KR20070111569A - A package of electron parts - Google Patents

A package of electron parts Download PDF

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Publication number
KR20070111569A
KR20070111569A KR1020060044509A KR20060044509A KR20070111569A KR 20070111569 A KR20070111569 A KR 20070111569A KR 1020060044509 A KR1020060044509 A KR 1020060044509A KR 20060044509 A KR20060044509 A KR 20060044509A KR 20070111569 A KR20070111569 A KR 20070111569A
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KR
South Korea
Prior art keywords
ceramic substrate
metal
contact electrode
support plate
cover
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KR1020060044509A
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Korean (ko)
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KR100782293B1 (en
Inventor
한규진
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주식회사 코스텍시스
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Priority to KR1020060044509A priority Critical patent/KR100782293B1/en
Publication of KR20070111569A publication Critical patent/KR20070111569A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/066—Hermetically-sealed casings sealed by fusion of the joining parts without bringing material; sealed by brazing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Abstract

A package for an electronic component and a manufacturing method thereof are provided to reduce a manufacturing cost by forming a high cost ceramic substrate using a planar plate and a case using a metal. An electrode circuit is patterned under a planar ceramic substrate(10). A contact electrode(12) is formed on the ceramic substrate. The contact electrode is connected to the electrode circuit through a metal core, which penetrates the ceramic substrate. A solder ball(14) is fixed on the contact electrode. A contact node(31) of an electronic chip(30) is contacted with the solder ball. A Kovar, on which nickel and gold is plated, is formed to a rectangular case. A metal junction layer(22) is attached under a flange(21) of a cover(20). The metal junction layer is thermally attached to a metal rim(15) which is formed around the contact electrode, so that the cover is enclosed.

Description

전자부품용 패키지의 제조방법 및 전자부품용 패키지{a package of electron parts}Manufacturing method of electronic component package and package for electronic component {a package of electron parts}

도 1은 본 발명에 의한 패키지를 예시한 사시도,1 is a perspective view illustrating a package according to the present invention;

도 2는 본 발명에 의한 패키지를 예시한 분해사시도,2 is an exploded perspective view illustrating a package according to the present invention;

도 3a ∼ 도 3j는 본 발명에 의한 전자부품용 패키지의 제조과정을 순차적으로 예시한 단면도,3A to 3J are cross-sectional views sequentially illustrating a manufacturing process of a package for an electronic component according to the present invention;

도 4는 본 발명의 전자부품용 패키지를 구성하는 덮개들이 세라믹기판의 상부에 가로세로 배열된 상태를 예시한 사시도.4 is a perspective view illustrating a state in which covers constituting the package for an electronic component of the present invention are arranged vertically on the ceramic substrate.

* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings

10 : 세라믹기판 10a, 50a : 가이드공10: ceramic substrate 10a, 50a: guide hole

11 : 전극회로 12 : 접점전극11 electrode circuit 12 contact electrode

13 : 코어 14 : 솔더볼13 core 14 solder ball

15 : 금속 테두리 20 : 덮개15: metal border 20: cover

21 : 플랜지 22 : 접합층21: flange 22: bonding layer

30 : 칩 31 : 접점30: chip 31: contact

40 : 지지판 40a : 가이드봉40: support plate 40a: guide rod

41 : 수납홈 42 : 수직공41: storage groove 42: vertical hole

50 : 덮개판 60 : 중량체50: cover plate 60: weight

61 : 가이드핀 70 : 가열로61: guide pin 70: heating furnace

71 : 히터 72 : 컨베이어71: heater 72: conveyor

본 발명은 전자부품용 패키지의 제조방법 및 전자부품용 패키지에 관한 것으로서, 더욱 상세하게는 패키지를 구성하는 전체적인 부품의 수를 감소시켜 초 소형화를 이루도록 하고 부품들의 조립이 신속 간편하게 이루어져 생산성(生産性)을 높여줄 수 있도록 한 발명에 관한 것이다.The present invention relates to a method for manufacturing a package for an electronic component and a package for an electronic component, and more particularly, to reduce the total number of components constituting the package to achieve ultra-miniaturization and to assemble the components quickly and easily, thereby improving productivity. It is related to the invention which can raise).

일반적으로 전자부품용 패키지는 수정 진동편이나 IC 등으로 이루어진 전자 칩(chip)을 세라믹 케이스의 내부 전극회로에 연결하고, 금속판 리드를 부착하여 케이스 내부에 주입된 불활성 기체와 함께 전자 칩을 밀폐시키기 위하여 사용되는 것으로서 현대에는 전자기기의 부품인 발진기나 필터 등으로 다양하게 사용되며 갈수록 소형화 및 슬림화(slim type) 되는 추세이다.In general, a package for an electronic component connects an electronic chip made of a crystal vibrating element or an IC to an internal electrode circuit of a ceramic case, and attaches a metal plate lead to seal the electronic chip with an inert gas injected into the case. As it is used for the present invention, it is widely used as an oscillator or a filter, which is a component of an electronic device, and it is a trend of becoming smaller and slimmer.

