WO2009014029A1 - 封着材料、封着タブレット及び封着用ガラス組成物 - Google Patents

封着材料、封着タブレット及び封着用ガラス組成物 Download PDF

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Publication number
WO2009014029A1
WO2009014029A1 PCT/JP2008/062750 JP2008062750W WO2009014029A1 WO 2009014029 A1 WO2009014029 A1 WO 2009014029A1 JP 2008062750 W JP2008062750 W JP 2008062750W WO 2009014029 A1 WO2009014029 A1 WO 2009014029A1
Authority
WO
WIPO (PCT)
Prior art keywords
sealing
lamp base
sealing material
mass
glass composition
Prior art date
Application number
PCT/JP2008/062750
Other languages
English (en)
French (fr)
Inventor
Kentaro Ishihara
Original Assignee
Nippon Electric Glass Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008116597A external-priority patent/JP5344363B2/ja
Priority claimed from JP2008116550A external-priority patent/JP5344362B2/ja
Application filed by Nippon Electric Glass Co., Ltd. filed Critical Nippon Electric Glass Co., Ltd.
Priority to EP08778171A priority Critical patent/EP2168927A4/en
Publication of WO2009014029A1 publication Critical patent/WO2009014029A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
    • C03C3/066—Glass compositions containing silica with less than 40% silica by weight containing boron containing zinc
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
    • C03C3/068—Glass compositions containing silica with less than 40% silica by weight containing boron containing rare earths
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C03C3/122—Silica-free oxide glass compositions containing oxides of As, Sb, Bi, Mo, W, V, Te as glass formers
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/04—Frit compositions, i.e. in a powdered or comminuted form containing zinc
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J61/00—Gas-discharge or vapour-discharge lamps
    • H01J61/02—Details
    • H01J61/36—Seals between parts of vessels; Seals for leading-in conductors; Leading-in conductors
    • H01J61/361—Seals between parts of vessel
    • H01J61/363—End-disc seals or plug seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J61/00—Gas-discharge or vapour-discharge lamps
    • H01J61/02—Details
    • H01J61/36—Seals between parts of vessels; Seals for leading-in conductors; Leading-in conductors
    • H01J61/366—Seals for leading-in conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • H01J9/32—Sealing leading-in conductors
    • H01J9/323—Sealing leading-in conductors into a discharge lamp or a gas-filled discharge device

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Glass Compositions (AREA)

Abstract

　封着材料４を介して、外管２とランプ基材５が封着されている。電流供給部材３は、ランプ基材５に挿入されて、封着材料４によりランプ基材５に固定されている。排気管６は、ランプ基材５に挿入されて、封着材料４によりランプ基材５に固定されている。外管２の内部には放電容器が配置されている。封着材料４は、体積％で、ガラス粉末３５～７５％、耐火性フィラー粉末２５～６５％を含有し、熱膨張係数が７０×１０－７／°C未満であり、ガラス粉末が、ガラス組成として、質量％で、Ｂｉ２Ｏ３　５５～８５％、Ｂ２Ｏ３　５～２０％、ＺｎＯ　１～１５％、ＳｉＯ２　０～７％含有するものである。
PCT/JP2008/062750 2007-07-20 2008-07-15 封着材料、封着タブレット及び封着用ガラス組成物 WO2009014029A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP08778171A EP2168927A4 (en) 2007-07-20 2008-07-15 SEALING MATERIAL, SEALING COMPRESSOR AND GLASS COMPOSITION FOR SEALED SEALING

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2007-189290 2007-07-20
JP2007-189455 2007-07-20
JP2007189290 2007-07-20
JP2007189455 2007-07-20
JP2008-116597 2008-04-28
JP2008116597A JP5344363B2 (ja) 2007-07-20 2008-04-28 封着用ガラス組成物
JP2008116550A JP5344362B2 (ja) 2007-07-20 2008-04-28 封着材料および封着タブレット
JP2008-116550 2008-04-28

Publications (1)

Publication Number Publication Date
WO2009014029A1 true WO2009014029A1 (ja) 2009-01-29

Family

ID=41718830

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062750 WO2009014029A1 (ja) 2007-07-20 2008-07-15 封着材料、封着タブレット及び封着用ガラス組成物

Country Status (2)

