200917428 九、發明說明 【發明所屬之技術領域】 本發明係關於電子零件封裝的製造方法等。 【先前技術】 石英振動元件等的各種電子零件，係在電子零件封裝 的內部，將石英等的各種機能構件予以收容而構成。此電 子零件封裝，係主要是，具備：由陶瓷所構成的封裝本體 、和形成在此封裝本體的金屬化區域、和在此金屬化區域 中’經由銲料而固定之接縫環（seam ring )、和對此接縫 環而藉由接縫溶接而固定之蓋部（lid)。封裝本體爲箱 狀構件，於中央具備：將機能構件予以收容之凹部。金屬 化區域，係形成於此封裝本體的凹部的開口周圍，對鎢或 鉬等施加鍍鎳（Ni )而構成。 如第1 1圖所示地，在製造此電子零件封裝的情況， 使用著具有對於基座而於上方突出之凸部之封裝專用治具 。對於此凸部，先將環狀的接縫環及銲料以此順序加以層 積，而且將封裝本體的凹部保持在朝向下方，將此凹部嵌 入至專用治具的凸部。保持此狀態，如藉由加熱爐以加熱 全體而使銲料熔融，則接縫環被銲於電子零件封裝的金屬 化區域。 另外，封裝專用治具，係爲了在加熱時避免銲料的附 者，所以採用碳素材。 在被固定了接縫環的電子零件封裝本體的凹部等，適 -4 - 200917428 宜地配置著機能構件’如將蓋部以進行接縫熔接來密閉內 部，就完成電子零件。 〔專利文獻1〕日本特開平8-46075號公報 【發明內容】 〔發明所欲解決的課題〕 現在電子電件的小型化係正有顯著地發展。就此結果 來說，接縫環的寬方向尺寸亦變小，例如亦存在著：該尺 寸成爲0·2〜0.3mm左右般的電子零件。若接縫環的寬度變 小’則必需提高對於封裝本體（金屬化區域）之接縫環的 位置決定精確度。 但是，在先前的製造方法，係爲了實現電子零件封裝 之圓滑的安裝，所以在專用治具的凸部與接縫環之間以及 同凸部與封裝本體的凹部之間，必需確保某程度的間隙， 而有難以將位置決定精確度予以提高的問題。 另外’在電子零件封裝的量產工程，係多使用在被分 割爲封裝本體之前的中間平板材料（所謂的集合基板）。 也就是’對於在陶瓷平板形成了複數的凹部之中間平板材 料’將接縫環加以集中固定’之後切斷此中間平板材料而 得到電子零件封裝。在此情況’專用治具亦有作爲合於此 中間平板材料的構造之必要’其必需具備：對應於中間平 板材料的各凹部之複數凸部。在量產工程，係於專用治具 的全部凸部’設置了接縫環和銲料的狀態下，從上方嵌合 中間平板材料’維持該狀態而搬入加熱爐而使接縫環集中 -5- 200917428 固定。 但是，此中間平板材料係因爲由陶瓷的燒成 所以因燒成時的收縮而最大產生有數％的形狀誤 應於形狀誤差，係先將中間平板材料的各凹部、 具的凸部的間隙予以加大設定、或將中間平板材 誤差區分等級，而需要事先準備好對應於各等級 具，總之，形成了安裝精確度惡化、製造成本增 原因。 而且，這些專用治具，係因爲由碳素材而構 因與封裝本體或與接縫環的接觸而磨耗，因該異 環不能適切地銲上等，而成爲使製造品質下降的 〇 本發明係鑑於以上問題點而爲之，其目的爲 品質，而且可柔軟地對應電子零件的小型化之電 裝的製造方法。 〔用以解決課題的手段〕 由本發明者的專心致力硏究，而上述目的係 的手段來達成。 (1 ) 一種以具備：對於形成在電子零件封 金屬化區域’配置蓋部固定環之環（r i n g )配置 將前述盍部固定環的一部分予以點加熱，利用銲 述蓋部固定環加以暫時固定於前述金屬化區域之 定步驟、和將已使前述蓋部固定環進行了暫時固 而製造， 差。在對 與專用治 料的形狀 的專用治 大之主要 成，所以 物而接縫 主要原因 提供：高 子零件封 藉由下述 裝本體的 步驟、和 料而將前 環暫時固 定之前述 -6- 200917428 電子零件封裝本體予以加熱’而使前述銲料全體性地熔融 ，使前述蓋部固定環固定於前述金屬化區域之環固定步驟 ，而作爲其特徵之電子零件封裝的製造方法。 (2) 如上述（1)所記載的電子零件封裝之製造方法 ’以於前述蓋部固定環，係事先被塗佈（coating )前述銲 料作爲其特徵。 (3) 如上述（1)所記載的電子零件封裝之製造方法 ’其特徵係以：更具備對於形成在電子零件封裝本體之金 屬化區域’配置銲料之銲料配置步驟，在前述環配置步驟 ’係於前述銲料上配置蓋部固定環。 (4 )如上述（1 ) 、（ 2 )或（3 )所記載的電子零件 封裝之製造方法’係以：前述金屬化區域係形成在電子零 件封裝本體的凹部附近，作爲其特徵。 (5 )如上述（1 )至（4 )中之任一項所記載的電子 零件封裝之製造方法，係以：在前述環暫時固定步驟，使 熔接電極抵接於前述蓋部固定環，藉由熔接電流而使前述 銲料部分地溶融，作爲其特徵。 (6 )如上述（1 )至（5 )中之任一項所記載的電子 零件封裝製造方法’係以前述蓋部固定環係被構成爲方形 的環狀’在前述環暫時固定步驟，部分地加熱前述蓋部固 定環的角部’於前述金屬化區域進行暫時固定’作爲其特 徵。 (7 )如上述（1 )至（6 )中之任一項所記載的電子 零件封裝製造方法’係以：在前述環暫時固定步驟，於氮 -7- 200917428 氣環境中，部分地加熱前述蓋部固定環，於前述金屬化區 域進行暫時固定，作爲其特徵。 8 . —種電子零件封裝，係以：藉由上述（1 )至（7 ) 中之任一項所記載的電子零件封裝製造方法而製造，作爲 其特徵。 (9 ) 一種以具備：對於形成在電子零件封裝本體的 金屬化區域，搬送蓋部固定環而定位、進行配置之環配置 手段、和將前述蓋部固定環的一部分進行點加熱，使銲料 部分地熔融，使前述蓋部固定環加以暫時固定於前述金屬 化區域之點加熱手段、和將已使前述蓋部固定環加以暫時 固定之前述電子零件封裝本體全體予以加熱，而使前述銲 料全體性地熔融，使前述蓋部固定環固定於前述金屬化區 域之環固定用加熱手段，作爲其特徵之電子零件封裝的製 造裝置。 〔發明的效果〕 如藉由本發明，則能顯現：可得小型、高品質的電子 零件封裝之優良的效果。 【實施方式】 以下，一邊參照圖面、同時詳細說明關於本發明的實 施形態之例。 於第1圖，係表示有關本發明的實施形態之電子零件 封裝製造裝置1(以下，爲製造裝置1)之全體構成。此 -8- 3、 200917428 製造裝置1係具備集合基板搭載平台2、銲料配置臂 環配置臂4、點熔接裝置5、加熱爐6 (省略圖示） 離蓋7。於集合基板搭載平台2，集合基板50係被定 配置。 銲料配置臂3及環配置臂4,個別具備：將被搬 抓住之夾頭部3A、4A、和使此夾頭部3A、4A上下 Z軸部3B、4B、和使夾頭部3A、4A於平面方向移 X-Y軸部3C、4C、和將集合基板50的凹部50A或金 區域5 0 B的位置加以檢測之位置檢測部3 d、4 D。另 在本實施形態’係作爲位置檢測部3 D、4 D而使用 等的攝影裝置’而成爲藉由影像而檢測對象物的位置 銲料配置臂3係從收容了環狀的銲料5 2之卡匣 將銲料52抓住而取出至上方向（z軸上方向），將 料52搬送至平面方向（X-Y平面方向），在集合基| 的凹部50A的周圍的金屬化區域50B上，高精確度 位’使之下降而配置。環配置臂4係從收容了環狀的 環54之卡匣32，將接縫環54抓住而取出至上方向（ 上方向）’將此接縫環54搬送至平面方向（χ_γ平 向）’以重疊於集合基板50上的銲料52的方式來定 進行配置。200917428 IX. Description of the Invention [Technical Field] The present invention relates to a method of manufacturing an electronic component package and the like. [Prior Art] Various electronic components such as a quartz vibration element are housed inside an electronic component package, and various functional components such as quartz are housed. The electronic component package mainly includes a package body made of ceramic, a metallized region formed in the package body, and a seam ring fixed by solder in the metallized region. And a lid that is fixed by the seam by the seam of the seam loop. The package body is a box-shaped member, and has a concave portion for accommodating the functional member at the center. The metallized region is formed around the opening of the concave portion of the package body, and is formed by applying nickel (Ni) to tungsten or molybdenum. As shown in Fig. 1, in the case of manufacturing the electronic component package, a package-dedicated jig having