이와 같은 전자부품용 패키지는 얇은 조각의 수정 진동편에 도체(導體) 전극이 연결되어 전기적 신호에 의한 압전효과(壓電效果)에 의하여 진동되면서 안정된 주파수를 공급하는 수정진동자(quartz vibrator), 수정발진자(crystal oscillator), 수정여파기(quartz filter), 소오필터(saw filter), MCF필터 등에 널리 사용된다.Such a package for an electronic component has a quartz vibrator or crystal that supplies a stable frequency while a conductor electrode is connected to a thin crystal quartz piece and vibrates by a piezoelectric effect caused by an electrical signal. Widely used in crystal oscillator, quartz filter, saw filter, MCF filter, etc.

종래의 전자부품용 패키지는 절연체들 사이에 전극회로들이 다층 배열된 세라믹 케이스 내부에 전자 칩이 수납되어 와이어에 의하여 전극과 연결되고 케이스의 상부에는 금속 리드(Lid)가 접합되어 케이스의 내부가 밀폐되는 구성으로 되어 있다.Conventional electronic component packages have electronic chips housed in ceramic cases in which electrode circuits are arranged between insulators, connected to electrodes by wires, and metal leads (Lid) are bonded to upper parts of the cases to seal the inside of the case. It becomes the structure that becomes.

그러나, 전자 칩들은 초소형으로 이루어져 자동화된 로봇의 집게 팔을 이용하여 케이스 내부에 자동으로 투입하도록 되어 있고, 로봇이 칩을 집어서 수평이동 후 다시 하강되어 케이스 내부에 칩을 투입시킴에 따라 작업의 속도가 현저하게 저하되는 것이므로 그 생산성(生産性)을 높여줄 수 없었을 뿐 아니라 가격이 비싼 세라믹을 소결(燒結) 성형하여 케이스로 제조하는 것이므로 전체적인 패키지의 제조원가가 상승되는 등의 폐단이 발생되었다.However, the electronic chips are made of microminiatures to be automatically inserted into the case using the automated arm of the robot, and the robot picks up the chip and moves it horizontally and then descends to insert the chip into the case. Since the speed is remarkably lowered, the productivity cannot be increased, and since the expensive ceramics are sintered and manufactured into a case, the overall cost of the package is increased.

본 발명은 상기한 문제점을 감안하여 창안한 것으로서, 그 목적은 패키지를 구성하는 전체적인 부품의 수를 감소시켜 초 소형화를 이루도록 하고, 부품들의 조립이 신속 간편하게 이루어져 생산성(生産性)을 높여줄 수 있는 전자부품용 패키지의 제조방법 및 전자부품용 패키지를 제공함에 있는 것이다.The present invention has been made in view of the above-described problems, and its object is to reduce the total number of parts constituting the package to achieve ultra-miniaturization, and to assemble the parts quickly and easily to increase productivity. The present invention provides a method for manufacturing an electronic component package and a package for the electronic component.

