WO2008123455A1 - Copper alloy material, and method for production thereof - Google Patents
Copper alloy material, and method for production thereof Download PDFInfo
- Publication number
- WO2008123455A1 WO2008123455A1 PCT/JP2008/056196 JP2008056196W WO2008123455A1 WO 2008123455 A1 WO2008123455 A1 WO 2008123455A1 JP 2008056196 W JP2008056196 W JP 2008056196W WO 2008123455 A1 WO2008123455 A1 WO 2008123455A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- alloy material
- copper alloy
- production
- mass
- yield strength
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
Abstract
Disclosed is a copper alloy material comprising 0.1 to 4 mass% of an element X [wherein the element X represents at least one transition element selected from Ni, Fe, Co and Cr] and 0.01 to 3 mass% of an element Y [wherein the element Y represents at least one element selected from Ti, Si, Zr and Hf], with the remainder being copper and unavoidable impurities. The copper alloy material has an electrical conductivity of 50% IACS or more, an yield strength of 600 MPa or more, and a stress relaxation rate of 20% or less as measured after the copper alloy material is maintained for 1000 hours while applying a stress of 80% of the yield strength.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08739314A EP2157199A4 (en) | 2007-03-28 | 2008-03-28 | Copper alloy material, and method for production thereof |
CN2008800181847A CN101680056B (en) | 2007-03-28 | 2008-03-28 | Copper alloy material, and method for production thereof |
US12/593,402 US20100170595A1 (en) | 2007-03-28 | 2008-03-28 | Copper alloy material, and method for production thereof |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007086026 | 2007-03-28 | ||
JP2007-086026 | 2007-03-28 | ||
JP2008085013A JP2008266787A (en) | 2007-03-28 | 2008-03-27 | Copper alloy material and its manufacturing method |
JP2008-085013 | 2008-03-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008123455A1 true WO2008123455A1 (en) | 2008-10-16 |
Family
ID=39830940
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/056196 WO2008123455A1 (en) | 2007-03-28 | 2008-03-28 | Copper alloy material, and method for production thereof |
Country Status (5)
Country | Link |
---|---|
US (1) | US20100170595A1 (en) |
EP (1) | EP2157199A4 (en) |
JP (1) | JP2008266787A (en) |
CN (1) | CN101680056B (en) |
WO (1) | WO2008123455A1 (en) |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2006265731A (en) * | 2005-02-28 | 2006-10-05 | Furukawa Electric Co Ltd:The | Copper alloy |
JP2006274445A (en) * | 2005-03-02 | 2006-10-12 | Furukawa Electric Co Ltd:The | Copper alloy and method for production thereof |
JP2006336068A (en) * | 2005-06-01 | 2006-12-14 | Furukawa Electric Co Ltd:The | Copper alloy for electrical and electronic devices |
JP2006342389A (en) * | 2005-06-08 | 2006-12-21 | Kobe Steel Ltd | Copper alloy sheet for electrical connection part |
JP2007016304A (en) * | 2005-06-10 | 2007-01-25 | Dowa Holdings Co Ltd | Cu-NI-SI-ZN-BASE ALLOY |
Family Cites Families (3)
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CN1177946C (en) * | 2001-09-07 | 2004-12-01 | 同和矿业株式会社 | Copper alloy for connector use and producing method thereof |
WO2005118896A1 (en) * | 2004-06-02 | 2005-12-15 | The Furukawa Electric Co., Ltd. | Copper alloy for electrical and electronic devices |
JP4441467B2 (en) * | 2004-12-24 | 2010-03-31 | 株式会社神戸製鋼所 | Copper alloy with bending workability and stress relaxation resistance |
-
2008
- 2008-03-27 JP JP2008085013A patent/JP2008266787A/en active Pending
- 2008-03-28 CN CN2008800181847A patent/CN101680056B/en active Active
- 2008-03-28 WO PCT/JP2008/056196 patent/WO2008123455A1/en active Application Filing
- 2008-03-28 US US12/593,402 patent/US20100170595A1/en not_active Abandoned
- 2008-03-28 EP EP08739314A patent/EP2157199A4/en not_active Withdrawn
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006265731A (en) * | 2005-02-28 | 2006-10-05 | Furukawa Electric Co Ltd:The | Copper alloy |
JP2006274445A (en) * | 2005-03-02 | 2006-10-12 | Furukawa Electric Co Ltd:The | Copper alloy and method for production thereof |
JP2006336068A (en) * | 2005-06-01 | 2006-12-14 | Furukawa Electric Co Ltd:The | Copper alloy for electrical and electronic devices |
JP2006342389A (en) * | 2005-06-08 | 2006-12-21 | Kobe Steel Ltd | Copper alloy sheet for electrical connection part |
JP2007016304A (en) * | 2005-06-10 | 2007-01-25 | Dowa Holdings Co Ltd | Cu-NI-SI-ZN-BASE ALLOY |
Non-Patent Citations (1)
Title |
---|
See also references of EP2157199A4 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011038151A (en) * | 2009-08-12 | 2011-02-24 | Furukawa Electric Co Ltd:The | Copper alloy material and manufacturing method therefor |
JP2016020543A (en) * | 2011-03-29 | 2016-02-04 | 株式会社神戸製鋼所 | Copper alloy material for electronic and electric component |
Also Published As
Publication number | Publication date |
---|---|
CN101680056A (en) | 2010-03-24 |
JP2008266787A (en) | 2008-11-06 |
CN101680056B (en) | 2013-01-09 |
US20100170595A1 (en) | 2010-07-08 |
EP2157199A4 (en) | 2012-06-27 |
EP2157199A1 (en) | 2010-02-24 |
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