WO2008122220A1 - Shielding and heat-dissipating device - Google Patents

Shielding and heat-dissipating device Download PDF

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Publication number
WO2008122220A1
WO2008122220A1 PCT/CN2008/070419 CN2008070419W WO2008122220A1 WO 2008122220 A1 WO2008122220 A1 WO 2008122220A1 CN 2008070419 W CN2008070419 W CN 2008070419W WO 2008122220 A1 WO2008122220 A1 WO 2008122220A1
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WO
WIPO (PCT)
Prior art keywords
heat
heat sink
shielding
conductive
pcb
Prior art date
Application number
PCT/CN2008/070419
Other languages
English (en)
French (fr)
Inventor
Linfang Jin
Liechun Zhou
Original Assignee
Huawei Technologies Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co., Ltd. filed Critical Huawei Technologies Co., Ltd.
Priority to DE602008003166T priority Critical patent/DE602008003166D1/de
Priority to EP08715155A priority patent/EP2031952B1/en
Priority to DE202008017728U priority patent/DE202008017728U1/de
Priority to AT08715155T priority patent/ATE486492T1/de
Priority to US12/249,541 priority patent/US7692927B2/en
Publication of WO2008122220A1 publication Critical patent/WO2008122220A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Definitions

  • the present invention relates to the field of electronic technologies, and in particular, to a shielding and heat dissipating device. Background technique
  • Embodiments of the present invention provide a shielding and heat dissipating device to achieve the effects of both shielding and heat dissipation.
  • a shielding and heat dissipation device provided by an embodiment of the invention includes:
  • a conductive support disposed on the printed circuit board PCB around the shielded heat-generating electronic component and electrically connected to the conductive layer of the printed circuit board;
  • the heat sink is disposed on the heat-generating electronic component, and the heat sink has a conductive surface, and the conductive surface is electrically connected to the conductive bracket.
  • the heat sink and the heat-generating electronic component can be in sufficient contact to achieve a good heat dissipation effect.
  • the conductive surface of the heat sink is used as a part of the shielding cavity, and forms a complete shielding cavity with the conductive layer of the conductive bracket and the printed circuit board to achieve a good shielding effect.
  • FIG. 1 is a schematic diagram of an internal structure of a heat sink using a heat sink in the prior art
  • FIG. 2 is a schematic view showing the internal structure of the shielding and heat dissipating device provided in the first embodiment of the present invention
  • FIG. 3 is a schematic view showing the internal structure of the shielding and heat dissipating device provided in the second embodiment of the present invention
  • 4 is a schematic view showing the internal structure of the shielding and heat dissipating device provided in Embodiment 3 of the present invention
  • FIG. 5 is a schematic view showing the internal structure of the shielding and heat dissipating device provided in Embodiment 4 of the present invention.
  • heat dissipate heat for electronic devices There are many ways to dissipate heat for electronic devices.
  • the usual heat dissipation methods include heat conduction, heat convection, and heat radiation.
  • a common heat dissipation scheme is to mount a heat sink over the device.
  • the heat sink 2 and the heat generating device 7 have a heat conducting layer 4 on the surface thereof for reducing the interface thermal resistance between the heat sink 2 and the heat generating device 7.
  • the surface of the heat sink is usually surface treated, such as anodized.
  • the surface treated heat sink increases the radiation heat dissipation ability due to the increased surface blackness, and is not easily corroded. This heat dissipation method can effectively spread the heat of a large heat generating device and lower the temperature of the device.
  • both RF and baseband chips require electromagnetic shielding.
  • the existing shielding method requires soldering stainless steel or other metal sheets on the PCB near the shielded device, and together with the PCB layer copper to form a complete conductive metal chamber, the device is located inside the metal chamber, according to the shielding needs, metal
  • the chamber can be made as a single chamber or as a multi-chamber.
  • the thermal interface material is filled between the heat sinks to reduce the interface thermal resistance between the shield box and the heat sink. Therefore, it is necessary to use two thermal interface materials between the shielding box and the heat sink, between the shielding box and the heat generating device, so that the heat resistance between the heat sink and the device becomes large, and the heat dissipation effect of the heat sink is greatly reduced.