상기한 목적을 달성하기 위한 본 발명의 특징은, 평평한 세라믹판재의 저면에 전극회로(11) 패턴을 인쇄하고, 상면에는 접점전극(12)을 인쇄한 후 금속 코 어(13)를 관통 결합시켜 전극회로(11)와 접점전극(12)이 연결되도록 하고, 접점전극(12)의 둘레에는 금속 테두리(15)를 인쇄한 후 접점전극(12)의 표면에 솔더볼(14)을 납땜하여 세라믹기판(10)을 완성하는 단계; 코바(Kovar)로 이루어진 얇은 금속판재를 프레스 금형으로 펀칭 및 프레싱하여 사각형 케이스의 하부 주연부에 외향 절곡된 플랜지(21)가 형성되도록 하고, 금속의 표면에 니켈(Ni)과 금(Au) 도금을 연속 실시하여 도금막들이 형성되도록 한 후 플랜지(21)의 저면에 금속 접합층(22)을 열 접착시켜 덮개(20)를 완성하는 단계; 지지판(40)에 가로세로 배열된 사각형의 수납홈(41)들에 덮개(20)를 뒤집어서 놓여지도록 하고, 덮개(20)의 내부에는 전자 칩(30)들이 놓여지도록 하는 단계; 세라믹기판(10)의 사방에 뚫려진 가이드공(10a)들이 지지판(40)의 사방에 고정된 가이드봉(40a)에 삽입되도록 하여 세라믹기판(10)이 지지판(40)에 놓여지면서 세라믹기판(10)에 용접된 솔더볼(14)들이 전자 칩(30)의 접점(31)에 접촉되도록 하는 단계; 상기 덮개판(50)의 사방에 뚫려진 가이드공(50a)들이 지지판(40)의 사방 가이드봉(40a)에 삽입되도록 하여 덮개판(50)이 세라믹기판(10) 위에 놓여지도록 하는 단계; 위로부터 차례로 적층된 덮개판(50), 세라믹기판(10), 지지판(40)을 뒤집어 지지판(40)이 상측에 위치되도록 한 후 지지판(40)을 관통하여 수납홈(41)과 통하는 수직공(42)들에 중량체(60)의 하부 가이드핀(61)들이 각각 삽입되도록 하여 수납홈(41)들에 삽입된 덮개(20)가 눌려지도록 하는 단계; 적층된 지지판(40), 세라믹기판(10), 덮개판(50)을 컨베이어(72)에 올려놓고 히터(71)가 장치된 가열로(70)를 통과시켜 덮개(20)의 플랜지(21)에 부착된 접합층(22)을 용융시켜 접점전극(12)의 둘레에 형성된 금속 테두 리(15)에 부착시키고, 솔더볼(14)이 용융(鎔融)되도록 하여 전자 칩(30)의 접점(31)이 세라믹기판(10)의 접점전극(12)에 고정되도록 하는 단계; 덮개판(50)을 분리하고, 지지판(40)에서 세라믹기판(10)을 분리하여 세라믹기판(10)에 열 접착된 덮개(20)들이 가로세로 배열되도록 하는 단계; 세라믹기판(10)에서 덮개(20)들 사이를 가로 세로 절단하여 세라믹기판(10) 위에 덮개(20)가 열 접착된 전자부품용 패키지를 완성하는 단계로 이루어진 것을 특징으로 하는 전자부품용 패키지의 제조방법에 의하여 달성될 수 있는 것이다.Features of the present invention for achieving the above object, by printing the electrode circuit 11 pattern on the bottom surface of the flat ceramic plate, the upper surface of the contact electrode 12 by printing the metal core 13 through the coupling The electrode circuit 11 and the contact electrode 12 are connected to each other, and a metal frame 15 is printed around the contact electrode 12, and then a solder ball 14 is soldered to the surface of the contact electrode 12 to form a ceramic substrate. (10) completing; A thin metal plate made of Kovar is punched and pressed with a press mold to form an outwardly bent flange 21 at the lower periphery of the rectangular case, and nickel and gold plating are formed on the surface of the metal. Performing a continuous plating to form plating films and then thermally bonding the metal bonding layer 22 to the bottom of the flange 21 to complete the lid 20; Placing the lid 20 upside down on the rectangular receiving grooves 41 arranged horizontally on the support plate 40, and placing the electronic chips 30 inside the lid 20; The ceramic substrate 10 is placed on the support plate 40 so that the guide holes 10a drilled in all directions of the ceramic substrate 10 are inserted into the guide rods 40a fixed to the four sides of the support plate 40. Allowing the solder balls 14 welded to 10 to contact the contacts 31 of the electronic chip 30; Allowing the cover plate 50 to be placed on the ceramic substrate 10 by inserting the guide holes 50a drilled in all directions of the cover plate 50 into the guide rods 40a of the support plate 40; The cover plate 50, the ceramic substrate 10, and the support plate 40, which are sequentially stacked from above, are turned upside down so that the support plate 40 is positioned on the upper side, and then vertical holes penetrating the support plate 40 to communicate with the receiving groove 41. The lower guide pins 61 of the weight body 60 are inserted into the 42 so that the covers 20 inserted into the receiving grooves 41 are pressed; The laminated support plate 40, the ceramic substrate 10, and the cover plate 50 are placed on the conveyor 72, and the flange 21 of the cover 20 is passed through a heating furnace 70 equipped with a heater 71. Is bonded to the metal edge 15 formed around the contact electrode 12, and the solder balls 14 are melted so as to melt the bonding layer 22 attached to the contact layer 12 of the electronic chip 30. 31) being fixed to the contact electrode 12 of the ceramic substrate 10; Separating the cover plate 50 and separating the ceramic substrate 10 from the support plate 40 so that the covers 20 thermally bonded to the ceramic substrate 10 are arranged in a horizontal direction; Comprising a step for completing the package for the electronic component, the cover 20 is heat-bonded on the ceramic substrate 10 by vertically cutting between the cover 20 in the ceramic substrate 10 It can be achieved by the manufacturing method.

이하, 상기한 목적을 달성하기 위한 바람직한 실시예를 첨부된 도면에 의하여 상세히 설명하면 다음과 같다.Hereinafter, described in detail by the accompanying drawings a preferred embodiment for achieving the above object is as follows.

실시예Example

도 3a에서 도시한 바와 같이, 평판으로 구성된 평평한 세라믹판재의 저면에는 전극회로(11) 패턴을 인쇄하고, 상면에는 접점전극(12)을 인쇄한 후 금속 코어(13)를 관통 결합시켜 전극회로(11)와 접점전극(12)이 연결되도록 하고, 접점전극(12)의 둘레에는 금속 테두리(15)를 인쇄한 후 접점전극(12)의 표면에는 솔더볼(14)을 납땜하여 세라믹기판(10)을 완성하였다.As shown in FIG. 3A, an electrode circuit 11 pattern is printed on a bottom surface of a flat ceramic plate formed of a flat plate, and a contact electrode 12 is printed on an upper surface thereof. 11) is connected to the contact electrode 12, the metal rim 15 is printed around the contact electrode 12, and then solder ball 14 on the surface of the contact electrode 12 by soldering the ceramic substrate 10 Was completed.

