WO2009026284A2 - Coating composition and article using the same - Google Patents
Coating composition and article using the same Download PDFInfo
- Publication number
- WO2009026284A2 WO2009026284A2 PCT/US2008/073584 US2008073584W WO2009026284A2 WO 2009026284 A2 WO2009026284 A2 WO 2009026284A2 US 2008073584 W US2008073584 W US 2008073584W WO 2009026284 A2 WO2009026284 A2 WO 2009026284A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- fluoropolymer
- coating composition
- coating
- article
- solvent
- Prior art date
Links
- 239000008199 coating composition Substances 0.000 title claims abstract description 92
- 229920002313 fluoropolymer Polymers 0.000 claims description 159
- 239000004811 fluoropolymer Substances 0.000 claims description 158
- 239000002904 solvent Substances 0.000 claims description 45
- 239000011247 coating layer Substances 0.000 claims description 33
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 claims description 19
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 15
- HCDGVLDPFQMKDK-UHFFFAOYSA-N hexafluoropropylene Chemical group FC(F)=C(F)C(F)(F)F HCDGVLDPFQMKDK-UHFFFAOYSA-N 0.000 claims description 13
- -1 polytetrafluoroethylene Polymers 0.000 claims description 10
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 10
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 10
- 239000002033 PVDF binder Substances 0.000 claims description 5
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 claims description 5
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 5
- 229920001780 ECTFE Polymers 0.000 claims description 3
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 claims description 3
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 claims description 3
- PEVRKKOYEFPFMN-UHFFFAOYSA-N 1,1,2,3,3,3-hexafluoroprop-1-ene;1,1,2,2-tetrafluoroethene Chemical compound FC(F)=C(F)F.FC(F)=C(F)C(F)(F)F PEVRKKOYEFPFMN-UHFFFAOYSA-N 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229920013653 perfluoroalkoxyethylene Polymers 0.000 claims description 2
- 238000000576 coating method Methods 0.000 abstract description 67
- 239000011248 coating agent Substances 0.000 abstract description 63
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 37
- 230000015556 catabolic process Effects 0.000 abstract description 9
- 238000006731 degradation reaction Methods 0.000 abstract description 9
- 239000002245 particle Substances 0.000 description 33
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 27
- 238000001035 drying Methods 0.000 description 20
- 239000010410 layer Substances 0.000 description 14
- 239000000463 material Substances 0.000 description 14
- 238000004078 waterproofing Methods 0.000 description 14
- 229920001577 copolymer Polymers 0.000 description 12
- 239000000203 mixture Substances 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 229920005989 resin Polymers 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 8
- 229910052731 fluorine Inorganic materials 0.000 description 8
- 239000011737 fluorine Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 238000007789 sealing Methods 0.000 description 8
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 7
- 238000003618 dip coating Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 6
- 239000000654 additive Substances 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 6
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 5
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 5
- YLQBMQCUIZJEEH-UHFFFAOYSA-N Furan Chemical compound C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 4
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 4
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 4
- 230000002411 adverse Effects 0.000 description 4
- 238000000149 argon plasma sintering Methods 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 229920001973 fluoroelastomer Polymers 0.000 description 4
- 239000002798 polar solvent Substances 0.000 description 4
- SKYXLDSRLNRAPS-UHFFFAOYSA-N 1,2,4-trifluoro-5-methoxybenzene Chemical compound COC1=CC(F)=C(F)C=C1F SKYXLDSRLNRAPS-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 150000001336 alkenes Chemical class 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 238000005868 electrolysis reaction Methods 0.000 description 3
- 239000003759 ester based solvent Substances 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 239000005453 ketone based solvent Substances 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 229920011301 perfluoro alkoxyl alkane Polymers 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- DZCLVBQEPZQZNN-UHFFFAOYSA-N copper;phenol Chemical compound [Cu].OC1=CC=CC=C1 DZCLVBQEPZQZNN-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 238000004382 potting Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000000790 scattering method Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- HUAUNKAZQWMVFY-UHFFFAOYSA-M sodium;oxocalcium;hydroxide Chemical compound [OH-].[Na+].[Ca]=O HUAUNKAZQWMVFY-UHFFFAOYSA-M 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000010186 staining Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- JJRUAPNVLBABCN-UHFFFAOYSA-N 2-(ethenoxymethyl)oxirane Chemical compound C=COCC1CO1 JJRUAPNVLBABCN-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 241000270728 Alligator Species 0.000 description 1
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 1
- PYVHTIWHNXTVPF-UHFFFAOYSA-N F.F.F.F.C=C Chemical compound F.F.F.F.C=C PYVHTIWHNXTVPF-UHFFFAOYSA-N 0.000 description 1
- 241001282110 Pagrus major Species 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000003667 anti-reflective effect Effects 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 235000006708 antioxidants Nutrition 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 239000007844 bleaching agent Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000007809 chemical reaction catalyst Substances 0.000 description 1
- UUAGAQFQZIEFAH-UHFFFAOYSA-N chlorotrifluoroethylene Chemical group FC(F)=C(F)Cl UUAGAQFQZIEFAH-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013068 control sample Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000010981 drying operation Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 238000009408 flooring Methods 0.000 description 1
- 239000007850 fluorescent dye Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- SPNAQSNLZHHUIJ-UHFFFAOYSA-N s-[4-[4-(2-methylprop-2-enoylsulfanyl)phenyl]sulfanylphenyl] 2-methylprop-2-enethioate Chemical compound C1=CC(SC(=O)C(=C)C)=CC=C1SC1=CC=C(SC(=O)C(C)=C)C=C1 SPNAQSNLZHHUIJ-UHFFFAOYSA-N 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000007655 standard test method Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D127/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
- C09D127/02—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
- C09D127/12—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
- C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/04—Provision of filling media
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0212—Resin particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Definitions
- the present disclosure relates to a coating composition and an article using the same.
- a coating composition using a fluoropolymer has conventionally been known, and is widely used because of the performance properties such as waterproofing.
- JP Publ. No. 6-116531 describes a fluorine-based polymer-containing topcoating material for aqueous coating film, which is used to impart waterproofing properties to architectural structures such as a roof, a veranda, and a bath.
- This aqueous topcoating material is a composite waterproofing layer comprising layer of waterproofing coating film comprising an aqueous vinyl acetate-based copolymer dispersion solution (component A) and a cement binder and a coating film layer comprising a component A, a fluoropolymer dispersion solution, and a pigment.
- JP Publ. Nos. 57-34107 and 57-34108 describe a fluorine-containing copolymer capable of being dissolved in an organic solvent used to exhibit waterproofing properties in a baking coating material and other coating materials. Furthermore, JP Publ. No. 8-217993 describes a fluid repellant coating material comprising particles of a low molecular weight ethylene tetrafluoride resin and a binder resin, which is useful for coating on an automobile body and tableware.
- JP Publ. No. 5-152067 describes an EL (electroluminescent) light emitting element in which a light emitting portion is sealed with a protective layer, the protective layer comprising a waterproofing coating layer formed of a fluorine-based monomer coated on the entire perimeter of the light emitting portion, and a waterproofing layer formed of material sold under the trade designation "TEFLON" or a silicone tube.
