 -alkyl, arylcarbonyl, in particular C ⁇ -io-arylcarbonyl, aryloxycarbonyl, in particular Ce- 10- aryloxycarbonyl, arylaminocarbonyl, in particular Arylsulfanylcarbonyl, in particular C 6 .
  • arylsulfanylcarbonyl, heteroaryl, heteroarylalkyl, in particular heteroaryl-C-12-alkyl, heteroarylcarbonyl, heteroaryloxycarbonyl, heteroarylaminocarbonyl, heteroarylsulfanylcarbonyl, trifluoromethyl, formyl, C (CH 2 -CH 2 -O-) n H or D (CH 2 -CH 2 -CH 2 -O) n H where n 1 to 20, where all radicals of the molecule thus obtained, in particular the aliphatic and aromatic radicals, in each case independently of one another, optionally also one or more times, in particular one, two or three times, preferably simple, can be substituted, in particular by substituents selected from the radicals mentioned above as well as selected from ammonium, hydroxycarbonyl, alkoxycarbonyl, in particular C- ⁇ _ 18 alkoxycarbonyl, aryloxycarbonyl, particularly C ⁇ -io-aryloxycarbonyl, amid
  • Particularly preferred flame retardants are selected from compounds of the formulas (V) to (XII)
  • n in formula (XII) is an integer between 1 and 20,000,000.
  • n in formula (XII) is an integer between 1 and 1,000,000, more preferably between 1 and 100,000 and most preferably between 1 and 10,000, between 1 and 1,000, between 1 and 300, between 1 and 100 and in particular between 1 and 10
  • the weakly coordinating anion A is hexafluoroantimonate (SbF 6 ).
  • the present invention therefore also provides the hexafluoroantimonates of the compounds of the formula (VII), (X), (XI) and (XII).
  • the compounds mentioned can be obtained by reacting the halides of the compounds of the formula (VII), (X), (XI) and (XII) with metal-SbF 6 salts, in particular KSbF 6 , the reaction preferably being carried out in an aqueous medium he follows.
  • the description of the flame retardants according to the invention relates both to their use and to their use in the curable formulation comprising an epoxy resin system, at least one initiator and at least one flame retardant.
  • the flame retardants of the invention can be prepared starting from the respective phosphonium salts by ion exchange using appropriate metal salts in an efficient and inexpensive process.
  • the flame retardants of the invention are characterized by a very good solubility in the respective resin system, preferably in the epoxy resin, whereby an excellent formability is achieved.
  • the flame retardants according to the invention have the advantage that they do not impede the polymerization process in such a curing, but even accelerate by the release of extremely strong acids, such as HSbF ⁇ , whereby they can be used as effective flame retardants and polymerization accelerators in cationically polymerizing resin systems.
  • an object of the present invention is a curable preparation comprising a) an epoxy resin system, b) an initiator selected from the following compounds or mixtures thereof: i) compounds of the general formula (XV)
  • a D epoxy resin system D is understood to mean a resin composition which is formed on the basis of epoxide compounds or epoxide-containing compounds.
  • the epoxy compounds or epoxide-containing compounds of the epoxy resin system of the preparation may comprise both oligomeric and monomeric epoxy compounds as well as epoxides of the polymeric type and may be aliphatic, cycloaliphatic, aromatic or heterocyclic compounds.
  • the epoxy compounds or epoxide-containing compounds of the epoxy resin system generally have on average at least one polymerizable epoxide group per molecule, preferably at least about 1.5 polymerizable epoxide groups per molecule.
  • the polymeric epoxies include linear epoxy terminated polymers (e.g., a diglycidyl ether of a polyoxyalkylene glycol), oxirane moiety polymers (e.g., polybutadiene polyepoxide), and polymers having pendant epoxy groups (e.g., a glycidyl methacrylate polymer or copolymer).
  • linear epoxy terminated polymers e.g., a diglycidyl ether of a polyoxyalkylene glycol
  • oxirane moiety polymers e.g., polybutadiene polyepoxide
  • polymers having pendant epoxy groups e.g., a glycidyl methacrylate polymer or copolymer.
  • These epoxies may be pure compounds or mixtures containing one, two or more epoxide groups per molecule.
  • the "average" number of epoxide groups per molecule is determined by dividing the total number of e
  • the molecular weight of the epoxy compounds or epoxide-containing compounds of the epoxy resin system varies from 100 g / mol up to a maximum of 10,000 g / mol for polymeric epoxy resins.
  • the epoxide compounds or epoxide-containing compounds are likewise no limits.
  • the backbone may be of any type and the substituent groups thereon may represent all groups that do not substantially interfere with cure.
  • the substituent groups include halogens, ester groups, ethers, sulfonate groups, siloxane groups, nitro groups, phosphate groups, and the like.
