WO2008133172A1 - 樹脂混合用複合フィラー - Google Patents

樹脂混合用複合フィラー Download PDF

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Publication number
WO2008133172A1
WO2008133172A1 PCT/JP2008/057497 JP2008057497W WO2008133172A1 WO 2008133172 A1 WO2008133172 A1 WO 2008133172A1 JP 2008057497 W JP2008057497 W JP 2008057497W WO 2008133172 A1 WO2008133172 A1 WO 2008133172A1
Authority
WO
WIPO (PCT)
Prior art keywords
particles
composite
inorganic oxide
oxide particles
metal
Prior art date
Application number
PCT/JP2008/057497
Other languages
English (en)
French (fr)
Inventor
Kishio Hidaka
Yoshihiro Furukawa
Hiroshi Hozoji
Kazuhiro Suzuki
Nobutake Tsuyuno
Toshio Yasuda
Original Assignee
Hitachi High-Technologies Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High-Technologies Corporation filed Critical Hitachi High-Technologies Corporation
Priority to JP2009511842A priority Critical patent/JP5133338B2/ja
Publication of WO2008133172A1 publication Critical patent/WO2008133172A1/ja

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0075—Magnetic shielding materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/06—Metallic powder characterised by the shape of the particles
    • B22F1/068—Flake-like particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/16—Metallic particles coated with a non-metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
    • H01F1/26—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Electromagnetism (AREA)
  • Dispersion Chemistry (AREA)
  • Power Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Soft Magnetic Materials (AREA)
  • Hard Magnetic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

　樹脂組成物と混合して用いられ、絶縁性、電磁波吸収性、放熱性に優れた複合フィラーを提供する。 　金属粒子と、無機酸化物粒子とよりなる複合粒子であって、金属粒子の径は無機酸化物粒子の径の１０倍以上であり、無機酸化物粒子が金属粒子の表面に刺さるようにして覆っている構造を有することにある。前記複合粒子はアスペクト比が５以上の平板状の軟磁性金属粉末と無機酸化物粒子が相互に積層されて一つの粒子が構成されている。また、前記複合粒子と、前期複合粒子を構成しない無機酸化物の粒子とを混合した樹脂混合用複合フィラーにある。
PCT/JP2008/057497 2007-04-17 2008-04-17 樹脂混合用複合フィラー WO2008133172A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009511842A JP5133338B2 (ja) 2007-04-17 2008-04-17 樹脂混合用複合フィラー

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007107681 2007-04-17
JP2007-107681 2007-04-17

Publications (1)

Publication Number Publication Date
WO2008133172A1 true WO2008133172A1 (ja) 2008-11-06

Family

ID=39925628

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057497 WO2008133172A1 (ja) 2007-04-17 2008-04-17 樹脂混合用複合フィラー

Country Status (2)

Country Link
JP (2) JP5133338B2 (ja)
WO (1) WO2008133172A1 (ja)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012034160A (ja) * 2010-07-30 2012-02-16 Konica Minolta Medical & Graphic Inc 超音波探触子用バッキング材、それを用いた超音波探触子、及び超音波医用画像診断装置
WO2012023685A1 (ko) * 2010-08-20 2012-02-23 동현전자 주식회사 코어-쉘 타입의 필러 입자를 포함하는 복합 시트용 조성물, 이를 포함하는 복합 시트 및 복합 시트의 제조 방법
CN102103918B (zh) * 2009-12-18 2013-03-20 北京有色金属研究总院 一种薄型低频吸波材料及其制备方法
JP2013065844A (ja) * 2011-08-31 2013-04-11 Toshiba Corp 磁性材料、磁性材料の製造方法およびインダクタ素子
JP2013082981A (ja) * 2011-10-12 2013-05-09 Mitsui Mining & Smelting Co Ltd 複合銅粉
JP5384711B1 (ja) * 2012-10-05 2014-01-08 Ｎｅｃトーキン株式会社 磁性扁平粉及びその製造方法並びに磁性シート
JP5462356B2 (ja) * 2010-03-26 2014-04-02 日立粉末冶金株式会社 圧粉磁心及びその製造方法
KR101438397B1 (ko) * 2012-10-12 2014-09-17 두성산업 주식회사 고열전도성 방열 테이프 및 이를 포함하는 고열전도성 방열테이프 물품
JP2015079890A (ja) * 2013-10-17 2015-04-23 株式会社アドマテックス シリカ被覆磁性材料粒子およびその製造方法
EP3062316A4 (en) * 2013-10-22 2017-06-14 Nitto Denko Corporation Soft magnetic resin composition and soft magnetic film
CN111725145A (zh) * 2020-06-16 2020-09-29 杰群电子科技（东莞）有限公司 一种半导体封装结构、封装方法及电子产品
CN111725159A (zh) * 2020-06-16 2020-09-29 杰群电子科技（东莞）有限公司 一种高散热半导体产品、封装方法及电子产品
CN111725160A (zh) * 2020-06-16 2020-09-29 杰群电子科技（东莞）有限公司 一种高功率半导体模组、封装方法及电子产品
JP2021072336A (ja) * 2019-10-30 2021-05-06 セイコーエプソン株式会社 絶縁体被覆磁性合金粉末粒子、圧粉磁心、およびコイル部品
CN114539778A (zh) * 2022-02-23 2022-05-27 深圳市锐扬创科技术股份有限公司 一种应用于高宽频谱的导热吸波纳米级新型功能复合材料及其制备方法

