JP4280394B2 - Wiring board manufacturing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
More particularly, the present invention relates to a method for manufacturing a wiring board in which a sealing ring is joined to a large-sized large-sized plate having a large number of product portions that become wiring boards after division using a positioning block.
[0002]
[Prior art]
Conventionally, as a method of brazing a seal ring to a metallization layer for sealing a wiring board, a method of brazing the seal ring in a large-sized state for taking multiple pieces before dividing into each wiring board is known. In other words, after placing the positioning block in the recess (cavity) for mounting the electronic components for each product part that becomes the wiring board after the division, the brazing material interposed between the sealing metallization layer and the seal ring is melted The sealing metallization layer and the seal ring are fixed. According to this method, a large number of product parts can be brazed at a time, so that there is a merit that work efficiency is good.
[0003]
[Problems to be solved by the invention]
However, the process of arranging the positioning block on each large-sized product portion for taking a large number of parts is cumbersome and contributes to an increase in manufacturing cost. In particular, with the miniaturization of the product, the positioning block is also miniaturized, and placing and removing has become a work requiring skill.
[0004]
[Means for Solving the Problems]
Accordingly, the method of manufacturing a wiring board according to claim 1 for solving the above-described problem includes a first main surface and a second main surface, and includes a large number of product portions that become the wiring substrate after division. Among the large-sized multi-use sizes, a step of placing a positioning block in the electronic component mounting recess formed on the first main surface side of each product portion, and a seal provided around the electronic component mounting recess The step of placing a sealing ring on the metallization layer for fastening, the step of joining the metallization layer for sealing and the sealing ring, and the multiple blocks of the positioning block are maintained while maintaining the arrangement. Remove from the large size, transfer to the recessed parts for mounting the electronic parts of each other large-sized product part, and divide the large-sized large size with the sealing ring into each product part And a step of forming a substrate.
[0005]
According to the present invention, it is necessary to place a positioning block for the first large-sized large format, but the multiple-sized large size to be brazed after that was used in the previous brazing process. Since it is only necessary to move the positioning block to the next large-sized large block as it is, it is possible to dramatically improve the work efficiency.
[0006]
The material of the positioning block is not particularly limited as long as it is a material that can withstand the brazing temperature, such as a fired ceramic. The material of the seal ring is not particularly limited, but a known material such as Kovar or 42 alloy is preferably used.
[0007]
As a moving method, each positioning block is sucked by a suction plate having a large number of suction holes, the positioning block is removed from the brazed large-sized large plate, and the other large-sized large-sized plate before brazing is left as it is. It is good to move to and to set in the recessed part of each product part.
[0008]
Furthermore, the invention described in claim 2 is characterized in that a brazing material is fixed in advance to the sealing metallized layer.
As a method of placing the seal ring on each product part, a method of manually placing the seal ring is also conceivable. However, as a more efficient method, a large number of seal rings are oscillated on each product part and positioned. A method of disposing a seal ring on each metallization layer for sealing through a mask is preferable. When this method is used, a large number of large-sized sheets are also tilted or vibrated, so that when a preform made of brazing material or the like is used, the preform placed in advance may be detached. In contrast, if the brazing material is brazed to the sealing metallization layer in advance, the brazing material is not likely to come off, and the sealing ring and the sealing metallization layer can be brazed efficiently and reliably. it can.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a method for manufacturing a wiring board according to the present invention will be described in detail with reference to FIGS. First, a reference numeral 10 in the figure denotes a large-sized large size (hereinafter, also simply referred to as a large size) having a first main surface and a second main surface and having a product portion 11 that becomes each wiring board 1 after division. 1 is a plan view of the large format 10, and FIG. 2 is a partially enlarged sectional view thereof. A central portion of each product portion 11 is provided with a cavity (concave portion) 2 that is rectangular in plan view and has a stepped shape and a narrow width downward. On the first main surface (upper surface 4) of the large format 10, a sealing metallization layer 5 is formed around each cavity 2 in a square frame shape in plan view. The metallized layer 5 is formed with a nickel plating layer (not shown). Furthermore, break grooves 12 and 13 for division are formed on the boundary line of each product part 11.