  • Suitable epoxy resin systems in the context of the present invention are, for example, preferably selected from bisphenol A type epoxy resins, bisphenol S type epoxy resins, bisphenol F type epoxy resins, phenol novolak type epoxy resins, cresol novolak epoxy resins.
  • Type, epoxidized products of numerous dicyclopentadiene-modified phenolic resins obtainable by reaction of dicyclopentadiene with numerous phenols, epoxidized products of 2,2 ', 6,6'-tetramethylbiphenol, aromatic epoxy resins such as epoxy resins with naphthalene Backbone and epoxy resins with fluorene skeleton, aliphatic epoxy resins such as Neopentylglykoldiglycidylether and 1,6-Hexandioldiglycidylether, alicyclic epoxy resins such as 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate and bis (3,4-epoxycyclohexyl) adipate, and epoxy resins with a hetero ring such as Triglycidyl isocyanurate.
  • aromatic epoxy resins such as epoxy resins with naphthalene Backbone and epoxy resins with fluorene skeleton
  • the epoxy resins include, for example, the reaction product of bisphenol A and epichlorohydrin, the reaction product of phenol and formaldehyde (novolak resins) and epichlorohydrin, glycidyl esters, and the reaction product of epichlorohydrin and p-aminophenol.
  • epoxy resins that are commercially available include, in particular, octadecylene oxide, epichlorohydrin, styrene oxide, vinylcyclohexene oxide, glycidol, glycidyl methacrylate, diglycidyl ethers of bisphenol A (eg, those sold under the trade designations "Epon 828”, “Epon 825”, “Epon 1004" and “Epon 1010" from Hexion Specialty Chemicals Inc., "DER-331”, “DER-332”, “DER-334”, “DER-732", and “DER736” from the Dow
  • reactive resins and terpene phenolic resins such as. B. NIREZ TM 2019 of
  • YP 50 from Toto Kasei, PKHC from Dow Chemical Co. and BKR 2620 from Showa Union Gosei Corp. deploy.
  • reactive resins and polyisocyanates such as. B. Coronate TM L from Nippon
  • epoxy resins may preferably include copolymers of acrylic acid esters with glycidol, e.g.
  • epoxy resins are well known and include epoxides such as e.g.
  • epichlorohydrin Alkylene oxides, e.g. Propylene oxide, styrene oxide; Alkenyloxides, e.g. butadiene oxide;
  • Glycidyl esters e.g. Ethylglycidat.
  • Cyclohexylepoxid groups especially those with a silicone backbone. Examples are UV
  • the preparations according to the invention comprise a mixture of a plurality of said epoxy resin systems.
  • mixtures may include two or more molecular weight distributions of epoxide-containing compounds, such as a low molecular weight (below 200), an average molecular weight (about 200 to 10,000), and a higher molecular weight (above about 10,000).
  • the epoxy resin may contain a mixture of epoxy-containing materials of different chemical nature (eg, aliphatic or aromatic) or functionality (eg, polar or nonpolar).
  • the initiator of the preparation according to the invention is preferably selected from compounds of general formula (XV) ([M (L) JA b ) O (XV).
  • a, b, and c according to formula (XV) can represent both integers and number ranges, and a can not additionally represent integers.
  • c is preferably either 1 (monomeric metal complex) or is preferably in the range from 1 to 20,000,000 (monomeric, dimeric, trimeric, oligomeric and polymeric coordination compounds or mixtures of these), for example preferably 1 to 20,000, more preferably 1 to 1,000, most particularly preferably 1 to 500 or 1 to 300. Particularly preferred for e, however, is a number range between 1 and 20,000,000.
  • c 1, it means according to the invention that monomeric coordination compounds are present. If c is a numerical range from 1 to p, this means that, in addition to monomeric, dimeric, trimeric, oligomeric and polymeric coordination compounds, so-called coordination polymers, and mixtures of these with different chain lengths are also present.
  • curable composition wherein the initiator according to formula (XV) of the preparation comprising at least one metal cation M, at least one ligand L and at least hexafluoroantimonate (SbF 6 " ) as weakly coordinating anion, by complex formation reaction of a corresponding metal SbF 6 salt with a corresponding ligand (L) is obtained.
  • the initiator according to formula (XV) of the preparation comprising at least one metal cation M, at least one ligand L and at least hexafluoroantimonate (SbF 6 " ) as weakly coordinating anion, by complex formation reaction of a corresponding metal SbF 6 salt with a corresponding ligand (L) is obtained.
  • the metal cation (M) of the initiators according to formula (XV) can be selected from the group of the transition metals of the fourth or fifth period or of the second or third main group of the periodic table.
  • the metal cation (M) is selected from the group comprising Ag, Fe, Mg, Co, Cu, Al or Ti.
