WO2008140076A1 - フォトレジスト剥離剤組成物 - Google Patents

フォトレジスト剥離剤組成物 Download PDF

Info

Publication number
WO2008140076A1
WO2008140076A1 PCT/JP2008/058750 JP2008058750W WO2008140076A1 WO 2008140076 A1 WO2008140076 A1 WO 2008140076A1 JP 2008058750 W JP2008058750 W JP 2008058750W WO 2008140076 A1 WO2008140076 A1 WO 2008140076A1
Authority
WO
WIPO (PCT)
Prior art keywords
weight
remover composition
photoresist
hydroxypyrimidine
pyrone
Prior art date
Application number
PCT/JP2008/058750
Other languages
English (en)
French (fr)
Inventor
Takafumi Yamabe
Yoshitaka Nishijima
Hidekuni Yasue
Original Assignee
Nagase Chemtex Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nagase Chemtex Corporation filed Critical Nagase Chemtex Corporation
Priority to KR1020097024223A priority Critical patent/KR101420471B1/ko
Priority to CN2008800160126A priority patent/CN101681129B/zh
Publication of WO2008140076A1 publication Critical patent/WO2008140076A1/ja

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

　ＦＰＤ製造工程において、Ａｌ又はＡｌ合金配線を腐食させることなく、かつ、Ｃｕ又はＣｕ合金配線を腐食させることなく、フォトレジストを剥離することができるＦＰＤ製造用フォトレジスト剥離剤組成物を提供する。本発明は、マルトール、２，６－ジメチルガンマピロン、４－ヒドロキシ－６－メチル－２－ピロン、４－ヒドロキシクマリン、２，４－ジヒドロキシキノリン、２－アミノ－４，６－ジヒドロキシピリミジン、２，４－ジアミノ－６－ヒドロキシピリミジン、２－アミノ－４－ヒドロキシ－６－メチルピリミジン、４，６－ジメチル－２－ヒドロキシピリミジン、ウラシル及び６－メチルウラシルからなる群から選択される少なくとも１種の複素環式化合物０．０５～１０重量%、一級若しくは二級のアルカノールアミン又はアルキルアミン５～４５重量%、極性有機溶剤３０～９４．８５重量％、糖アルコール０．１～１０重量％を含有する。
PCT/JP2008/058750 2007-05-15 2008-05-13 フォトレジスト剥離剤組成物 WO2008140076A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020097024223A KR101420471B1 (ko) 2007-05-15 2008-05-13 포토레지스트 박리제조성물
CN2008800160126A CN101681129B (zh) 2007-05-15 2008-05-13 光致抗蚀剂剥离剂组合物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-129699 2007-05-15
JP2007129699A JP4716225B2 (ja) 2007-05-15 2007-05-15 フォトレジスト剥離剤組成物

Publications (1)

Publication Number Publication Date
WO2008140076A1 true WO2008140076A1 (ja) 2008-11-20

Family

ID=40002266

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/058750 WO2008140076A1 (ja) 2007-05-15 2008-05-13 フォトレジスト剥離剤組成物

Country Status (5)

Country Link
JP (1) JP4716225B2 (ja)
KR (1) KR101420471B1 (ja)
CN (1) CN101681129B (ja)
TW (1) TWI434150B (ja)
WO (1) WO2008140076A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016151645A1 (ja) * 2015-03-24 2016-09-29 パナソニックＩｐマネジメント株式会社 レジスト剥離液
EP4063957A4 (en) * 2019-11-21 2023-12-27 LTC Co. Ltd. PHOTOSENSITIVE RESIN STRIPING COMPOSITION FOR MANUFACTURING A DISPLAY DEVICE

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010119753A1 (ja) * 2009-04-17 2010-10-21 ナガセケムテックス株式会社 フォトレジスト剥離剤組成物及びフォトレジスト剥離方法
WO2011014027A2 (ko) * 2009-07-29 2011-02-03 동우 화인켐 주식회사 세정액 조성물 및 이를 이용한 패널의 세정방법
JP5023128B2 (ja) 2009-10-07 2012-09-12 東京エレクトロン株式会社 塗布現像装置及び塗布現像方法
JP5709075B2 (ja) * 2010-09-10 2015-04-30 ナガセケムテックス株式会社 リン酸及び／又はリン酸塩の水溶液のパーティクル数経時安定化方法及びレジスト残渣剥離剤組成物
KR101089211B1 (ko) * 2010-12-02 2011-12-02 엘티씨 (주) 1차 알칸올 아민을 포함하는 ｌｃｄ 제조용 포토레지스트 박리액 조성물
CN106547177A (zh) * 2015-09-16 2017-03-29 东友精细化工有限公司 抗蚀剂剥离液组合物、平板显示器基板及其制造方法
CN108139692A (zh) * 2015-10-13 2018-06-08 长濑化成株式会社 光致抗蚀剂剥离液
WO2018061064A1 (ja) * 2016-09-30 2018-04-05 パナソニックＩｐマネジメント株式会社 レジスト剥離液
JP7176089B2 (ja) 2018-07-20 2022-11-21 インテグリス・インコーポレーテッド 腐食防止剤を含む洗浄組成物
JP7247038B2 (ja) 2019-07-02 2023-03-28 株式会社カネカ 被覆導体およびその製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08262746A (ja) * 1995-03-28 1996-10-11 Mitsubishi Gas Chem Co Inc フォトレジスト剥離剤組成物および剥離方法
JP2001350276A (ja) * 2000-06-05 2001-12-21 Nagase Kasei Kogyo Kk フォトレジスト剥離剤組成物及びその使用方法
JP2002351093A (ja) * 2001-05-22 2002-12-04 Nagase Chemtex Corp レジスト剥離用組成物
JP2004287288A (ja) * 2003-03-24 2004-10-14 Nagase Chemtex Corp レジスト剥離用組成物及びレジスト剥離方法
WO2007010679A1 (ja) * 2005-07-21 2007-01-25 Kao Corporation 剥離剤組成物