a convex portion protruding upward from the susceptor is used. In the convex portion, the annular seam ring and the solder are first laminated in this order, and the concave portion of the package body is held downward, and the concave portion is fitted into the convex portion of the dedicated jig. Maintaining this state, if the solder is melted by heating the entire furnace, the seam ring is welded to the metallized area of the electronic component package. In addition, the special jig for packaging is made of carbon material in order to avoid attachment of solder during heating. In the recessed portion of the electronic component package body to which the seam ring is fixed, etc., the functional component is suitably disposed. If the lid portion is welded to the joint to seal the inner portion, the electronic component is completed. [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei 8-46075. SUMMARY OF THE INVENTION [Problems to be Solved by the Invention] The miniaturization of electronic components is now progressing remarkably. As a result, the width dimension of the seam ring is also small. For example, there is also an electronic component having a size of about 0.2 mm to about 0.3 mm. If the width of the seam loop becomes smaller, it is necessary to increase the accuracy of the position of the seam loop of the package body (metallized region). However, in the prior manufacturing method, in order to realize the smooth mounting of the electronic component package, it is necessary to ensure a certain degree between the convex portion of the special jig and the seam ring and between the convex portion and the concave portion of the package body. There is a gap, and there is a problem that it is difficult to improve the accuracy of the position determination. In addition, in the mass production of electronic component packaging, an intermediate flat material (so-called collective substrate) before being divided into package bodies is used. That is, the intermediate flat material is cut and fixed for the intermediate flat material having a plurality of concave portions formed in the ceramic flat plate, and then the intermediate flat plate material is cut to obtain an electronic component package. In this case, the special jig is also necessary as a structure for the intermediate flat material. It is necessary to have a plurality of convex portions corresponding to the respective concave portions of the intermediate flat material. In the mass production project, in the state where the joint ring of the special jig is provided with the seam ring and the solder, the intermediate flat material is fitted from above to maintain the state and is carried into the heating furnace to concentrate the seam ring-5- 200917428 Fixed. However, this intermediate flat plate material is caused by a large number of shapes due to shrinkage during firing due to shrinkage during firing, and the gap between the concave portions and the convex portions of the intermediate flat plate material is first given. Increase the setting, or classify the intermediate plate error, and need to prepare the corresponding level in advance. In short, the installation accuracy is deteriorated and the manufacturing cost is increased. Further, these special jigs are worn by the contact of the package body or the seam ring due to the carbon material, and the heterogeneous ring cannot be properly welded, and the manufacturing quality is lowered. In view of the above problems, the object is a quality, and it is also possible to soften the method of manufacturing a miniaturized electronic component. [Means for Solving the Problem] The inventors of the present invention have focused their efforts on the purpose and achieved the above-mentioned means. (1) A portion in which a part of the crotch fixing ring is heated in a ring arrangement in which a lid fixing ring is formed in an electronic component sealing metallized region, and is temporarily fixed by welding a cap fixing ring The step of forming the metallized region and the step of fixing