  • the shielding problem cannot be solved and the electrical specifications are unqualified. Since the surface of the surface-treated heat sink does not conduct electricity, it cannot form a complete conductive shielding chamber with other parts of the shielding cavity, which is likely to cause severe electromagnetic compatibility (EMC) problems.
  • EMC electromagnetic compatibility
  • the heat sink when using a conductive heat sink, it is necessary to ensure that the heat sink is in close contact with the device, and that the heat sink is electrically connected to other parts of the shield box, which may cause difficulty in installation. Moreover, the heat sink has a low heat radiation capability and is easily corroded.
  • embodiments of the present invention provide a shielding and heat dissipating device for a surface-conducting heat sink connected between a heat conducting layer and a conductive layer of a PCB by a conductive bracket surrounding the shielded heat-generating electronic component Provided on the PCB, and the conductive bracket is electrically connected to the conductive layer of the PCB, so that the conductive layer of the bracket and the heat sink and the PCB form a complete shielding cavity, so that the heat sink can participate in electromagnetic shielding of the electronic component;
  • the non-conductive heat sink is provided with a conductive surface on the heat sink.
  • the conductive surface can be disposed on the bottom or side of the heat sink, and is connected by a conductive bracket between the conductive surface of the heat sink and the conductive layer of the PCB to make the conductive
  • the conductive layer of the bracket and the heat sink and the PCB form a complete shielding cavity, so that the heat sink can also function as an electromagnetic shield while dissipating heat.
  • the above conductive support may be an elastic metal piece or an elastic conductive foam, etc., and can simultaneously serve as a support and a conductive shield.
  • the internal structure of the shielding and heat dissipating device provided in the embodiment of the present invention is as shown in FIG. 2, wherein the elastic metal piece 1 is used as a bracket, and the top end of the shielding box 9 is set in combination with the structure of the shielding box in the prior art.
  • the opening is formed, and the elastic metal piece 1 and the shielding case 9 are an integrated structure.
  • the elastic metal piece 1 is disposed as a part of the shielding case 9 in the cavity of the shielding case 9, and is disposed around the heat-generating electronic component 3.
  • the shielding box 9 is mounted in the same manner as in the prior art, and is soldered to the PCB 5, and the bottom of the shielding box 9 and the conductive layer of the PCB 5 are electrically connected.
  • the surface of the heat sink 2 can be electrically conductive, and the bottom of the heat sink 2 is used as a conductive surface, and the rest of the bottom portion of the heat sink 2 can be made positive.
  • the pole treatment preserves the conductive characteristics of the bottom; the heat sink 2 may be anodized first, and then a conductive metal is plated on the bottom of the heat sink 2 to make the bottom of the heat sink 2 conductive.
  • the positive treatment of the heat sink 2 is to increase the surface blackness of the heat sink 2, and to increase the heat dissipation capability, and the portion of the heat sink 2 that is anodized is not electrically conductive.
  • the conductive layer of the PCB 5 may be the formation copper of the PCB 5. Since the elastic metal piece 1 itself has elasticity, the heat sink 2 can be directly pressed against the elastic metal piece 1, so that the elastic metal piece 1 abuts against the bottom of the heat sink 2 due to elasticity, and the elastic metal piece 1 and the heat sink are easily realized. 2 electrical connection at the bottom. Thus, the bottom of the heat sink 2 serves as the top of the shield case 9, and together with the shield case 9, constitutes a complete shield cavity, and the elastic metal piece 1 disposed around the heat-generating electronic component 3 in the shield case 9 will heat the heat sink 2.
  • the large shield cavity formed by the shield box 9 is divided into a plurality of small shield cavities for shielding the electromagnetic radiation of the individual heat-generating electronic components 3.
  • the heat sink 2 is pressed against the elastic metal piece 1 by its own gravity, so that the physical connection between the heat sink 2 and the elastic metal piece 1 is not strong, and the fixing of the heat sink 2 cannot be stabilized. Therefore, positioning holes may be respectively disposed at corresponding positions of the heat sink 2 and the PCB 5.
  • the screw 10 is inserted into the heat dissipation.
  • the nut 11 is screwed at the other end of the screw 10 to ensure a certain tightening force, so that the elastic metal piece 1 and the bottom of the heat sink 2 are in full contact.
  • the heat sink 2 can be well fixed to the PCB 5.