[0010]
The large format 10 first includes a ceramic green sheet (thickness of 0.25 mm to 0.3 mm) mainly composed of alumina formed so that each layer 15, 16, 17 is formed and a predetermined number of substrate portions can be taken. Manufacture each. Then, it is cut and punched into a shape corresponding to each layer, and a metallized paste such as W or Mo such as a sealing metallized layer, a wiring layer, or a common conductor layer for plating is printed.
The ceramic green sheets thus manufactured are laminated and pressed to form an unfired ceramic large size, and then fired to obtain the large size 10 shown in FIG. 1 (see FIGS. 1 and 2).
[0011]
Next, a square frame-shaped brazing material (silver brazing) preform corresponding to the metallization layer 5 for sealing of each product part 11 is placed on each metallization layer 5 for sealing, and heated and melted. Then, the brazing material 6 is formed on the metallizing layer for sealing (see FIG. 3).
Next, as shown in FIG. 4, the positioning block 7 is disposed in each cavity 2. For the first large format 10, it is necessary to arrange the positioning blocks 7 manually.
[0012]
Next, a seal ring 8 made of Kovar having a rectangular frame shape in plan view is placed around each positioning block 7, that is, on the sealing metallization layer 5 on which a brazing material has been previously applied (see FIG. 5). . In this state, the brazing material 6 is heated and melted again, and the brazing of the seal ring 8 is completed (FIG. 7).
[0013]
From the large format 10 after the brazing process is completed, the positioning block 7 is sucked and removed by using a suction plate 9 having a large number of suction holes 14 as shown in FIG. The removed positioning block 7 is transferred to another large-sized cavity before brazing as shown in FIG. According to such a method, the used positioning block 7 can be removed at once from the large format 10 after the brazing operation is completed, and the positioning block 7 is manually operated for the second and subsequent brazing operations. There is no need to line up. Therefore, it is possible to efficiently braze the seal ring 8 to a large number of large formats, thereby reducing the manufacturing cost.
[0014]
The large format 10 that has finished brazing the seal ring 8 is divided along the break grooves 12 and 13 after plating the surface of the seal ring 8 and the surface of each wiring layer with Ni plating or Au plating. As a result, a large number of wiring boards 1 are formed (see FIG. 8). The wiring board 1 is used by attaching a lid to the seal ring 8 after electronic parts such as a SAW filter are mounted in the cavity 2.
[0015]
According to the method for manufacturing a wiring board of the present invention, it is not necessary to separately arrange each large size by transferring the positioning block once arranged to another large size. In other words, for the first large format, it is necessary to arrange blocks in each of the electronic component mounting recesses, but after using them (after brazing), they are transferred as they are to other large formats, This saves you the trouble of rearranging and dramatically improves production efficiency.
[Brief description of the drawings]
FIG. 1 is a plan view of a large-sized large format according to the present invention.
FIG. 2 is a partially enlarged cross-sectional view of the large-size large format shown in FIG. 1;
3 is a partial enlarged cross-sectional view showing a state in which a brazing material is applied on the large-sized large-sized sealing metallization layer of FIG. 2;
FIG. 4 is a partially enlarged cross-sectional view showing a state in which a positioning block is disposed in each cavity.
FIG. 5 is a partially enlarged sectional view showing a state where a seal ring is placed.
FIG. 6 is a partially enlarged cross-sectional view showing a state in which a seal ring is brazed.
FIG. 7 is an explanatory diagram showing a process of removing a positioning block from a large format by sucking the positioning block on the suction plate.
FIG. 8 is a cross-sectional view of the wiring board after dividing the large format.
[Explanation of symbols]
1 Wiring board 2 Cavity (recess)
4 Upper surface 5 Sealing metallized layer 6 Brazing material 7 Positioning block 8 Seal ring 9 Suction plate 10 Large size 11 Product part 12, 13 Break groove 14 Suction hole

Claims (2)

Electrons formed on the first main surface side of each of the product parts of the large-sized multi-size large-size unit having a first main surface and a second main surface and having a large number of product parts to be wiring boards after division. Placing the positioning block in the component mounting recess;
Placing a sealing ring on the sealing metallization layer provided around the recess for mounting the electronic component;
Bonding the metallization layer for sealing and the sealing ring;
The step of removing the positioning block from the large-size multi-use large format while maintaining the arrangement, and transferring the block to the electronic component mounting recess of each other multi-size large product portion;
A process of dividing the large size for taking a large number of pieces to which the sealing ring is joined into each product part and making each wiring board;
A method for manufacturing a wiring board, comprising: The method for manufacturing a wiring board according to claim 1, wherein a brazing material is fixed to the sealing metallization layer in advance.

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