상기 세라믹기판(10)에 인쇄되는 전극회로(11) 패턴, 접점전극(12) 및 금속 테두리(15)는 동(銅)이나 텅스텐 및 기타 금속합금을 미세 분말화시켜 접착제 용액에 혼합한 겔(gel) 상태의 페이스트(paste)를 사용하여 실크스크린 인쇄한 것이다. 이와 같이 금속분말로 이루어진 페이스트를 사용하여 인쇄하는 기술은 이미 PCB 등과 같은 기판의 제조에 널리 사용되는 관용화 된 기술이므로 접착제의 종류나 기타 배합비율과 같은 상세한 설명은 생략하였다.The electrode circuit 11 pattern, the contact electrode 12, and the metal rim 15 printed on the ceramic substrate 10 are made of fine powder of copper or tungsten and other metal alloys and mixed in an adhesive solution ( Silkscreen printing using gel paste. As such, the printing technique using a paste made of metal powder is already a conventional technique widely used in the manufacture of a substrate such as a PCB, and thus detailed descriptions such as the type of adhesive and other compounding ratios are omitted.

이어서, 도 3b에서 도시한 바와 같이, 코바(Kovar)로 이루어진 얇은 금속판재를 프레스 금형으로 펀칭 및 프레싱하여 사각형 케이스의 하부 주연부에 외향 절곡된 플랜지(21)가 형성되도록 하고, 금속의 표면에는 니켈(Ni)과 금(Au) 도금을 연속 실시하여 도금막들이 형성되도록 한 후 플랜지(21)의 저면에 금속 접합층(22)을 열 접착시켜 덮개(20)를 완성하였다. 상기 코바(Kovar)는 철(Fe), 니켈(Ni), 코발트(Co)의 금속 합금이다.Subsequently, as shown in FIG. 3B, a thin metal plate made of Kovar is punched and pressed with a press mold to form an outwardly bent flange 21 at the lower periphery of the rectangular case, and nickel is formed on the surface of the metal. (Ni) and gold (Au) plating were continuously performed to form the plating films, and then the metal bonding layer 22 was thermally bonded to the bottom of the flange 21 to complete the lid 20. The kovar is a metal alloy of iron (Fe), nickel (Ni), and cobalt (Co).

이어서, 도 3c와 도 3d에서 도시한 바와 같이, 지지판(40)에 가로세로 배열된 사각형의 수납홈(41)들에 덮개(20)를 뒤집어서 놓여지도록 하고, 덮개(20)의 내부에는 전자 칩(30)들이 놓여지도록 하였다.Subsequently, as shown in FIGS. 3C and 3D, the lid 20 is placed upside down on the rectangular receiving grooves 41 arranged horizontally and vertically on the support plate 40, and the electronic chip is disposed inside the lid 20. 30 were to be placed.

이어서, 도 3e에서 도시한 바와 같이, 세라믹기판(10)의 사방에 뚫려진 가이드공(10a)들이 지지판(40)의 사방에 고정된 가이드봉(40a)에 삽입되도록 하여 세라믹기판(10)이 지지판(40)에 놓여지도록 하였다. 이때, 세라믹기판(10)에 용접된 솔더볼(14)들은 전자 칩(30)의 접점(31)에 접촉되도록 하였다.Subsequently, as shown in FIG. 3E, the ceramic substrate 10 is inserted into the guide rods 10a drilled in all directions of the ceramic substrate 10 so as to be inserted into the guide rods 40a fixed to the four sides of the support plate 40. To be placed on the support plate 40. At this time, the solder balls 14 welded to the ceramic substrate 10 are in contact with the contacts 31 of the electronic chip 30.

이어서, 도 3f에서 도시한 바와 같이, 상기 덮개판(50)의 사방에 뚫려진 가이드공(50a)들이 지지판(40)의 사방 가이드봉(40a)에 삽입되도록 하여 덮개판(50)이 세라믹기판(10) 위에 놓여지도록 하였다.Subsequently, as shown in FIG. 3F, the cover plate 50 is inserted into the four-side guide rods 40a of the support plate 40 so that the guide holes 50a bored on all sides of the cover plate 50 are inserted into the ceramic substrate. (10) to be placed upon.

이어서, 도 3g에서 도시한 바와 같이, 위로부터 차례로 적층된 덮개판(50), 세라믹기판(10), 지지판(40)을 뒤집어 지지판(40)이 상측에 위치되도록 한 후 지지판(40)을 관통하여 수납홈(41)과 통하는 수직공(42)들에 중량체(60)의 하부 가이드핀(61)들이 각각 삽입되도록 하여 수납홈(41)들에 삽입된 덮개(20)가 눌려지도록 하였다.Subsequently, as shown in FIG. 3G, the cover plate 50, the ceramic substrate 10, and the support plate 40, which are sequentially stacked from the top, are turned upside down so that the support plate 40 is positioned on the upper side, and then penetrates the support plate 40. Thus, the lower guide pins 61 of the weight body 60 are inserted into the vertical holes 42 communicating with the receiving grooves 41 so that the covers 20 inserted into the receiving grooves 41 are pressed.