  • the heat conductive layer 4 may be filled in a small air gap between the heat sink 2 and the heat-generating electronic component 3, and the heat conductive layer 4 is made of a thermal interface material such as a thermal pad or a thermal conductive adhesive to reduce the heat sink 2 and the heat-generating electronic component 3
  • the thermal resistance between the interfaces is better, so that the heat dissipation capability of the heat sink 2 is better utilized.
  • the heat-conducting layer 4 may be of a different thickness or a compressible soft thermal interface material of the same thickness. Part of the heat generated by the heat-generating electronic component 3 is conducted to the heat sink 2 through the heat-conducting layer 4, and the heat sink 2 diffuses heat into the surrounding environment by heat radiation and air convection.
  • the elastic metal piece 1 in the shielding case 9 is electrically connected to the bottom of the heat sink 2.
  • the second embodiment of the present invention adds the side surface of the heat sink 2 to the conductive surface based on Fig. 2, that is, the bottom surface and the side surface of the heat sink 2 are both conductive surfaces.
  • the elastic metal piece 1 is electrically connected to the side surface of the heat sink 2.
  • the elastic metal piece 1 and the shielding case 9 are integrated structures, the shielding case 9 is soldered on the PCB 5, and the shielding case 9 and the PCB 5 are The conductive layers are electrically connected.
  • the elastic metal piece 1 electrically connected to the side surface of the heat sink 2 needs to be disposed at a corresponding position of the shielding box 9 according to the size of the heat sink 2, so that the heat sink 2 is inserted into the opening of the top of the shielding box 9, and when pressed downward, the use and
  • the elasticity of the elastic metal piece 1 electrically connected to the side surface of the heat sink 2 presses the heat sink 2 inward.
  • the heat sink 2 cannot be fixed firmly only by the elastic force of the elastic metal piece 1. Therefore, positioning holes can be respectively disposed at corresponding positions of the heat sink 2 and the PCB 5, and the heat is transmitted between the heat sink 2 and the elastic metal piece 1.
  • the screw 10 is inserted into the positioning holes of the heat sink 2 and the PCB 5, and the nut 11 is screwed into the other end of the screw 10 and tightened to ensure a certain degree.
  • the top tightening force brings the elastic metal piece 1 and the bottom of the heat sink 2 into full contact.
  • the heat sink 2 can be well fixed to the PCB 5.
  • the top of the heat sink 2 can be positively treated to improve the surface heat radiation capability of the heat sink 2 and increase the heat dissipation capability.
  • the elastic metal piece 1 electrically connected to the side surface of the heat sink 2 in the second embodiment shown in FIG. 3 is improved.
  • an elastic metal piece 1 is disposed on the side wall of the shielding box 9, and the elastic metal piece 1 is provided.
  • the shielding box 9 is also an integrated structure.
  • the heat sink 2 applies an inward pressing force by which the elastic metal piece 1 presses the heat sink 2 inwardly to make the electrical contact between the elastic metal piece 1 and the side surface of the heat sink 2 good.
  • the heat sink 2 cannot be fixed firmly by the pressing force of the elastic metal piece 1, so that the same bolts or circlips as those in the first and second embodiments above can be used.
  • the heat sink 2 is fixed to the PCB 5.
  • the lower surface of the heat sink 2 may be designed as a metal boss.
  • FIG. 5 it is a schematic diagram of an internal structure of Embodiment 4 of the present invention. Since the heights of the heat-generating electronic components 3 are different, the gap between the lower-level electronic components and the heatsink 2 is relatively large, resulting in The thickness of the heat conductive layer 4 filled in the middle of the gap is large, which affects the heat dissipation effect.
  • the heat sink metal boss 8 can be designed on the lower surface of the heat sink 2, corresponding to different heights of the heat-generating electronic component 3, the heat sink metal The height of the boss 8 is adjusted as needed. The purpose is to reduce the gap between the heat sink 2 and the heat-generating electronic component 3 to reduce the thickness of the heat-conductive layer 4 filled between the gaps, so that the heat-dissipating effect is better.
  • the fourth embodiment of the present invention is improved on the basis of the foregoing embodiment, and the heat sink 2 is designed with a special structure to reduce the thickness of the heat conductive layer 4 filled between the heat sink 2 and the heat-generating electronic component 3, and the heat dissipation effect is obtained. better.