  • the ligand (L) is a compound having at least one (CC) double and / or triple bond, preferably a substituted or unsubstituted, branched or uneaten, cyclic or non-cyclic alkene or alkyne with 1 up to 30 carbon atoms.
  • the ligand (L) is an ether, in particular a cyclic ether, preferably a crown ether.
  • the ligand (L) is a compound from the group of nitriles. Such a compound comprises at least one C ⁇ N group.
  • Suitable preferred ligands (L) are for example selected from propene, 1-butene, 1-pentene, 1-hexene, 1-octene, 1-decene, isoprene, norbornene, cyclohexene, cyclooctene, cyclodecene, 1, 4-cyclohexadiene, 4- Vinylcyclohexene, trans-2-octene, styrene, 5-norbornene-2-carboxylic acid, butadiene, 1, 5-hexadiene, 1, 6-heptadiene, 1, 7-octadiene, 1, 9-decadiene, sorbic acid ethyl ester, 1, 3 Cyclohexadiene, 1,3-cyclooctadiene, 1,5-cyclooctadiene, norbornadiene, dicyclopentadiene, cycloheptatriene, trans, trans, trans-1, 5,9-cyclododecatrien
  • cyclic di-, tri- or tetraenes eg, 1, 5-cyclooctadiene, cycloheptatriene or cyclooctatetraene
  • mononuclear metal complexes eg, 1, 5-cyclooctadiene, cycloheptatriene or cyclooctatetraene
  • polynuclear ligand-bridged structures e.g. 1, 5-cyclooctadiene, cycloheptatriene or cyclooctatetraene
  • open-chain dienes are used as ligands L, depending on the metal cation and anion, the formation of coordination polymers may also be favored.
  • the ligands 1, 5-hexadiene and 1, 9-decadiene preferably give similar structures. As the number of double bonds in the ligand increases, more and more branching possibilities arise, the resulting structures are preferably more complex, and mixtures of different crosslinked oligomeric and polymeric compounds are preferably used Coordination compounds are obtained, such as the ligand squalene, an open-chain hexaalken. Preferably, in addition to mononuclear compounds and polynuclear compounds are formed.
  • the initiator according to formula (XV) is selected from [Ag (cyclohexene)., JSbF 6 , [Ag (cyclooctene)., JSbF 6 , [Ag (cycbdodecene) M ] SbF 6 , [Ag ( trans-2-octene), JSbF 6 , [Ag (SIyTOl) 1 JSbF 6 , [Ag (5-norbornene-2-) ⁇ [Ag (1, 5-hexadiene) M ] SbF 6 ⁇ i- P , ⁇ [Ag (1, 7-octadiene) i 5 ] SbF 6 ⁇ p , ⁇ [Ag (1, 7-octadiene) i 5 ] SbF 6 ⁇ iooo, ⁇ [Ag (1,7-octadiene) i 5 ] SbF 6 ⁇ iooo, ⁇ [
  • the initiator of the preparation according to the invention is furthermore preferably selected from compounds of the general formula (XVI) IA (XVI), where I is a diaryliodonium salt and A is a weakly coordinating anion according to the invention.
  • Particularly preferred initiators according to the invention of the formula (XVI) are compounds of the formula (XVIII),
  • R 13 and R 14 are independently selected from the group consisting of hydrogen, methyl, ethyl, n-propyl, isopropyl, n-butyl, tert-butyl, Cl, Br, OC, H 2, + 1, OCH 2 CH (CH 3) C, H 2 I + 1 , OCH 2 CH (C 2 H 5 ) C 1 H ⁇ +1 , OCH 2 CH (OH) C, H 2 I + 1 , OCH 2 CO 2 C, H 2 I +1 , OCH (CH 3 ) CO 2 C, H 2 I + 1 , OCH (C 2 H 5 ) CO 2 C, H 2 I + 1 and i is an integer between O and 18.
  • the initiator of the preparation according to the invention is also preferably selected from compounds of the general formula (XVII), SA (XVII), where S is a triarylsulfonium salt and A is a weakly coordinating anion according to the invention.
  • Particularly preferred initiators according to formula (XVII) are selected from compounds according to formula (XIX) and / or formula (XX) or mixtures thereof,
  • R 15 is selected from the group consisting of hydrogen, methyl, ethyl, n-propyl, isopropyl, n-butyl, tert-butyl, phenylsulfide (PhS) and phenoxy (PhO).
  • the initiators according to the invention of formula (XVI) and formula (XVII) are described in US Pat. Nos. 5,726,216 and 5,877,229 to Janke et al. described as cationic initiators.