- a protective layer comprising a waterproofing coating layer formed of a fluorine-based monomer coated on the entire perimeter of the light emitting portion, and a waterproofing layer formed of material sold under the trade designation "TEFLON" or a silicone tube.
- JP Publ. No. 2003-114304 discloses an antireflective film comprising a transparent substrate and at least a single light scattering layer formed on the transparent substrate, which is not directly involved in a coating composition which imparts waterproofing properties.
- JP Publ. No. 2003-114304 describes a light scattering layer containing translucent fine particles and a translucent resin and a difference in a refractive index between the translucent fine particles and the translucent resin of 0.02 or more and 0.15 or less.
- Polystrene beads also are included as the translucent fine particles and bis(4-methacryloylthiophenyl)sulfide is included as the translucent resin. It is described that the difference in the refractive index is adjusted so as to obtain a preferable light scattering angle.
- LEDs light emitting diodes
- traffic signal devices already use large and strong housing to maintain high waterproofing properties
- the electric bulbs and fluorescent lamps used in these devices have been replaced with LEDs to achieve energy savings and reduce maintenance cost.
- LED use in an automobile red tail lights also has being increasing.
- an LED itself is in the form of a portable chip
- luminescent devices such as traffic signal devices
- a large-sized pedestal is required to install the LED chip
- a large-sized transparent housing or cover is required to provide waterproofing capability.
- LEDs used in a lighting devices in for example the lighting of an express highway and exterior lighting could be turned on during the night to achieve further energy savings.
- a luminescent device such as a traffic signal device or an exterior lighting system, which are durable, not bulky, and are waterproof. Additionally, it is desirable that, after coating an apparatus with a waterproofing coating composition, the inside of the apparatus is transparent for ease in subsequent repairing.
- a conventional waterproofing coating material has insufficient insulating properties and is inferior in ultraviolet degradation resistance, which limits its use outdoors.
- a coating composition having excellent water resistance, insulating properties, and ultraviolet degradation resistance, which seals a conductive portion of wiring, electric contacts, and electric wire to provide devices, such as luminescent devices, which are durable, not bulky, and waterproof.
- the present disclosure includes the following aspects.
- a coating composition comprising a fluoropolymer A, a fluoropolymer B and a solvent wherein the fluoropolymer A is soluble in the solvent, and the fluoropolymer B is granular and is insoluble in the solvent.
- conductive portion includes any electrically connecting means used to constitute the article of the present disclosure, as is easily understood by the following description. Examples of suitable electrically connecting means include, but are not limited to, electric contact such as electric/electronic circuit, electric wiring, conductor wire, flip chip, and bump. In the present disclosure, antenna is also defined as “conductive portion”.
- a functional element includes optional parts which can actively or passively function in an electronic device and other apparatuses.
- Typical examples of the functional device include, but are not limited to, a light emitting device such an LED chip, a semiconductor element such as an IC (integrated circuit) chip or an LSI (lightening imaging sensor) chip, a capacitor (condenser), a reactor, a inductor, and a resistor.
- Fig. 1 is a plan view (A) and a sectional view (B) which show one example of a circuit board comprising an LED chip installed therein according to the present disclosure;
- Fig. 2 is a plan view (A) and a sectional view (B) which show another example of a circuit board comprising an LED chip installed therein according to the present disclosure
- Fig. 3 is a plan view (A) and a sectional view (B) which show another example of a circuit board comprising an LED chip installed therein according to the present disclosure
- Fig. 4 is a perspective view (A) of a substrate used in a water resistance test.
- Fig. 5 a top view (A) and a side view of a substrate using a bullet-shaped LED including long pins.
- a coating composition which can easily form a sealing layer (hereinafter referred to as a "coating layer” in the present disclosure) is provided.
- the coating composition can also impart excellent water resistance, insulating properties and durability, particularly ultraviolet degradation resistance, which are derived from physical properties of the coating layer, to the resulting sealed article.
- the present disclosure contains solvent insoluble fluoropolymer particles and therefore can properly improve the viscosity without shortening a working life up to drying of a coating composition. Therefore, it becomes easy to perform thick coating of the coating composition and a thick transparent coating membrane can be formed by a single coating operation.
- this coating composition is easily prepared, for example, by dissolving a fluoropolymer in a solvent and dispersing fluoropolymer particles and therefore can be coated by simple coating means such as brush coating or dip coating.
- this coating composition can be easily coated even on a medium having an irregular surface, for example, a circuit board comprising an LED chip mounted on a surface, or a semiconductor substrate comprising an LSI chip installed therein.
- the resulting coating layer has excellent water resistance, insulating properties and durability, particularly ultraviolet degradation resistance, it is possible to provide various articles utilizing these excellent characteristics, for example, in an LED device of an outdoor advertising device, a traffic signal device, a electroluminescence device, other electric device, a lighting system, and a coated electric wire.
- the article of the present disclosure can be continuously used for about 10 years without causing deterioration of characteristics and damage.
- the coating composition of the present disclosure contains a fluoropolymer as a base, it is possible to impart other good characteristics: such as excellent water resistance, insulating properties, and durability (particularly ultraviolet degradation resistance and heat resistance and oil resistance or staining resistance) to the resulting article.
- the article of the present disclosure has very excellent water resistance (Japanese Industrial Standard C0920 (corresponding to IEC60529) protection class 7 or higher class (immersion-proof type): level in which immersion of water in an amount enough to exert an adverse influence even when immersed in water in a depth of 15 cm to 1 m for 30 minutes), and thus it becomes possible to use under conditions closer to the use in water.
- a luminescent device requiring a DC power supply such as the devices using an LED
- resistance to water namely, water resistance is important as compared with conventional luminescent devices that use, for example, an electric bulb or a fluorescent lamp, which require an AC power supply.
- the coating composition of the present disclosure is remarkably excellent in water resistance, when the coating composition is applied to an LED and the resulting LED is placed outdoors, or placed in a location where an LED is likely to be wetted, a location where humidity is high or the position where dew condensation may occur, the LED does not deteriorate and it does not become impossible to use. Since durability, particularly ultraviolet degradation resistance, is added to these features, market expansion can be expected in the future in other articles of the present disclosure and portions thereof (for example, surface of woods, surface of paper materials, surface of cloth materials, surface of flooring materials).
- the present disclosure provides a coating composition, and an article, for example, an LED device, various electric devices, and an antenna, in which the conductive portion such as wiring, electric contact or electric wire is sealed by coating with the coating composition,.
- a coating composition is prepared by dispersing particles of a fluoropolymer (fluoropolymer B) which is insoluble in a solvent, into a coating composition comprising substantially a fluoropolymer (A) which is soluble in a solvent and the solvent containing the fluoropolymer dissolved therein.
- fluoropolymer which is soluble in a solvent means a fluoropolymer in which a mixture of a solvent and a solute made of a fluoropolymer exhibits a stable, single and uniform liquid state in a macroscopic state.