  • the embodiment of the present invention has a special internal structure design, and the problem that the heat sink plays the dual functions of heat dissipation and electromagnetic shielding is better solved without changing the heat dissipation structure of the electronic component in the prior art, and The structure is simple, solving the trouble of installation.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cookers (AREA)

Description

屏蔽和散热装置 本申请要求于 2007 年 04 月 04 日提交中国专利局、 申请号为 200720143737.4、 发明名称为"屏蔽和散热装置"的中国专利申请的优先权， 其全部内容通过引用结合在本申请中。 技术领域
本发明涉及电子技术领域， 尤其涉及一种屏蔽和散热装置。 背景技术
在电子领域， 新的功能和新的零部件的使用量都在不断的增长。 由于 向更高的处理能力和更广阔的应用方向的发展， 设备产生的热量也迅速增 长； 而器件的集成度还在不断增加， 电子设备的体积在向小型化发展。 一 方面， 电子设备的体积不断减小， 另一方面， 功耗有不断增加的趋势， 由 此导致的直接问题是设备热流密度不断提高， 散热难度和成本迅速加大， 成为设计的瓶颈。 因此， 在实际产品中的诸多制约条件下， 如何将单板上 高密度的器件产生的热量有效扩散出去就成了目前急切需要解决的问题。 发明内容
本发明实施例提供一种屏蔽和散热装置，以达到既屏蔽又散热的效果。 本发明实施例提供的一种屏蔽和散热装置， 包括：
导电支架， 围绕被屏蔽的发热电子元件设置于印刷电路板 PCB上， 且 与印刷电路板的导电层电性连接；
散热器， 设置于所述发热电子元件上， 且所述散热器具有导电面， 所 述导电面与所述导电支架电性连接。 本发明的实施例提供的技术方案中， 散热器与发热电子元件能够充分接触， 从而达到良好的散热效果。 同时， 散热器的导电面作为屏蔽腔的一部分， 与导电支架、 印刷电路板的导电层 构成一个完整的屏蔽腔， 达到良好的屏蔽效果。 附图说明
图 1 是现有技术中利用散热器散热的内部结构示意图；
图 2 是本发明实施例一中提供的屏蔽和散热装置的内部结构示意图； 图 3是本发明实施例二中提供的屏蔽和散热装置的内部结构示意图； 图 4是本发明实施例三中提供的屏蔽和散热装置的内部结构示意图； 图 5是本发明实施例四中提供的屏蔽和散热装置的内部结构示意图。 符号说明
1 弹性金属片
2散热器
3 发热电子元件
4 导热层
5 PCB
6 热焊盘
7 发热器件
8散热器金属凸台
9 屏蔽盒
10 螺钉
11 螺母 具体实施方式
目前为电子器件设计的散热方式有很多，通常的散热途径包括热传导、 热对流和热辐射。 一种常用的散热方案是在器件上方安装散热器， 如图 1 所示， 散热器 2与发热器件 7表面有导热层 4, 用来降低散热器 2与发热 器件 7之间的界面热阻。 对于自然散热， 散热器表面通常要做表面处理， 例如阳极处理。 表面处理后的散热器由于表面黑度提高， 增加了辐射散热 能力， 也不容易腐蚀。 此种散热方式可以有效扩散发热量大器件的热量， 降低器件温度。
