WO2008123147A1 - 金属製部材の溶接部の表面処理方法 - Google Patents

金属製部材の溶接部の表面処理方法 Download PDF

Info

Publication number
WO2008123147A1
WO2008123147A1 PCT/JP2008/055297 JP2008055297W WO2008123147A1 WO 2008123147 A1 WO2008123147 A1 WO 2008123147A1 JP 2008055297 W JP2008055297 W JP 2008055297W WO 2008123147 A1 WO2008123147 A1 WO 2008123147A1
Authority
WO
WIPO (PCT)
Prior art keywords
weld
metal member
mpa
treating surface
treating
Prior art date
Application number
PCT/JP2008/055297
Other languages
English (en)
French (fr)
Inventor
Sakae Inayoshi
Fumiaki Ishigure
Katsunobu Ishizawa
Takeru Nomura
Original Assignee
Ulvac, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac, Inc. filed Critical Ulvac, Inc.
Priority to KR20097017386A priority Critical patent/KR101489977B1/ko
Publication of WO2008123147A1 publication Critical patent/WO2008123147A1/ja

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23GCLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • C23G1/08Iron or steel
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24CABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00Brightening metals by chemical means
    • C23F3/04Heavy metals
    • C23F3/06Heavy metals with acidic solutions
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23GCLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • C23G1/08Iron or steel
    • C23G1/083Iron or steel solutions containing H3PO4
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25FPROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F1/00Electrolytic cleaning, degreasing, pickling or descaling
    • C25F1/02Pickling; Descaling
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25FPROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F1/00Electrolytic cleaning, degreasing, pickling or descaling
    • C25F1/02Pickling; Descaling
    • C25F1/04Pickling; Descaling in solution
    • C25F1/06Iron or steel
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25FPROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00Electrolytic etching or polishing
    • C25F3/16Polishing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Arc Welding In General (AREA)

Abstract

 真空雰囲気下において不要ガスの発生原因となる溶接焼け部を、効率よく安全に行うことが可能な金属製部材の溶接部の表面処理方法を提供するために 金属製部材の溶接部に、研削粒を含有した溶液を1MPa~15Mpaの圧力で吹き付け、電解研磨、電解酸洗、燐酸による酸洗浄又は化学研磨を行うことを特徴とする。
PCT/JP2008/055297 2007-03-23 2008-03-21 金属製部材の溶接部の表面処理方法 WO2008123147A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR20097017386A KR101489977B1 (ko) 2007-03-23 2008-03-21 금속제 부재의 용접부의 표면처리방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007075710A JP5072398B2 (ja) 2007-03-23 2007-03-23 金属製部材の溶接部の表面処理方法
JP2007-075710 2007-03-23

Publications (1)

Publication Number Publication Date
WO2008123147A1 true WO2008123147A1 (ja) 2008-10-16

Family

ID=39830644

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055297 WO2008123147A1 (ja) 2007-03-23 2008-03-21 金属製部材の溶接部の表面処理方法

Country Status (5)