- fluoropolymer which is insoluble in a solvent means a fluoropolymer which is dispersed in a solvent.
- a difference between a refractive index of the fluoropolymer A and a refractive index of the fluoropolymer B is preferably less than
- the fluoropolymer A used in the present disclosure may exhibit various characteristics, such as the molecular structure and fluorine atoms contained in the molecule that are useful.
- the fluoropolymer A is, for example, substantially transparent and does not exert an adverse influence on light transmission.
- fluoropolymer A has, as particuliar characteristics, water resistance, insulating properties, durability including ultraviolet degradation resistance, heat resistance and oil resistance (staining resistance).
- the fluoropolymer A of the present disclosure can be easily dissolved in a solvent and therefore can be easily applied by coating. Particularly, since fluoropolymer
- a and the solvent used in the present disclosure does not necessarily need to be heated to dissolve the fluoropolymer, not only are the handling properties noticeably improved, but also the range of the use of fluoropolymer A is increased.
- it is required to increase film strength by using additives in the coating composition such as a reaction catalyst or a crosslinking agent to introduce a crosslinked structure so as to form a fluororesin coating.
- additives in the coating composition such as a reaction catalyst or a crosslinking agent to introduce a crosslinked structure so as to form a fluororesin coating.
- additives in the present disclosure it is not necessary to use such additives which can react to crosslink the fluoropolymer.
- the fluoropolymer A is not specifically limited as long as it has excellent characteristics described above and also sufficiently exhibits these characteristics in the resulting coating composition and article, and includes various fluorine-based reins and fluorine-based rubbers.
- the molecular weight of the fluoropolymer A can vary within a wide range, but is commonly about 10,000 or more. When the molecular weight is less than 10,000, it may become impossible to form a resin film after drying the coating composition.
- the molecular weight of the fluoropolymer A is preferably within a range from about 50,000 to 200,000, and more preferably from about 50,000 to 150,000.
- the molecular weight of the fluoropolymer A means a molecular weight obtained by ASTM D4001-93 (2006): Standard Test Method for Determination of Weight- Average Molecular Weight of Polymers by Light Scattering.
- Fluoropolymer A includes partially fluorinated and perfluorinated polymers including fluoroplastics and fluoroelastomers.
- fluoropolymer A of the present disclosure include, but are not limited to, FEVE- (fluoroethylene-alkyl vinyl ether alternative copolymer), PVDF- (polyvinylidene fluoride) and THV-based fluoropolymers. These fluoropolymers may be used alone or in combination.
- the FEVE-based fluoropolymer is, for example, a fluorine-containing copolymer which contains olefin, cyclohexyl vinyl ether, alkyl vinyl ether, and hydroxyalkyl vinyl ether as essential constituent components, wherein the copolymer may be partially fluorinated or perfluorinated.
- the contents of olefin, cyclohexyl vinyl ether, alkyl vinyl ether and hydroxyalkyl vinyl ether are respectively from 40 to 60 mol% (mole %), 5 to 45 mol%, 3 to 15 mol% and 0 to 30 mol%.
- olefin a perhaloolefm, chlorotrifluoroethylene or tetrafluoroethylene may be used.
- FEVE -based fluoropolymer is a fluorine-containing copolymer containing, as essential constituent components, fluoroolefm, cyclohexyl vinyl ether, and glycidyl vinyl ether.
- the VDF-based fluoropolymer may be a rubber (elastomer)-based fluoropolymer or a plastic.
- the VDF-based fluoropolymer is a rubber-based fluoropolymer, it includes for example, a copolymer of vinylidene fluoride (VDF), tetrafluoroethylene (TFE), and propylene; a fluororubber comprising a copolymer of VDF and hexafluoropropylene (HFP); and a fluororubber comprising a copolymer of VDF, HFP, and TFE.
- VDF-based fluoropolymer is a plastic-based fluoropolymer, it includes for example, VDF polymer and VDF-TFE copolymer.
- the fluoropolymer A may be a fluoropolymer containing at least HFP and VDF.
- a fluoropolymer is typically a binary fluoropolymer comprising HFP and VDF, or a fluoropolymer comprising at least TFE, HFP and VDF, for example a ternary fluoropolymer comprising the above monomers (e.g., THV).
- THV-based fluoropolymers some THV-based fluoropolymers are easily dissolved in a solvent and have excellent characteristics such as water resistance, insulating properties and ultraviolet degradation resistance.
- the fluoropolymer can be coated on the non-flat surface of a circuit board by a simple method such as brush coating or dip coating and a thick coating film can be easily formed by multiple coating.
- a composition ratio of TFE, HFP, and VDF of the fluoropolymer can vary within a wide range.
- a fluoropolymer having excellent fluidity, excellent processability and low permeability of moisture is desired.
- fluoropolymer A contains about 36 to 72% by weight of TFE, about 0 to 56% by weight of HFP and about 30 to 65% by weight of VDF is preferable.
- fluoropolymer A having a preferable composition ratio as disclosed above has the following advantages, namely, it maintains chemical resistance similar to that of PTFE (polytetrafluoroethylene), has a low substance permeability, a crystallinity of about 30%, which cannot be attained by a conventional fluororubber, and flexibility.
- PTFE polytetrafluoroethylene
- a fluoropolymer, such a fluoropolymer A can easily follow the deformation when applied to a flexible circuit board because of the flexibility and also defects such as cracks do not occur. Therefore, it can be advantageously used to produce a down-sized electronic device with a complicated arrangement of constituent components.
- THV-based fluoropolymer containing about 36 to 72% by weight of TFE, about 0 to 56% by weight of HFP and about 8 to 45% by weight of VDF was compared with a conventional fluororesin, and the following results were obtained.
- FEP perfluoroethylene-propylene copolymer
- PVDF polyvinyldene fluoride
- ETFE ethylene-tetrafluoroethylene copolymer
- THV-based fluoropolymer is commercially available, for example, from Dyneon Co., Oakdale, MN sold under the trade designation of "DYNEON” THV 220, "DYNEON” THV 415, “DYNEON” THV 500.
- THV220 is particularly useful and has such characteristics: melting point of 12O 0 C, glass transition point at 5 0 C, flame retardancy V-O (in accordance with UL-94), low moisture vapor transmission, and a refractive index of 1.36.
- the coating composition comprises a solvent and a proper amount of fluoropolymer A dissolved in the solvent.
- the solvent is not specifically limited as long as the solvent can easily dissolve fluoropolymer A and does not exert an adverse influence on the characteristics of the resulting coating composition and article.
- the solvent is preferably a ketone-based solvent, an ester-based solvent, a furan-based solvent, or a polar solvent. These solvents may be used alone or in combination.
- solvents that are suitable such as those that dissolve THV-based fluoropolymers include ketone-based, ester-based, and polar solvents.
- ketone-based solvent include: acetone (dimethyl ketone), MEK (methyl ethyl ketone), diethyl ketone, and MIBK (methyl isobutyl ketone).
- ester-based solvent include methyl acetate, ethyl acetate, and butyl acetate.
