WO2009004722A1 - プローブおよびプローブカード - Google Patents
プローブおよびプローブカード Download PDFInfo
- Publication number
- WO2009004722A1 WO2009004722A1 PCT/JP2007/063314 JP2007063314W WO2009004722A1 WO 2009004722 A1 WO2009004722 A1 WO 2009004722A1 JP 2007063314 W JP2007063314 W JP 2007063314W WO 2009004722 A1 WO2009004722 A1 WO 2009004722A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- probe
- beam parts
- contact point
- end region
- posterior end
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06727—Cantilever beams
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/667,084 US8507908B2 (en) | 2007-07-03 | 2007-07-03 | Probe and probe card |
CN200780053525A CN101688885A (zh) | 2007-07-03 | 2007-07-03 | 探针及探针卡 |
PCT/JP2007/063314 WO2009004722A1 (ja) | 2007-07-03 | 2007-07-03 | プローブおよびプローブカード |
JP2009521483A JP5100751B2 (ja) | 2007-07-03 | 2007-07-03 | プローブおよびプローブカード |
KR1020107002103A KR101106971B1 (ko) | 2007-07-03 | 2007-07-03 | 프로브 및 프로브 카드 |
TW097124546A TW200912326A (en) | 2007-07-03 | 2008-06-30 | Probe and probe card |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2007/063314 WO2009004722A1 (ja) | 2007-07-03 | 2007-07-03 | プローブおよびプローブカード |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009004722A1 true WO2009004722A1 (ja) | 2009-01-08 |
Family
ID=40225792
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/063314 WO2009004722A1 (ja) | 2007-07-03 | 2007-07-03 | プローブおよびプローブカード |
Country Status (6)
Country | Link |
---|---|
US (1) | US8507908B2 (ja) |
JP (1) | JP5100751B2 (ja) |
KR (1) | KR101106971B1 (ja) |
CN (1) | CN101688885A (ja) |
TW (1) | TW200912326A (ja) |
WO (1) | WO2009004722A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4555362B2 (ja) * | 2008-06-02 | 2010-09-29 | 株式会社アドバンテスト | プローブ、電子部品試験装置及びプローブの製造方法 |
TWI465726B (zh) * | 2012-01-10 | 2014-12-21 | Star Techn Inc | 具有強化探針電性觸點結構之積體電路測試卡 |
JP6237441B2 (ja) * | 2014-04-24 | 2017-11-29 | 日本電産リード株式会社 | 電極構造体、検査治具、及び電極構造体の製造方法 |
JP2016050860A (ja) * | 2014-08-29 | 2016-04-11 | オムロン株式会社 | 検査端子ユニットおよびプローブカードおよび検査端子ユニットの製造方法 |
US10739381B2 (en) | 2017-05-26 | 2020-08-11 | Tektronix, Inc. | Component attachment technique using a UV-cure conductive adhesive |
TWI833373B (zh) * | 2022-09-28 | 2024-02-21 | 研鋐精密電子科技股份有限公司 | 用於探針卡的通用電路板 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000249722A (ja) * | 1999-01-29 | 2000-09-14 | Advantest Corp | フォトリソグラフィで形成するコンタクトストラクチャ |
JP2002520596A (ja) * | 1998-07-08 | 2002-07-09 | カプレス エイピーエス | 多探針プローブ |
JP2003509695A (ja) * | 1999-09-15 | 2003-03-11 | カプレス アクティーゼルスカブ | 高分解能位置決めおよび多探針プローブの位置決め用ナノドライブ |
JP2005300501A (ja) * | 2004-04-16 | 2005-10-27 | Ritsumeikan | マルチプローブの製造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7304486B2 (en) | 1998-07-08 | 2007-12-04 | Capres A/S | Nano-drive for high resolution positioning and for positioning of a multi-point probe |
US6343369B1 (en) * | 1998-09-15 | 2002-01-29 | Microconnect, Inc. | Methods for making contact device for making connection to an electronic circuit device and methods of using the same |
US6436802B1 (en) * | 1998-11-30 | 2002-08-20 | Adoamtest Corp. | Method of producing contact structure |
JP2974214B1 (ja) * | 1998-12-16 | 1999-11-10 | 株式会社双晶テック | プローブユニット |
US6535003B2 (en) * | 1999-01-29 | 2003-03-18 | Advantest, Corp. | Contact structure having silicon finger contactor |
US6232669B1 (en) | 1999-10-12 | 2001-05-15 | Advantest Corp. | Contact structure having silicon finger contactors and total stack-up structure using same |