Country Link
EP (1) EP2168927A4 (ja)
WO (1) WO2009014029A1 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012035565A1 (en) * 2010-09-16 2012-03-22 Daunia Solar Cell S.R.L. Sealing agent with low softening temperature useful in the preparation of electronic devices
WO2012073662A1 (ja) * 2010-11-29 2012-06-07 セントラル硝子株式会社 無鉛低融点ガラス組成物
WO2016181736A1 (ja) * 2015-05-14 2016-11-17 日本電気硝子株式会社 ビスマス系ガラス粉末及びこれを用いた複合粉末材料
CN106663591A (zh) * 2014-07-18 2017-05-10 京瓷株式会社 发光装置
CN111556856A (zh) * 2017-11-28 2020-08-18 日立化成株式会社 密封材料和使用其的多层玻璃面板
CN114213025A (zh) * 2021-12-15 2022-03-22 西安赛尔电子材料科技有限公司 一种用于钽电容盖组封接玻璃的制备方法及封接工艺

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2558426B1 (en) * 2010-04-15 2020-04-08 Ferro Corporation Low-melting lead-free bismuth sealing glasses
JP5957847B2 (ja) * 2011-10-13 2016-07-27 セントラル硝子株式会社 ビスマス系ガラス組成物
CN103874666A (zh) * 2011-10-14 2014-06-18 旭硝子株式会社 有机led元件的散射层用玻璃、有机led元件用的层叠基板及其制造方法、以及有机led元件及其制造方法
JP6449788B2 (ja) * 2013-02-25 2019-01-09 サン−ゴバン グラス フランス 有機発光ダイオードを有するデバイスのための基材
CN105731803A (zh) * 2016-02-26 2016-07-06 中国建筑材料科学研究总院 一种铜封接玻璃粉及其制备方法及应用及电池的电极
WO2018070529A1 (ja) * 2016-10-13 2018-04-19 日本電気硝子株式会社 ビスマス系ガラス、ビスマス系ガラスの製造方法及び封着材料
GB201910100D0 (en) * 2019-07-15 2019-08-28 Johnson Matthey Plc Composition, paste and methods

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0517179A (ja) 1991-07-11 1993-01-26 Nippon Electric Glass Co Ltd 低融点低膨張性封着材料
JPH0624797A (ja) 1992-07-08 1994-02-01 Asahi Glass Co Ltd 接着又は封着用ガラス
JPH06263477A (ja) * 1993-03-12 1994-09-20 Nippon Seiki Co Ltd シ−ル構造
FR2794120A1 (fr) 1999-05-28 2000-12-01 Baruch Nachmansohn Verres de soudure a devitrification sans plomb ni autres materiaux toxiques
JP2002241143A (ja) 2001-02-09 2002-08-28 Ngk Insulators Ltd 封着用組成物
JP2003034550A (ja) * 2001-07-24 2003-02-07 Asahi Glass Co Ltd 無鉛ガラス、ガラスフリット、ガラスペースト、電子回路部品および電子回路
EP1291329A1 (en) 2000-05-11 2003-03-12 Matsushita Electric Industrial Co., Ltd. Glass composition, sealing glass for magnetic head and magnetic head
JP2003095697A (ja) * 2001-09-18 2003-04-03 Nihon Yamamura Glass Co Ltd 封着用組成物
JP2003128430A (ja) 2001-10-22 2003-05-08 Asahi Techno Glass Corp 無鉛ガラス組成物
WO2004037736A1 (ja) 2002-10-23 2004-05-06 Matsushita Electric Industrial Co., Ltd. 磁気ヘッド用ギャップ接合ガラスおよび磁気ヘッド
JP2004284934A (ja) * 2002-04-24 2004-10-14 Central Glass Co Ltd 無鉛低融点ガラス
EP1496025A1 (en) 2002-03-29 2005-01-12 Matsushita Electric Industrial Co., Ltd. Bismuth glass composition, and magnetic head and plasma display panel including the same as sealing member
US20060105898A1 (en) 2004-11-12 2006-05-18 Asahi Techno Glass Corporation Low melting glass, sealing composition and sealing paste
JP2007165551A (ja) * 2005-12-13 2007-06-28 Nippon Electric Glass Co Ltd 光学用キャップ部品
JP2008069033A (ja) * 2006-09-13 2008-03-27 Central Glass Co Ltd 無鉛低融点ガラス