- An example of the furan-based solvent includes THF (tetrahydrofuran).
- An example of the polar solvent includes NMP (N-methyl-2-pyrrolidone).
- polar solvents such as NMP (N-methyl-2-pyrrolidone), DMAC (dimethylacetamide), DMSO (dimethyl sulfoxide), and DMF (N,N-dimethylformamide)
- MIBK methyl isobutyl ketone
- Fluoropolymer A can be used in the amount of about 25% by weight or less, and preferably from about 5 to 20% by weight, based on the weight of the coating composition excluding a fluoropolymer which is insoluble in the solvent (fluoropolymer B). More preferably, fluoropolymer A can be used in the amount of about 10 to 15% by weight.
- fluoropolymer A is less than 1% by weight, a composition having a viscosity suited for coating cannot be obtained and the coating film cannot exhibit various characteristics derived from the fluoropolymer.
- the amount of fluoropolymer A is more than 20% by weight, a composition having viscosity suited for coating cannot be obtained and only a composition having a low strength and inferior characteristics is obtained.
- a fluoropolymer (fluoropolymer B), which is granular and insoluble in the solvent, is added and dispersed in a solution of fluoropolymer A and solvent.
- fluoropolymer B makes it possible to adjust to the viscosity, which in turn, enables a thick coating to be applied through a single coating operation.
- the coating composition may be designed to achieve optimal coating thickness and appropriate drying time.
- the concentration of fluoropolymer A was increased to achieve a thicker coating, without adding the fluoropolymer B, the viscosity of the resulting composition would rapidly increase, however, the resulting composition cannot be easily coated, and is more difficult to handle because of the drying time is too short.
- the amount of particles of fluoropolymer B is preferably from 50 to 150% in terms of the dry weight of particles of the fluoropolymer B to the dry weight of particles of the fluoropolymer A.
- the percentage of fluoropolymer B particles is too small, the effect of the addition of fluoropolymer B is not exerted.
- the percentage of fluoropolymer B is too large, voids are formed because of the insufficient amount of fluoropolymer A, which serves as a continuous matrix after the drying of the coating composition.
- fluoropolymer B examples include: PTFE-based particles, THV-based particles, PFA-based particles, FEP-based particles, ETFE-based particles, VDF-based particles, PCTFE (polychlorotrifluoroethylene)-based particles, and ECTFE (ethylene- chlorotrifluoroethylene copolymer)-based particles, and combinations thereof. Also, the difference between the refractive index of fluoropolymer A and the refractive index of fluoropolymer B is less than 0.15. Similarity of the refractive index between fluoropolymers A and B can allow for transparency of the coating film after drying the coating composition.
- the refractive index of fluoropolymer A and the refractive index of fluoropolymer B is not specifically limited, but the difference between them is less than 0.15.
- fluoropolymer A is a THV-based polymer (with a refractive index of about 1.36) and a large amount of PTFE particles (refractive index: 1.35) and
- TFE particles is added to the fluoropolymer A and solvent solution, one can achieve a dried coating composition with good transparency.
- the refractive index is measured by ISO 489 (1999): Plastics-Determination of refractive index.
- the particle size of fluoropolymer B is not specifically limited, but is commonly from 1 to 1,000 ⁇ m. When the particle size is too small, it becomes difficult to achieve thick coatings easily. On the other hand, when the particle size is too large, it may become difficult to achieve transparency and smoothness of the film coating.
- the particles of fluoropolymer B preferably have a high transparency so as to allow transparency of the coating film obtained from the coating composition. Transparency can be obtained by decreasing the particle size in the case of PTFE-based particles.
- the particle size can be measured by a laser scattering method in accordance with ISO13320-1 (1999-11-01).
- the coating composition of the present disclosure comprises at least three components, for example, a solvent, a fluoropolymer which is soluble in the solvent (fluoropolymer A) and a fluoropolymer which is insoluble in the solvent (fluoropolymer B), but may optionally contain additives.
- Additives are commonly used in coating compositions to aid in preparation or to impart additional characteristics to the resulting composition.
- Preferable additives include, for example, surfactants, coloring agents having transparency, fluorescent dyes, whitening agents, anti-oxidants, and ultraviolet absorbers.
- the coating composition of the present disclosure can be prepared by dissolving fluoropolymer A and optional additives in a solvent, and adding fluoropolymer B to the solution.
- the resulting coating solution has the desired viscosity and therefore can be coated on the surface of an article using conventional techniques such as brush coating, dip coating, or spray coating.
- a sealing portion may be formed by dropping the coating solution in a predetermined portion using a technique such as potting.
- the coating solution may be coated by single or plural coating operations depending on the viscosity of the composition. However, since the viscosity may be adjusted by the addition of fluoropolymer B, a thick coating can be achieved in a single coating operation. The single coating operation may also reduce opacity caused by inclusion of air at the interface between layers in the case of multiple coating operations.
- the resulting coating film is cured by drying.
- the drying operation may be performed at ambient temperature and, if necessary, drying may be accelerated using a heater or an oven.
- the thickness of a coating film after drying namely, a coating layer (or a sealing layer), with which the surface of an article is coated, varies depending on the amount of a coating solution and the number of coatings.
- the thickness of the coating layer is commonly at least about 10 ⁇ m (micrometer) and, for example, about 100 ⁇ m or more. Since fluoropolymer particles (fluoropolymer B) are added to the coating composition of the present disclosure, the thickness of the coating layer can be controlled to 0.5 mm
- the coating composition of the present disclosure has remarkable characteristics such as light transmission and/or diffusion, water resistance, ultraviolet stability, and coating ability. Therefore the coating composition of the present disclosure may be used to coat various articles, for example, to form a coating layer or a sealing layer.
- the coating layer or a sealing layer can be formed over a conductive portion of an article.
- the coating composition of the present disclosure can be used to coat an article, thereby sealing the conductive portion included in the article. Since the exposed portion (electric circuit, wiring, antenna, etc.) can be protected from moisture, ultraviolet light, or other surrounding adverse influences, the article including the conductive portion coated with the coating composition of this disclosure may be stably maintained for a long period of time. Further, use of the coating composition of this disclosure may also enable the downsizing of articles, such as traffic signaling devices, because sufficient water resistance can be achieved via the coating composition, eliminating the use of bulky housings, a hood or the like.
- the present disclosure also provides an article comprising an object with a conductive portion, and a coating layer formed of the coating composition of the present disclosure wherein at least the conductive portion is sealed.