  • Examples of commercially available diaryliodonium salts and triarylsulfonium salts are (4-octyloxyphenyl) phenyliodonium hexafluoroantimonate sold by General Electric Corporation as aryl fluoroantimonate product 479-2092 and CYRACURE UVI-6974, CYRACURE UVI-6990 (Union Carbide Corporation), DEGACURE KI-85 (Degussa Corporation) and FX-512 of 3M Corporation.
  • the weakly coordinating anion A of the initiator and / or the flame retardant is hexafluoroantimonate (SbF 6 ).
  • the proportion of the initiator is preferably 0.01 to 10% by weight, preferably 0.5 to 3% by weight and more preferably 1 to 2% by weight, and the proportion of the flame retardant 0.01 to 50% by weight. . preferably 0.5 to 30 wt .-%, particularly preferably 2 to 21 wt .-% and in particular 20 wt .-% or 10 wt .-%, in each case based on the total amount of the preparation.
  • a preparation which, in addition to the components mentioned, contains at least one further component selected from the group of fillers, stabilizers, hardener accelerators, antioxidants, thickeners, catalysts, reactive diluents, plasticizers, further flameproofing additives, impact-resistant additives, such as For example, elastomers, thermoplastics, core-shell particles, nanoparticles, block copolymers and / or nanotubes.
  • Suitable plasticizers are, for example, preferably esters such as abietic acid esters, adipic acid esters, azelaic acid esters, benzoic acid esters, butyric acid esters, acetic acid esters, phosphoric esters, phthalic acid esters; Esters of higher fatty acids having from about 8 to about 44 carbon atoms, such as dioctyl adipate, diisodecylsuccinate, dibutyl sebacate or butyl oleate, esters containing OH groups or epoxidized fatty acids, fatty acid esters and fats, glycolic esters, phosphoric esters, phthalic acid esters, linear containing from 1 to 12 carbon atoms or branched alcohols such as dioctyl phthalate, dibutyl phthalate or butyl benzyl phthalate, propionic acid esters, sebacic acid esters, sulfonic acid esters, thiobutyric
  • asymmetric esters of difunctional, aliphatic dicarboxylic acids for example the esterification product of adipic acid monooctyl ester with 2-ethylhexanol (Edenol DOA, Fa. Henkel, Dusseldorf).
  • plasticizers are preferably the pure or mixed ethers of monofunctional, linear or branched C 4-16 alcohols or mixtures of two or more different ethers of such alcohols, for example dioctyl ether (available as Cetiol OE, Fa. Henkel, Dusseldorf).
  • end-compounded polyethylene glycols are used as plasticizers.
  • plasticizers for example, pol yethylene or polypropylene glycol di-C1-4 alkyl ethers, in particular the dimethyl or diethyl ether of diethylene glycol or dipropylene glycol, and mixtures of two or more of these.
  • the preparation of the invention may contain up to about 80% by weight of fillers.
  • suitable fillers are inorganic fillers, such as naturally occurring or synthetic materials such as quartz, nitrides (eg, silicon nitride), eg glasses derived from Ce, Sb, Sn, Zr, Sr, Ba and Al, colloidal silica, feldspar, borosilicate glasses, kaolin, talc, titanium dioxide and zinc glasses, as well as submicron sized silica particles ( For example, pyrogenic silicas, such as the "Aerosil” series “OX 50", "130", “150” and “200” silicas sold by Degussa, and "Cab-O-Sil M5" available from Cabot Corp.
  • fillers can be used which impart thixotropy to the formulation, for example swellable plastics such as PVC.
  • Suitable additive resins are all natural and synthetic resins, such as rosin derivatives (for example, by disproportionation, hydrogenation or esterification derived derivatives), coumarone-indene and polyterpene resins, aliphatic or aromatic hydrocarbon resins (C-5-, C -9-, (C-5) 2 resins), mixed C-5 / C-9 resins, hydrogenated and partially hydrogenated derivatives of the types mentioned, resins of styrene or ⁇ -methylstyrene and terpene-phenolic resins and others as listed in Ullmanns Encyclopedia of Industrial Chemistry (4th ed.), Volume 12, p. 525 D 555, Weinheim.
  • Suitable solvents are water, ketones, lower alcohols, lower carboxylic acids, ethers and esters such as (meth) acrylic acid (ester), acetone, acetylacetone, acetoacetic ester, methyl ethyl ketone, methyl isobutyl ketone, cyclopentanone, cyclohexanone, N-methylpyrrolidone, dioxane, tetrahydrofuran, 2-methoxyethanol , 2-ethoxyethanol, 1-methoxy-2-propanol, 1, 2-dimethoxyethane, ethyl acetate, n-butyl acetate, ethyl 3-ethoxypropionate, methanol, ethanol, iso-propanol, n-propanol, n-butanol, iso-butanol , sec-butanol, tert-butanol, diacetone alcohol, 2-ethylhexyl
  • adhesion promoters and / or reactive diluents ⁇ -silanes are advantageously selected from the group consisting of -, ⁇ -methacrylic, ⁇ -carbamatosilanes and ⁇ -alkoxysilanes. Suitable examples are (methacryloxymethyl) methyldiethoxysilane and methacryloxymethyltriethoxysilane, N- (triethoxysilylmethyl) -O-methyl-carbamate and N- (methyldiethoxysilylmethyl) -O-methyl-carbamate.