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4692497B2 (ja) * 2007-02-28 2011-06-01 ナガセケムテックス株式会社 フォトレジスト剥離剤組成物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08262746A (ja) * 1995-03-28 1996-10-11 Mitsubishi Gas Chem Co Inc フォトレジスト剥離剤組成物および剥離方法
JP2001350276A (ja) * 2000-06-05 2001-12-21 Nagase Kasei Kogyo Kk フォトレジスト剥離剤組成物及びその使用方法
JP2002351093A (ja) * 2001-05-22 2002-12-04 Nagase Chemtex Corp レジスト剥離用組成物
JP2004287288A (ja) * 2003-03-24 2004-10-14 Nagase Chemtex Corp レジスト剥離用組成物及びレジスト剥離方法
WO2007010679A1 (ja) * 2005-07-21 2007-01-25 Kao Corporation 剥離剤組成物

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016151645A1 (ja) * 2015-03-24 2016-09-29 パナソニックＩｐマネジメント株式会社 レジスト剥離液
EP4063957A4 (en) * 2019-11-21 2023-12-27 LTC Co. Ltd. PHOTOSENSITIVE RESIN STRIPING COMPOSITION FOR MANUFACTURING A DISPLAY DEVICE

Also Published As

Publication number Publication date
CN101681129B (zh) 2012-05-30
TWI434150B (zh) 2014-04-11
CN101681129A (zh) 2010-03-24
KR101420471B1 (ko) 2014-07-16
JP2008286881A (ja) 2008-11-27
KR20100017192A (ko) 2010-02-16
TW200900884A (en) 2009-01-01
JP4716225B2 (ja) 2011-07-06

Similar Documents

Publication Publication Date Title
WO2008140076A1 (ja) フォトレジスト剥離剤組成物
PT2453739E (pt) Processo para a preparação de uma suspensão aquosa de um composto pesticida orgânico
WO2006021457A3 (en) Pyrimidine derivatives
WO2010017364A3 (en) Low cost routes to high purity silicon and derivatives thereof
WO2008027264A3 (en) Disinfectant systems and methods
WO2006087143A8 (en) Novel processes for the preparation of a 2h-chromene
WO2009016460A3 (en) Pyrazole compounds and their use as raf inhibitors
WO2007092351A3 (en) Stable, concentrated herbicidal compositions
UA99447C2 (ru) Способ получения силденафила
WO2011038185A3 (en) Methods for preparing pyrimidine derivatives useful as protein kinase inhibitors
WO2011008312A3 (en) Indole and indoline derivatives and methods of use thereof
WO2008062376A3 (en) New process for the preparation of 2-imino-thiazolidin-4-one derivatives
WO2008062478A3 (en) Improved process for pure montelukast sodium through pure intermediates as well as novel amine salts
JP2008286881A5 (ja)
WO2009004643A3 (en) An improved process for preparation of (s)-pregabalin and intermediates thereof
WO2008105440A1 (ja) フォトレジスト剥離剤組成物
NO20081617L (no) Metoder for fremstilling av Glutaminsyrederivater
MX2007002833A (es) Derivados de alquiliden-tetrahidronaftaleno, procedimiento para su preparacion y su uso como antiinflamatorios.
IL185545A0 (en) Method of preparation of pure 4-pyrrolidinophenylbenzyl ether derivatives as maob inhibitors
MX2010009876A (es) Nuevo proceso para la preparacion de derivados de acido ciclohexanocarboxilico por medio del derivado de ciclohexanocarboxamida correspondiente.
MX2009004558A (es) Compuesto amida o su sal, e inhibidor de formacion de biopelicula, quitador de biopelicula y bactericida usando cada uno el compuesto amida o su sal.
WO2006131338A3 (en) Crystalline solvate of omeprazole sodium
WO2009024323A3 (en) Process for preparing pyrimidine derivatives
WO2006076350A3 (en) Processes for the preparation of aminoethoxybenzyl alcohols
WO2011015334A3 (en) Vitamin k3 derivative/nsa formulation

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880016012.6

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08752630

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20097024223

Country of ref document: KR

Kind code of ref document: A

122 Ep: pct application non-entry in european phase

Ref document number: 08752630

Country of ref document: EP

Kind code of ref document: A1