이어서, 도 3h에서 도시한 바와 같이, 적층된 지지판(40), 세라믹기판(10), 덮개판(50)을 컨베이어(72)에 올려놓고 히터(71)가 장치된 가열로(70)를 통과시켜 덮개(20)의 플랜지(21)에 부착된 접합층(22)을 용융시켜 접점전극(12)의 둘레에 형성된 금속 테두리(15)에 부착시키고, 솔더볼(14)이 용융(鎔融)되도록 하여 전자 칩(30)의 접점(31)이 세라믹기판(10)의 접점전극(12)에 고정되도록 하였다.Subsequently, as shown in FIG. 3H, the laminated support plate 40, the ceramic substrate 10, and the cover plate 50 are placed on the conveyor 72 and passed through the heating furnace 70 equipped with the heater 71. To melt the bonding layer 22 attached to the flange 21 of the cover 20 to attach to the metal rim 15 formed around the contact electrode 12, so that the solder ball 14 is melted. The contact 31 of the electronic chip 30 is fixed to the contact electrode 12 of the ceramic substrate 10.

상기 접합층(22)은 금(Au) 78∼82％, 주석(Sn) 18∼22중량％의 합금으로 구성되어 200∼400℃의 열에 의하여 저온 용융되는 금속합금으로 되어 있고, 가열로(70)를 통과하면 접합층(22)이 용융되면서 덮개(20)가 중량체(60)에 의하여 눌려지므로 세라믹기판(10)에 견고하게 열 접착된다.The bonding layer 22 is composed of an alloy of gold (Au) 78 to 82% and tin (Sn) 18 to 22% by weight, and is a metal alloy which is melted at low temperature by heat of 200 to 400 ° C., and the heating furnace 70 When the bonding layer 22 is melted, the lid 20 is pressed by the weight 60 while being firmly bonded to the ceramic substrate 10.

이와 같이 금(Au)과 주석(Sn)을 주성분으로 하는 접합층(21)은 약 200∼400℃의 저온에서도 잘 용융되어 용접 특성 및 용융시 흐름성이 우수할 뿐 아니라 융점(melting point), 젖음성(wettability) 등을 비롯하여, 기계적 특성(joint strength, hardness, creep-fatigue resistance), 전기적 특성(electrical conductivity), 열적 특성(CTE, thermal conductivity) 등이 뛰어나면서도 유독성(toxicity)이 거의 없어 환경오염을 일으킬 염려가 없는 것으로서 덮개(20)를 세라믹기판(10)에 견고하게 접합시킬 수 있는 동시에 결합작업이 매우 간편하다.As such, the bonding layer 21 mainly composed of gold (Au) and tin (Sn) melts well even at low temperatures of about 200 to 400 ° C., so that it has excellent welding properties and flowability during melting, as well as a melting point, It is excellent in mechanical strength (joint strength, hardness, creep-fatigue resistance), electrical conductivity, thermal conductivity (CTE), including wettability, but has little toxicity. The cover 20 can be firmly bonded to the ceramic substrate 10 as it does not cause any damage, and at the same time, the joining operation is very simple.

이어서, 도 3i에서 도시한 바와 같이, 덮개판(50)을 분리하고, 지지판(40)에서 세라믹기판(10)을 분리하여 세라믹기판(10)에 열 접착된 덮개(20)들이 가로세로 배열되도록 하였다.Subsequently, as shown in FIG. 3I, the cover plate 50 is separated, and the ceramic substrate 10 is separated from the support plate 40 so that the covers 20 thermally bonded to the ceramic substrate 10 are arranged in a horizontal direction. It was.

이어서, 도 3j 및 도 4에서 도시한 바와 같이, 세라믹기판(10)에서 덮개(20)들 사이를 전기톱으로 가로 세로 절단하여 세라믹기판(10) 위에 덮개(20)가 열 접착된 전자부품용 패키지를 완성할 수 있었다.Subsequently, as shown in FIGS. 3J and 4, the ceramic substrate 10 is vertically cut between the covers 20 by a chainsaw for electronic components in which the cover 20 is heat-bonded on the ceramic substrate 10. I was able to complete the package.

상기 제조과정에서 이루어지는 공정의 대부분은 자동화시스템을 사용하여 실시하였고, 지지판(40), 덮개판(50), 세라믹기판(10) 등의 결합과 분리 같은 간단한 작업만 작업자가 수행하였다.Most of the processes performed in the manufacturing process were carried out using an automated system, and the operator performed only simple tasks such as coupling and separating of the support plate 40, the cover plate 50, the ceramic substrate 10, and the like.