  • Morpholine, N-methylmorpholine, 1, 3-diazabicyclo [5.4.6] undecene-7 are particularly suitable catalysts for promoting crosslinking.
  • Further suitable catalysts are those based on organic or inorganic heavy metal compounds, such as, for example, cobalt naphthenate, dibutyltin dilaurate, tin mercaptides, tin dichloride, zirconium tetraoctoate, tin naphthenate, tin stearate, antimony octoate, lead octoate, metal acetoacetate, especially iron acetylacetonate.
  • organic or inorganic heavy metal compounds such as, for example, cobalt naphthenate, dibutyltin dilaurate, tin mercaptides, tin dichloride, zirconium tetraoctoate, tin naphthenate, tin stearate, antimony oc
  • organotin organotitanium, organozirconium or organoaluminum compounds are organotin organotitanium, organozirconium or organoaluminum compounds.
  • organotin organotitanium, organozirconium or organoaluminum compounds are dibutyltin dilaurate, dibutyltin dimaleate, tin octoate, isopropyltriisostearoyl titanate, isopropyltris (dioctylpyrophosphate) titanate,
  • Dibutyltin alkyl esters such as dibutyltin alkyl maleates or dibutyltin laurates are particularly suitable, especially dibutyltin bisethyl maleate, dibutyltin bisbutyl maleate, dibutyltin bisoctyl maleate, dibutyltin bisoleyl maleate, dibutyltin bisacetylacetate, dibutyltin diacetate, dibutyltin dioctoate, dibutyltin oxide, dibutyltin bis-triethoxysilicate and their catalytically active derivatives.
  • the catalysts mentioned can be used alone or as a mixture of two or more of the catalysts mentioned.
  • the preparations according to the invention may contain up to 5% by weight of such catalysts in the overall composition.
  • the preparations according to the invention may further contain up to about 7% by weight, in particular about 3 to about 5% by weight, of antioxidants in the overall composition.
  • the stabilizers or antioxidants which can be used as additives in the invention include hindered phenols of high molecular weight (M w ), polyfunctional phenols and sulfur and phosphorus-containing phenols.
  • phenols are, for example, 1, 3,5-trimethyl-2,4,6-tris (3,5-di-tert-butyl-4-hydroxybenzyl) benzene; Pentaerythritol tetrakis-3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate; n-octa-decyl-3,5-di-tert-butyl-m-hydroxyphenyl) propionate; 4,4-methylenebis (2,6-di-tert-butyl-phenol); 4,4-thiobis (6-tert-butyl-o-cresol); 2,6-di-tert-butylphenol; 2,4-dimethyl-6-tert-but
  • Suitable photostabilizers are, for example, those sold under the name Thinuvin®
  • Suitable stabilizers may also be included, preferably selected from the groups of the oxanilides, triazines and benzotriazole (the latter available as Tinuvin ® grades from Ciba-Spezialitatenchemie) and benzophenones or combinations thereof. It may be advantageous to add light stabilizers that do not absorb UV light.
  • a selection of suitable preferred UV absorbers and light stabilizers which may be included in the preparations according to the invention are:
  • 2-hydroxybenzophenones for example the 4-hydroxy, 4-methoxy, 4-octyloxy, 4-decyloxy, A-
  • Esters of substituted and unsubstituted benzoic acids such as 4-tert-butylphenyl salicylate, phenyl salicylate, octylphenyl salicylate, dibenzoylresorcinol, bis (4-tert-butylbenzoyl) resorcinol, benzoylresorcinol, 2,4-di-tert-butylphenyl-3,5-di- tert-butyl-4-hydroxybenzoate, hexadecyl-3,5-di-tert-butyl-4-hydroxybenzoate, octadecyl-3,5-di-tert-butyl-4-hydroxybenzoate, 2-methyl-4,6-di-benzoate, tert-butylphenyl-3,5-di-tert-butyl-4-hydroxybenzoate.
  • the formulations according to the invention may contain up to about 2% by weight, preferably about 1% by weight, of such UV stabilizers in the overall composition.
  • the preparations according to the invention can furthermore contain impact-resistant additives (impact modifiers).
