WO2008123288A1 - トラップ装置、排気系及びこれを用いた処理システム - Google Patents

トラップ装置、排気系及びこれを用いた処理システム Download PDF

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Publication number
WO2008123288A1
WO2008123288A1 PCT/JP2008/055678 JP2008055678W WO2008123288A1 WO 2008123288 A1 WO2008123288 A1 WO 2008123288A1 JP 2008055678 W JP2008055678 W JP 2008055678W WO 2008123288 A1 WO2008123288 A1 WO 2008123288A1
Authority
WO
WIPO (PCT)
Prior art keywords
trap
exhaust
coolant
casing
treating
Prior art date
Application number
PCT/JP2008/055678
Other languages
English (en)
French (fr)
Inventor
Ryoji Yamazaki
Original Assignee
Tokyo Electron Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Limited filed Critical Tokyo Electron Limited
Priority to CN2008800111331A priority Critical patent/CN101652834B/zh
Priority to KR1020097020418A priority patent/KR101290051B1/ko
Publication of WO2008123288A1 publication Critical patent/WO2008123288A1/ja
Priority to US12/569,935 priority patent/US20100012292A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/34—Chemical or biological purification of waste gases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2258/00—Sources of waste gases
    • B01D2258/02—Other waste gases
    • B01D2258/0216—Other waste gases from CVD treatment or semi-conductor manufacturing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biomedical Technology (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Environmental & Geological Engineering (AREA)
  • Chemical Vapour Deposition (AREA)
  • Treating Waste Gases (AREA)
  • Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)

Abstract

　被処理体Ｗに対して処理を行う処理室１０からの排気ガスを排出する排気路２２に設けられて排気ガス中から排気物を捕捉するためのトラップ装置において、トラップ要素に捕捉された排気物を効率よく除去してトラップ要素を再生することができる技術が提供される。トラップ装置は、排気路に介設される筐体４２と、筐体内に設けられて排気物を捕捉するトラップ要素４８と、トラップ要素を加熱するトラップ加熱装置５４と、筐体内へ冷媒を導入する冷媒導入装置６０と、筐体から冷媒を排出するための冷媒排出部６２と、トラップ要素で捕捉した排気物を除去するためにトラップ加熱装置によりトラップ要素を加熱した状態で冷媒導入装置より前記冷媒を筐体内に導入するように制御する制御部８８とを備えている。
PCT/JP2008/055678 2007-03-31 2008-03-26 トラップ装置、排気系及びこれを用いた処理システム WO2008123288A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2008800111331A CN101652834B (zh) 2007-03-31 2008-03-26 捕集装置、排气系统以及采用该排气系统的处理系统
KR1020097020418A KR101290051B1 (ko) 2007-03-31 2008-03-26 트랩 장치, 배기계 및 이것을 이용한 처리 시스템
US12/569,935 US20100012292A1 (en) 2007-03-31 2009-09-30 Trap apparatus, exhaust system and processing system using same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007095823A JP5135856B2 (ja) 2007-03-31 2007-03-31 トラップ装置、排気系及びこれを用いた処理システム
JP2007-095823 2007-03-31

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/569,935 Continuation US20100012292A1 (en) 2007-03-31 2009-09-30 Trap apparatus, exhaust system and processing system using same

Publications (1)

Publication Number Publication Date
WO2008123288A1 true WO2008123288A1 (ja) 2008-10-16

Family

ID=39830776

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055678 WO2008123288A1 (ja) 2007-03-31 2008-03-26 トラップ装置、排気系及びこれを用いた処理システム

Country Status (5)

Country Link
US (1) US20100012292A1 (ja)
JP (1) JP5135856B2 (ja)
KR (1) KR101290051B1 (ja)
CN (1) CN101652834B (ja)
WO (1) WO2008123288A1 (ja)

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JP5254279B2 (ja) * 2010-06-29 2013-08-07 東京エレクトロン株式会社 トラップ装置及び基板処理装置
EP2586890A1 (fr) * 2011-10-28 2013-05-01 Adixen Vacuum Products Canalisation d'évacuation de gaz et procédé d'évacuation associé
CN103094159B (zh) * 2011-10-31 2016-02-24 细美事有限公司 基板处理设备及基板处理方法
JP5921168B2 (ja) * 2011-11-29 2016-05-24 株式会社日立国際電気 基板処理装置
US10471479B2 (en) * 2012-12-28 2019-11-12 SCREEN Holdings Co., Ltd. Treatment device and exhaust switching device therefor, and exhaust switching unit and switching valve box
US9490149B2 (en) * 2013-07-03 2016-11-08 Lam Research Corporation Chemical deposition apparatus having conductance control
JP6150716B2 (ja) * 2013-12-02 2017-06-21 住友重機械工業株式会社 コールドトラップ
JP6607795B2 (ja) * 2016-01-25 2019-11-20 東京エレクトロン株式会社 基板処理装置
JP6628653B2 (ja) * 2016-03-17 2020-01-15 東京エレクトロン株式会社 トラップ装置及びこれを用いた排気系、並びに基板処理装置
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CN111095524B (zh) 2017-09-12 2023-10-03 应用材料公司 用于使用保护阻挡物层制造半导体结构的设备和方法
US10643867B2 (en) 2017-11-03 2020-05-05 Applied Materials, Inc. Annealing system and method
KR102396319B1 (ko) 2017-11-11 2022-05-09 마이크로머티어리얼즈 엘엘씨 고압 프로세싱 챔버를 위한 가스 전달 시스템
CN111373519B (zh) 2017-11-16 2021-11-23 应用材料公司 高压蒸气退火处理设备
KR20200075892A (ko) 2017-11-17 2020-06-26 어플라이드 머티어리얼스, 인코포레이티드 고압 처리 시스템을 위한 컨덴서 시스템
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JP2019145752A (ja) * 2018-02-23 2019-08-29 株式会社荏原製作所 オイリーシランの処理装置および方法
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CN112996950B (zh) 2018-11-16 2024-04-05 应用材料公司 使用增强扩散工艺的膜沉积
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JPS58106186A (ja) * 1981-12-18 1983-06-24 Hitachi Ltd トラツプ装置
JPH07331446A (ja) * 1994-06-03 1995-12-19 Sumitomo Metal Mining Co Ltd プラズマｃｖｄ装置
JP2001044185A (ja) * 1999-07-27 2001-02-16 Tokyo Electron Ltd 処理装置の排気システム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI735075B (zh) * 2019-08-21 2021-08-01 南韓商未來寶股份有限公司 半導體製程用流路方向轉換式反應副產物收集裝置

Also Published As

Publication number Publication date
CN101652834A (zh) 2010-02-17
US20100012292A1 (en) 2010-01-21
KR101290051B1 (ko) 2013-07-30
JP2008253879A (ja) 2008-10-23
KR20090125262A (ko) 2009-12-04
JP5135856B2 (ja) 2013-02-06
CN101652834B (zh) 2012-07-04

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