在很多应用领域， 如无线终端中， 射频和基带芯片都需要电磁屏蔽。 现有的屏蔽方式需要在被屏蔽的器件附近的 PCB 上焊接不锈钢或其他金 属片， 和 PCB地层铜皮一起构成一个完整的导电金属腔室， 器件位于金属 腔室内部， 根据屏蔽的需要， 金属腔室可以做成单腔或多腔。 在研究过程 中发现， 安装散热器的散热方式虽然可以有效扩散发热量大器件的热量， 降低器件温度， 但却难以应用于屏蔽腔内部器件的散热， 这是由于屏蔽盒 的存在， 散热器不能和器件直接接触。 若要安装散热器， 则需在屏蔽盒与 散热器之间填充热界面材料， 以降低屏蔽盒与散热器之间的界面热阻。 如 此以来， 需要在屏蔽盒与散热器之间、 屏蔽盒与发热器件之间使用两次热 界面材料， 使得散热器与器件之间的热阻变得很大， 散热器散热的效果大 打折扣。
若取消屏蔽盒上盖， 在散热器与器件之间填充热界面材料， 则导致屏 蔽问题无法解决， 电气指标不合格。 由于经过表面处理的散热器表面不导 电， 不能和屏蔽腔的其他部分构成一个完整的导电屏蔽腔室， 容易造成严 重的电磁兼容 '1·生（EMC, Electro Magnetic Compatibility ) 问题。
另外， 釆用导电的散热器时， 既要保证散热器与器件紧密接触， 又要 保证散热器与屏蔽盒其他部分导电连接， 会有安装上的困难。 而且， 散热 器的热辐射能力较低， 容易被腐蚀。
鉴于此， 本发明的实施例提供了一种屏蔽和散热装置， 对于表面导电 的散热器， 在散热器和 PCB的导电层之间用可导电支架连接， 该导电支架 围绕被屏蔽的发热电子元件设置于 PCB上， 并且该导电支架与 PCB的导 电层电性连接， 使支架与散热器和 PCB的导电层构成一个完整的屏蔽腔， 从而使得散热器能够参与对电子元件的电磁屏蔽； 对于表面不导电的散热 器， 则在散热器上设有导电面， 该导电面可设置于散热器的底部或侧面， 并在散热器的导电面和 PCB的导电层之间用导电支架连接，使导电支架与 散热器和 PCB的导电层构成一个完整的屏蔽腔，从而使得散热器在散热的 同时还能发挥电磁屏蔽的作用。 以上导电支架可以为弹性金属片或弹性导 电泡棉等， 可同时起到支撑和导电屏蔽的作用。 实施例一
本发明实施例中提供的屏蔽和散热装置内部结构， 如图 2所示， 图中 釆用弹性金属片 1做支架， 并结合现有技术中屏蔽盒的结构， 将屏蔽盒 9 的顶端设成开口状， 且弹性金属片 1和屏蔽盒 9为一体化的结构， 弹性金 属片 1作为屏蔽盒 9的一部分， 位于屏蔽盒 9的腔体内， 围绕发热电子元 件 3设置。 屏蔽盒 9的安装则和现有技术相同， 是焊接于 PCB 5上， 且屏 蔽盒 9的底部和 PCB 5的导电层之间电性连接。 散热器 2表面可导电， 把 散热器 2的底部作为导电面， 则可将散热器 2上除底部的其余部分进行阳 极处理， 保留底部的导电特性； 也可先将散热器 2进行阳极处理， 然后在 散热器 2的底部镀上一层导电金属， 使散热器 2的底部具有导电特性。 对 散热器 2进行阳性处理是为了提高散热器 2的表面黑度， 增加散热能力， 散热器 2上做阳极处理的部分不导电。
PCB 5的导电层可为 PCB 5的地层铜皮。 由于弹性金属片 1本身具有 弹性， 所以可将散热器 2直接压在弹性金属片 1上， 使弹性金属片 1由于 弹性而抵顶于散热器 2的底部， 轻松实现弹性金属片 1与散热器 2底部的 电性连接。 如此以来， 散热器 2的底部作为屏蔽盒 9的顶部， 和屏蔽盒 9 一起构成一个完整的屏蔽腔体， 而屏蔽盒 9内围绕发热电子元件 3设置的 弹性金属片 1 , 则将散热器 2和屏蔽盒 9构成的大屏蔽腔体分成了若干个 小的屏蔽腔， 用来屏蔽单个发热电子元件 3的电磁辐射。
但是， 散热器 2仅靠自身重力压在弹性金属片 1上， 会使散热器 2和 弹性金属片 1之间的物理连接不牢固， 而且对散热器 2的固定也不能达到 稳定。 因此可在散热器 2和 PCB 5的对应位置上分别设置定位孔， 当散热 器 2压在弹性金属片 1上， 并使散热器 2和 PCB 5的定位孔分别对应后， 将螺钉 10插入散热器 2和 PCB 5的定位孔中， 在螺钉 10的另一端旋入螺 母 11拧紧， 以保证一定的顶紧力，使弹性金属片 1和散热器 2的底部充分 接触。 如此以来， 散热器 2即能很好的固定在 PCB 5上。
除了利用上述的螺栓固定散热器 2之外， 还有其他多种固定散热器 2 的方式， 例如， 在 PCB 5上设置若干个卡座， 利用卡簧将散热器 2固定在 PCB 5上， 也为一种较常见的固定方式， 此处不加以赘述。