US7245135B2 (en) * | 2005-08-01 | 2007-07-17 | Touchdown Technologies, Inc. | Post and tip design for a probe contact |
-
2007
- 2007-07-03 CN CN200780053525A patent/CN101688885A/zh active Pending
- 2007-07-03 JP JP2009521483A patent/JP5100751B2/ja not_active Expired - Fee Related
- 2007-07-03 KR KR1020107002103A patent/KR101106971B1/ko not_active IP Right Cessation
- 2007-07-03 WO PCT/JP2007/063314 patent/WO2009004722A1/ja active Application Filing
- 2007-07-03 US US12/667,084 patent/US8507908B2/en not_active Expired - Fee Related
-
2008
- 2008-06-30 TW TW097124546A patent/TW200912326A/zh not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002520596A (ja) * | 1998-07-08 | 2002-07-09 | カプレス エイピーエス | 多探針プローブ |
JP2000249722A (ja) * | 1999-01-29 | 2000-09-14 | Advantest Corp | フォトリソグラフィで形成するコンタクトストラクチャ |
JP2003509695A (ja) * | 1999-09-15 | 2003-03-11 | カプレス アクティーゼルスカブ | 高分解能位置決めおよび多探針プローブの位置決め用ナノドライブ |
JP2005300501A (ja) * | 2004-04-16 | 2005-10-27 | Ritsumeikan | マルチプローブの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2009004722A1 (ja) | 2010-08-26 |
KR101106971B1 (ko) | 2012-01-20 |
TW200912326A (en) | 2009-03-16 |
US20100176829A1 (en) | 2010-07-15 |
US8507908B2 (en) | 2013-08-13 |
KR20100022124A (ko) | 2010-02-26 |
JP5100751B2 (ja) | 2012-12-19 |
TWI378242B (ja) | 2012-12-01 |
CN101688885A (zh) | 2010-03-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2009013809A1 (ja) | コンタクタ、プローブカード及びコンタクタの実装方法。 | |
WO2009004722A1 (ja) | プローブおよびプローブカード | |
WO2009004721A1 (ja) | プローブ、プローブカード及びプローブの製造方法 | |
TW200700734A (en) | Probes for a wafer test apparatus | |
TW200728734A (en) | Probe card | |
WO2008123076A1 (ja) | 接続用ボード、プローブカード及びそれを備えた電子部品試験装置 | |
TW200706882A (en) | Probe card assembly with a dielectric structure | |
SG168518A1 (en) | Probe card assembly | |
TW200707461A (en) | Torsion spring probe contactor design | |
WO2011110255A3 (de) | Messspitze mit integriertem messwandler | |
WO2007145968A3 (en) | Methods and apparatus for multi-modal wafer testing | |
TW200801526A (en) | Multi-layered probes | |
EP1191588A3 (en) | A spiral contactor and manufacturing method therefor | |
WO2005010925A3 (de) | Integrierte sensor-chip-einheit | |
DE602007006031D1 (de) | Prüfbare integrierte schaltung und ic-prüfverfahren | |
WO2010065353A3 (en) | Mechanical decoupling of a probe card assembly to improve thermal response | |
DE50205376D1 (de) | Chipkarte mit display | |
WO2005098462A3 (en) | Probe card and method for constructing same | |
WO2008089430A3 (en) | Probing structure with fine pitch probes | |
WO2008135811A3 (en) | Connector for flexible circuit | |
TW200706878A (en) | High frequency cantilever type probe card | |
EP1847834A4 (en) | INTERPOSER, PROBE CARD, AND INTERPOSER MANUFACTURING METHOD | |
WO2008093465A1 (ja) | 試験装置およびプローブカード | |
DE502005004060D1 (de) | Anordnung eines Halbleitermoduls und einer elektrischen Verschienung | |
EP1916716A3 (en) | Semiconductor device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200780053525.X Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 07768088 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2009521483 Country of ref document: JP Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 12667084 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 20107002103 Country of ref document: KR Kind code of ref document: A |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 07768088 Country of ref document: EP Kind code of ref document: A1 |