Country Link
JP (1) JP5072398B2 (ja)
KR (1) KR101489977B1 (ja)
CN (1) CN101622099A (ja)
TW (1) TWI426974B (ja)
WO (1) WO2008123147A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101014769B1 (ko) * 2010-09-20 2011-02-14 (주) 미래이피 진공챔버의 표면처리 방법
CN104625278A (zh) * 2013-11-12 2015-05-20 联合汽车电子有限公司 用铸造零部件经过铜钎焊制造产品的方法
FR3093016B1 (fr) * 2019-02-27 2022-07-01 Centre Techn Ind Mecanique Procédé et installation de polissage de pièce métallique
CN111774939A (zh) * 2019-04-04 2020-10-16 昆山德尚金属制品有限公司 一种不锈钢焊接管表面处理方法
JP7038751B2 (ja) * 2020-04-20 2022-03-18 株式会社Ihi ステンレス鋼部品の処理方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03223500A (ja) * 1990-01-29 1991-10-02 Chem Yamamoto:Kk ステンレス鋼厚板の溶接などに伴なう局部酸化スケールの処理方法
JPH11207620A (ja) * 1998-01-29 1999-08-03 Moriai Seiki Kk 物品の表面処理方法
JP2000033417A (ja) * 1998-07-21 2000-02-02 Daido Steel Co Ltd 鉄系線材の脱スケール方法及び装置
JP2006326762A (ja) * 2005-05-26 2006-12-07 Fuji Xerox Co Ltd 円筒状基体表面処理方法および円筒状基体表面処理装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61274877A (ja) * 1985-05-28 1986-12-05 Daifuku Co Ltd 吸着自走式研掃装置
JPH1133915A (ja) * 1997-07-22 1999-02-09 Mitsubishi Heavy Ind Ltd ブラスト装置
JP4433602B2 (ja) * 2000-10-31 2010-03-17 旭硝子株式会社 ブラスト処理方法
TWI342582B (en) * 2003-07-17 2011-05-21 Applied Materials Inc Method of surface texturizing
JP4418985B2 (ja) * 2004-03-24 2010-02-24 アーク岡山株式会社 マグネシウム又はマグネシウム合金からなる製品の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03223500A (ja) * 1990-01-29 1991-10-02 Chem Yamamoto:Kk ステンレス鋼厚板の溶接などに伴なう局部酸化スケールの処理方法
JPH11207620A (ja) * 1998-01-29 1999-08-03 Moriai Seiki Kk 物品の表面処理方法
JP2000033417A (ja) * 1998-07-21 2000-02-02 Daido Steel Co Ltd 鉄系線材の脱スケール方法及び装置
JP2006326762A (ja) * 2005-05-26 2006-12-07 Fuji Xerox Co Ltd 円筒状基体表面処理方法および円筒状基体表面処理装置

Also Published As

Publication number Publication date
JP5072398B2 (ja) 2012-11-14
CN101622099A (zh) 2010-01-06
TW200920536A (en) 2009-05-16
TWI426974B (zh) 2014-02-21
JP2008229803A (ja) 2008-10-02
KR101489977B1 (ko) 2015-02-04
KR20090122429A (ko) 2009-11-30

Similar Documents

Publication Publication Date Title
WO2008123147A1 (ja) 金属製部材の溶接部の表面処理方法
WO2005081289A3 (en) Process and apparatus for removing residues from semiconductor substrates
TW200719785A (en) A reflow apparatus, a reflow method, and a manufacturing method of a semiconductor device
WO2004048636A3 (en) Method of cleaning a coated process chamber component
TW200610752A (en) Alphahydroxyacids with ultra-low metal concentration
TW200636836A (en) Silicon electrode assembly surface decontamination by acidic solution
TW200711757A (en) Method for removing surface deposits and passivating interior surfaces of the interior of a chemical vapor deposition reactor
TW200604369A (en) Method for removing carbon-containing residues from a substrate
TW200725197A (en) Apparatus and methods for mask cleaning
WO2008105255A1 (ja) プラズマ処理装置のクリーニング方法、そのクリーニング方法を実行するプラズマ処理装置およびそのクリーニング方法を実行するプログラムを記憶する記憶媒体
TW200636838A (en) Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid
WO2006100260A3 (de) Oberflächenbehandlung
NZ607801A (en) Gas stream purification apparatus and method
TW200507121A (en) Removal of CMP and post-CMP residue from semiconductors using supercritical carbon dioxide process
SG127810A1 (en) Method and process for reactive gas cleaning of tool parts
CN101294287A (zh) 一种用于板材除锈的中性除锈剂配方及工艺
WO2006012830A3 (de) Verfahren zur behandlung einer mit radiokarbon kontaminierten keramik, insbesondere reaktorgraphit
SG148967A1 (en) Process for cleaning a semiconductor wafer using a cleaning solution
CN101080331B (zh) 齿轮表面处理工序
TWI324797B (en) Method for removing particles from a surface
WO2006005907A3 (en) Pump cleaning
EP1696476A3 (en) Method of surface processing substrate, method of cleaning substrate, and programs for implementing the methods
EP1441043A3 (en) Supply of gas to semiconductor process chamber
TW200725724A (en) Surface grinding method of semiconductor wafer and making method thereof
TW200501198A (en) Method of cleaning surface of semiconductor wafer

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880006996.X

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08722649

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 1020097017386

Country of ref document: KR

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08722649

Country of ref document: EP

Kind code of ref document: A1