CN101020231B - Short flow high efficiency preparing process of pure copper and copper alloy belt - Google Patents
Short flow high efficiency preparing process of pure copper and copper alloy belt Download PDFInfo
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- CN101020231B CN101020231B CN200710064884A CN200710064884A CN101020231B CN 101020231 B CN101020231 B CN 101020231B CN 200710064884 A CN200710064884 A CN 200710064884A CN 200710064884 A CN200710064884 A CN 200710064884A CN 101020231 B CN101020231 B CN 101020231B
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Abstract
The short flow and high efficiency preparing process of pure copper and copper alloy belt belongs to the field of belt material preparing technology. The technological process includes the following steps: melting pure copper or copper alloy material at 1100-1350 deg.c, and continuous directional solidification in the blank pulling speed of 1-200 mm/min, cooling water amount of 100-1700 l/hr, cooling water temperature of 15-35 deg.c and vacuum of 0.1-2 Pa, to produce 1-600 mm wide and 1-25 mm thick belt. The continuous directional solidification may be in down pull mode, horizontal mode or updrawing mode. If necessary, the belt may be further cold rolled to below 50 micron thickness without need of intermediate annealing. The belt product with longitudinal crystal structure has high working plasticity, and excellent mechanical and physical performance.
Description
Technical field
The invention belongs to the band preparing technical field, the short process making method of a kind of fine copper and copper alloy band particularly is provided.
Background technology
In recent years, breakthrough along with semiconductor technology, integrated circuit technique and electronic component quality, electronic equipment is more and more to precise treatment, miniaturization and high performance development, requirement to materials such as Copper Foil, monocrystalline targets improves [Fan Xinhui day by day, Yan Wen. the progress and the application prospect thereof of high-fidelity single-crystal metal wire rod. the Arms Material scientific and engineering, 2000,23 (1): 62～65].Mainly show the following aspects: 1. the ic substrate material wishes to adopt the flawless advanced material as thin as a wafer of no crystal boundary; 2. based on the information processing technology of high-caliber electronic computer, require the high speed of information processing, the miniaturization of memory capacity super largeization and device volume, these development trends require the Copper Foil on base material-copper coated foil plate surface of PCB not only to have ultra-thin thickness and high cleanliness, and low resistivity will be arranged; 3. more and more higher to interconnecting devices with the requirement of high-end products such as band, banded cable, transformer copper strips and oxygen-free copper stripe.Show according to the customs statistics data, China's copper coin band import volume is above 270,000 tons in recent years, and the speed with annual 12%～20% increases, reached 1/3rd of domestic consumption amount, the product of import mainly be above-mentioned several high-end copper coin band [Wang Jun. Chinese copper coin band market profile is analyzed. China Metal Bulletin, 2005, (14): 17～18].
The problem that copper and copper alloy band traditional preparation process processing technology exist has: easily air-breathing and oxidation during melting, the blank of producing easily produces segregation and defective such as loose, in following process (rolling, forging and pressing etc.), need surperficial peeling, repeatedly anneal, operation such as cleaning, and needs that lumber recovery is low, product quality and performances (as electric conductivity) are difficult to satisfy high-end user (electronics, communication).The continuous directional solidification technology [big wild sincere U.S.. heated mold can be reported with continuous casting process O.C.C.. Japan metallography, 1984,23 (9): 773～775] be directional solidification technique and continuous casting technology to be combined and a kind of near end form that grows up, the material preparation technology of short flow process, overcome traditional directional freeze method ingot casting limited length, be prone to equiax crystal at the ingot casting top, and the thick shortcoming of crystal grain.The continuous directional solidification technology is that the cooling casting mold with traditional continuous casting changes heated mold into, in the frozen metal and do not set up between solidified melt along the high-temperature gradient of throwing direction, make it possess the directional solidification condition, thereby obtain to have the column crystal of unidirectional solidification or the product of single crystal organization.This technology comprises pull-down, horizontal or top-guiding type.Utilize this technology can obtain the good nearly end form goods of surface quality, and increase substantially the plastic deformation ability of material.Owing to have continuous columnar or single crystal organization, can reduce resistivity, improve the fidelity characteristic of signal transmission, satisfy electronics and communication field needs [Xie Jianxin, etc. materials processing new technology and new technology. Beijing: metallurgical industry publishing house, 2004].
Summary of the invention
The object of the present invention is to provide the short process making method of a kind of fine copper and copper alloy band, conventional fine copper and copper alloy band production method complex process have been solved, product quality and performance are difficult to satisfy problems such as instructions for use, and the short flow high efficiency of developing a kind of fine copper and copper alloy band prepares processing method.This method technology is simple, and flow process is short, can prepare wide 1～600mm, the band of thick 1～25mm, and need not any intermediate annealing and can directly be cold-rolled to below the 50 μ m thickness with heavy reduction.Band has continuous columnar or single crystal organization.
The present invention adopt the continuous directional solidification method prepare along its length continuous columnar or the fine copper and the copper alloy made-up belt of single crystal organization, and need not operations such as any intermediate annealing, can be cold-rolled to below the 50 μ m.Technology is: fine copper or copper alloy raw material are melted down at 1100～1350 ℃, and the continuous directional solidification casting speed is 1～200mm/min, and cooling water inflow is 100～1700L/h, 15～35 ℃ of cooling water temperatures, vacuum is 0.1～2Pa, makes wide 1～600mm, the made-up belt of thick 1～25mm.The continuous directional solidification method can be pull-down, horizontal or top-guiding type.Can adopt 10%～30% percentage pass reduction as required, be cold-rolled to below the 50 μ m, need not operations such as intermediate annealing.