전술한 제조과정을 통해 완성된 전자부품용 패키지는 도 1 내지는 도 2에서 도시한 바와 같이, 평평한 세라믹기판(10)의 저면에는 전극회로(11)가 패턴을 이루어 형성되고, 세라믹기판(10)의 상면에는 접점전극(12)이 형성되어 세라믹기판(10)을 관통하여 고정되는 금속 코어(13)에 의하여 전극회로(11)와 연결되며, 접점전극(12)의 표면에는 솔더볼(14)이 고정되고, 솔더볼(14)들에는 전자 칩(30)의 접점(31)이 접촉되어 납땜으로 고정되며, 코바(Kovar)의 표면에 니켈(Ni)과 금(Au) 도금막들이 연속 형성된 얇은 금속판재를 사각 케이스로 성형한 덮개(20)의 플랜지(21) 저면에 부착된 금속 접합층(22)이 접점전극(12)의 둘레에 형성된 금속 테두리(15)에 열 접착되어 덮개(20)의 내부가 밀폐되는 구성으로 되어 있다.In the package for an electronic component completed through the above-described manufacturing process, as shown in FIGS. 1 and 2, the electrode circuit 11 is formed on the bottom surface of the flat ceramic substrate 10 to form a pattern, and the ceramic substrate 10 is formed. The contact electrode 12 is formed on the upper surface of the contact electrode 12 and is connected to the electrode circuit 11 by a metal core 13 fixed through the ceramic substrate 10. The solder ball 14 is formed on the surface of the contact electrode 12. It is fixed, the solder ball 14 is in contact with the contact 31 of the electronic chip 30 is fixed by soldering, a thin metal in which nickel (Ni) and gold (Au) plating films are continuously formed on the surface of the kovar The metal bonding layer 22 attached to the bottom surface of the flange 21 of the cover 20 formed of a rectangular case is thermally bonded to the metal rim 15 formed around the contact electrode 12 so that the lid 20 The inside is sealed.

이상에서는 본 발명의 바람직한 실시예에 대하여 도시하고 또한 설명하였으나, 본 발명은 상기한 실시예에 한정되지 아니하며, 청구범위에서 청구하는 본 발 명의 요지를 벗어남이 없이 당해 본 발명이 속하는 분야에서 통상의 지식을 가진 자라면 누구든지 다양한 변형 실시가 가능한 것은 물론이고, 그와 같은 변경은 기재된 청구범위 내에 있게 된다.Although the above has been illustrated and described with respect to the preferred embodiments of the present invention, the present invention is not limited to the above-described embodiments, and the present invention without departing from the gist of the present invention claimed in the claims is common in the art to which the present invention pertains. Various modifications can be made by those skilled in the art, and such modifications are intended to fall within the scope of the appended claims.

이상에서 상술한 바와 같은 본 발명은, 세라믹을 소결(燒結) 성형함에 따라 제조가 까다롭고 가격이 비싼 세라믹기판(10)은 단순하게 평판으로 형성되고, 비교적 성형이 용이한 금속 덮개(20)를 케이스 형태로 성형한 것이므로 전체적인 패키지의 제조가 신속 간편하게 이루어지면서도 제조원가를 저렴하게 유지할 수 있고, 전체적인 패키지의 두께를 얇게 하여 소형화 및 슬림 타입의 패키지를 구현할 수 있을 뿐 아니라 세라믹기판(10)이 평판으로 이루어진 것이므로 자동화된 로봇이 전자 칩(30)을 집어서 수평이동 후 놓아주기만 하면 항상 정확한 위치에 칩(30)이 고정되는 것이므로 로봇이 수평이동 후 다시 하강되는 종래의 기술에 비하여 정밀도를 높여줄 수 있고, 작업의 속도가 배가되어 그 생산성(生産性)을 최대한 높여줄 수 있는 등의 이점이 있는 것이다.As described above, according to the present invention, as the ceramic is sintered, the ceramic substrate 10, which is difficult to manufacture and expensive, is simply formed into a flat plate, and a metal cover 20 which is relatively easy to form is formed. Since it is molded in a case shape, manufacturing of the overall package can be made quickly and easily, and manufacturing cost can be maintained at a low cost, and the ceramic substrate 10 is flat as well as a compact and slim type package can be realized by thinning the overall package thickness. Since the automated robot picks up the electronic chip 30 and then releases it after the horizontal movement, the chip 30 is always fixed at the correct position. Therefore, the robot can raise the precision compared to the conventional technology in which the robot descends again after the horizontal movement. And the speed of work can be doubled to increase the productivity as much as possible. will be.

또한, 지지판(40), 덮개판(50), 세라믹기판(10) 등의 결합과 분리 같은 간단한 작업만 작업자가 수행하고 제조과정에서 이루어지는 대부분의 공정이 로봇에 의한 자동화시스템을 사용하는 것이므로 부품들의 조립이 신속 간편하게 이루어져 생산성(生産性)을 높여줄 수 있고, 전체적인 부품의 수가 감소되어 전자부품용 패키지의 대외 경쟁력을 최대한 높여줄 수 있는 등의 이점이 있는 것이다.In addition, since only a simple operation such as the coupling and separation of the support plate 40, the cover plate 50, the ceramic substrate 10, etc. is performed by the operator, most of the processes performed in the manufacturing process use an automated system by a robot. The assembly can be made quickly and easily to increase productivity, and the overall number of parts can be reduced to increase the external competitiveness of the package for an electronic component as much as possible.