- the article of the present disclosure can include various objects with a conductive portion. Typical examples thereof include, but are not limited to: an LED device in which an LED element of the LED device and a conductive portion connected to the LED element are at least sealed with the coating layer of the present disclosure, a flexible circuit board comprising a functional element mounted on a surface (also referred to as a print circuit board) in which the functional element of the circuit board and a conductive portion connected to the functional element are at least sealed with the coating layer of the present disclosure, an electronic device comprising a functional element installed therein in which the functional element of the device and a conductive portion connected to the functional element are at least sealed with the coating layer of the present disclosure, a coated electric wire in which an exposed electric wire of the electric wire is at least sealed with the coating layer of the present disclosure, and an antenna which is coated with the coating layer of
- the LED device includes, for example, a traffic signal device (for example, road signal device, railway signal device, construction signboard with signal lamp, etc.), an EL panel (for example, rise-and-fall type large-sized EL panels, information board, an on-vehicle traffic signal device, ringlight, etc.), a road traffic sign (for example, direction board, traffic jam display panel, guidance light for tunnel driving, etc.), an advertising medium (for example, large-sized LED television, advertising light, pole sign, internally illuminated EL signboard, channel letter, edge light, etc.) and an on-vehicle light.
- a traffic signal device for example, road signal device, railway signal device, construction signboard with signal lamp, etc.
- an EL panel for example, rise-and-fall type large-sized EL panels, information board, an on-vehicle traffic signal device, ringlight, etc.
- a road traffic sign for example, direction board, traffic jam display panel, guidance light for tunnel driving, etc.
- an advertising medium for example, large-
- the circuit board includes: a rigid print circuit board made of a phenol resin including cellulose, an epoxy resin including glass fibers or a fluororesin (PTFE, etc.); and a flexible print circuit board made of a polyimide resin or a hydrocarbon-based resin (PE, PP, etc.), an LED chip or a semiconductor chip being installed on the surface.
- the base material is commonly formed of a flexible film, and can be formed of an acrylic resin, a polyester resin, a polyurethane resin, a polyvinyl chloride resin or a hydrocarbon-based resin, in addition to a polyimide resin.
- the conductive portion such as wiring, circuit, and contact on the base material can be formed with an optional pattern using the same technique as that employed commonly to produce a print circuit board.
- a wiring pattern layer such as wiring can be formed from a conductive metal such as copper, nickel, gold, silver or aluminum or an alloy thereof using a technique such as vacuum deposition or inkjet printing.
- the wiring pattern layer may be formed by applying a conductor film on the entire surface of a film base material and selectively etching the conductor film. If necessary, the wiring pattern layer may be formed using a technique such as soldering.
- Figs. 1 to 3 each show an example of a linear light comprising a circuit board comprising an LED chip installed therein. In a plan view of the respective drawings, a coating layer 5 is shown in a hatched line so as to help an understanding of the arranged state.
- Fig. 1 shows a linear light in which an LED chip 3 is installed on a surface of a circuit board 1 made of an epoxy resin including glass fibers.
- the LED chip 3 can emit white light.
- a copper wiring 2 is exposed and a covered lead wire 6 is connected to the copper wiring and is fixed using solder 4.
- the copper wiring 2 and the connection portion between the copper wiring 2 and the lead wire 6, and the LED chip 3 is sealed with the coating layer 5 so as to coat them.
- the coating layer 5 can be easily formed by dropping the coating composition of the present disclosure in a spot-like manner using a drop method and curing the coating composition.
- the coating composition of the present disclosure is applied only to a portion, which must be coated, of the surface of the circuit board 1.
- Adhesion of the coating composition to the circuit board 1 is very high and the coating layer 5 does not peel off during use. Water resistance, insulating properties, and durability of the circuit board can be further improved by coating the coating composition on the entire surface of one surface of the circuit board 1.
- Fig. 2 shows one modification of the circuit board shown in Fig. 1.
- the coating composition of the present disclosure is applied to the entire top surface of circuit board 1, including the LED chip 3.
- the coating composition can be applied by a spray-coating method. Adhesion of the coating composition to circuit board 1 is very high and the coating layer 5 does not peel off during use.
- Fig. 3 shows another modification of the circuit board 1 shown in Fig. 1.
- the coating composition of the present disclosure is uniformly coated on the entire surface (top, bottom, and sides) of the circuit board 1 to form a coating layer 5.
- the coating composition can be applied by a dip-coating method. Adhesion of the coating composition to the circuit board 1 is very high and the coating layer 5 does not peel off during use.
- the coating composition of the present disclosure can be used to protect or seal an exposed portion of electric wire (not shown).
- electric wire is commonly covered with a vinyl chloride resin.
- the vinyl chloride resin is peeled away to a required position to expose the electric wire.
- the coating composition of the present disclosure can be used to coat the now exposed electric wire to protect the exposed electric wire from external influences (e.g., moisture).
- the surface of various antennas can be coated with the coating composition of the present disclosure to protect the antennas. The antennas may be continuously used for a long period while maintaining excellent characteristics of the antenna without the occurrence of defects.
- Fluoroopolymer A was a copolymer of TFE, HFP and VDF sold under the trade designation "DYNEON” THV 220A by Dyneon LLC, Oakdale, MN and MEK was used as a solvent.
- Fluoropolymer B was a PTFE powder sold under the trade designation "DYNEON” Micropowder TF 9205 by Dyneon LLC, Oakdale, MN.
- DYNEON THV 220A is a fluoropolymer having a molecular weight of more than 10,000.
- DYNEON Micropowder TF 9205 has an average particle size measured by a laser scattering method is 8 ⁇ m. With respect to coating compositions having various concentrations, the drying time and viscosity were measured. Method for measurement of drying time
- fluoropolymer A was added to the solvent at room temperature (25 0 C) and dissolved by mixing to obtain a coating composition containing no fluoropolymer B.
- fluoropolymer B was further added, followed by stirring to obtain a uniform dispersion solution.
- 0.5 ml of the coating composition was spread over a horizontal glass plate in a shape of a circle having a diameter of about 30 mm (25 to 30 mm).
- the coating would feel dry to the touch, there may still be fluid underneath the surface and the coating may feel elastic.
- the time, at which the coating no longer feels elastic was recorded as the total drying time. Measurement of viscosity
- the viscosity of the coating composition was measured according to JISK6833 (fiscal 1994) using a viscometer manufactured by Tokyo Keiki Co., Ltd.
- Example 3 was preformed in the same manner as Example 2, except that the particle size of DYNEON THV610 was classified as between 125 to 250 ⁇ m.
- Example 4 was preformed in the same manner as Example 2, except that the particle size of DYNEON THV610 was classified as between 125 to 250 ⁇ m and butyl acetate was used in place of MEK as the solvent.
- Example 5 was preformed in the same manner as in Example 2, except that fluoropolymer B was a PTFE fluorine resin particulate sold under the trade designation "DYNEON” TF9207 Micropowder (manufactured by 3M Co., St. Paul, MN) and butyl acetate was used in place of MEK as the solvent.
- fluoropolymer B was a PTFE fluorine resin particulate sold under the trade designation "DYNEON” TF9207 Micropowder (manufactured by 3M Co., St. Paul, MN) and butyl acetate was used in place of MEK as the solvent.
- Comparative Example 1 was prepared in the same manner as in Example 2, except that 0.5 g (the same volume as that of 5 g of DYNEON THV 610) of glass bubbles sold under the trade designation "3M Glass Bubbles K20" (manufactured by 3M Co., St. Paul, MN) was added and a coating composition was prepared.
