WO2008123455A1 - Copper alloy material, and method for production thereof - Google Patents

Copper alloy material, and method for production thereof Download PDF

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Publication number
WO2008123455A1
WO2008123455A1 PCT/JP2008/056196 JP2008056196W WO2008123455A1 WO 2008123455 A1 WO2008123455 A1 WO 2008123455A1 JP 2008056196 W JP2008056196 W JP 2008056196W WO 2008123455 A1 WO2008123455 A1 WO 2008123455A1
Authority
WO
WIPO (PCT)
Prior art keywords
alloy material
copper alloy
production
mass
yield strength
Prior art date
Application number
PCT/JP2008/056196
Other languages
French (fr)
Japanese (ja)
Inventor
Hiroshi Kaneko
Kuniteru Mihara
Tatsuhiko Eguchi
Original Assignee
The Furukawa Electric Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by The Furukawa Electric Co., Ltd. filed Critical The Furukawa Electric Co., Ltd.
Priority to EP08739314A priority Critical patent/EP2157199A4/en
Priority to US12/593,402 priority patent/US20100170595A1/en
Priority to CN2008800181847A priority patent/CN101680056B/en
Publication of WO2008123455A1 publication Critical patent/WO2008123455A1/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/06Alloys based on copper with nickel or cobalt as the next major constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)

Abstract

Disclosed is a copper alloy material comprising 0.1 to 4 mass% of an element X [wherein the element X represents at least one transition element selected from Ni, Fe, Co and Cr] and 0.01 to 3 mass% of an element Y [wherein the element Y represents at least one element selected from Ti, Si, Zr and Hf], with the remainder being copper and unavoidable impurities. The copper alloy material has an electrical conductivity of 50% IACS or more, an yield strength of 600 MPa or more, and a stress relaxation rate of 20% or less as measured after the copper alloy material is maintained for 1000 hours while applying a stress of 80% of the yield strength.
PCT/JP2008/056196 2007-03-28 2008-03-28 Copper alloy material, and method for production thereof WO2008123455A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP08739314A EP2157199A4 (en) 2007-03-28 2008-03-28 Copper alloy material, and method for production thereof
US12/593,402 US20100170595A1 (en) 2007-03-28 2008-03-28 Copper alloy material, and method for production thereof
CN2008800181847A CN101680056B (en) 2007-03-28 2008-03-28 Copper alloy material, and method for production thereof

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-086026 2007-03-28
JP2007086026 2007-03-28
JP2008085013A JP2008266787A (en) 2007-03-28 2008-03-27 Copper alloy material and its manufacturing method
JP2008-085013 2008-03-27

Publications (1)

Publication Number Publication Date
WO2008123455A1 true WO2008123455A1 (en) 2008-10-16

Family

ID=39830940

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/056196 WO2008123455A1 (en) 2007-03-28 2008-03-28 Copper alloy material, and method for production thereof

Country Status (5)

Country Link
US (1) US20100170595A1 (en)
EP (1) EP2157199A4 (en)
JP (1) JP2008266787A (en)
CN (1) CN101680056B (en)
WO (1) WO2008123455A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011038151A (en) * 2009-08-12 2011-02-24 Furukawa Electric Co Ltd:The Copper alloy material and manufacturing method therefor
JP2016020543A (en) * 2011-03-29 2016-02-04 株式会社神戸製鋼所 Copper alloy material for electronic and electric component

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JP2011017070A (en) * 2009-07-10 2011-01-27 Furukawa Electric Co Ltd:The Copper alloy material for electric and electronic component
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JP2006274445A (en) * 2005-03-02 2006-10-12 Furukawa Electric Co Ltd:The Copper alloy and method for production thereof
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WO2005118896A1 (en) * 2004-06-02 2005-12-15 The Furukawa Electric Co., Ltd. Copper alloy for electrical and electronic devices
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JP2006265731A (en) * 2005-02-28 2006-10-05 Furukawa Electric Co Ltd:The Copper alloy
JP2006274445A (en) * 2005-03-02 2006-10-12 Furukawa Electric Co Ltd:The Copper alloy and method for production thereof
JP2006336068A (en) * 2005-06-01 2006-12-14 Furukawa Electric Co Ltd:The Copper alloy for electrical and electronic devices
JP2006342389A (en) * 2005-06-08 2006-12-21 Kobe Steel Ltd Copper alloy sheet for electrical connection part
JP2007016304A (en) * 2005-06-10 2007-01-25 Dowa Holdings Co Ltd Cu-NI-SI-ZN-BASE ALLOY

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011038151A (en) * 2009-08-12 2011-02-24 Furukawa Electric Co Ltd:The Copper alloy material and manufacturing method therefor
JP2016020543A (en) * 2011-03-29 2016-02-04 株式会社神戸製鋼所 Copper alloy material for electronic and electric component

Also Published As

Publication number Publication date
US20100170595A1 (en) 2010-07-08
CN101680056A (en) 2010-03-24
EP2157199A4 (en) 2012-06-27
JP2008266787A (en) 2008-11-06
EP2157199A1 (en) 2010-02-24
CN101680056B (en) 2013-01-09

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