the lid fixing ring are temporarily made, which is inferior. In the special treatment of the shape of the special treatment material, the main reason for the seam is provided: the high-part part seal is temporarily fixed by the following steps of loading the main body and the material. - 200917428 A method of manufacturing an electronic component package characterized in that the electronic component package body is heated to fuse the solder integrally, and the cover fixing ring is fixed to the ring-forming step of the metallized region. (2) The method of manufacturing an electronic component package according to the above (1), wherein the cover fixing ring is coated with the solder in advance. (3) The method of manufacturing an electronic component package according to the above (1), characterized in that the solder arrangement step of disposing solder in the metallized region of the electronic component package body is further provided in the ring arrangement step A cover fixing ring is disposed on the solder. (4) The method of manufacturing an electronic component package according to (1), (2), or (3), wherein the metallized region is formed in the vicinity of a concave portion of the electronic component package body. (5) The method of manufacturing an electronic component package according to any one of (1) to (4), wherein, in the step of temporarily fixing the ring, the welding electrode is brought into contact with the cover fixing ring, The solder is partially melted by a welding current as a feature. (6) The method of manufacturing an electronic component package according to any one of the above (1) to (5), wherein the cover portion fixing ring is formed in a square ring shape, and the ring is temporarily fixed in the ring portion The corner portion 'the temporary fixation of the metallized region' is heated to the surface of the cover fixing ring. (7) The method of manufacturing an electronic component package according to any one of the above (1) to (6), wherein the step of temporarily fixing the ring is to partially heat the gas in a nitrogen atmosphere of nitrogen-7-200917428 The cover fixing ring is temporarily fixed in the metallized region as a feature. The electronic component package is manufactured by the electronic component package manufacturing method according to any one of the above (1) to (7). (9) A ring arrangement device for positioning and arranging a cover portion fixing ring formed in a metallized region of an electronic component package main body, and heating a part of the cover portion fixing ring to a solder portion The ground heating means, the point heating means for temporarily fixing the cover fixing ring to the metallized region, and the entire electronic component package body for temporarily fixing the cover fixing ring to heat the entire solder joint A device for manufacturing an electronic component package characterized in that the cover fixing ring is fixed to the ring-fixing heating means in the metallized region. [Effects of the Invention] According to the present invention, it is possible to obtain an excellent effect of obtaining a small-sized, high-quality electronic component package. [Embodiment] Hereinafter, an example of an embodiment of the present invention will be described in detail with reference to the drawings. In the first embodiment, the electronic component package manufacturing apparatus 1 (hereinafter referred to as the manufacturing apparatus 1) according to the embodiment of the present invention is shown. The -8-3, 200917428 manufacturing apparatus 1 includes a collective substrate mounting platform 2, a solder arrangement arm ring arrangement arm 4, a spot welding device 5, and a heating furnace 6 (not shown). The collective substrate mounting platform 2 is mounted on the collective substrate 50. The solder disposing arm 3 and the ring disposing arm 4 are provided separately with the chucking heads 3A and 4A to be gripped, and the upper and lower Z-axis portions 3B and 4B and the gripping head portion 3A of the chucking heads 3A and 4A. 4A moves the XY axis portions 3C and 4C in the planar direction and the position detecting portions 3d and 4D that detect the positions of the concave portion 50A or the gold region 50B of the collective substrate 50. In the present embodiment, the image detecting device 3D and 4D are used as the position detecting unit 3D and 4D, and the position of the object is detected by the image. The solder placement arm 3 is a card in which the ring-shaped solder 5 2 is housed.