WO2009019818A1 - 撮像用光検出装置 - Google Patents

撮像用光検出装置 Download PDF

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Publication number
WO2009019818A1
WO2009019818A1 PCT/JP2008/001952 JP2008001952W WO2009019818A1 WO 2009019818 A1 WO2009019818 A1 WO 2009019818A1 JP 2008001952 W JP2008001952 W JP 2008001952W WO 2009019818 A1 WO2009019818 A1 WO 2009019818A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
refractive index
index transparent
order diffracted
detecting device
Prior art date
Application number
PCT/JP2008/001952
Other languages
English (en)
French (fr)
Inventor
Seiji Nishiwaki
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Priority to JP2008551594A priority Critical patent/JP4264465B2/ja
Priority to US12/440,195 priority patent/US8076745B2/en
Priority to CN2008800008932A priority patent/CN101548381B/zh
Publication of WO2009019818A1 publication Critical patent/WO2009019818A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14621—Colour filter arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14629—Reflectors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/10—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths
    • H04N23/11—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths for generating image signals from visible and infrared light wavelengths
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
    • H04N25/11—Arrangement of colour filter arrays [CFA]; Filter mosaics
    • H04N25/13—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements
    • H04N25/134—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements based on three different wavelength filter elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Color Television Image Signal Generators (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)

Abstract

　撮像用光検出装置は、基板（５）上に１次元状あるいは２次元状に配列された複数の光検出器（６）と、複数の光検出器の上方に形成された低屈折率透明層（１２）と、複数の光検出器の配列方向に沿って低屈折率透明層内に埋め込まれた柱状又は板状の複数の高屈折率透明部（１３）とを備える。１つの高屈折率透明部に対して２つ以上の光検出器が対応している。低屈折率透明層及び高屈折率透明部に入射する光は、それらを通過することでその波面に発生した位相シフトにより、０次回折光と１次回折光と－１次回折光とに分離される。これにより、光利用効率の向上と画素の高密度化とを実現できる。
PCT/JP2008/001952 2007-08-06 2008-07-22 撮像用光検出装置 WO2009019818A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008551594A JP4264465B2 (ja) 2007-08-06 2008-07-22 撮像用光検出装置
US12/440,195 US8076745B2 (en) 2007-08-06 2008-07-22 Imaging photodetection device
CN2008800008932A CN101548381B (zh) 2007-08-06 2008-07-22 摄像用光检测装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-204394 2007-08-06
JP2007204394 2007-08-06

Publications (1)

Publication Number Publication Date
WO2009019818A1 true WO2009019818A1 (ja) 2009-02-12

Family

ID=40341063

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/001952 WO2009019818A1 (ja) 2007-08-06 2008-07-22 撮像用光検出装置

Country Status (5)

Country Link
US (1) US8076745B2 (ja)
JP (1) JP4264465B2 (ja)
KR (1) KR20100047862A (ja)
CN (1) CN101548381B (ja)
WO (1) WO2009019818A1 (ja)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012001930A1 (ja) * 2010-07-02 2012-01-05 パナソニック株式会社 固体撮像装置
JP2012182432A (ja) * 2011-02-09 2012-09-20 Canon Inc 光電変換装置および撮像システム
US8384818B2 (en) 2008-06-18 2013-02-26 Panasonic Corporation Solid-state imaging device including arrays of optical elements and photosensitive cells
WO2013061489A1 (ja) * 2011-10-24 2013-05-02 パナソニック株式会社 カラー撮像装置
WO2013094178A1 (ja) * 2011-12-19 2013-06-27 パナソニック株式会社 撮像装置
WO2013164901A1 (ja) * 2012-05-02 2013-11-07 パナソニック株式会社 固体撮像装置
WO2014033976A1 (ja) * 2012-09-03 2014-03-06 パナソニック株式会社 固体撮像素子、撮像装置および信号処理方法
WO2014034149A1 (ja) * 2012-09-03 2014-03-06 パナソニック株式会社 固体撮像素子および撮像装置
WO2014083836A1 (ja) * 2012-11-30 2014-06-05 パナソニック株式会社 集光装置、固体撮像素子および撮像装置
JP2016072620A (ja) * 2014-09-30 2016-05-09 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． イメージセンサ及びこれを含む電子装置
JP2019184986A (ja) * 2018-04-17 2019-10-24 日本電信電話株式会社 カラー撮像素子および撮像装置
JP2020123964A (ja) * 2018-04-17 2020-08-13 日本電信電話株式会社 カラー撮像素子および撮像装置
JPWO2021059409A1 (ja) * 2019-09-25 2021-04-01
JP2022027780A (ja) * 2018-04-17 2022-02-14 日本電信電話株式会社 カラー撮像素子および撮像装置
WO2023013261A1 (ja) * 2021-08-06 2023-02-09 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子および電子機器
WO2023013085A1 (ja) * 2021-08-06 2023-02-09 ソニーセミコンダクタソリューションズ株式会社 撮像素子
WO2023195286A1 (ja) * 2022-04-04 2023-10-12 ソニーセミコンダクタソリューションズ株式会社 光検出素子および電子機器