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1642871B1 (en) * 2003-06-27 2010-12-01 Yamato Electronic Co., Ltd. Lead-free glass material for use in sealing and, sealed article and method for sealing using the same
JP4900868B2 (ja) * 2004-12-14 2012-03-21 日本電気硝子株式会社 タブレット一体型排気管
JP5257824B2 (ja) * 2006-04-03 2013-08-07 日本電気硝子株式会社 非結晶性ガラスタブレットおよびタブレット一体型排気管

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0517179A (ja) 1991-07-11 1993-01-26 Nippon Electric Glass Co Ltd 低融点低膨張性封着材料
JPH0624797A (ja) 1992-07-08 1994-02-01 Asahi Glass Co Ltd 接着又は封着用ガラス
JPH06263477A (ja) * 1993-03-12 1994-09-20 Nippon Seiki Co Ltd シ−ル構造
FR2794120A1 (fr) 1999-05-28 2000-12-01 Baruch Nachmansohn Verres de soudure a devitrification sans plomb ni autres materiaux toxiques
EP1291329A1 (en) 2000-05-11 2003-03-12 Matsushita Electric Industrial Co., Ltd. Glass composition, sealing glass for magnetic head and magnetic head
JP2002241143A (ja) 2001-02-09 2002-08-28 Ngk Insulators Ltd 封着用組成物
JP2003034550A (ja) * 2001-07-24 2003-02-07 Asahi Glass Co Ltd 無鉛ガラス、ガラスフリット、ガラスペースト、電子回路部品および電子回路
JP2003095697A (ja) * 2001-09-18 2003-04-03 Nihon Yamamura Glass Co Ltd 封着用組成物
JP2003128430A (ja) 2001-10-22 2003-05-08 Asahi Techno Glass Corp 無鉛ガラス組成物
EP1496025A1 (en) 2002-03-29 2005-01-12 Matsushita Electric Industrial Co., Ltd. Bismuth glass composition, and magnetic head and plasma display panel including the same as sealing member
JP2004284934A (ja) * 2002-04-24 2004-10-14 Central Glass Co Ltd 無鉛低融点ガラス
WO2004037736A1 (ja) 2002-10-23 2004-05-06 Matsushita Electric Industrial Co., Ltd. 磁気ヘッド用ギャップ接合ガラスおよび磁気ヘッド
US20060105898A1 (en) 2004-11-12 2006-05-18 Asahi Techno Glass Corporation Low melting glass, sealing composition and sealing paste
JP2007165551A (ja) * 2005-12-13 2007-06-28 Nippon Electric Glass Co Ltd 光学用キャップ部品
JP2008069033A (ja) * 2006-09-13 2008-03-27 Central Glass Co Ltd 無鉛低融点ガラス

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2168927A4 *

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012035565A1 (en) * 2010-09-16 2012-03-22 Daunia Solar Cell S.R.L. Sealing agent with low softening temperature useful in the preparation of electronic devices
US8927445B2 (en) 2010-09-16 2015-01-06 Daunia Solar Cell S.R.L. Sealing agent with low softening temperature useful in the preparation of electronic devices
KR101811374B1 (ko) 2010-09-16 2017-12-22 다우니아 솔라 셀 에스.알.엘. 전자장치의 제조에 유용한 저 연화점의 실링제
WO2012073662A1 (ja) * 2010-11-29 2012-06-07 セントラル硝子株式会社 無鉛低融点ガラス組成物
JP2012116669A (ja) * 2010-11-29 2012-06-21 Central Glass Co Ltd 無鉛低融点ガラス組成物
CN106663591A (zh) * 2014-07-18 2017-05-10 京瓷株式会社 发光装置
EP3171389A4 (en) * 2014-07-18 2018-03-28 Kyocera Corporation Light-emitting device
CN106663591B (zh) * 2014-07-18 2018-09-28 京瓷株式会社 发光装置
WO2016181736A1 (ja) * 2015-05-14 2016-11-17 日本電気硝子株式会社 ビスマス系ガラス粉末及びこれを用いた複合粉末材料
CN111556856A (zh) * 2017-11-28 2020-08-18 日立化成株式会社 密封材料和使用其的多层玻璃面板
CN111556856B (zh) * 2017-11-28 2023-07-28 株式会社力森诺科 密封材料和使用其的多层玻璃面板
CN114213025A (zh) * 2021-12-15 2022-03-22 西安赛尔电子材料科技有限公司 一种用于钽电容盖组封接玻璃的制备方法及封接工艺

Also Published As

Publication number Publication date
EP2168927A1 (en) 2010-03-31
EP2168927A4 (en) 2012-01-11

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