WO2009011023A1 - 配線基板及びその製造方法 - Google Patents

配線基板及びその製造方法 Download PDF

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Publication number
WO2009011023A1
WO2009011023A1 PCT/JP2007/064021 JP2007064021W WO2009011023A1 WO 2009011023 A1 WO2009011023 A1 WO 2009011023A1 JP 2007064021 W JP2007064021 W JP 2007064021W WO 2009011023 A1 WO2009011023 A1 WO 2009011023A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
wiring board
manufacturing
groove portion
base
Prior art date
Application number
PCT/JP2007/064021
Other languages
English (en)
French (fr)
Inventor
Michimasa Takahashi
Masakazu Aoyama
Original Assignee
Ibiden Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co., Ltd. filed Critical Ibiden Co., Ltd.
Priority to CN200780100601A priority Critical patent/CN101803482A/zh
Priority to EP07790801A priority patent/EP2173146A1/en
Priority to PCT/JP2007/064021 priority patent/WO2009011023A1/ja
Priority to JP2009523463A priority patent/JP4834157B2/ja
Publication of WO2009011023A1 publication Critical patent/WO2009011023A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1536—Temporarily stacked PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

　配線基板１９は、第１基板１と、第１基板１より実装面積が小さい第２基板２と、第１基板１と第２基板２との間に設けられているベース基板３と、を積層して構成され、外周の少なくとも一部の厚みが、中央部よりも薄く形成される。ベース基板３は、無機フィラー配合樹脂を含んで構成される。第１基板１及び前記第２基板２は、可撓性樹脂を含んで構成される。第１基板１と第２基板２とにはヴィア４４が設けられている。第１基板１と第２基板２との間には層間溝部１１が設けられている。層間溝部１１には気体等が充填されている。
PCT/JP2007/064021 2007-07-13 2007-07-13 配線基板及びその製造方法 WO2009011023A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN200780100601A CN101803482A (zh) 2007-07-13 2007-07-13 布线基板及其制造方法
EP07790801A EP2173146A1 (en) 2007-07-13 2007-07-13 Wiring board and manufacturing method thereof
PCT/JP2007/064021 WO2009011023A1 (ja) 2007-07-13 2007-07-13 配線基板及びその製造方法
JP2009523463A JP4834157B2 (ja) 2007-07-13 2007-07-13 配線基板及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/064021 WO2009011023A1 (ja) 2007-07-13 2007-07-13 配線基板及びその製造方法

Publications (1)

Publication Number Publication Date
WO2009011023A1 true WO2009011023A1 (ja) 2009-01-22

Family

ID=40259372

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/064021 WO2009011023A1 (ja) 2007-07-13 2007-07-13 配線基板及びその製造方法

Country Status (4)

Country Link
EP (1) EP2173146A1 (ja)
JP (1) JP4834157B2 (ja)
CN (1) CN101803482A (ja)
WO (1) WO2009011023A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2866535B1 (en) * 2012-06-22 2019-09-04 Nikon Corporation Substrate, imaging unit and imaging device
CN108882562B (zh) * 2017-05-10 2020-11-10 欣兴电子股份有限公司 线路板单元与其制作方法
CN113194619B (zh) * 2021-04-09 2022-08-26 东莞市多普光电设备有限公司 一种印刷电路板的生产工艺

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05152693A (ja) 1991-11-30 1993-06-18 Nitto Denko Corp 補強部付フレキシブルプリント基板およびその製法
JPH1174651A (ja) * 1997-03-13 1999-03-16 Ibiden Co Ltd プリント配線板及びその製造方法
JPH11172457A (ja) * 1997-12-05 1999-06-29 Ibiden Co Ltd 無電解めっき用接着剤および多層プリント配線板
JP2000013019A (ja) * 1998-06-23 2000-01-14 Sharp Corp ビルトアップ多層プリント配線板およびその製造方法
JP2002064271A (ja) * 2000-06-09 2002-02-28 Matsushita Electric Ind Co Ltd 複合配線基板及びその製造方法
JP2005079402A (ja) * 2003-09-01 2005-03-24 Fujikura Ltd 回路基板およびその製造方法
JP2005236205A (ja) * 2004-02-23 2005-09-02 Sharp Corp 多層プリント配線板の製造方法及び多層プリント配線板
JP2005268505A (ja) * 2004-03-18 2005-09-29 Fujikura Ltd 多層配線板およびその製造方法
JP2005336287A (ja) * 2004-05-26 2005-12-08 Matsushita Electric Works Ltd フレキシブルプリント配線板用熱硬化性接着シート、その製造方法及びそれを用いた多層フレキシブルプリント配線板並びにフレックスリジッドプリント配線板
JP2006032830A (ja) 2004-07-21 2006-02-02 Fujikura Ltd 部分ビルドアップ配線板の製造方法
JP2006114741A (ja) * 2004-10-15 2006-04-27 Ibiden Co Ltd 多層コア基板及びその製造方法
JP2006202891A (ja) * 2005-01-19 2006-08-03 Fujikura Ltd リジッドフレックスプリント配線板の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004266238A (ja) * 2003-01-09 2004-09-24 Sony Chem Corp 複合配線板、基板素片
JP2005064357A (ja) * 2003-08-19 2005-03-10 Fujikura Ltd 多層配線板およびその製造方法

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05152693A (ja) 1991-11-30 1993-06-18 Nitto Denko Corp 補強部付フレキシブルプリント基板およびその製法
JPH1174651A (ja) * 1997-03-13 1999-03-16 Ibiden Co Ltd プリント配線板及びその製造方法
JPH11172457A (ja) * 1997-12-05 1999-06-29 Ibiden Co Ltd 無電解めっき用接着剤および多層プリント配線板
JP2000013019A (ja) * 1998-06-23 2000-01-14 Sharp Corp ビルトアップ多層プリント配線板およびその製造方法
JP2002064271A (ja) * 2000-06-09 2002-02-28 Matsushita Electric Ind Co Ltd 複合配線基板及びその製造方法
JP2005079402A (ja) * 2003-09-01 2005-03-24 Fujikura Ltd 回路基板およびその製造方法
JP2005236205A (ja) * 2004-02-23 2005-09-02 Sharp Corp 多層プリント配線板の製造方法及び多層プリント配線板
JP2005268505A (ja) * 2004-03-18 2005-09-29 Fujikura Ltd 多層配線板およびその製造方法
JP2005336287A (ja) * 2004-05-26 2005-12-08 Matsushita Electric Works Ltd フレキシブルプリント配線板用熱硬化性接着シート、その製造方法及びそれを用いた多層フレキシブルプリント配線板並びにフレックスリジッドプリント配線板
JP2006032830A (ja) 2004-07-21 2006-02-02 Fujikura Ltd 部分ビルドアップ配線板の製造方法
JP2006114741A (ja) * 2004-10-15 2006-04-27 Ibiden Co Ltd 多層コア基板及びその製造方法
JP2006202891A (ja) * 2005-01-19 2006-08-03 Fujikura Ltd リジッドフレックスプリント配線板の製造方法

Also Published As

Publication number Publication date
CN101803482A (zh) 2010-08-11
JPWO2009011023A1 (ja) 2010-09-09
JP4834157B2 (ja) 2011-12-14
EP2173146A1 (en) 2010-04-07

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