WO2008101884A3 - Verfahren zur kontaktierung elektrischer bauelemente - Google Patents

Verfahren zur kontaktierung elektrischer bauelemente Download PDF

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Publication number
WO2008101884A3
WO2008101884A3 PCT/EP2008/051909 EP2008051909W WO2008101884A3 WO 2008101884 A3 WO2008101884 A3 WO 2008101884A3 EP 2008051909 W EP2008051909 W EP 2008051909W WO 2008101884 A3 WO2008101884 A3 WO 2008101884A3
Authority
WO
WIPO (PCT)
Prior art keywords
dispersion
carrier
electrical components
inventive method
electrical component
Prior art date
Application number
PCT/EP2008/051909
Other languages
English (en)
French (fr)
Other versions
WO2008101884A2 (de
Inventor
Rene Lochtman
Norbert Wagner
Juergen Kaczun
Juergen Pfister
Raffaele Antonino Addamo
Ralf Noerenberg
Original Assignee
Basf Se
Rene Lochtman
Norbert Wagner
Juergen Kaczun
Juergen Pfister
Raffaele Antonino Addamo
Ralf Noerenberg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se, Rene Lochtman, Norbert Wagner, Juergen Kaczun, Juergen Pfister, Raffaele Antonino Addamo, Ralf Noerenberg filed Critical Basf Se
Publication of WO2008101884A2 publication Critical patent/WO2008101884A2/de
Publication of WO2008101884A3 publication Critical patent/WO2008101884A3/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating

Abstract

Es wird ein Verfahren zur elektrischen Kontaktierung elektrischer Bauelemente (122) auf einem Träger (110) vorgeschlagen, welches folgende Schritte aufweist: (a) In mindestens einem Bereich des Trägers (110) wird mindestens eine Dispersion (116) aufgebracht, wobei die Dispersion (116) elektrisch leitfähige Partikel umfasst; (b) mindestens ein elektrisches Bauelement (122) wird auf die Dispersion (116) aufgebracht; und (c) die Dispersion (116) wird ganz oder teilweise stromlos und/oder galvanisch metallisiert. Weiterhin wird eine elektrische Komponente (134) vorgeschlagen, welche mindestens einen Träger (110) und mindestens ein elektrisches Bauelement (122) umfasst. Das elektrische Bauelement (122) ist mit einem erfindungsgemäßen Verfahren auf dem Träger (110) kontaktiert. Weiterhin werden eine Vorrichtung zur Durchführung des erfindungsgemäßen Verfahrens sowie eine Dispersion (116) zur Verwendung in dem erfindungsgemäßen Verfahren und eine Verwendung dieser Dispersion (116) vorgeschlagen.
PCT/EP2008/051909 2007-02-20 2008-02-18 Verfahren zur kontaktierung elektrischer bauelemente WO2008101884A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP07102696 2007-02-20
EP07102696.7 2007-02-20

Publications (2)

Publication Number Publication Date
WO2008101884A2 WO2008101884A2 (de) 2008-08-28
WO2008101884A3 true WO2008101884A3 (de) 2008-11-13

Family

ID=39339905

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/051909 WO2008101884A2 (de) 2007-02-20 2008-02-18 Verfahren zur kontaktierung elektrischer bauelemente

Country Status (2)

Country Link
TW (1) TW200843588A (de)
WO (1) WO2008101884A2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109797485A (zh) * 2019-02-26 2019-05-24 安徽丹凤电子材料股份有限公司 一种耐高温耐腐蚀玻璃纤维电子布

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2126190B1 (de) 2007-02-20 2010-07-14 Basf Se Verfahren zur herstellung von metallisierten textilen oberflächen mit strom erzeugenden oder strom verbrauchenden artikeln
DE102008027558A1 (de) * 2008-06-10 2009-12-17 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Kontaktierung, Zusammensetzung für die Chipkontaktierung sowie deren Verwendung
TWI417525B (zh) * 2009-11-12 2013-12-01 具有無線射頻系統標籤之溫度感測貼片
DE102012213572A1 (de) * 2012-08-01 2014-02-06 Ifm Electronic Gmbh Kapazitiver Drucksensor
DE102018125216B3 (de) * 2018-10-11 2020-02-06 Neotech AMT GmbH Verfahren zur Vorbereitung der automatisierten Herstellung einer Elektronikkomponente, Verfahren zur automatisierten Herstellung und/oder zum automatisierten Nachbearbeiten einer Elektronikkomponente, Recheneinrichtung, Computerprogramm und elektronisch lesbarer Datenträger
CN111144533A (zh) * 2019-12-20 2020-05-12 四川华大恒芯科技有限公司 一种芯片防转移方法、防转移芯片及射频标签

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5839190A (en) * 1989-06-09 1998-11-24 Sullivan; Kenneth W. Methods for fabricating solderless printed wiring devices
US20050191511A1 (en) * 2003-12-26 2005-09-01 Hideo Aoki Metal-containing resin particle, metal-containing resin layer, method of forming metal-containing resin layer, and substrate for electronic circuit
WO2007144322A1 (de) * 2006-06-14 2007-12-21 Basf Se Verfahren zur herstellung von elektrisch leitfähigen oberflächen auf einem träger

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5839190A (en) * 1989-06-09 1998-11-24 Sullivan; Kenneth W. Methods for fabricating solderless printed wiring devices
US20050191511A1 (en) * 2003-12-26 2005-09-01 Hideo Aoki Metal-containing resin particle, metal-containing resin layer, method of forming metal-containing resin layer, and substrate for electronic circuit
WO2007144322A1 (de) * 2006-06-14 2007-12-21 Basf Se Verfahren zur herstellung von elektrisch leitfähigen oberflächen auf einem träger

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109797485A (zh) * 2019-02-26 2019-05-24 安徽丹凤电子材料股份有限公司 一种耐高温耐腐蚀玻璃纤维电子布

Also Published As

Publication number Publication date
TW200843588A (en) 2008-11-01
WO2008101884A2 (de) 2008-08-28

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