  • Suitable impact-resistant additives are, for example, end-functionalized or non-end-functionalized thermoplastics such as polysulfones, polyphenylsulfones, polyethersulfones (eg Radel and Udel from Solvay, or Ultrason from BASF), polyetheretherketones, polyetherketones, polybutylene terephthalates, polycarbonates, polyetherimides, polyethylene, nylon, polyamideimides , Poly (aryl ether), polyester, polyarylate.
  • end-functionalized or non-end-functionalized thermoplastics such as polysulfones, polyphenylsulfones, polyethersulfones (eg Radel and Udel from Solvay, or Ultrason from BASF), polyetheretherketones, polyetherketones, polybutylene terephthalates, polycarbonates, polyetherimides, polyethylene, nylon, polyamideimides , Poly (aryl ether), polyester, polyarylate.
  • Suitable elastomers which also act as impact modifiers are, for example, EPDM or EPM rubber, polyisobutylene, butyl rubber, ethylene-vinyl acetate, hydrogenated block copolymers of dienes (for example by hydrogenation of SBR, cSBR, SBS, SIS or IR; Example known as SEPS and SEBS), copolymers of styrene, butadiene, and ethylene, or styrene, butylenes, ethylene, butadiene, butyl rubber, neoprene rubber, and poly (siloxanes).
  • Suitable nanoparticles which can likewise be used as impact modifiers are, in particular, those based on silicon dioxide (eg Nanopox of nanoresins), aluminum oxide, zirconium oxide and barium sulfate. They preferably have a particle size of less than 50 nm.
  • suitable nanoparticles based on silica are fumed silicas which are sold under the trade name Aerosil® VP8200, VP721 or R972 by Degussa or the trade names Cab O SiKB ) TS 610, CT 1110F or CT 1110G by CABOT. "Multiwall” and “single-wall” nanotubes with a modified or unmodified surface can also be used.
  • nanoparticles which are in the form of dispersions for example the dispersion which is sold under the trade name High Link® OG 103-31 by the company Clariant Hoechst.
  • Suitable core-shell particles e.g. have a crosslinked silica core and a functionalized shell (e.g., Genioperl from Wacker, Albidur from Nanoresins) or the e.g. having a rubber core (e.g., Zeon, Kaneka) as well as suitable highly functionalized polymers e.g. Polyols, dendritic polymers (e.g., Perstorp's Boltorn) and polyester can also be used.
  • a functionalized shell e.g., Genioperl from Wacker, Albidur from Nanoresins
  • a rubber core e.g., Zeon, Kaneka
  • suitable highly functionalized polymers e.g. Polyols, dendritic polymers (e.g., Perstorp's Boltorn) and polyester can also be used.
  • the preparations according to the invention may contain up to 90% by weight, preferably up to 80% by weight, more preferably up to 50% by weight, of impact-strength additives in the overall composition.
  • preparations of the invention may contain thermal inhibitors, which are intended to prevent premature polymerization.
  • Suitable inhibitors are, for example, hydroquinone, hydroquinone derivatives, p-methoxyphenol, ⁇ -naphthol or sterically hindered phenols such as 2,6-di (tert-butyl) -p-cresol.
  • Suitable dispersants are water-soluble high molecular weight organic compounds bearing polar groups, for example polyvinyl alcohols, polyethers, polyvinylpyrrolidone or cellulose ethers.
  • Suitable emulsifiers may be nonionic emulsifiers and, in some cases, ionic emulsifiers may also be used.
  • thermally activatable initiators may be added selected from organic azo compounds, organic peroxides, C-C cleaving initiators such as benzpinacol silyl ethers, hydroxy imides such as e.g. N-hydroxyphthalimide or N-hydroxysuccinimide.
  • Suitable thermally activatable peroxo compounds which are suitable as initiators include representatives of the various peroxidic compounds, such as disuccinoyl peroxide, potassium peroxodisulfate, cyclohexylsulfonylacetyl peroxide, dibenzoyl peroxide, cyclohexanone peroxide, di-tert-butyl peroxide, dialkyl peroxides, diacyl peroxides, peroxydicarbonates, perketals, peroxycarboxylic acids and their esters, ketone peroxides and / or hydroperoxides.
  • peroxidic compounds such as disuccinoyl peroxide, potassium peroxodisulfate, cyclohexylsulfonylacetyl peroxide, dibenzoyl peroxide, cyclohexanone peroxide, di-tert-butyl peroxide, dialkyl peroxides, diacyl peroxides, per
  • di (3,5,5-trimethylhexanoyl) peroxide didecanoyl peroxide, dilauroyl peroxide, dibenzoyl peroxide, di (2-ethylhexyl) peroxydicarbonate, dicyclohexyl peroxydicarbonate, di (4-tert-butylcyclohexyl) peroxydicarbonate, dimyristyl peroxydicarbonate, diacetyl peroxydicarbonate, di-tert-butyl peroxy oxalate and peroxycarboxylic acid esters from the reaction products between pivalic acid, neodecanoic acid or 2-ethylhexanoic acid and tert-butyl hydroperoxide, tert-amyl hydroperoxide, cumyl hydroperoxide, 2,5-dimethyl-2,5-dihydroperoxy-hexane, 1,3-di (2-hydroxyperoxy
  • the initiators can be used in the preparation according to the invention with other initiators. These may be, for example, photoinitiators known to the person skilled in the art.
