WO2009004808A1 - 電子部品パッケージ製造方法 - Google Patents

電子部品パッケージ製造方法 Download PDF

Info

Publication number
WO2009004808A1
WO2009004808A1 PCT/JP2008/001747 JP2008001747W WO2009004808A1 WO 2009004808 A1 WO2009004808 A1 WO 2009004808A1 JP 2008001747 W JP2008001747 W JP 2008001747W WO 2009004808 A1 WO2009004808 A1 WO 2009004808A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
component package
fixing ring
lid fixing
manufacturing electronic
Prior art date
Application number
PCT/JP2008/001747
Other languages
English (en)
French (fr)
Inventor
Kazuhisa Momose
Original Assignee
Akim Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Akim Corporation filed Critical Akim Corporation
Priority to CN200880022974.2A priority Critical patent/CN101730935B/zh
Publication of WO2009004808A1 publication Critical patent/WO2009004808A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

　電子部品パッケージ本体に形成されるメタライズ領域に対して、リッド固定リングを配置する。更に、リッド固定リングの一部をスポット加熱して、ろう材を部分的に溶融させ、このリッド固定リングをメタライズ領域に仮固定する。その後、電子部品パッケージ本体を加熱してろう材を全体的に溶融させ、リッド固定リングをメタライズ領域に固定させるようにした。これにより、電子部品パッケージを高精度に製造可能にし、電子部品の小型化に対応する。
PCT/JP2008/001747 2007-07-04 2008-07-03 電子部品パッケージ製造方法 WO2009004808A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN200880022974.2A CN101730935B (zh) 2007-07-04 2008-07-03 电子部件封装体的制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-176154 2007-07-04
JP2007176154A JP4723540B2 (ja) 2007-07-04 2007-07-04 電子部品パッケージ製造方法

Publications (1)

Publication Number Publication Date
WO2009004808A1 true WO2009004808A1 (ja) 2009-01-08

Family

ID=40225873

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/001747 WO2009004808A1 (ja) 2007-07-04 2008-07-03 電子部品パッケージ製造方法

Country Status (4)

Country Link
JP (1) JP4723540B2 (ja)
CN (1) CN101730935B (ja)
TW (1) TWI437671B (ja)
WO (1) WO2009004808A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5459127B2 (ja) * 2010-07-20 2014-04-02 千住金属工業株式会社 機能部品の製造方法及び機能部品
JP5568026B2 (ja) 2011-01-20 2014-08-06 トヨタ自動車株式会社 ろう付け方法及びろう付け構造
JP6070702B2 (ja) * 2012-06-04 2017-02-01 日立金属株式会社 シールリングおよびシールリングの製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001148436A (ja) * 1999-11-22 2001-05-29 Ngk Spark Plug Co Ltd セラミックパッケージ及びセラミックパッケージの製造方法
JP2001352003A (ja) * 2000-06-08 2001-12-21 Ngk Spark Plug Co Ltd 配線基板の製造方法
JP2003001428A (ja) * 2001-06-15 2003-01-08 Nippon Avionics Co Ltd パッケージ封止におけるリッドの仮付け装置
JP2003133449A (ja) * 2001-10-25 2003-05-09 Kyocera Corp ろう材付きシールリングおよびこれを用いた電子部品収納用パッケージの製造方法
JP2006179740A (ja) * 2004-12-24 2006-07-06 Nippon Avionics Co Ltd パッケージの封止方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2754273Y (zh) * 2004-11-25 2006-01-25 浙江东晶电子股份有限公司 金属封装石英晶体谐振器

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001148436A (ja) * 1999-11-22 2001-05-29 Ngk Spark Plug Co Ltd セラミックパッケージ及びセラミックパッケージの製造方法
JP2001352003A (ja) * 2000-06-08 2001-12-21 Ngk Spark Plug Co Ltd 配線基板の製造方法
JP2003001428A (ja) * 2001-06-15 2003-01-08 Nippon Avionics Co Ltd パッケージ封止におけるリッドの仮付け装置
JP2003133449A (ja) * 2001-10-25 2003-05-09 Kyocera Corp ろう材付きシールリングおよびこれを用いた電子部品収納用パッケージの製造方法
JP2006179740A (ja) * 2004-12-24 2006-07-06 Nippon Avionics Co Ltd パッケージの封止方法

Also Published As

Publication number Publication date
TWI437671B (zh) 2014-05-11
TW200917428A (en) 2009-04-16
JP4723540B2 (ja) 2011-07-13
CN101730935A (zh) 2010-06-09
JP2009016537A (ja) 2009-01-22
CN101730935B (zh) 2011-10-05

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