- the glass bubbles are a soda- lime borosilicate glass, with a true specific gravity of 0.200 ⁇ 0.02, and particle size distribution of 30 to 110 ⁇ m (80% or more).
- Comparative Example 2 Comparative Example 2 was prepared in the same manner as in Comparative
- Example 1 except that butyl acetate was used in place of MEK as the solvent.
- Comparative Example 3 was prepared in the same manner as in Example 1 , except that fluoropolymer B was not added.
- Comparative Example 4 was prepared in the same manner as in Example 1 , except that fluoropolymer B was not added and butyl acetate was used in place of MEK as the solvent.
- the samples of the above Examples and Comparative Examples were subjected to a light transmission test and a water resistance test.
- Measurement of transmittance A film was peeled off from a paper phenol copper substrate and a spectral transmittance was measured over the entire visible range using a spectrophotometer, Model U-4100, manufactured by Hitachi, Ltd.. Then a visible light transmittance was determined by correction of visibility and the light source.
- Water resistance test The paper phenol copper substrate used for coating had a width of 16 mm, thickness of 1.5 mm and a length of 75 mm and was provided with a slit having a width of 0.2 mm at the center (see Fig. 4). Therefore, right and left copper wirings 2 on substrate 1 were electrically independent.
- the entire portion below lines C-C was coated with a coating layer 5 formed by dip coating. Furthermore, a water resistance test was performed by dipping in water to lines W-W below the lines C-C. Each of the right and left portions, in which the upper copper wiring is exposed, was clipped with an alligator clip connected to a digital multimeter (P-IO, manufactured by METEX Co.), and then a resistance value was measured. As shown in Table 3, a control sample having no coating layer showed a resistance value of several hundred k ⁇ (kilo ohms).
- a coating composition of the present disclosure was prepared as described in Example 1 by adding the same amount by weight DYNEON TF9205 Micropowder to DYNEON THV220A to generate a coating composition in which the weight of fluoropolymer A based on the total weight of a fluoropolymer A and the solvent" is 20% and the weight of fluoropolymer B based on the weight of fluoropolymer A is 100%.
- This coating composition was coated onto circuit board 1 to form the article shown in Fig. 5. As shown in Fig. 5, LEDs are connected via electrical wires onto circuit board 1.
- Lead wire 6 is attached to circuit board 1 for connection to a power supply and a coating composition is applied to circuit board 1 to encase with coating layer 5.
- the bullet-shaped LEDs of the article shown in Fig. 5, were soldered onto circuit board 1. Because of the complicated shape, a dip coating method, a brush coating method and a potting method were used in combination to applying the coating composition to circuit board 1 comprising the LEDs.
- the length of the LED pins, which penetrate through, and protrude from, circuit board 1 varied from 1 to 5 mm. Even when the length of extruding pins was 5 mm, a thick coating could be performed with the coating compositions of the present disclosure.
- the resulting article (Fig. 5) was connected to a power supply and immersed in water. The LEDs emitted light continuously for 30 minutes or more. Neither the generation of oxygen and hydrogen gas (electrolysis) nor dissolution of metal ions was observed during the immersion in water.
- a coating composition was prepared as disclosed in Example 6 and was coated onto an LED linear light (obtained under the trade designation "White LED Substrate Unit NP-00014", manufactured by Shibazaki Seisakusho Ltd.) through dip coating and then the LED was continuously turned on by carrying an electric current for 2 hours or more in a state where the circuit board having an average thickness of 1,000 ⁇ m is immersed in water at a depth of 1 m from the water's surface. Consequently, it has been found that an LED installed circuit board of this example has water resistance corresponding to (Japanese Industrial Standard C0920) protection class 7 or higher class (immersion-proof type).
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Paints Or Removers (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08798178A EP2183329A4 (en) | 2007-08-23 | 2008-08-19 | COATING COMPOSITION AND PRODUCT THEREOF |
US12/671,934 US20110260945A1 (en) | 2007-08-03 | 2008-08-19 | Coating Composition and Article Using the Same |
CN200880103801A CN101784622A (zh) | 2007-08-23 | 2008-08-19 | 涂料组合物和使用此涂料组合物的制品 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-217386 | 2007-08-23 | ||
JP2007217386A JP2009051876A (ja) | 2007-08-23 | 2007-08-23 | コーティング組成物及びそれを使用した物品 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009026284A2 true WO2009026284A2 (en) | 2009-02-26 |
WO2009026284A3 WO2009026284A3 (en) | 2009-04-09 |
Family
ID=40378954
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2008/073584 WO2009026284A2 (en) | 2007-08-03 | 2008-08-19 | Coating composition and article using the same |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP2183329A4 (hr) |
JP (1) | JP2009051876A (hr) |
KR (1) | KR20100063083A (hr) |
CN (1) | CN101784622A (hr) |
TW (1) | TW200920799A (hr) |
WO (1) | WO2009026284A2 (hr) |
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2462824A (en) * | 2008-08-18 | 2010-02-24 | Crombie 123 Ltd | Printed circuit board encapsulation |
DE102009032424A1 (de) * | 2009-07-09 | 2011-01-13 | Osram Gesellschaft mit beschränkter Haftung | Leuchtvorrichtung mit einer flexiblen Leiterplatte |
WO2011134941A1 (en) | 2010-04-30 | 2011-11-03 | Solvay Solexis S.P.A. | Vdf polymer composition |
US20120000104A1 (en) * | 2009-03-17 | 2012-01-05 | Koninklijke Philips Electronics N.V. | Led strip for small channel letters |