The invention has the advantages that:
1. adopt the continuous directional solidification legal system to be equipped with fine copper and copper alloy made-up belt, its interior tissue is along band length direction continuous columnar or single crystal organization, thereby have the better plastic deformation ability of common polycrystalline copper strips than same size and mechanics and a physical property.
2. fine copper and the copper alloy made-up belt prepared of continuous directional solidification can be as required, and it is cold rolling to carry out heavy reduction rate, need not to carry out operations such as intermediate annealing, process the following band of 50 μ m thickness, simplified technology greatly, reduce production cost, improved product quality.
3. adopt the continuous directional solidification legal system to be equipped with fine copper and copper alloy made-up belt, its casting speed maximum can reach 200mm/min, is fit to industrial production in batches.
The specific embodiment
Embodiment: width is that 25mm, thickness are the fine copper sheet material of 5mm.Adopting copper content is that 99.9% oxygen-free copper is raw material.At first copper is melted down at 1160 ℃, cooling water inflow is 1700L/h, and 30 ℃ of cooling water temperatures when vacuum is 1Pa, adopt the pull-down continuous directional solidification apparatus, with the velocity pull-down of 90mm/min, draw out the fine copper sheet material of wide 25mm, thick 5mm.Prepared plate surface light, interior tissue are continuous columnar, and the diameter of column crystal is 1～4mm.Adopt 10%～30% percentage pass reduction subsequently, need not intermediate annealing, be rolling to the thick band of 50 μ m through multi-pass, in the operation of rolling no wooden dipper song, limit split, phenomenon such as broken belt, product surface light, inner zero defect.
Claims (2)
1. the short process making method of fine copper and copper alloy band, it is characterized in that, technology is: fine copper or copper alloy raw material are melted down at 1100～1350 ℃, the continuous directional solidification casting speed is 1～200mm/min, cooling water inflow is 100～1700L/h, 15～35 ℃ of cooling water temperatures, and vacuum is 0.1～2Pa, make wide 1～600mm, the band of thick 1～25mm;
Adopt 10%～30% percentage pass reduction, be cold-rolled to below the 50 μ m, need not the intermediate annealing operation.
2. in accordance with the method for claim 1, it is characterized in that the continuous directional solidification method is pull-down, horizontal or top-guiding type.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710064884A CN101020231B (en) | 2007-03-28 | 2007-03-28 | Short flow high efficiency preparing process of pure copper and copper alloy belt |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710064884A CN101020231B (en) | 2007-03-28 | 2007-03-28 | Short flow high efficiency preparing process of pure copper and copper alloy belt |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101020231A CN101020231A (en) | 2007-08-22 |
| CN101020231B true CN101020231B (en) | 2010-05-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN200710064884A Active CN101020231B (en) | 2007-03-28 | 2007-03-28 | Short flow high efficiency preparing process of pure copper and copper alloy belt |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090286083A1 (en) * | 2008-05-13 | 2009-11-19 | Hitachi Cable, Ltd. | Copper wire for a magnet wire, magnet wire using same, and method for fabricating copper wire for a magnet wire |
| JP6749421B2 (en) * | 2017-01-10 | 2020-09-02 | 京セラ株式会社 | Mounting member for heat treatment |
| CN107460536A (en) * | 2017-08-24 | 2017-12-12 | 武陟吉铨特种金属材料有限公司 | A kind of method of heat type molding V-type continuously casting single crystal Cu |
| CN112195422B (en) * | 2020-09-11 | 2021-12-17 | 中铝材料应用研究院有限公司 | Preparation method of single-crystal-like pure copper |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1743679A (en) * | 2004-08-30 | 2006-03-08 | 株式会社东芝 | Fluid pump for cooling |
| CN1792500A (en) * | 2006-01-06 | 2006-06-28 | 北京科技大学 | Continuous directional solidifying method for preparing binary aluminium bronze wire |
-
2007
- 2007-03-28 CN CN200710064884A patent/CN101020231B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1743679A (en) * | 2004-08-30 | 2006-03-08 | 株式会社东芝 | Fluid pump for cooling |
| CN1792500A (en) * | 2006-01-06 | 2006-06-28 | 北京科技大学 | Continuous directional solidifying method for preparing binary aluminium bronze wire |
Non-Patent Citations (4)
| Title |
|---|
| 王自东等.连续定向凝固过程铜铬合金的组织与缺陷.北京科技大学学报22 6.2000,4(6),全文. |
| 王自东等.连续定向凝固过程铜铬合金的组织与缺陷.北京科技大学学报22 6.2000,4(6),全文. * |
| 许广济等.定向凝固制备CuAlNi形状记忆合金的研究.特种铸造及有色合金4 25.2005,4(6),全文. |
| 许广济等.定向凝固制备CuAlNi形状记忆合金的研究.特种铸造及有色合金4 25.2005,4(6),全文. * |
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| CN101020231A (en) | 2007-08-22 |
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Assignee: Heze Guangyuan Copper Strip Co.,Ltd. Assignor: University of Science and Technology Beijing Contract record no.: 2011370000497 Denomination of invention: Short flow high efficiency preparing process of pure copper and copper alloy belt Granted publication date: 20100519 License type: Exclusive License Open date: 20070822 Record date: 20111123 |
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Assignee: Heze Guangyuan Copper Strip Co.,Ltd. Assignor: University of Science and Technology Beijing Contract record no.: 2011370000497 Date of cancellation: 20150427 |
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