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CN102160180A (zh) * 2009-07-24 2011-08-17 松下电器产业株式会社 摄像装置以及固体摄像元件
JP5503458B2 (ja) 2010-08-24 2014-05-28 パナソニック株式会社 固体撮像素子および撮像装置
JP5852006B2 (ja) 2011-06-16 2016-02-03 パナソニック インテレクチュアル プロパティ コーポレーション オブアメリカＰａｎａｓｏｎｉｃ Ｉｎｔｅｌｌｅｃｔｕａｌ Ｐｒｏｐｅｒｔｙ Ｃｏｒｐｏｒａｔｉｏｎ ｏｆ Ａｍｅｒｉｃａ 固体撮像素子、撮像装置および信号処理方法
CN103503143B (zh) 2012-05-02 2016-12-28 松下电器（美国）知识产权公司 固体摄像元件以及摄像装置
JP5958837B2 (ja) * 2012-05-28 2016-08-02 パナソニックＩｐマネジメント株式会社 奥行き推定撮像装置
DE102012221356A1 (de) * 2012-06-20 2013-12-24 Robert Bosch Gmbh Sensor und Verfahren zur Erfassung von Licht und Verfahren und Vorrichtung zur Ermittlung einer Farbinformation
CN103943646B (zh) * 2014-04-23 2017-01-18 上海理工大学 能够增强电荷耦合元件紫外响应能力的光学薄膜及制备
KR102159166B1 (ko) 2014-05-09 2020-09-23 삼성전자주식회사 색분리 소자 및 상기 색분리 소자를 포함하는 이미지 센서
KR102219704B1 (ko) 2014-06-13 2021-02-24 삼성전자주식회사 색분리 소자 어레이, 상기 색분리 소자 어레이를 포함하는 이미지 센서, 및 상기 색분리 소자 어레이를 포함하는 촬상 장치
US10180354B2 (en) * 2014-11-07 2019-01-15 Semiconductor Energy Laboratory Co., Ltd. Imaging device and electronic device
KR102465995B1 (ko) * 2015-09-30 2022-11-25 삼성전자주식회사 색분할기 구조와 그 제조방법, 색분할기 구조를 포함하는 이미지센서 및 이미지센서를 포함하는 광학장치
KR102561097B1 (ko) 2015-12-22 2023-07-28 삼성전자주식회사 색분리 소자 어레이, 이를 포함한 이미지 센서 및 전자 장치
CN110115023B (zh) * 2016-12-18 2021-11-16 真三维公司 全景摄像机
EP3812801A1 (en) 2019-10-23 2021-04-28 Samsung Electronics Co., Ltd. Image sensor including color separating lens array and electronic device including the image sensor
EP3812802A1 (en) 2019-10-23 2021-04-28 Samsung Electronics Co., Ltd. Image sensor including color separating lens array and electronic apparatus including the image sensor

