WO2008142754A1 - 電子部品試験装置及び電子部品試験方法 - Google Patents

電子部品試験装置及び電子部品試験方法 Download PDF

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Publication number
WO2008142754A1
WO2008142754A1 PCT/JP2007/060212 JP2007060212W WO2008142754A1 WO 2008142754 A1 WO2008142754 A1 WO 2008142754A1 JP 2007060212 W JP2007060212 W JP 2007060212W WO 2008142754 A1 WO2008142754 A1 WO 2008142754A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
component testing
blasting
contact arms
testing device
Prior art date
Application number
PCT/JP2007/060212
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Hiroki Ikeda
Yoshinari Kogure
Tsuyoshi Yamashita
Hiroyuki Takahashi
Original Assignee
Advantest Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corporation filed Critical Advantest Corporation
Priority to JP2009515024A priority Critical patent/JPWO2008142754A1/ja
Priority to PCT/JP2007/060212 priority patent/WO2008142754A1/ja
Priority to TW097113779A priority patent/TW200900711A/zh
Publication of WO2008142754A1 publication Critical patent/WO2008142754A1/ja

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
PCT/JP2007/060212 2007-05-18 2007-05-18 電子部品試験装置及び電子部品試験方法 WO2008142754A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009515024A JPWO2008142754A1 (ja) 2007-05-18 2007-05-18 電子部品試験装置及び電子部品試験方法
PCT/JP2007/060212 WO2008142754A1 (ja) 2007-05-18 2007-05-18 電子部品試験装置及び電子部品試験方法
TW097113779A TW200900711A (en) 2007-05-18 2008-04-16 Electronic component testing device and electronic component testing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/060212 WO2008142754A1 (ja) 2007-05-18 2007-05-18 電子部品試験装置及び電子部品試験方法

Publications (1)

Publication Number Publication Date
WO2008142754A1 true WO2008142754A1 (ja) 2008-11-27

Family

ID=40031481

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/060212 WO2008142754A1 (ja) 2007-05-18 2007-05-18 電子部品試験装置及び電子部品試験方法

Country Status (3)

Country Link
JP (1) JPWO2008142754A1 (zh)
TW (1) TW200900711A (zh)
WO (1) WO2008142754A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI769664B (zh) * 2021-01-15 2022-07-01 鴻勁精密股份有限公司 測試裝置及其應用之測試設備

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI401766B (zh) * 2009-03-23 2013-07-11 Evertechno Co Ltd 試驗處理機及其零件移送方法
TWI414798B (zh) * 2010-05-21 2013-11-11 Hon Tech Inc 可執行冷測／熱測之電子元件測試分類機
JP2013024829A (ja) * 2011-07-26 2013-02-04 Seiko Epson Corp 電子部品搬送装置及び電子部品搬送方法
JP5942459B2 (ja) * 2012-02-14 2016-06-29 セイコーエプソン株式会社 ハンドラー、及び部品検査装置
KR102270760B1 (ko) * 2019-11-29 2021-06-30 에이엠티 주식회사 미세 피치를 갖는 디바이스의 테스트장치
CN113326167B (zh) * 2021-05-13 2022-07-08 山东英信计算机技术有限公司 基于基板管理控制器通信的定温可调测试器和测试方法
TWI787919B (zh) * 2021-07-23 2022-12-21 致茂電子股份有限公司 多層架構之供料和分料裝置及具備該裝置之電子元件檢測設備
US11740283B2 (en) 2021-07-23 2023-08-29 Chroma Ate Inc. Multistory electronic device testing apparatus

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62127677A (ja) * 1985-11-29 1987-06-09 Ando Electric Co Ltd 部品の温度試験装置
JPS62121579U (zh) * 1986-01-24 1987-08-01
JPH1164437A (ja) * 1997-08-22 1999-03-05 Ando Electric Co Ltd Ｉｃ加熱装置
JP2002148303A (ja) * 2000-11-10 2002-05-22 Advantest Corp 電子部品試験用保持装置、電子部品試験装置および電子部品試験方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62127677A (ja) * 1985-11-29 1987-06-09 Ando Electric Co Ltd 部品の温度試験装置
JPS62121579U (zh) * 1986-01-24 1987-08-01
JPH1164437A (ja) * 1997-08-22 1999-03-05 Ando Electric Co Ltd Ｉｃ加熱装置
JP2002148303A (ja) * 2000-11-10 2002-05-22 Advantest Corp 電子部品試験用保持装置、電子部品試験装置および電子部品試験方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI769664B (zh) * 2021-01-15 2022-07-01 鴻勁精密股份有限公司 測試裝置及其應用之測試設備

Also Published As

Publication number Publication date
JPWO2008142754A1 (ja) 2010-08-05
TWI373626B (zh) 2012-10-01
TW200900711A (en) 2009-01-01

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