抓住The solder 52 is grasped and taken out to the upper direction (the z-axis direction), and the material 52 is transported to the planar direction (XY plane direction), and the metallized region 50B around the concave portion 50A of the collective base | is highly accurate. 'Let it fall and configure. The ring arrangement arm 4 is carried out from the cassette 32 in which the ring 54 is accommodated, and the seam ring 54 is grasped and taken out in the upper direction (upward direction) to convey the seam ring 54 to the plane direction (χ_γ). The arrangement is performed in such a manner as to be superimposed on the solder 52 on the collective substrate 50.
點熔接裝置5係具備：相當於本發明的點加熱手 接縫熔接滾子單元5 A、和對接縫熔接滾子單元5 a供 接電流之電源單元5 B、和使接縫熔接滾子單元5 a移 上下方向之垂直滑件5 C、和使接縫熔接滾子單元5 A 、隔 位而 送物 動之 動之 屬化 外， CCD 〇 30， 此銲 反50 地定 接縫 Z軸 面方 位， 段， 給溶 動於 移動 -9- 200917428 於平面方向之水平滑件5 D。接縫熔接滾子單元5 A係具有 自由旋轉之熔接滾子5 E。另外，垂直滑件5 C係特別具備 無圖示之彈簧等的壓上手段，對集合基板50，將熔接滾 子5E以特定加重壓上。因而，在集合基板5〇爲變形、在 電子零件封裝的固定狀態產生誤差的情況，各熔接滾子 5E係上下移動而吸收該誤差。 因而’使溶接滾子5E抵接於已搭載在集合基板50上 的接縫環5 4 ’藉由將熔接電流加以流過，來加熱接縫環 5 4與熔接滾子5 E的接點，該接點附近的銲料5 2係部分 地進行熔融。就此結果，接縫環54係部分地被銲在集合 基板5 0的金屬化區域5 0 B。 加熱爐6係相當於本發明的環固定用加熱手段，將已 暫時固定接縫環5 4的集合基板5 0予以收容，將全體進行 加熱。就此結果，銲料5 2全體地熔融，藉由此銲料5 2而 接縫環54的全周係被完全地銲於金屬化區域50B。 隔離蓋7係覆蓋：集合基板搭載平台2、銲料配置臂 3、環配置臂4、點熔接裝置5等的周圍。以在此隔離蓋7 的內部導入氮，將集合基板搭載平台2的附近設成氮氣環 境狀態。由此，在點加熱時，抑制：金屬化區域5 0B或接 縫環5 4進行氧化。 接著，參照第2圖及第3圖，說明有關電子零件封裝 60 ° 電子零件封裝60’係具備：陶瓷封裝本體62、銲料 5 2、接縫環5 4。陶瓷封裝本體6 2，係爲中間平板材料之 -10- 200917428 集合基板50，被分割爲立方體形狀而構成，在6面中的^ 面形成凹部50A。在凹部5〇A的開口周圍，係形成爲長方 形環狀之金屬化區域50B。此金屬化區域5〇b係以鎢或鉬 等的金屬材料構成，於其上施以鍍鎳。另外，陶瓷封裝本 體62的尺寸，係例如長邊方向爲2 5mrn、寬方向爲 2 · 0mm左右、或是成爲該以下的情況爲理想。 銲料52係依照融點而可選擇各式各樣的材料，但例 如可使用在850度熔融之Cu-Ag材料。之外亦例如可選 擇：Sn-Ag 材料、Pd_Sn 材料、Au_Sn 材料、Cu_Ag_In 材 料等。此銲料52係合於金屬化區域5〇B的形狀，成爲長 方形環狀的平板材料。 接縫環54 ’係成爲科伐鐵鈷鎳（Koval )材料之直徑 0.2〜0.3mm左右的金屬環，施加鍍鎳而得。此接縫環54 的大小，係與金屬化區域5 0 B —致。 如第3圖所示地’成爲陶瓷封裝本體62的中間薄片 材料之集合基板5 0，係於一片陶瓷薄片中，將多數的凹 部5 0 A形成至矩陣狀而構成。另外，在此凹部5 〇 a的周 圍，係如已述之，形成金屬化區域5 0 B (在第3圖係省略 圖示）。此金屬化區域50B，係將金屬素材以高度7-14 "m的厚度加以印刷，將該加熱至約1 3 0 0度而形成。而 且，在此凹部5 0 A的配列之間，將分割用的溝5 0 C形成 至網目狀，一施加外力’則沿著此溝50C而破裂。另外， 如後述地，接縫環5 4係事先固定於此集合基板5 0。因而 ，如沿著此溝50C而分割集合基板50，則可得已事先固 -11 - 200917428 定接縫環54之電子零件封裝60。 接著’說明有關使用製造裝置1之電子零件封裝60 的製造方法。 首先’在表示於第4(A)圖的狀態之準備步驟，凹 部50A爲將開口於上方之集合基板5〇，定位固定在集合 基板？合載平台2之上。另外集合基板搭載平台2的周圍係 先作爲氮氣環境狀態。之後，在如第4 ( B )圖所示之銲 料配置步驟，利用銲料配置臂3，在金屬化區域50B定位 配置銲料52。銲料52之定位，係例如以進行：將閃光照 射於金屬化區域5 0B，將該反射光，藉由位置檢測部3 D 加以攝影，而將金屬化區域50B的位置及角度予以高精確 度地檢測。 接著，在表示於第5 ( A )圖的狀態之環配置步驟， 利用環配置臂4，於銲料5 2之上將接縫環5 4加以定位而 配置。此定位，亦同樣地進行：藉由位置決定檢測部4 D 而將金屬化區域50B及銲料52的位置加以高精確度地檢 測。 之後，在第5 ( B )圖的狀態所示之環暫時固定步驟 ，使點熔接裝置5的熔接滾子5 E下降’使熔接滾子5 E 抵接於接縫環5 4相對之各邊。此時’儘量使熔接滾子5 E 不移動，將作爲熔接電流之100-150A左右之脈衝電流， 以3 - 6毫秒流過。此結果，接縫環5 4與熔接滾子5 E的接 點係被點狀地加熱，其附近的銲料5 2係進行熔融。之後 ，停止熔接電流’如使接縫環54上昇’則銲料52固化’ -12- 200917428 部分地被銲於金屬化區域5 0與接縫環5 4。藉由此 高精確度地決定了位置之狀態，可在接縫環5 4被 定於金屬化區域50的同時，將銲料52的一部分作 的「濡濕狀態」。將上述銲料配置步驟、環配置步 暫時固定步驟，對應於集合基板5 0的各凹部5 0 A 化區域50B反覆實行，在全部的金屬化區域50B 縫環54暫時固定。 之後，在環固定步驟，將已暫時固定了接縫環 集合基板50，搬入至加熱爐6而加熱全體。若昇 定的溫度，則銲料5 2，係將暫時固定時，成爲濡 的部分作爲起點（觸發器）而進行熔融，此濡濕狀 向全體性地擴展。特別是，在接縫環54與金屬 5 0B之間，係因爲表面張力進行作用，所以自然地 精確度的位置決定。之後，逐漸地下降加熱爐6的 而一邊將包含於銲料5 2內部的氣泡脫氣，同時使 固化。該結果，接縫環54的全周被銲於金屬化區 。之後，分割集合基板5 0，而得到已固定了接縫環 電子零件封裝60。 如藉由本實施形態，則將接縫環54高精確度 而暫時固定，之後，藉由加熱爐6而固定全周’所 可對於金屬化區域5 Ο B而高精確度地固定接縫環 外，藉由環暫時固定步驟，將銲料5 2的一部分事 「濡濕狀態」之後，以加熱爐6加熱全體，所以成 此濡濕狀態作爲起點而擴展爲濡濕至全體的狀態’ ，在被 暫時固 爲所謂 驟、環 的金屬 上將接 54之 溫至特 濕狀態 態係朝 化區域 實現高 溫度， 之冷卻 域 5 0B [54之 地定位 以成爲 5 4。另 先作爲 爲可將 而可提 -13- 200917428 高銲接的品質。結果，可使製造時的良率提高。即使 子零件封裝已被小型化的情況，亦可高精確度地製造 零件封裝60。 另外，在本實施形態，係如第6 ( A )圖所示， :將接縫環5 4的對抗之2邊的中間區域X進行點加 而固定於金屬化區域50B的情況，但本發明係不限於 如第6 ( B)圖所示地，將方形的接縫環5 4的角部Y 加熱，進行暫時固定之情事亦爲理想。封裝本體側的 化區域50B，係因爲於表面施加電鍍處理，故因表面 等而角部容易隆起。