TWI367952B - - Google Patents

Info

Publication number
TWI367952B
TWI367952B TW097108444A TW97108444A TWI367952B TW I367952 B TWI367952 B TW I367952B TW 097108444 A TW097108444 A TW 097108444A TW 97108444 A TW97108444 A TW 97108444A TW I367952 B TWI367952 B TW I367952B
Authority
TW
Taiwan
Application number
TW097108444A
Other languages
Chinese (zh)
Other versions
TW200900515A (en
Inventor
Hiroshi Kuwagaki
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of TW200900515A publication Critical patent/TW200900515A/en
Application granted granted Critical
Publication of TWI367952B publication Critical patent/TWI367952B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/02—Single bars, rods, wires, or strips
TW097108444A 2007-03-30 2008-03-11 Cu-Ni-Si-Co-based copper alloy for electronic material, and method for production thereof TW200900515A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007092269A JP4937815B2 (en) 2007-03-30 2007-03-30 Cu-Ni-Si-Co-based copper alloy for electronic materials and method for producing the same

Publications (2)

Publication Number Publication Date
TW200900515A TW200900515A (en) 2009-01-01
TWI367952B true TWI367952B (en) 2012-07-11

Family

ID=39830921

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097108444A TW200900515A (en) 2007-03-30 2008-03-11 Cu-Ni-Si-Co-based copper alloy for electronic material, and method for production thereof

Country Status (5)

Country Link
JP (1) JP4937815B2 (en)
KR (1) KR101159562B1 (en)
CN (1) CN101646791B (en)
TW (1) TW200900515A (en)
WO (1) WO2008123436A1 (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101161597B1 (en) * 2007-09-28 2012-07-03 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 Cu-ni-si-co-base copper alloy for electronic material and process for producing the copper alloy
JP4596490B2 (en) * 2008-03-31 2010-12-08 Ｊｘ日鉱日石金属株式会社 Cu-Ni-Si-Co-based copper alloy for electronic materials and method for producing the same
JP5319700B2 (en) * 2008-12-01 2013-10-16 Ｊｘ日鉱日石金属株式会社 Cu-Ni-Si-Co-based copper alloy for electronic materials and method for producing the same
JP5261161B2 (en) * 2008-12-12 2013-08-14 Ｊｘ日鉱日石金属株式会社 Ni-Si-Co-based copper alloy and method for producing the same
JP4708485B2 (en) * 2009-03-31 2011-06-22 Ｊｘ日鉱日石金属株式会社 Cu-Co-Si based copper alloy for electronic materials and method for producing the same
JP5578827B2 (en) * 2009-10-13 2014-08-27 Ｄｏｗａメタルテック株式会社 High-strength copper alloy sheet and manufacturing method thereof
JP4677505B1 (en) * 2010-03-31 2011-04-27 Ｊｘ日鉱日石金属株式会社 Cu-Ni-Si-Co-based copper alloy for electronic materials and method for producing the same
JP5961335B2 (en) 2010-04-05 2016-08-02 Ｄｏｗａメタルテック株式会社 Copper alloy sheet and electrical / electronic components
JP4830035B2 (en) 2010-04-14 2011-12-07 Ｊｘ日鉱日石金属株式会社 Cu-Si-Co alloy for electronic materials and method for producing the same
JP4672804B1 (en) * 2010-05-31 2011-04-20 Ｊｘ日鉱日石金属株式会社 Cu-Co-Si based copper alloy for electronic materials and method for producing the same
JP4708497B1 (en) 2010-06-03 2011-06-22 Ｊｘ日鉱日石金属株式会社 Cu-Co-Si alloy plate and method for producing the same
JP4834781B1 (en) 2010-08-24 2011-12-14 Ｊｘ日鉱日石金属株式会社 Cu-Co-Si alloy for electronic materials
JP2012072470A (en) 2010-09-29 2012-04-12 Jx Nippon Mining & Metals Corp Cu-Co-Si-BASED COPPER ALLOY FOR ELECTRONIC MATERIAL AND METHOD FOR PRODUCING THE SAME
CN102560191A (en) * 2010-12-09 2012-07-11 北京有色金属研究总院 High-performance elastic copper alloy and preparation and processing method thereof
JP5441876B2 (en) * 2010-12-13 2014-03-12 Ｊｘ日鉱日石金属株式会社 Cu-Ni-Si-Co-based copper alloy for electronic materials and method for producing the same
JP5451674B2 (en) 2011-03-28 2014-03-26 Ｊｘ日鉱日石金属株式会社 Cu-Si-Co based copper alloy for electronic materials and method for producing the same
JP4799701B1 (en) * 2011-03-29 2011-10-26 Ｊｘ日鉱日石金属株式会社 Cu-Co-Si based copper alloy strip for electronic materials and method for producing the same
JP6039999B2 (en) 2012-10-31 2016-12-07 Ｄｏｗａメタルテック株式会社 Cu-Ni-Co-Si based copper alloy sheet and method for producing the same
JP5647703B2 (en) 2013-02-14 2015-01-07 Ｄｏｗａメタルテック株式会社 High-strength Cu-Ni-Co-Si-based copper alloy sheet, its manufacturing method, and current-carrying parts
CN106636734B (en) * 2015-10-30 2019-01-15 北京有色金属研究总院 High-intensitive, highly conductive, high resistance to stress relaxation copper alloy elastic material and preparation method thereof
CN105316523A (en) * 2015-12-02 2016-02-10 苏州龙腾万里化工科技有限公司 Durable resistance alloy for milling machine regulator
CN109072341B (en) * 2016-03-31 2021-07-27 同和金属技术有限公司 Cu-Ni-Si-based copper alloy sheet material and method for producing same
CN105908015A (en) * 2016-05-05 2016-08-31 太仓小小精密模具有限公司 Anti-oxidization copper alloy mold material
CN106399749B (en) * 2016-10-05 2018-01-05 宁波兴业盛泰集团有限公司 A kind of high strength and high flexibility cupro-nickel Si system alloy material and preparation method thereof
CN106756202A (en) * 2016-11-23 2017-05-31 宁波兴业盛泰集团有限公司 A kind of blaster fuse frame material complicated pluralism Cu alloy material and preparation method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6045698B2 (en) * 1982-01-20 1985-10-11 日本鉱業株式会社 Lead material for semiconductor equipment
JPS63143230A (en) * 1986-12-08 1988-06-15 Nippon Mining Co Ltd Precipitation strengthening high tensile copper alloy having high electrical conductivity
JP3699701B2 (en) * 2002-10-31 2005-09-28 日鉱金属加工株式会社 Easy-to-process high-strength, high-conductivity copper alloy
JP4068626B2 (en) * 2005-03-31 2008-03-26 日鉱金属株式会社 Cu-Ni-Si-Co-Cr-based copper alloy for electronic materials and method for producing the same
JP2007136467A (en) * 2005-11-15 2007-06-07 Hitachi Cable Ltd Cast ingot of copper alloy, method for producing cast ingot of copper alloy, method for producing copper alloy strip and production device for cast ingot of copper alloy

Also Published As

Publication number Publication date
CN101646791A (en) 2010-02-10
WO2008123436A1 (en) 2008-10-16
TW200900515A (en) 2009-01-01
KR101159562B1 (en) 2012-06-26
CN101646791B (en) 2011-11-16
KR20090122303A (en) 2009-11-26
JP2008248333A (en) 2008-10-16
JP4937815B2 (en) 2012-05-23

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