Claims (3)

평평한 세라믹판재의 저면에 전극회로(11) 패턴을 인쇄하고, 상면에는 접점전극(12)을 인쇄한 후 금속 코어(13)를 관통 결합시켜 전극회로(11)와 접점전극(12)이 연결되도록 하고, 접점전극(12)의 둘레에는 금속 테두리(15)를 인쇄한 후 접점전극(12)의 표면에 솔더볼(14)을 납땜하여 세라믹기판(10)을 완성하는 단계;The electrode circuit 11 pattern is printed on the bottom of the flat ceramic plate, and the contact electrode 12 is printed on the upper surface thereof, and then the electrode circuit 11 and the contact electrode 12 are connected to each other through the metal core 13. And printing a metal rim 15 around the contact electrode 12 and soldering the solder balls 14 to the surface of the contact electrode 12 to complete the ceramic substrate 10. 코바(Kovar)로 이루어진 얇은 금속판재를 프레스 금형으로 펀칭 및 프레싱하여 사각형 케이스의 하부 주연부에 외향 절곡된 플랜지(21)가 형성되도록 하고, 금속의 표면에 니켈(Ni)과 금(Au) 도금을 연속 실시하여 도금막들이 형성되도록 한 후 플랜지(21)의 저면에 금속 접합층(22)을 열 접착시켜 덮개(20)를 완성하는 단계; A thin metal plate made of Kovar is punched and pressed with a press mold to form an outwardly bent flange 21 at the lower periphery of the rectangular case, and nickel and gold plating are formed on the surface of the metal. Performing a continuous plating to form plating films and then thermally bonding the metal bonding layer 22 to the bottom of the flange 21 to complete the lid 20; 지지판(40)에 가로세로 배열된 사각형의 수납홈(41)들에 덮개(20)를 뒤집어서 놓여지도록 하고, 덮개(20)의 내부에는 전자 칩(30)들이 놓여지도록 하는 단계;Placing the lid 20 upside down on the rectangular receiving grooves 41 arranged horizontally on the support plate 40, and placing the electronic chips 30 inside the lid 20; 세라믹기판(10)의 사방에 뚫려진 가이드공(10a)들이 지지판(40)의 사방에 고정된 가이드봉(40a)에 삽입되도록 하여 세라믹기판(10)이 지지판(40)에 놓여지면서 세라믹기판(10)에 용접된 솔더볼(14)들이 전자 칩(30)의 접점(31)에 접촉되도록 하는 단계;The ceramic substrate 10 is placed on the support plate 40 so that the guide holes 10a drilled in all directions of the ceramic substrate 10 are inserted into the guide rods 40a fixed to the four sides of the support plate 40. Allowing the solder balls 14 welded to 10 to contact the contacts 31 of the electronic chip 30; 상기 덮개판(50)의 사방에 뚫려진 가이드공(50a)들이 지지판(40)의 사방 가이드봉(40a)에 삽입되도록 하여 덮개판(50)이 세라믹기판(10) 위에 놓여지도록 하 는 단계;Allowing the cover plate 50 to be placed on the ceramic substrate 10 by inserting the guide holes 50a drilled in all directions of the cover plate 50 into the guide rods 40a of the support plate 40; 위로부터 차례로 적층된 덮개판(50), 세라믹기판(10), 지지판(40)을 뒤집어 지지판(40)이 상측에 위치되도록 한 후 지지판(40)을 관통하여 수납홈(41)과 통하는 수직공(42)들에 중량체(60)의 하부 가이드핀(61)들이 각각 삽입되도록 하여 수납홈(41)들에 삽입된 덮개(20)가 눌려지도록 하는 단계;The cover plate 50, the ceramic substrate 10, and the support plate 40, which are sequentially stacked from above, are turned upside down so that the support plate 40 is positioned on the upper side, and then vertical holes penetrating the support plate 40 to communicate with the receiving groove 41. The lower guide pins 61 of the weight body 60 are inserted into the 42 so that the covers 20 inserted into the receiving grooves 41 are pressed; 적층된 지지판(40), 세라믹기판(10), 덮개판(50)을 컨베이어(72)에 올려놓고 히터(71)가 장치된 가열로(70)를 통과시켜 덮개(20)의 플랜지(21)에 부착된 접합층(22)을 용융시켜 접점전극(12)의 둘레에 형성된 금속 테두리(15)에 부착시키고, 솔더볼(14)이 용융(鎔融)되도록 하여 전자 칩(30)의 접점(31)이 세라믹기판(10)의 접점전극(12)에 고정되도록 하는 단계;The laminated support plate 40, the ceramic substrate 10, and the cover plate 50 are placed on the conveyor 72, and the flange 21 of the cover 20 is passed through a heating furnace 70 equipped with a heater 71. Is bonded to the metal edge 15 formed around the contact electrode 12, and the solder balls 14 are melted so that the contact layer 31 of the electronic chip 30 is melted. ) Is fixed to the contact electrode 12 of the ceramic substrate 10; 덮개판(50)을 분리하고, 지지판(40)에서 세라믹기판(10)을 분리하여 세라믹기판(10)에 열 접착된 덮개(20)들이 가로세로 배열되도록 하는 단계;Separating the cover plate 50 and separating the ceramic substrate 10 from the support plate 40 so that the covers 20 thermally bonded to the ceramic substrate 10 are arranged in a horizontal direction; 세라믹기판(10)에서 덮개(20)들 사이를 가로 세로 절단하여 세라믹기판(10) 위에 덮개(20)가 열 접착된 전자부품용 패키지를 완성하는 단계로 이루어진 것을 특징으로 하는 전자부품용 패키지의 제조방법.The ceramic substrate 10 of the electronic component package, characterized in that consisting of a step for transversal vertically cut between the cover 20 to complete the package for the electronic component, the cover 20 is heat-bonded on the ceramic substrate 10 Manufacturing method. 