於是，如對於金屬化區域50B的 部分（角部）銲上接縫環54，則可使接縫環54的暫 定狀態安定。 另外，在本實施形態，係表示：相對之一對熔接 5 E，係以內側爲直徑小、外側爲直徑大的方式來配置 況，但如第7圖所示地，將內側設爲直徑大、外側設 徑小之情事亦理想。以如此作用，成爲可使熔接滾ΐ 的直徑大之側，進入至凹部5 0 Α內，可確實地避開 合基板5 0之接觸。 而且在本實施形態，係限於使用集合基板5 0而 電子零件封裝6 0的情況而加以表示，但本發明係不 於此，亦可對於已事先分割的封裝本體62，銲上接 54。此情況係如第8圖所示地，利用可將複數封裝 62予以搭載之托盤70爲理想。托盤70的定位用 70A，係設置封裝本體62，與集合基板50的情況相 在電 電子 表未 熱， 此， 予以 金屬 張力 壁厚 時固 滾子 的情 爲直 :5E 跑隼 〆、 製造 限定 縫環 本體 凹部 同， 200917428 可在封裝本體62固定接縫環54。 另外再加上，在本實施形態，係限於表示在封 62形成凹部5 0 A的情況，但本發明係不限於此。 年的電件之小型薄型化，如第9圖所示地，作到： 體62 (或集合基板5 0 )係以平面的平板材料構成 封裝本體62的環狀金屬化區域50B，經由銲料52 縫環54加以固定亦佳。藉由此接縫環54的厚度， 實質上的凹部。 另外，在本實施形態，係作爲將接縫環54暫 於金屬化區域5 0B之裝置，而使用接縫熔接式的點 置5，但是本發明係不限於此，由雷射等的照射來 加熱而銲接亦佳。也就是，在本發明，係如可以設 地加熱接縫環5 4而濡濕銲料5 2的狀態，則可選擇 置。而且，在本實施形態，係在將接縫環54予以 定時，使用了加熱爐，但本發明係不限定於此，亦 其他的加熱手段而進行加熱。而且，在本實施形態 示：於金屬化區域5 0 B配置了銲料5 2之後，於其 縫環5 4加以載置的情況，但本發明係不限於此。 如第1 0 ( A )圖所示地，對於接縫環5 4而塗佈（ )銲料5 2的情況，係如第10 ( B )圖般地，將此 5 4直接載置於金屬化區域5 0 B亦佳。如點加熱接i ，則銲料5 2熔融，可將接縫環5 4銲於金屬化區域 另外’本發明的電子零件封裝製造方法等，當 定於上述之實施形態，在不逸脫本發明的要旨之範 裝本體 隨著近 封裝本 ，在此 而將接 可形成 時固定 熔接裝 進行點 爲部分 各種裝 最終固 可藉由 ，係例 上將接 例如： coating 接縫環 逢環54 50B。 然不限 圍內可 -15- 200917428 加以各式各樣的變更。 〔產業上的可利用性〕 本發明係可廣泛地利用在電子零件的製造領域。 【圖式簡單說明】 〔第1圖〕表示有關本發明的實施形態之電子零件封 裝製造裝置的槪略構成之正面圖。 〔第2圖〕表示藉由同製造裝置而製造之電子零件封 裝的構造之安裝立體圖。 〔第3圖〕表示爲相同電子零件封裝的中間薄片材料 的集合基板之立體圖。 〔第4圖〕表示同電子零件封裝的製造工程之剖面圖 〇 〔第5圖〕表示同電子零件封裝的製造工程之剖面圖 〇 〔第6圖〕表示同電子零件封裝的點加熱區域之立體 圖。 〔第7圖〕表示同製造裝置的其他構成例之部分放大 圖。 〔第8圖〕表示同製造裝置的其他構成例之部分放大 圖。 〔第9圖〕表示同電子零件封裝的其他構造例之安裝 立體圖。 -16- 200917428 〔第1 〇圖〕表示同電子零件封裝的其他構造例之安 裝立體圖。 〔第11圖〕表示先前的電子零件封裝的製造方法之 剖面圖。 【主要元件符號說明】 1:電子零件封裝製造裝置 3 :銲料配置臂 4 :環配置臂 5 :點熔接裝置 5 0 :集合基板 50Α :凹部 5 0 Β :金屬化區域 5 2 :銲料 5 4 :接縫環 60 :電子零件封裝 62 :封裝本體 -17-The spot welding device 5 is provided with a spot heating hand seam welding roller unit 5 A corresponding to the present invention, a power supply unit 5 B for supplying current to the seam welding roller unit 5 a, and a seam welding roller The unit 5 a moves the vertical slider 5 C in the up and down direction, and the movement of the seam welding roller unit 5 A and the object to move the object, and the CCD 〇 30, the welding reverse 50 ground seam Z Axial orientation, segment, for the movement of the horizontal slider 5 D in the direction of the plane -9- 200917428. The seam welding roller unit 5 A has a freely rotating welding roller 5 E. Further, the vertical slider 5 C is particularly provided with a pressing means such as a spring (not shown), and the welding roller 5E is pressed against the collective substrate 50 with a specific weight. Therefore, when the collective substrate 5 is deformed and an error occurs in the fixed state of the electronic component package, each of the welding rollers 5E moves up and down to absorb the error. Therefore, the welding ring 5E is brought into contact with the seam ring 5 4 ′ mounted on the collecting substrate 50 to heat the joint of the seam ring 54 and the welding roller 5 E by flowing a welding current. The solder 52 in the vicinity of the contact is partially melted. As a result of this, the seam ring 54 is partially welded to the metallized region 50B of the collecting substrate 50. The heating furnace 6 corresponds to the heating means for ring fixing of the present invention, and the collective substrate 50 of the temporarily fixed seam ring 54 is housed and heated as a whole. As a result, the solder 52 is entirely melted, and the entire circumference of the seam ring 54 is completely welded to the metallized region 50B by the solder 52. The spacer cover 7 covers the periphery of the collective substrate mounting stage 2, the solder arrangement arm 3, the ring arrangement arm 4, the spot welding device 5, and the like. Nitrogen is introduced into the inside of the separation cover 7, and the vicinity of the collective substrate mounting platform 2 is placed in a nitrogen atmosphere. Thereby, at the time of spot heating, it is suppressed that the metallized region 50B or the seam ring 54 is oxidized. Next, referring to Fig. 2 and Fig. 3, the electronic component package 60 ° electronic component package 60' is provided with a ceramic package body 62, a solder 5, and a seam ring 504. The ceramic