US20120036750A1 (en) * | 2010-08-12 | 2012-02-16 | Sun Inno Tech | Internally Illuminated Panel and Method of Making the Same |
US8492898B2 (en) | 2007-02-19 | 2013-07-23 | Semblant Global Limited | Printed circuit boards |
RU2505572C2 (ru) * | 2012-04-26 | 2014-01-27 | Открытое акционерное общество "Научно-исследовательский институт приборостроения имени В.В. Тихомирова" | Лаковая композиция |
US8995146B2 (en) | 2010-02-23 | 2015-03-31 | Semblant Limited | Electrical assembly and method |
US9000463B2 (en) | 2010-04-14 | 2015-04-07 | Pang-Ming Huang | LED housing with fluoropolymer surface coating layer and LED structure having the same |
US9055700B2 (en) | 2008-08-18 | 2015-06-09 | Semblant Limited | Apparatus with a multi-layer coating and method of forming the same |
EP2707910A4 (en) * | 2011-05-10 | 2015-06-24 | Shat R Shield Inc | SILICONE COATED LUMINAIRE DIODE |
EP2965597A1 (en) * | 2013-03-07 | 2016-01-13 | D.R.E.T. Technology SAGL | Method of printing electronic systems on textile substrates |
US9540536B2 (en) | 2014-09-02 | 2017-01-10 | E I Du Pont De Nemours And Company | Heat-curable polymer paste |
EP3196550A1 (en) * | 2016-01-20 | 2017-07-26 | OSRAM GmbH | A method of producing lighting devices and corresponding lighting device |
WO2017162734A1 (de) * | 2016-03-23 | 2017-09-28 | Osram Opto Semiconductors Gmbh | Verfahren zur herstellung einer elektronischen vorrichtung und elektronische vorrichtung |
WO2019175197A1 (en) | 2018-03-15 | 2019-09-19 | Solvay Specialty Polymers Italy S.P.A. | Fluoropolymer composition for components of light emitting apparatus |
CN110603299A (zh) * | 2017-05-20 | 2019-12-20 | 霍尼韦尔国际公司 | Milk lumilux分散体 |
DE102019205064A1 (de) * | 2019-04-09 | 2020-10-15 | Conti Temic Microelectronic Gmbh | Verwendung des Stoffs [P(VdF-HFP)HP] als Kühleinrichtung zur Kühlung einer Sensorvorrichtung eines Kraftfahrzeugs |
US10939542B2 (en) | 2017-06-15 | 2021-03-02 | Lg Chem, Ltd. | Partially molded substrate and partial molding device and method |
US11786930B2 (en) | 2016-12-13 | 2023-10-17 | Hzo, Inc. | Protective coating |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011064861A1 (ja) * | 2009-11-26 | 2011-06-03 | Cheng Chiang-Ming | 多機能照明装置 |
EP2428537A1 (de) * | 2010-09-13 | 2012-03-14 | Sika Technology AG | Abdichtungsmembran mit verbesserter Haftung |
CN102977700B (zh) * | 2012-12-28 | 2016-05-04 | 上海电缆研究所 | 一种全面改善架空导线性能的涂料 |
US10103037B2 (en) * | 2014-05-09 | 2018-10-16 | Intel Corporation | Flexible microelectronic systems and methods of fabricating the same |
KR102237112B1 (ko) | 2014-07-30 | 2021-04-08 | 엘지이노텍 주식회사 | 발광 소자 및 이를 구비한 광원 모듈 |
CN109314168A (zh) * | 2016-05-03 | 2019-02-05 | 霍尼韦尔国际公司 | 具有改善的耐化学品性的光发射器设备和部件及相关方法 |
US10700247B2 (en) | 2016-06-29 | 2020-06-30 | Mitsubishi Electric Corporation | Display device and method for manufacturing display device |
SG11201912983YA (en) * | 2017-07-21 | 2020-01-30 | Chemours Co Fc Llc | Photocrosslinkable fluoropolymer coating composition and passivation layer formed therefrom |
CN111527568B (zh) * | 2017-10-26 | 2023-03-24 | 赛义德·泰穆尔·艾哈迈德 | 包括用于疏水性的、疏油性的和亲油性的涂层的非牛顿流体的组合物及其使用方法 |
JP6899412B2 (ja) * | 2018-07-27 | 2021-07-07 | 住友化学株式会社 | Ledデバイスの製造方法 |
WO2020230715A1 (ja) | 2019-05-16 | 2020-11-19 | 住友化学株式会社 | 電子部品及びその製造方法 |
CN113811429A (zh) | 2019-05-16 | 2021-12-17 | 住友化学株式会社 | 电子部件的制造方法和电子部件 |
JP6998362B2 (ja) * | 2019-05-16 | 2022-01-18 | 住友化学株式会社 | 電子部品及びその製造方法 |
JP6856787B1 (ja) * | 2020-01-29 | 2021-04-14 | 住友化学株式会社 | 電子部品の製造方法 |
JP6870128B1 (ja) * | 2020-01-30 | 2021-05-12 | 住友化学株式会社 | フッ素樹脂封止剤及びその製造方法 |
JP6816317B1 (ja) * | 2020-01-30 | 2021-01-20 | 住友化学株式会社 | フッ素樹脂シート及びその製造方法 |
JP6830168B1 (ja) * | 2020-01-30 | 2021-02-17 | 住友化学株式会社 | 電子部品の製造方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0456018B1 (en) * | 1990-05-10 | 1993-06-16 | Elf Atochem North America, Inc. | Powder coatings of vinylidene fluoride/hexafluoropropylene copolymers |
US6506843B1 (en) * | 1998-04-30 | 2003-01-14 | Dajkin Industries, Ltd. | Thermosetting powder coating composition |
US20030213405A1 (en) * | 2002-01-15 | 2003-11-20 | Toru Harada | Ink, ink jet recording method and azo compound |
US7108743B2 (en) * | 2001-04-09 | 2006-09-19 | Fuji Photo Film Co., Ltd. | Coloring composition for image formation and method for improving ozone resistance of color image |
US20060217484A1 (en) * | 2003-04-09 | 2006-09-28 | Seiji Tanimoto | (Meth)acrylic resin emulsion and process for producing the same |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5922453A (en) * | 1997-02-06 | 1999-07-13 | Rogers Corporation | Ceramic-filled fluoropolymer composite containing polymeric powder for high frequency circuit substrates |
WO2002003397A2 (en) * | 2000-06-30 | 2002-01-10 | 3M Innovative Properties Company | Insulation material for use in high-frequency electronic parts |
US20070053179A1 (en) * | 2005-09-08 | 2007-03-08 | Pang Slew I | Low profile light source utilizing a flexible circuit carrier |
-
2007
- 2007-08-23 JP JP2007217386A patent/JP2009051876A/ja not_active Withdrawn
-
2008
- 2008-08-19 EP EP08798178A patent/EP2183329A4/en not_active Withdrawn
- 2008-08-19 CN CN200880103801A patent/CN101784622A/zh active Pending
- 2008-08-19 WO PCT/US2008/073584 patent/WO2009026284A2/en active Application Filing
- 2008-08-19 KR KR1020107006285A patent/KR20100063083A/ko not_active Application Discontinuation
- 2008-08-22 TW TW097132252A patent/TW200920799A/zh unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0456018B1 (en) * | 1990-05-10 | 1993-06-16 | Elf Atochem North America, Inc. | Powder coatings of vinylidene fluoride/hexafluoropropylene copolymers |
US6506843B1 (en) * | 1998-04-30 | 2003-01-14 | Dajkin Industries, Ltd. | Thermosetting powder coating composition |
US7108743B2 (en) * | 2001-04-09 | 2006-09-19 | Fuji Photo Film Co., Ltd. | Coloring composition for image formation and method for improving ozone resistance of color image |
US20030213405A1 (en) * | 2002-01-15 | 2003-11-20 | Toru Harada | Ink, ink jet recording method and azo compound |