  • Suitable preferred photoinitiators are benzophenone, acetophenone, acetonaphthoquinone, methyl ethyl ketone, valerophenone, hexanophenone, .alpha.-phenylbutyrophenone, p-morpholinopropiophenone, dibenzosuberone, 4-morpholinobenzophenone, 4-morpholinodeoxybenzoin, p-diacetylbenzene, 4-aminobenzophenone, 4'-methoxyacetophenone, Methylanthraquinone, tert-butylanthraquinone, anthraquinonecarboxylic acid esters, benzaldehyde, ⁇ -tetralone, 9-acetylphenanthrene, 2-acetylphenanthrene, 10-thioxanthenone, 3-acetylphenanthrene, 3-acetylindole, 9-fluorenone,
  • thermal post-curing accelerator it is preferable to use e.g. Zinnoctoat, zinc octoate, dibutyltin laureate or Diaza [2.2.2] bicyclooctane be used in the inventive preparations.
  • a combination of a thermally activatable initiator and a photochemical initiator is additionally used in the preparations according to the invention. This has the advantage that initiators can be used that are optimized for their field of application.
  • the preparation according to the invention which contains an initiator according to the invention, at least one flame retardant according to the invention and an epoxy resin system according to the invention is preferably non-thermally curable.
  • the nonthermal curing of the preparations is essentially a cationic polymerization process.
  • non-thermal in the present invention is understood to mean radiation-initiated curing, wherein thermal initiation induced by deliberately and actively supplied thermal energy is not included in the "non-thermal" curing can be caused by the radiation-initiated curing thermal energy ,
  • the non-thermal curing is due to the initiators of the invention mainly by a cationic mechanism.
  • the curing of the preparation according to the invention is preferably carried out by blasting with at least one wavelength of 1 mm, preferably at least 780 nm, preferably at least 1 nm, very particularly preferably at least 10 ⁇ m.
  • the preparations according to the invention are preferably curable by radiation selected from x-ray, gamma, electron, UV and / or microwave radiation.
  • a source of UV rays a mercury lamp, a halogen lamp, but also monochromatic radiation in the form of lasers can be used.
  • UV crosslinking preferably takes place by means of short-term ultraviolet irradiation in a wavelength range of 200 to 450 nm, in particular using mercury high pressure or medium pressure lamps at a power of 80 to 240 W / cm.
  • the source of electron beams a system for utilizing thermoelectrons produced by commercially available tungsten filament, a cold cathode method which generates electron beams by passing a high voltage pulse through a metal, and a secondary electron method, the secondary electrons ionized by the collision Gas molecules are generated, and uses a metal electrode, are used.
  • a source of ⁇ -rays ⁇ -rays and v-rays fissile substances, such as Co, can be used.
  • ⁇ -rays a vacuum tube that causes the collision of an accelerated electron with an anode can be used.
  • the radiation can be used either singly or in combination of two or more types of radiation. In the latter case, two or more types of radiation may be used either simultaneously or at certain time intervals.
  • the curing using radiation is preferably carried out at 15 ° C to 50 0 C in a period of 5 seconds to 12 hours, preferably 8 seconds to 4 hours, most preferably 10 seconds to 1 hour.
  • the resulting heat of reaction can heat the samples to much higher temperatures.
  • the radiation used for curing the preparation according to the invention is an ionizing radiation, preferably X-ray and / or electron radiation.
  • the curing of the preparation according to the invention is carried out by cationic polymerization, wherein the polymerization is preferably initiated by the action of electron beams.
  • the curing or polymerization by means of electron beams has the advantage that the rays, depending on the selected irradiation energy, almost completely penetrate the material to be hardened and thus a homogeneous and complete hardening can be better achieved.
  • the high-energy radiation in the presence of cationic initiators releases a large number of cations for the polymerization.
  • curable composition which is curable at 3 eV to 25 MeV, in particular at 6 eV to 20 MeV, preferably at 1 keV to 15 MeV, most preferably at 1 keV to 10 MeV.
  • the preparation according to the invention is cured with a freely selectable irradiation unit of from 1 to 1000 kGy, preferably from 1 to 300 kGy, particularly preferably from 10 to 200 kGy.