package body 6 2 is an intermediate flat material -10- 200917428 The collective substrate 50 is divided into a cubic shape, and a concave portion 50A is formed on the surface of the six faces. Around the opening of the recess 5A, a metalized region 50B having a rectangular ring shape is formed. The metallized region 5〇b is made of a metal material such as tungsten or molybdenum, and nickel plating is applied thereto. Further, the size of the ceramic package body 62 is preferably such that the longitudinal direction is 2 5 mrn and the width direction is about 2.0 mm or less. The solder 52 can be selected from a wide variety of materials depending on the melting point, but for example, a Cu-Ag material melted at 850 degrees can be used. For example, Sn-Ag material, Pd_Sn material, Au_Sn material, Cu_Ag_In material, etc. may be selected. This solder 52 is bonded to the shape of the metallized region 5〇B to form a rectangular ring-shaped flat plate material. The seam ring 54' is a metal ring having a diameter of 0.2 to 0.3 mm of a Koval material, and is obtained by applying nickel plating. This seam ring 54 is sized to coincide with the metallized area 50B. As shown in Fig. 3, the collective substrate 50 which is the intermediate sheet material of the ceramic package body 62 is formed in a single ceramic sheet, and a plurality of concave portions 50A are formed in a matrix shape. Further, as described above, the metallized region 5 0 B is formed around the concave portion 5 〇 a (not shown in Fig. 3). The metallized region 50B is formed by printing a metal material at a thickness of 7-14 "m and heating it to about 1300 degrees. Further, between the arrangement of the recesses 50 A, the dividing groove 50c is formed in a mesh shape, and an external force is applied to be broken along the groove 50C. Further, as will be described later, the seam ring 54 is fixed to the collective substrate 50 in advance. Therefore, if the collective substrate 50 is divided along the groove 50C, the electronic component package 60 in which the seam ring 54 is fixed in advance can be obtained. Next, a method of manufacturing the electronic component package 60 using the manufacturing apparatus 1 will be described. First, in the preparation step shown in the state of Fig. 4(A), the concave portion 50A is a collective substrate 5 that is opened upward, and is positioned and fixed to the collective substrate. Above the platform 2. Further, the periphery of the collective substrate mounting stage 2 is first used as a nitrogen atmosphere. Thereafter, in the solder disposing step shown in Fig. 4(B), the solder 52 is placed by the solder, and the solder 52 is positioned and disposed in the metallized region 50B. The positioning of the solder 52 is performed, for example, by irradiating a flash to the metallized region 50B, and photographing the reflected light by the position detecting portion 3D to accurately position and angle the metalized region 50B. Detection. Next, in the ring arrangement step shown in the state of Fig. 5(A), the seam ring 4 is placed on the solder 52 by the ring arrangement arm 4, and is placed. This positioning is also performed in the same manner: the position of the metallized region 50B and the solder 52 is detected with high accuracy by the position determining detecting portion 4 D. Thereafter, in the ring temporary fixing step shown in the state of the fifth (B) diagram, the welding roller 5 E of the spot welding device 5 is lowered, so that the welding roller 5 E abuts against the opposite sides of the seaming ring 5 4 . At this time, the welding roller 5 E is not moved as much as possible, and a pulse current of about 100 to 150 A as a welding current flows through 3 to 6 milliseconds. As a result, the joint between the seam ring 54 and the welding roller 5E is heated in a dot shape, and the solder 52 in the vicinity thereof is melted. Thereafter, the welding current is stopped. If the seam ring 54 is raised, the solder 52 is solidified by -12-200917428 and partially welded to the metallized region 