WO2008123436A1 - Cu-ni-si-co-based copper alloy for electronic material, and method for production thereof - Google Patents
Cu-ni-si-co-based copper alloy for electronic material, and method for production thereof Download PDFInfo
- Publication number
- WO2008123436A1 WO2008123436A1 PCT/JP2008/056142 JP2008056142W WO2008123436A1 WO 2008123436 A1 WO2008123436 A1 WO 2008123436A1 JP 2008056142 W JP2008056142 W JP 2008056142W WO 2008123436 A1 WO2008123436 A1 WO 2008123436A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- carried out
- copper alloy
- mass
- production
- electronic material
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/02—Single bars, rods, wires, or strips
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008800101753A CN101646791B (en) | 2007-03-30 | 2008-03-28 | Cu-ni-si-co-based copper alloy for electronic material, and method for production thereof |
KR1020097021841A KR101159562B1 (en) | 2007-03-30 | 2008-03-28 | Cu-ni-si-co-based copper alloy for electronic material, and method for production thereof |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007092269A JP4937815B2 (en) | 2007-03-30 | 2007-03-30 | Cu-Ni-Si-Co-based copper alloy for electronic materials and method for producing the same |
JP2007-092269 | 2007-03-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008123436A1 true WO2008123436A1 (en) | 2008-10-16 |
Family
ID=39830921
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/056142 WO2008123436A1 (en) | 2007-03-30 | 2008-03-28 | Cu-ni-si-co-based copper alloy for electronic material, and method for production thereof |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4937815B2 (en) |
KR (1) | KR101159562B1 (en) |
CN (1) | CN101646791B (en) |
TW (1) | TW200900515A (en) |
WO (1) | WO2008123436A1 (en) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2194151B1 (en) * | 2007-09-28 | 2014-08-13 | JX Nippon Mining & Metals Corporation | Cu-ni-si-co-base copper alloy for electronic material and process for producing the copper alloy |
JP4596490B2 (en) * | 2008-03-31 | 2010-12-08 | Jx日鉱日石金属株式会社 | Cu-Ni-Si-Co-based copper alloy for electronic materials and method for producing the same |
KR101331339B1 (en) * | 2008-12-01 | 2013-11-19 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | Cu-ni-si-co based copper ally for electronic materials and manufacturing method therefor |
JP5261161B2 (en) * | 2008-12-12 | 2013-08-14 | Jx日鉱日石金属株式会社 | Ni-Si-Co-based copper alloy and method for producing the same |
JP4708485B2 (en) | 2009-03-31 | 2011-06-22 | Jx日鉱日石金属株式会社 | Cu-Co-Si based copper alloy for electronic materials and method for producing the same |
JP5578827B2 (en) * | 2009-10-13 | 2014-08-27 | Dowaメタルテック株式会社 | High-strength copper alloy sheet and manufacturing method thereof |
JP4677505B1 (en) | 2010-03-31 | 2011-04-27 | Jx日鉱日石金属株式会社 | Cu-Ni-Si-Co-based copper alloy for electronic materials and method for producing the same |
JP5961335B2 (en) | 2010-04-05 | 2016-08-02 | Dowaメタルテック株式会社 | Copper alloy sheet and electrical / electronic components |
JP4830035B2 (en) | 2010-04-14 | 2011-12-07 | Jx日鉱日石金属株式会社 | Cu-Si-Co alloy for electronic materials and method for producing the same |
JP4672804B1 (en) * | 2010-05-31 | 2011-04-20 | Jx日鉱日石金属株式会社 | Cu-Co-Si based copper alloy for electronic materials and method for producing the same |
JP4708497B1 (en) | 2010-06-03 | 2011-06-22 | Jx日鉱日石金属株式会社 | Cu-Co-Si alloy plate and method for producing the same |
JP4834781B1 (en) | 2010-08-24 | 2011-12-14 | Jx日鉱日石金属株式会社 | Cu-Co-Si alloy for electronic materials |
JP2012072470A (en) | 2010-09-29 | 2012-04-12 | Jx Nippon Mining & Metals Corp | Cu-Co-Si-BASED COPPER ALLOY FOR ELECTRONIC MATERIAL AND METHOD FOR PRODUCING THE SAME |
CN102560191A (en) * | 2010-12-09 | 2012-07-11 | 北京有色金属研究总院 | High-performance elastic copper alloy and preparation and processing method thereof |
JP5441876B2 (en) * | 2010-12-13 | 2014-03-12 | Jx日鉱日石金属株式会社 | Cu-Ni-Si-Co-based copper alloy for electronic materials and method for producing the same |