Families Citing this family (7)

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KR20160068762A (ko) * 2013-10-04 2016-06-15 이 아이 듀폰 디 네모아 앤드 캄파니 열전도성 전기 절연 입자 및 조성물
JP6215163B2 (ja) * 2014-09-19 2017-10-18 株式会社東芝 複合磁性材料の製造方法
JP6230513B2 (ja) * 2014-09-19 2017-11-15 株式会社東芝 複合磁性材料の製造方法
JP6550731B2 (ja) * 2014-11-28 2019-07-31 Tdk株式会社 コイル部品
JP2020150036A (ja) * 2019-03-11 2020-09-17 藤倉化成株式会社 磁性塗料組成物
JP7222771B2 (ja) * 2019-03-22 2023-02-15 日本特殊陶業株式会社 圧粉磁心
JP7229825B2 (ja) * 2019-03-22 2023-02-28 日本特殊陶業株式会社 圧粉磁心

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JP2000223884A (ja) * 1999-02-02 2000-08-11 Daido Steel Co Ltd 電磁波吸収体
JP2001358493A (ja) * 2000-04-10 2001-12-26 Hitachi Ltd 電磁波吸収材とその製造法及びそれを用いた各種用途
JP2002299648A (ja) * 2001-03-30 2002-10-11 Hitachi Ltd 光送信・受信モジュール
JP2006128278A (ja) * 2004-10-27 2006-05-18 Toshiba Corp 高周波磁性材料およびそれを用いた高周波磁性部品、並びにその製造方法

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JP2007046074A (ja) * 2005-08-08 2007-02-22 Hitachi Metals Ltd 金属微粒子およびその製造方法
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Publication number Priority date Publication date Assignee Title
JP2000017194A (ja) * 1998-06-30 2000-01-18 Toyo Alum Kk 導電性粉末およびそれを使用した塗料、塗膜、樹脂組成物、樹脂成形体および接着剤
JP2000223884A (ja) * 1999-02-02 2000-08-11 Daido Steel Co Ltd 電磁波吸収体
JP2001358493A (ja) * 2000-04-10 2001-12-26 Hitachi Ltd 電磁波吸収材とその製造法及びそれを用いた各種用途
JP2002299648A (ja) * 2001-03-30 2002-10-11 Hitachi Ltd 光送信・受信モジュール
JP2006128278A (ja) * 2004-10-27 2006-05-18 Toshiba Corp 高周波磁性材料およびそれを用いた高周波磁性部品、並びにその製造方法