평평한 세라믹기판(10)의 저면에는 전극회로(11)가 패턴을 이루어 형성되고, 세라믹기판(10)의 상면에는 접점전극(12)이 형성되어 세라믹기판(10)을 관통하여 고정되는 금속 코어(13)에 의하여 전극회로(11)와 연결되며, 접점전극(12)의 표면 에는 솔더볼(14)이 고정되고, 솔더볼(14)들에는 전자 칩(30)의 접점(31)이 접촉되어 납땜으로 고정되며, 코바(Kovar)의 표면에 니켈(Ni)과 금(Au) 도금막들이 연속 형성된 얇은 금속판재를 사각 케이스로 성형한 덮개(20)의 플랜지(21) 저면에 부착된 금속 접합층(22)이 접점전극(12)의 둘레에 형성된 금속 테두리(15)에 열 접착되어 덮개(20)의 내부가 밀폐되도록 한 것을 특징으로 하는 전자부품용 패키지.On the bottom of the flat ceramic substrate 10, an electrode circuit 11 is formed in a pattern, and a contact electrode 12 is formed on an upper surface of the ceramic substrate 10 to fix the metal core penetrating the ceramic substrate 10. 13 is connected to the electrode circuit 11, the solder ball 14 is fixed to the surface of the contact electrode 12, the solder ball 14 is in contact with the contact 31 of the electronic chip 30 by soldering The metal bonding layer is fixed and attached to the bottom surface of the flange 21 of the lid 20 formed by forming a rectangular metal case of a thin metal plate on which a surface of a kovar is formed of nickel (Ni) and gold (Au) plating layers. 22) The package for an electronic component, characterized in that the inside of the cover 20 is sealed by heat-bonding to the metal rim (15) formed around the contact electrode (12). 제 1항에 있어서,The method of claim 1, 상기 접합층(22)은 금(Au) 78∼82％, 주석(Sn) 18∼22중량％의 합금으로 구성되어 200∼400℃의 열에 의하여 저온 용융(鎔融)되는 금속합금으로 구성한 것을 특징으로 하는 전자부품용 패키지.The bonding layer 22 is composed of an alloy of gold (Au) 78 to 82%, tin (Sn) 18 to 22% by weight and composed of a metal alloy which is melted at low temperature by heat of 200 to 400 ° C. Package for electronic components.
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101244281B1 (en) * 2011-12-22 2013-03-18 비나텍주식회사 Super capacitor using separator-electrode and manufacturing method thereof
KR101297091B1 (en) * 2011-12-22 2013-08-14 비나텍주식회사 Super capacitor of surface mount type and manufacturing method thereof
KR101297092B1 (en) * 2011-12-27 2013-08-14 비나텍주식회사 Super capacitor of surface mount type and manufacturing method thereof
KR101306600B1 (en) * 2011-12-27 2013-09-11 비나텍주식회사 Method for manufacturing super capacitor of surface mount type

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JPH05136182A (en) * 1991-11-08 1993-06-01 Nec Corp Hybrid integrated circuit substrate
JP3832911B2 (en) 1996-11-29 2006-10-11 日本特殊陶業株式会社 Manufacturing method of base used for IC package etc.
JP3408987B2 (en) 1999-03-30 2003-05-19 三菱電機株式会社 Semiconductor device manufacturing method and semiconductor device
JP2002208830A (en) 2001-01-10 2002-07-26 Mitsubishi Electric Corp Manufacture of surface acoustic wave device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101244281B1 (en) * 2011-12-22 2013-03-18 비나텍주식회사 Super capacitor using separator-electrode and manufacturing method thereof
KR101297091B1 (en) * 2011-12-22 2013-08-14 비나텍주식회사 Super capacitor of surface mount type and manufacturing method thereof
KR101297092B1 (en) * 2011-12-27 2013-08-14 비나텍주식회사 Super capacitor of surface mount type and manufacturing method thereof
KR101306600B1 (en) * 2011-12-27 2013-09-11 비나텍주식회사 Method for manufacturing super capacitor of surface mount type

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