WO2008143004A1 - ドライエッチング方法 - Google Patents

ドライエッチング方法 Download PDF

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Publication number
WO2008143004A1
WO2008143004A1 PCT/JP2008/058534 JP2008058534W WO2008143004A1 WO 2008143004 A1 WO2008143004 A1 WO 2008143004A1 JP 2008058534 W JP2008058534 W JP 2008058534W WO 2008143004 A1 WO2008143004 A1 WO 2008143004A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
etching method
dry etching
etching
processed
Prior art date
Application number
PCT/JP2008/058534
Other languages
English (en)
French (fr)
Inventor
Yasuhiro Morikawa
Koukou Suu
Toshio Hayashi
Masayuki Satou
Original Assignee
Ulvac, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac, Inc. filed Critical Ulvac, Inc.
Priority to AU2008252203A priority Critical patent/AU2008252203A1/en
Priority to US12/597,645 priority patent/US20100133233A1/en
Priority to JP2009515143A priority patent/JP5090443B2/ja
Priority to CN2008800159148A priority patent/CN101681826B/zh
Priority to KR1020097023612A priority patent/KR101242464B1/ko
Priority to EP08752425.2A priority patent/EP2148360B1/en
Publication of WO2008143004A1 publication Critical patent/WO2008143004A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/082—Shaping or machining of piezoelectric or electrostrictive bodies by etching, e.g. lithography
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Drying Of Semiconductors (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

　基板の両面をドライエッチングしても基板の割れることがないドライエッチン グ方法の提供。 　真空チャンバー内に、フルオロカーボンガス及び希ガスからなるエッチン グガスを導入し、真空チャンバー内を所定の圧力にしてプラズマを発生させ、基板載置部 に設置された熱伝導性シートの粘着面に固着した被処理基板をエッチングして加工する。
PCT/JP2008/058534 2007-05-14 2008-05-08 ドライエッチング方法 WO2008143004A1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
AU2008252203A AU2008252203A1 (en) 2007-05-14 2008-05-08 Dry etching method
US12/597,645 US20100133233A1 (en) 2007-05-14 2008-05-08 Dry etching method
JP2009515143A JP5090443B2 (ja) 2007-05-14 2008-05-08 ドライエッチング方法
CN2008800159148A CN101681826B (zh) 2007-05-14 2008-05-08 干式蚀刻方法
KR1020097023612A KR101242464B1 (ko) 2007-05-14 2008-05-08 건식 식각 방법
EP08752425.2A EP2148360B1 (en) 2007-05-14 2008-05-08 Dry etching method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007127789 2007-05-14
JP2007-127789 2007-05-14

Publications (1)

Publication Number Publication Date
WO2008143004A1 true WO2008143004A1 (ja) 2008-11-27

Family

ID=40031716

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/058534 WO2008143004A1 (ja) 2007-05-14 2008-05-08 ドライエッチング方法

Country Status (8)

Country Link
US (1) US20100133233A1 (ja)
EP (1) EP2148360B1 (ja)
JP (1) JP5090443B2 (ja)
KR (1) KR101242464B1 (ja)
CN (1) CN101681826B (ja)
AU (1) AU2008252203A1 (ja)
TW (1) TWI449101B (ja)
WO (1) WO2008143004A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010177540A (ja) * 2009-01-30 2010-08-12 Panasonic Corp 基板のドライエッチング方法
JP2010178169A (ja) * 2009-01-30 2010-08-12 Panasonic Corp 水晶デバイスの製造方法
JP2011029459A (ja) * 2009-07-27 2011-02-10 Ulvac Japan Ltd デバイスの製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110880444B (zh) * 2019-11-28 2022-04-12 河北工程大学 一种基于等离子体蚀刻的连续双面蚀刻光学器件的装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10125769A (ja) 1996-10-21 1998-05-15 Matsushita Electron Corp 静電チャック電極構造
JPH11150133A (ja) * 1997-09-04 1999-06-02 Hitachi Ltd 半導体素子の搭載方法及びそのシステム、半導体素子分離装置並びにｉｃカードの製造方法
JP2002059363A (ja) * 2000-08-23 2002-02-26 Chemitoronics Co Ltd ウエーハ支持体
JP2005101110A (ja) * 2003-09-22 2005-04-14 Ulvac Japan Ltd 低誘電率層間絶縁膜のドライエッチング方法
JP2006186847A (ja) 2004-12-28 2006-07-13 Epson Toyocom Corp 水晶片集合体とその製造方法、フォトマスク、及び水晶振動子
JP2007053189A (ja) * 2005-08-17 2007-03-01 Konica Minolta Holdings Inc シリコン構造体の製造に用いるマスクパターンを有するシリコン基板及びシリコン構造体の製造方法
JP2007096756A (ja) * 2005-09-29 2007-04-12 Seiko Epson Corp 基板の製造方法、水晶振動片及びジャイロ振動片