  • the preparation is curable at 132 kGy in 4 steps a 33 kGy.
  • a combination of thermal and non-thermal curing can also be carried out.
  • a non-thermal curing step may be performed first, followed by a thermal curing step.
  • the hardening can also take place under protective gas.
  • any gas which is inert with respect to the chemicals used is suitable as protective gas.
  • gases such as N 2 , CO 2 or Ar come into question.
  • inexpensive gases such as CO 2 and N 2 .
  • CO 2 has the advantage that it collects at the bottom of vessels and thus is easy to handle.
  • Suitable shielding gases are, in particular, non-toxic and nonflammable.
  • Another object of the present invention relates to the aforementioned use of the inventive composition as adhesives, composite materials, sealants, materials and / or for the coating of surfaces.
  • such a preparation according to the invention can be applied as a coating composition to a surface and then cured.
  • Particularly preferred substrates are wood, paper, textile, leather, fleece, plastics (polycarbonate, polymethacrylate, polystyrene, polyester, polyolefin, epoxy resins, melamine resins, triacetylcellulose resins, ABS resins, AS resins, norbornene resins, etc.), glass, ceramics, Paper, mineral building materials, such as cement blocks and fiber cement boards, metals or coated metals suitable.
  • the substrate may also be a plate, a film or a three-dimensionally shaped body.
  • composition in this case as a coating composition
  • various application methods can be used, such as spraying, flow coating, knife coating, brushing, pouring, dipping, soaking, trickling, rolling, shatter coating or dip coating.
  • the substrate to be coated can rest as such, wherein the application device or Dstrom is moved.
  • Another object of the present invention is the already mentioned method for curing the preparation according to the invention, comprising the steps a. Providing a curable preparation, b. Irradiation of said preparation with radiation sufficient to cure said preparation and the cured product as such, obtained by non-thermal curing of the preparation according to the invention, preferably by the method mentioned above.
  • said cured product is a coating, a film, a material, a composite material, an adhesive and / or a sealant.
  • the starting material for the silver-alkene complexes was the commercially available AgSbF 6 (Aldrich, 98% or Chempur, 95 +%).
  • the synthesis of the complexes was carried out in accordance with methods known from the literature (HW Qinn, RL Van Gilder, Can. J. Chem. 1970, 48, 2435, A. Albinati, SV Meille, G. Carturan, J. Organomet. Chem., 1979, 182 , 269, H. Masuda, M. Munakata, S. Kitagawa, J. Organomet Chem 1990, 391, 131, AJ Canty, R. Colton, Inorg., Chim. Acta 1994, 220, 99).
  • the respective metal chloride was first reacted with AgSbF 6 in a suitable solvent such as methanol, the precipitated AgCl was separated by filtration and the resulting solution of the metal hexafluoroantimonate was reacted with the respective ligand. Thereafter, the solvent was removed and the compound was dried under high vacuum.
  • a suitable solvent such as methanol
  • Example 2a Typical synthesis of a phosphonium hexafluoroantimonate from the corresponding halides by ion exchange
  • the solid is taken up in 100 ml of DMF and a solution of 26.2 g (100 mmol) of triphenylphosphine in 40 ml of DMF is added.
  • the reaction mixture is stirred at 140 ° C. for 16 h. After cooling to room temperature, the mixture is first decanted off, then centrifuged off and the product is washed three times with 40 ml of DMF and twice with 25 ml of diethyl ether each time. Finally, it is dried in vacuo at 50 ° C. and the yield is 28 g (22 mmol, 88%).
  • a mixture of the inventive epoxy resin system (40 wt .-% to 95 wt .-%), the flame retardant of the invention (0.01 wt .-% to 50 wt .-%) and the initiator of the invention (0.1 wt .-% to 10 wt .-%) and optionally further additives is homogenized with stirring and, if appropriate, a slight heat input within 1 to 100 min.
  • the epoxy resin Novolak DEN 431 from Dow Chemical Co., 100 parts by weight
  • the respective hexafluoroantimonate of the phosphonium salts as flame retardant additive (10 or 20 parts by weight) according to formula V to XII are combined and stirred (1-2 Minutes) at 50 0 C mixed.
  • the photoinitiator ⁇ [Ag (1, 7-octadiene) i 5] (SbF 6) ⁇ P (2 parts by weight) is then added at 50 0 C and homogenized preparation under stirring.
  • the preparations are in aluminum bowls with the dimensions 7x3, 5 ⁇ 3 cm
  • Electron beam energy of 10 MeV The total dose of 132 kGy is introduced in 33 kGy increments.
  • Example 4 Fire behavior tests by UL94-VB test
  • the electron beam hardened resin plates (3 mm sample thickness) are demolded, sawed and with

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