另外， 在散热器 2和发热电子元件 3之间的微小空气间隙内可填充导 热层 4, 导热层 4釆用热界面材料， 如导热垫或导热胶， 以降低散热器 2 和发热电子元件 3之间的界面热阻，从而更好的发挥散热器 2的散热能力。 对于高度不同的发热电子元件 3 , 导热层 4可为厚度不同， 也可为厚度相 同的可压缩柔软热界面材料。 发热电子元件 3所产生的部分热量通过导热 层 4传导到散热器 2上， 散热器 2通过热辐射和空气对流将热量扩散到周 围环境中。这样以来，发热电子元件 3的热量就被最终扩散到周围环境中， 发热电子元件 3本身的温度下降。 本发明实施例一， 只需在散热器 2和发热电子元件 3之间填充一层导 热层 4 , 而现有技术中需要在屏蔽盒与散热器之间、 屏蔽盒与发热器件之 间分别使用导热层 4 , 相比之下本发明具有更好的散热效果。 实施例二
图 3所示的实施例一种， 是将屏蔽盒 9中的弹性金属片 1与散热器 2 的底部电性连接。 为了达到更好的电磁屏蔽效果， 本发明的实施例二在图 2的基础上， 将散热器 2的侧面增设为导电面， 即散热器 2的底部和侧面 都为导电面。 如图 3所示， 弹性金属片 1与散热器 2的侧面电性连接， 弹 性金属片 1和屏蔽盒 9为一体化的结构， 屏蔽盒 9焊接在 PCB 5上， 并且 屏蔽盒 9与 PCB 5的导电层之间电性连接。 与散热器 2侧面电性连接的弹 性金属片 1需要根据散热器 2的大小设置在屏蔽盒 9的对应位置， 使得散 热器 2插入屏蔽盒 9顶部的开口中， 向下挤压时， 利用与散热器 2侧面电 性连接的弹性金属片 1的弹性， 将散热器 2向内压紧。 但是， 只靠弹性金 属片 1的弹性力无法将散热器 2固定牢固， 因此， 可在散热器 2和 PCB 5 的对应位置上分别设置定位孔，当散热器 2和弹性金属片 1之间电性连接， 并使散热器 2和 PCB 5的定位孔分别对应后， 将螺钉 10插入散热器 2和 PCB 5的定位孔中， 在螺钉 10的另一端旋入螺母 11并拧紧， 以保证一定 的顶紧力， 使弹性金属片 1和散热器 2的底部充分接触。 如此以来， 散热 器 2即能很好的固定在 PCB 5上。另外，可对散热器 2的顶部做阳性处理， 以提高散热器 2的表面热辐射能力， 增加散热能力。 实施例三
对图 3所示实施例二中与散热器 2侧面电性连接的弹性金属片 1进行 改进， 如图 4所示， 在屏蔽盒 9的侧壁上设置弹性金属片 1 , 该弹性金属 片 1和屏蔽盒 9也为一体化的结构。 当散热器 2插入屏蔽盒 9顶部的开口 中， 向下挤压时， 屏蔽盒 9侧壁上的弹性金属片 1被向外挤压， 受迫变形， 由于弹性金属片 1具有弹性， 会给散热器 2施加一个向内的挤压力， 利用 该挤压力， 弹性金属片 1将散热器 2向内压紧， 使弹性金属片 1和散热器 2侧面的电性接触良好。但是只靠弹性金属片 1的挤压力，无法将散热器 2 固定牢固， 因此可釆用与以上实施例一、 二中相同的螺栓或卡簧等固定方 式将散热器 2固定在 PCB 5上。
以上为本发明实施例利用弹性金属片作支架的情况， 当然， 除了利用 弹性金属片， 还有其他很多种替代方式， 同样可以实现本发明实施例的目 的。 例如： 釆用弹性导电泡棉代替弹性金属片， 利用导电泡棉自身的弹性， 来连接 PCB和散热器上的导电面， 充分导通， 实现电磁屏蔽腔体的构架。 实施例四
为减小发热电子元件 3与散热器 2之间的导热热阻， 散热器 2下表面 可设计成金属凸台状。 如图 5所示， 为本发明实施例四的一种内部结构示 意图， 由于发热电子元件 3的高度各不相同， 有些高度较低的电子元件和 散热器 2之间的空隙比较大，导致其空隙中间填充的导热层 4的厚度较大， 影响散热效果， 为解决这一问题， 可以在散热器 2的下表面设计散热器金 属凸台 8 , 对应发热电子元件 3不同的高度， 散热器金属凸台 8的高度根 据需要做设计调节。其目的是减少散热器 2和发热电子元件 3之间的空隙， 以降低空隙间填充的导热层 4的厚度， 使散热效果更好。