US20060217484A1 (en) * | 2003-04-09 | 2006-09-28 | Seiji Tanimoto | (Meth)acrylic resin emulsion and process for producing the same |
Non-Patent Citations (1)
Title |
---|
See also references of EP2183329A2 * |
Cited By (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8492898B2 (en) | 2007-02-19 | 2013-07-23 | Semblant Global Limited | Printed circuit boards |
US9648720B2 (en) | 2007-02-19 | 2017-05-09 | Semblant Global Limited | Method for manufacturing printed circuit boards |
GB2462824A (en) * | 2008-08-18 | 2010-02-24 | Crombie 123 Ltd | Printed circuit board encapsulation |
US9055700B2 (en) | 2008-08-18 | 2015-06-09 | Semblant Limited | Apparatus with a multi-layer coating and method of forming the same |
US20120000104A1 (en) * | 2009-03-17 | 2012-01-05 | Koninklijke Philips Electronics N.V. | Led strip for small channel letters |
CN102356267A (zh) * | 2009-03-17 | 2012-02-15 | 皇家飞利浦电子股份有限公司 | 用于小型槽型字母的led灯带 |
US9236536B2 (en) | 2009-04-22 | 2016-01-12 | Shat-R-Shield, Inc. | Silicone coated light-emitting diode |
DE102009032424A1 (de) * | 2009-07-09 | 2011-01-13 | Osram Gesellschaft mit beschränkter Haftung | Leuchtvorrichtung mit einer flexiblen Leiterplatte |
US8995146B2 (en) | 2010-02-23 | 2015-03-31 | Semblant Limited | Electrical assembly and method |
US9000463B2 (en) | 2010-04-14 | 2015-04-07 | Pang-Ming Huang | LED housing with fluoropolymer surface coating layer and LED structure having the same |
US8642702B2 (en) | 2010-04-30 | 2014-02-04 | Solvay Specialty Polymers Italy S.P.A. | VDF polymer composition |
WO2011134941A1 (en) | 2010-04-30 | 2011-11-03 | Solvay Solexis S.P.A. | Vdf polymer composition |
US20120036750A1 (en) * | 2010-08-12 | 2012-02-16 | Sun Inno Tech | Internally Illuminated Panel and Method of Making the Same |
EP2707910A4 (en) * | 2011-05-10 | 2015-06-24 | Shat R Shield Inc | SILICONE COATED LUMINAIRE DIODE |
RU2505572C2 (ru) * | 2012-04-26 | 2014-01-27 | Открытое акционерное общество "Научно-исследовательский институт приборостроения имени В.В. Тихомирова" | Лаковая композиция |
EP2965597A1 (en) * | 2013-03-07 | 2016-01-13 | D.R.E.T. Technology SAGL | Method of printing electronic systems on textile substrates |
US9540536B2 (en) | 2014-09-02 | 2017-01-10 | E I Du Pont De Nemours And Company | Heat-curable polymer paste |
US10125968B2 (en) | 2016-01-20 | 2018-11-13 | Osram Gmbh | Method of producing lighting devices and corresponding lighting device |
EP3196550A1 (en) * | 2016-01-20 | 2017-07-26 | OSRAM GmbH | A method of producing lighting devices and corresponding lighting device |
US10886426B2 (en) | 2016-03-23 | 2021-01-05 | Osram Oled Gmbh | Method for producing an electronic device and electronic device |
WO2017162734A1 (de) * | 2016-03-23 | 2017-09-28 | Osram Opto Semiconductors Gmbh | Verfahren zur herstellung einer elektronischen vorrichtung und elektronische vorrichtung |
US11786930B2 (en) | 2016-12-13 | 2023-10-17 | Hzo, Inc. | Protective coating |
CN110603299A (zh) * | 2017-05-20 | 2019-12-20 | 霍尼韦尔国际公司 | Milk lumilux分散体 |
CN110603299B (zh) * | 2017-05-20 | 2022-05-10 | 霍尼韦尔国际公司 | Milk lumilux分散体 |
US10939542B2 (en) | 2017-06-15 | 2021-03-02 | Lg Chem, Ltd. | Partially molded substrate and partial molding device and method |
WO2019175197A1 (en) | 2018-03-15 | 2019-09-19 | Solvay Specialty Polymers Italy S.P.A. | Fluoropolymer composition for components of light emitting apparatus |
DE102019205064A1 (de) * | 2019-04-09 | 2020-10-15 | Conti Temic Microelectronic Gmbh | Verwendung des Stoffs [P(VdF-HFP)HP] als Kühleinrichtung zur Kühlung einer Sensorvorrichtung eines Kraftfahrzeugs |
Also Published As
Publication number | Publication date |
---|---|
WO2009026284A3 (en) | 2009-04-09 |
JP2009051876A (ja) | 2009-03-12 |
EP2183329A2 (en) | 2010-05-12 |
CN101784622A (zh) | 2010-07-21 |
EP2183329A4 (en) | 2011-05-11 |
TW200920799A (en) | 2009-05-16 |
KR20100063083A (ko) | 2010-06-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20110260945A1 (en) | Coating Composition and Article Using the Same | |
WO2009026284A2 (en) | Coating composition and article using the same | |
KR102417311B1 (ko) | 가요성 전자 표면을 위한 연신성 상호접속재 | |
CN102473824B (zh) | 白色反射材料及其制造方法 | |
CN1140972A (zh) | 场致发光照明元件、其制造方法以及使用这种元件的照明开关单元 | |
KR101837646B1 (ko) | 광 추출 층을 갖는 유기 발광 다이오드 | |
JP2007231072A (ja) | コーティング組成物及びそれを使用した物品 | |
JP5475625B2 (ja) | Led実装用基板 | |
US20110214284A1 (en) | Highly conductive composites | |
JP5389052B2 (ja) | プリンタブルエレクトロニクス用の剥離コーティングとしてのガラス状シリコーン系ハードコーティングを備える電子デバイスの製造方法 | |
US20070246690A1 (en) | Conductive paste for conductive substrate or conductive film | |
CN1653561A (zh) | 透明导电层合薄膜、含透明导电层合薄膜的接触面板以及透明导电层合薄膜的制备方法 | |
JP2014526117A (ja) | 透明導電性積層電極及びその製法 | |
CN1085686A (zh) | 聚合物厚膜电阻组合物 | |
US8465677B2 (en) | Electrically conductive composition and fabrication method thereof | |
CN1697589A (zh) | 印刷线路板用屏蔽薄膜及其制造方法 | |
CN104575698A (zh) | 透明导电膜结构 | |
CN104813499B (zh) | 导电透明电极以及相关制造工艺 | |
KR20150066552A (ko) | 투명 전극 및 관련 제조 방법 | |
Lee et al. | Highly stretchable transparent bar coated Ag NW/PEDOT: PSS hybrid electrode for wearable and stretchable devices | |
CN106028637B (zh) | 柔性布线基板及其利用 | |
JP2015103480A (ja) | 導電性透明基材、その導電性透明基材を有する回路モジュール、発光パネル、タッチパネル、及びソーラパネル、並びに透明配線板の製造方法 | |
CN113764137B (zh) | 纳米银线导电膜的制备方法、纳米银线导电膜及其应用 | |
JP7211175B2 (ja) | 樹脂組成物 | |
US10584223B2 (en) | Optical member, optical semiconductor device, and illumination apparatus |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200880103801.3 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 08798178 Country of ref document: EP Kind code of ref document: A2 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 12671934 Country of ref document: US |
|
NENP | Non-entry into the national phase in: |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2008798178 Country of ref document: EP |
|
ENP | Entry into the national phase in: |
Ref document number: 20107006285 Country of ref document: KR Kind code of ref document: A |