50 and the seam ring 54. By thus determining the state of the position with high precision, a part of the solder 52 can be made "wet state" while the seam ring 54 is positioned in the metallized region 50. The solder arrangement step and the ring arrangement step temporary fixing step are performed in reverse for each concave portion 50A region 50B of the collective substrate 50, and the slit ring 54 is temporarily fixed in all the metallized regions 50B. Thereafter, in the ring fixing step, the seam ring assembly substrate 50 is temporarily fixed and carried into the heating furnace 6 to heat the entire portion. When the temperature is raised, the solder 5 2 is temporarily fixed, and the portion which becomes 濡 is melted as a starting point (trigger), and the wetness spreads in an all-round manner. In particular, between the seam ring 54 and the metal 50B, the surface tension is exerted, so the position of the natural precision is determined. Thereafter, the furnace 6 is gradually lowered while the air bubbles contained in the inside of the solder 52 are degassed while being solidified. As a result, the entire circumference of the seam ring 54 is welded to the metallized area. Thereafter, the collective substrate 50 is divided to obtain the seamed-ring electronic component package 60. According to the present embodiment, the seam ring 54 is temporarily fixed with high precision, and then the entire circumference can be fixed by the heating furnace 6 to fix the seam ring with high precision for the metallized region 5 Ο B. In the ring temporary fixing step, a part of the solder 52 is "sweetened", and then the entire furnace is heated by the heating furnace 6, so that the wet state is expanded to a state of being wet to the whole state as the starting point, and is temporarily fixed. The metal of the so-called ring and the ring is connected to the temperature of the ultra-wet state to achieve a high temperature, and the cooling zone 50B [54 is positioned to become 5 4 . In addition, as a high-quality welding quality, it can be mentioned as -13- 200917428. As a result, the yield at the time of manufacture can be improved. Even if the sub-part package has been miniaturized, the part package 60 can be manufactured with high precision. Further, in the present embodiment, as shown in Fig. 6(A), the intermediate portion X of the two sides of the seam ring 54 is added to the metalized region 50B, but the present invention is applied. It is also preferable that the corner portion Y of the square seam ring 504 is heated and temporarily fixed as shown in Fig. 6(B). Since the plating region 50B is applied to the surface of the package body, the corner portion is easily raised due to the surface or the like. Thus, if the seam ring 54 is welded to the portion (corner portion) of the metallized region 50B, the tentative state of the seam ring 54 can be stabilized. Further, in the present embodiment, the pair of welded portions 5 E are arranged such that the inner side has a small diameter and the outer side has a large diameter. However, as shown in Fig. 7, the inner side is made larger in diameter. The situation with small diameter on the outside is also ideal. In such a manner, the side of the diameter of the welding rim can be made larger, and the inside of the recessed portion 50 Α can be surely prevented from coming into contact with the substrate 50. Further, in the present embodiment, the present invention is limited to the case of using the collective substrate 50 and the electronic component package 60. However, the present invention is not limited thereto, and the package body 62 may be soldered to the package body 62 which has been previously divided. In this case, as shown in Fig. 8, it is preferable to use a tray 70 on which the plurality of packages 62 can be mounted. The positioning of the tray 70 is 70A, and the package body 62 is provided. In the case of the collective substrate 50, the electronic timepiece is not hot. Therefore, when the metal tension is thick, the solid roller is straight: 5E