JP5451674B2 (en) | 2011-03-28 | 2014-03-26 | Jx日鉱日石金属株式会社 | Cu-Si-Co based copper alloy for electronic materials and method for producing the same |
JP4799701B1 (en) * | 2011-03-29 | 2011-10-26 | Jx日鉱日石金属株式会社 | Cu-Co-Si based copper alloy strip for electronic materials and method for producing the same |
JP6039999B2 (en) | 2012-10-31 | 2016-12-07 | Dowaメタルテック株式会社 | Cu-Ni-Co-Si based copper alloy sheet and method for producing the same |
JP5647703B2 (en) | 2013-02-14 | 2015-01-07 | Dowaメタルテック株式会社 | High-strength Cu-Ni-Co-Si-based copper alloy sheet, its manufacturing method, and current-carrying parts |
CN106636734B (en) * | 2015-10-30 | 2019-01-15 | 北京有色金属研究总院 | High-intensitive, highly conductive, high resistance to stress relaxation copper alloy elastic material and preparation method thereof |
CN105316523A (en) * | 2015-12-02 | 2016-02-10 | 苏州龙腾万里化工科技有限公司 | Durable resistance alloy for milling machine regulator |
KR102590060B1 (en) * | 2016-03-31 | 2023-10-18 | 도와 메탈테크 가부시키가이샤 | Cu-Ni-Si based copper alloy sheet and manufacturing method |
CN105908015A (en) * | 2016-05-05 | 2016-08-31 | 太仓小小精密模具有限公司 | Anti-oxidization copper alloy mold material |
CN106399749B (en) * | 2016-10-05 | 2018-01-05 | 宁波兴业盛泰集团有限公司 | A kind of high strength and high flexibility cupro-nickel Si system alloy material and preparation method thereof |
CN106756202A (en) * | 2016-11-23 | 2017-05-31 | 宁波兴业盛泰集团有限公司 | A kind of blaster fuse frame material complicated pluralism Cu alloy material and preparation method thereof |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58123846A (en) * | 1982-01-20 | 1983-07-23 | Nippon Mining Co Ltd | Lead material for semiconductor apparatus |
JPS63143230A (en) * | 1986-12-08 | 1988-06-15 | Nippon Mining Co Ltd | Precipitation strengthening high tensile copper alloy having high electrical conductivity |
JP2006283120A (en) * | 2005-03-31 | 2006-10-19 | Nikko Metal Manufacturing Co Ltd | Cu-Ni-Si-Co-Cr BASED COPPER ALLOY FOR ELECTRONIC MATERIAL, AND ITS PRODUCTION METHOD |
JP2007136467A (en) * | 2005-11-15 | 2007-06-07 | Hitachi Cable Ltd | Cast ingot of copper alloy, method for producing cast ingot of copper alloy, method for producing copper alloy strip and production device for cast ingot of copper alloy |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3699701B2 (en) * | 2002-10-31 | 2005-09-28 | 日鉱金属加工株式会社 | Easy-to-process high-strength, high-conductivity copper alloy |
-
2007
- 2007-03-30 JP JP2007092269A patent/JP4937815B2/en active Active
-
2008
- 2008-03-11 TW TW097108444A patent/TW200900515A/en unknown
- 2008-03-28 CN CN2008800101753A patent/CN101646791B/en active Active
- 2008-03-28 KR KR1020097021841A patent/KR101159562B1/en active IP Right Grant
- 2008-03-28 WO PCT/JP2008/056142 patent/WO2008123436A1/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58123846A (en) * | 1982-01-20 | 1983-07-23 | Nippon Mining Co Ltd | Lead material for semiconductor apparatus |
JPS63143230A (en) * | 1986-12-08 | 1988-06-15 | Nippon Mining Co Ltd | Precipitation strengthening high tensile copper alloy having high electrical conductivity |
JP2006283120A (en) * | 2005-03-31 | 2006-10-19 | Nikko Metal Manufacturing Co Ltd | Cu-Ni-Si-Co-Cr BASED COPPER ALLOY FOR ELECTRONIC MATERIAL, AND ITS PRODUCTION METHOD |
JP2007136467A (en) * | 2005-11-15 | 2007-06-07 | Hitachi Cable Ltd | Cast ingot of copper alloy, method for producing cast ingot of copper alloy, method for producing copper alloy strip and production device for cast ingot of copper alloy |
Also Published As
Publication number | Publication date |
---|---|
TWI367952B (en) | 2012-07-11 |
CN101646791A (en) | 2010-02-10 |
CN101646791B (en) | 2011-11-16 |
KR101159562B1 (en) | 2012-06-26 |
TW200900515A (en) | 2009-01-01 |
JP4937815B2 (en) | 2012-05-23 |
KR20090122303A (en) | 2009-11-26 |
JP2008248333A (en) | 2008-10-16 |
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