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100278137B1 (ko) * 1997-09-04 2001-01-15 가나이 쓰도무 반도체소자의 탑재방법 및 그 시스템, 반도체소자 분리장치 및ic카드의 제조방법
JP2001156584A (ja) * 1999-11-30 2001-06-08 Sony Corp 圧電素子とその製造方法
US6642127B2 (en) * 2001-10-19 2003-11-04 Applied Materials, Inc. Method for dicing a semiconductor wafer
JP2003142979A (ja) * 2001-10-31 2003-05-16 River Eletec Kk 水晶振動子及びその製造方法
US20050178741A1 (en) * 2003-05-03 2005-08-18 Yeoh Joon C. Method of etching porous dielectric
US20050036267A1 (en) * 2003-05-20 2005-02-17 Savas Stephen Edward Clamp for holding and efficiently removing heat from workpieces
TWI231534B (en) * 2003-12-11 2005-04-21 Advanced Semiconductor Eng Method for dicing a wafer
JP2005286992A (ja) * 2004-03-02 2005-10-13 Seiko Epson Corp 圧電振動片、圧電振動子および圧電発振器
TWI236058B (en) * 2004-08-06 2005-07-11 Touch Micro System Tech Method of performing double side processes upon a wafer
TWI276844B (en) * 2006-03-28 2007-03-21 United Microelectronics Corp Etching method
JP4197001B2 (ja) * 2006-04-04 2008-12-17 エプソントヨコム株式会社 圧電振動片の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10125769A (ja) 1996-10-21 1998-05-15 Matsushita Electron Corp 静電チャック電極構造
JPH11150133A (ja) * 1997-09-04 1999-06-02 Hitachi Ltd 半導体素子の搭載方法及びそのシステム、半導体素子分離装置並びにｉｃカードの製造方法
JP2002059363A (ja) * 2000-08-23 2002-02-26 Chemitoronics Co Ltd ウエーハ支持体
JP2005101110A (ja) * 2003-09-22 2005-04-14 Ulvac Japan Ltd 低誘電率層間絶縁膜のドライエッチング方法
JP2006186847A (ja) 2004-12-28 2006-07-13 Epson Toyocom Corp 水晶片集合体とその製造方法、フォトマスク、及び水晶振動子
JP2007053189A (ja) * 2005-08-17 2007-03-01 Konica Minolta Holdings Inc シリコン構造体の製造に用いるマスクパターンを有するシリコン基板及びシリコン構造体の製造方法
JP2007096756A (ja) * 2005-09-29 2007-04-12 Seiko Epson Corp 基板の製造方法、水晶振動片及びジャイロ振動片

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2148360A4

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010177540A (ja) * 2009-01-30 2010-08-12 Panasonic Corp 基板のドライエッチング方法
JP2010178169A (ja) * 2009-01-30 2010-08-12 Panasonic Corp 水晶デバイスの製造方法
JP2011029459A (ja) * 2009-07-27 2011-02-10 Ulvac Japan Ltd デバイスの製造方法

Also Published As

Publication number Publication date
EP2148360B1 (en) 2014-01-22
CN101681826B (zh) 2011-08-10
EP2148360A1 (en) 2010-01-27
AU2008252203A1 (en) 2008-11-27
JPWO2008143004A1 (ja) 2010-08-05
CN101681826A (zh) 2010-03-24
EP2148360A4 (en) 2010-07-21
US20100133233A1 (en) 2010-06-03
TWI449101B (zh) 2014-08-11
TW200903633A (en) 2009-01-16
KR20100016479A (ko) 2010-02-12
KR101242464B1 (ko) 2013-03-12
JP5090443B2 (ja) 2012-12-05

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