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102103918B (zh) * 2009-12-18 2013-03-20 北京有色金属研究总院 一种薄型低频吸波材料及其制备方法
JP5462356B2 (ja) * 2010-03-26 2014-04-02 日立粉末冶金株式会社 圧粉磁心及びその製造方法
US9646756B2 (en) 2010-03-26 2017-05-09 Hitachi Powdered Metals Co., Ltd. Powder magnetic core and method for producing the same
JP2012034160A (ja) * 2010-07-30 2012-02-16 Konica Minolta Medical & Graphic Inc 超音波探触子用バッキング材、それを用いた超音波探触子、及び超音波医用画像診断装置
WO2012023685A1 (ko) * 2010-08-20 2012-02-23 동현전자 주식회사 코어-쉘 타입의 필러 입자를 포함하는 복합 시트용 조성물, 이를 포함하는 복합 시트 및 복합 시트의 제조 방법
JP2012522884A (ja) * 2010-08-20 2012-09-27 東▲ひょん▼電子株式会社 コアシェルタイプのフィラー粒子を含む複合シート用組成物、これを含む複合シート、および複合シートの製造方法
KR101237001B1 (ko) * 2010-08-20 2013-02-25 동현전자 주식회사 코어-쉘 타입의 필러 입자를 포함하는 복합 시트용 조성물, 이를 포함하는 복합 시트 및 복합 시트의 제조 방법
EP2607420A4 (en) * 2010-08-20 2017-11-15 Donghyun Electronics Co., Ltd. Composition for a composite sheet comprising core-shell type filler particles, a composite sheet comprising the same and a production method for the composite sheet
US9362033B2 (en) 2011-08-31 2016-06-07 Kabushiki Kaisha Toshiba Magnetic material, method for producing magnetic material, and inductor element
JP2013065844A (ja) * 2011-08-31 2013-04-11 Toshiba Corp 磁性材料、磁性材料の製造方法およびインダクタ素子
JP2014131054A (ja) * 2011-08-31 2014-07-10 Toshiba Corp 磁性材料
JP2013082981A (ja) * 2011-10-12 2013-05-09 Mitsui Mining & Smelting Co Ltd 複合銅粉
KR102040014B1 (ko) * 2012-10-05 2019-11-04 가부시키가이샤 토킨 자성 분말, 그 형성 방법 및 자성 시트
KR20140044735A (ko) * 2012-10-05 2014-04-15 엔이씨 도낀 가부시끼가이샤 자성 분말, 그 형성 방법 및 자성 시트
JP5384711B1 (ja) * 2012-10-05 2014-01-08 Ｎｅｃトーキン株式会社 磁性扁平粉及びその製造方法並びに磁性シート
KR101438397B1 (ko) * 2012-10-12 2014-09-17 두성산업 주식회사 고열전도성 방열 테이프 및 이를 포함하는 고열전도성 방열테이프 물품
JP2015079890A (ja) * 2013-10-17 2015-04-23 株式会社アドマテックス シリカ被覆磁性材料粒子およびその製造方法
EP3062316A4 (en) * 2013-10-22 2017-06-14 Nitto Denko Corporation Soft magnetic resin composition and soft magnetic film
US10269477B2 (en) 2013-10-22 2019-04-23 Nitto Denko Corporation Soft magnetic resin composition and soft magnetic film
JP2021072336A (ja) * 2019-10-30 2021-05-06 セイコーエプソン株式会社 絶縁体被覆磁性合金粉末粒子、圧粉磁心、およびコイル部品
JP7375469B2 (ja) 2019-10-30 2023-11-08 セイコーエプソン株式会社 絶縁体被覆磁性合金粉末粒子、圧粉磁心、およびコイル部品
CN111725159A (zh) * 2020-06-16 2020-09-29 杰群电子科技（东莞）有限公司 一种高散热半导体产品、封装方法及电子产品
CN111725160A (zh) * 2020-06-16 2020-09-29 杰群电子科技（东莞）有限公司 一种高功率半导体模组、封装方法及电子产品
CN111725145A (zh) * 2020-06-16 2020-09-29 杰群电子科技（东莞）有限公司 一种半导体封装结构、封装方法及电子产品
CN114539778A (zh) * 2022-02-23 2022-05-27 深圳市锐扬创科技术股份有限公司 一种应用于高宽频谱的导热吸波纳米级新型功能复合材料及其制备方法
CN114539778B (zh) * 2022-02-23 2022-10-28 深圳市锐扬创科技术股份有限公司 一种应用于高宽频谱的导热吸波纳米级功能复合材料及其制备方法

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JP2012151502A (ja) 2012-08-09
JP5453477B2 (ja) 2014-03-26
JP5133338B2 (ja) 2013-01-30
JPWO2008133172A1 (ja) 2010-07-22

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