本发明实施例四是在前述实施例的基础上进行改进， 其散热器 2釆用 特殊的结构设计， 使散热器 2和发热电子元件 3之间填充的导热层 4的厚 度得到降低， 散热效果更好。
本发明的实施例， 其特殊的内部结构设计， 在对现有技术中的电子元 件散热结构不做改动的情况下， 较好的解决了散热器发挥散热和电磁屏蔽 双重功能的问题， 并且其结构简单， 解决了安装上的麻烦。
以上公开的仅为本发明的几个具体实施例， 但是， 本发明并非局限于 此， 任何本领域的技术人员在不脱离本发明的实质下做的变更和替换都应 落入本发明的保护范围。

Claims

OP070801 WO 2008/122220 PCT/CN2008/070419 权 利 要 求
1、 一种屏蔽和散热装置， 其特征在于， 包括：
导电支架（ 1 ),围绕被屏蔽的发热电子元件设置于印刷电路板 PCB上， 且与印刷电路板的导电层电性连接；
散热器 （2 ), 设置于所述发热电子元件 （3 )上， 且所述散热器（2 ) 具有导电面， 所述导电面与所述导电支架（1 ) 电性连接。
2、如权利要求 1所述屏蔽和散热装置，其特征在于，还包括屏蔽盒（9 ), 该屏蔽盒（9 ) 的底部和 PCB的导电层之间电性连接， 所述导电支架 设置在屏蔽盒腔体内， 与该屏蔽盒连接。
3、 如权利要求 1所述屏蔽和散热装置， 其特征在于， 所述散热器（2 ) 的导电面釆用下述方法得到：
表面导电的散热器（2 )上保留一面具有导电特性， 将散热器 （2 )其 余部分进行阳极处理； 或者
将所述散热器（2 ) 的表面进行阳极处理， 然后在散热器 （2 )上需要 具有导电的表面镀上导电金属一层。
4、 如权利要求 1所述屏蔽和散热装置， 其特征在于，
在所述散热器（2 )和所述 PCB的对应位置上分别设置定位孔， 利用 该定位孔通过固定部件使散热器（2 ) 能固定在所述 PCB上。
5、如权利要求 1所述屏蔽和散热装置，其特征在于，所述导电支架（ 1 ) 釆用弹性金属片或导电泡棉制成。
6、如权利要求 1所述屏蔽和散热装置，其特征在于，所述导电支架（ 1 ) 釆用弹性金属片， 所述弹性金属片与屏蔽盒（9 ) 为一体化结构。
7、 如权利要求 1所述屏蔽和散热装置， 其特征在于， 所述散热器底部 设有金属凸台。
8、 如权利要求 1至 7中任一项所述屏蔽和散热装置， 其特征在于， 所 述散热器 （2 )和所述发热电子元件（3 )之间设有导热层。
9、 如权利要求 8所述屏蔽和散热装置， 其特征在于， 所述导热层为导 热垫和 /或导热胶。
PCT/CN2008/070419 2007-04-04 2008-03-05 Shielding and heat-dissipating device WO2008122220A1 (en)

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AT08715155T ATE486492T1 (de) 2007-04-04 2008-03-05 Abschirmungs- und wärmeableitungsvorrichtung
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US7692927B2 (en) 2010-04-06
EP2031952B1 (en) 2010-10-27
EP2031952A4 (en) 2009-06-17
DE202008017728U1 (de) 2010-05-12
ATE486492T1 (de) 2010-11-15
US20090040731A1 (en) 2009-02-12
CN201104378Y (zh) 2008-08-20
EP2031952A1 (en) 2009-03-04
DE602008003166D1 (de) 2010-12-09

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