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US8384818B2 (en) 2008-06-18 2013-02-26 Panasonic Corporation Solid-state imaging device including arrays of optical elements and photosensitive cells
US8759931B2 (en) 2010-07-02 2014-06-24 Panasonic Corporation Solid-state imaging device
JP2012015424A (ja) * 2010-07-02 2012-01-19 Panasonic Corp 固体撮像装置
WO2012001930A1 (ja) * 2010-07-02 2012-01-05 パナソニック株式会社 固体撮像装置
JP2012182432A (ja) * 2011-02-09 2012-09-20 Canon Inc 光電変換装置および撮像システム
US9293493B2 (en) 2011-02-09 2016-03-22 Canon Kabushiki Kaisha Photoelectric conversion apparatus and image sensing system
WO2013061489A1 (ja) * 2011-10-24 2013-05-02 パナソニック株式会社 カラー撮像装置
US9257469B2 (en) 2011-10-24 2016-02-09 Panasonic Intellectual Property Management Co., Ltd. Color imaging device
JPWO2013061489A1 (ja) * 2011-10-24 2015-04-02 パナソニックＩｐマネジメント株式会社 カラー撮像装置
JPWO2013094178A1 (ja) * 2011-12-19 2015-04-27 パナソニックＩｐマネジメント株式会社 撮像装置
US9496300B2 (en) 2011-12-19 2016-11-15 Panasonic Intellectual Property Management Co., Ltd. Imaging device having array of spectroscopic sections wherein an interval between two spectroscopic sections at a periphery of an imaging plane is smaller than an interval between two spectroscopic sections at a center of the imaging plane
WO2013094178A1 (ja) * 2011-12-19 2013-06-27 パナソニック株式会社 撮像装置
JPWO2013164901A1 (ja) * 2012-05-02 2015-12-24 パナソニック インテレクチュアル プロパティ コーポレーション オブアメリカＰａｎａｓｏｎｉｃ Ｉｎｔｅｌｌｅｃｔｕａｌ Ｐｒｏｐｅｒｔｙ Ｃｏｒｐｏｒａｔｉｏｎ ｏｆ Ａｍｅｒｉｃａ 固体撮像装置
WO2013164901A1 (ja) * 2012-05-02 2013-11-07 パナソニック株式会社 固体撮像装置
US9179114B2 (en) 2012-05-02 2015-11-03 Panasonic Intellectual Property Corporation Of America Solid-state image sensor
WO2014033976A1 (ja) * 2012-09-03 2014-03-06 パナソニック株式会社 固体撮像素子、撮像装置および信号処理方法
US9099370B2 (en) 2012-09-03 2015-08-04 Panasonic Intellectual Property Management Co., Ltd. Solid-state imaging element and imaging device
JPWO2014034149A1 (ja) * 2012-09-03 2016-08-08 パナソニックＩｐマネジメント株式会社 固体撮像素子および撮像装置
JPWO2014033976A1 (ja) * 2012-09-03 2016-08-08 パナソニック インテレクチュアル プロパティ コーポレーション オブ アメリカＰａｎａｓｏｎｉｃ Ｉｎｔｅｌｌｅｃｔｕａｌ Ｐｒｏｐｅｒｔｙ Ｃｏｒｐｏｒａｔｉｏｎ ｏｆ Ａｍｅｒｉｃａ 固体撮像素子、撮像装置および信号処理方法
US9425229B2 (en) 2012-09-03 2016-08-23 Panasonic Intellectual Property Corporation Of America Solid-state imaging element, imaging device, and signal processing method including a dispersing element array and microlens array
WO2014034149A1 (ja) * 2012-09-03 2014-03-06 パナソニック株式会社 固体撮像素子および撮像装置
WO2014083836A1 (ja) * 2012-11-30 2014-06-05 パナソニック株式会社 集光装置、固体撮像素子および撮像装置
US9673241B2 (en) 2012-11-30 2017-06-06 Panasonic Intellectual Property Management Co., Ltd. Light-condensing unit, solid-state image sensor, and image capture device
JPWO2014083836A1 (ja) * 2012-11-30 2017-01-05 パナソニックＩｐマネジメント株式会社 集光装置、固体撮像素子および撮像装置
JP2016072620A (ja) * 2014-09-30 2016-05-09 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． イメージセンサ及びこれを含む電子装置
JP2022027780A (ja) * 2018-04-17 2022-02-14 日本電信電話株式会社 カラー撮像素子および撮像装置
JP7265195B2 (ja) 2018-04-17 2023-04-26 日本電信電話株式会社 カラー撮像素子および撮像装置
JP2020123964A (ja) * 2018-04-17 2020-08-13 日本電信電話株式会社 カラー撮像素子および撮像装置
US10886321B2 (en) 2018-04-17 2021-01-05 Nippon Telegraph And Telephone Corporation Color image-capture element and image capture device
US11515352B2 (en) 2018-04-17 2022-11-29 Nippon Telegraph And Telephone Corporation Image-capture element and image capture device
US11967603B2 (en) 2018-04-17 2024-04-23 Nippon Telegraph And Telephone Corporation Image-capture element and image capture device
WO2019202890A1 (ja) * 2018-04-17 2019-10-24 日本電信電話株式会社 カラー撮像素子および撮像装置
JP2019184986A (ja) * 2018-04-17 2019-10-24 日本電信電話株式会社 カラー撮像素子および撮像装置
JPWO2021059409A1 (ja) * 2019-09-25 2021-04-01
JP7231869B2 (ja) 2019-09-25 2023-03-02 日本電信電話株式会社 撮像素子および撮像装置
WO2021059409A1 (ja) * 2019-09-25 2021-04-01 日本電信電話株式会社 撮像素子および撮像装置
WO2023013085A1 (ja) * 2021-08-06 2023-02-09 ソニーセミコンダクタソリューションズ株式会社 撮像素子
WO2023013261A1 (ja) * 2021-08-06 2023-02-09 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子および電子機器
WO2023195286A1 (ja) * 2022-04-04 2023-10-12 ソニーセミコンダクタソリューションズ株式会社 光検出素子および電子機器

Also Published As

Publication number Publication date
US20100176473A1 (en) 2010-07-15
JP4264465B2 (ja) 2009-05-20
US8076745B2 (en) 2011-12-13
KR20100047862A (ko) 2010-05-10
JPWO2009019818A1 (ja) 2010-10-28
CN101548381A (zh) 2009-09-30
CN101548381B (zh) 2011-03-30

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