running, manufacturing limitation The seam ring body recess is the same as 200917428. The seam ring 54 can be fixed to the package body 62. Further, in the present embodiment, the present invention is limited to the case where the concave portion 50A is formed in the seal 62, but the present invention is not limited thereto. In the case of the miniaturization of the electric components of the year, as shown in Fig. 9, the body 62 (or the collecting substrate 50) is formed of a flat plate material to form the annular metallized region 50B of the package body 62 via the solder 52. It is also preferable that the sewing ring 54 is fixed. By the thickness of the seam loop 54, the recess is substantially. Further, in the present embodiment, the seaming ring 54 is temporarily placed in the metallized region 50B, and the joint welding type is used. However, the present invention is not limited thereto, and irradiation by laser or the like is used. Heating and welding are also good. That is, in the present invention, if the seam ring 54 can be heated to wet the solder 5 2, it can be selected. Further, in the present embodiment, the heating ring is used when the seam ring 54 is timed. However, the present invention is not limited thereto, and other heating means are used for heating. Further, in the present embodiment, the solder 5 2 is placed on the metallized region 5 0 B and then placed on the slit ring 5 4 . However, the present invention is not limited thereto. As shown in Fig. 10 (A), when the solder ring 5 2 is applied to the seam ring 5 4 , the 5 4 is directly placed on the metallization as in the 10th (B) diagram. Area 5 0 B is also good. When the spot is heated to i, the solder 52 is melted, and the seam ring 54 is welded to the metallized region. In addition, the electronic component package manufacturing method of the present invention, etc., is set in the above embodiment, and the present invention is not detached. The main body of the package is the near-package body, and the fixed-welding device can be fixed at the point where the connection can be formed. The final assembly can be carried out. For example, the coating seam ring is 54 54B. . However, it is not limited to -15- 200917428 and various changes are made. [Industrial Applicability] The present invention can be widely utilized in the field of manufacturing electronic parts. [Brief Description of the Drawings] [Fig. 1] is a front view showing a schematic configuration of an electronic component package manufacturing apparatus according to an embodiment of the present invention. [Fig. 2] is a perspective view showing the mounting of the electronic component package manufactured by the same manufacturing apparatus. [Fig. 3] is a perspective view showing a collective substrate of an intermediate sheet material of the same electronic component package. [Fig. 4] is a cross-sectional view showing the manufacturing process of the same electronic component package. Fig. 5 is a cross-sectional view showing the manufacturing process of the same electronic component package. Fig. 6 is a perspective view showing the point heating region of the same electronic component package. . Fig. 7 is a partially enlarged view showing another configuration example of the manufacturing apparatus. [Fig. 8] is a partial enlarged view showing another configuration example of the manufacturing apparatus. Fig. 9 is a perspective view showing the mounting of another structural example of the electronic component package. -16- 200917428 [Fig. 1] shows an installation perspective view of another structural example of the same electronic component package. [Fig. 11] is a cross-sectional view showing a method of manufacturing the prior electronic component package. [Description of main component symbols] 1: Electronic component package manufacturing apparatus 3: Solder arrangement arm 4: Ring arrangement arm 5: Spot welding apparatus 50: Assembly substrate 50Α: recess 5 0 Β : Metallization area 5 2 : Solder 5 4 : Seam ring 60: electronic component package 62: package body -17-