WO2008117742A1 - 酸化亜鉛系半導体の製造方法及び酸化亜鉛系半導体の製造装置 - Google Patents
酸化亜鉛系半導体の製造方法及び酸化亜鉛系半導体の製造装置 Download PDFInfo
- Publication number
- WO2008117742A1 WO2008117742A1 PCT/JP2008/055237 JP2008055237W WO2008117742A1 WO 2008117742 A1 WO2008117742 A1 WO 2008117742A1 JP 2008055237 W JP2008055237 W JP 2008055237W WO 2008117742 A1 WO2008117742 A1 WO 2008117742A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- oxide semiconductor
- zinc oxide
- semiconductor manufacturing
- supplying means
- zone
- Prior art date
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/407—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4488—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by in situ generation of reactive gas by chemical or electrochemical reaction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02551—Group 12/16 materials
- H01L21/02554—Oxides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02565—Oxide semiconducting materials not being Group 12/16 materials, e.g. ternary compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Electrochemistry (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
高品質の酸化亜鉛系半導体を容易に製造できる酸化亜鉛系半導体の製造方法及びその製造装置を提供する。る酸化亜鉛半導体の製造装置1は、塩素ガス供給手段2と、キャリアガス供給手段3と、原料ゾーン4と、加熱手段5と、水供給手段6と、キャリアガス供給手段7と、成長ゾーン8と、加熱手段9と、基板保持手段10と、水素供給手段11とを備えている。原料ゾーン4では、塩素ガス供給手段2から供給される塩素ガスと亜鉛とを反応させて塩化亜鉛ガスを生成する。成長ゾーン8では、原料ゾーン4から供給される塩化亜鉛と、酸素材料として水供給手段6から供給される水とを反応させて、基板保持手段10に保持された成長基板16上に酸化亜鉛半導体を成長させる。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-079938 | 2007-03-26 | ||
JP2007079938A JP5052174B2 (ja) | 2007-03-26 | 2007-03-26 | 酸化亜鉛系半導体の製造方法及び酸化亜鉛系半導体の製造装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008117742A1 true WO2008117742A1 (ja) | 2008-10-02 |
Family
ID=39788477
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/055237 WO2008117742A1 (ja) | 2007-03-26 | 2008-03-21 | 酸化亜鉛系半導体の製造方法及び酸化亜鉛系半導体の製造装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5052174B2 (ja) |
TW (1) | TW200849341A (ja) |
WO (1) | WO2008117742A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8822263B2 (en) | 2008-06-30 | 2014-09-02 | National University Corporation Tokyo University Of Agriculture And Technology | Epitaxial growth method of a zinc oxide based semiconductor layer, epitaxial crystal structure, epitaxial crystal growth apparatus, and semiconductor device |
JP2010157574A (ja) * | 2008-12-26 | 2010-07-15 | Tokyo Univ Of Agriculture & Technology | 酸化亜鉛系半導体、酸化亜鉛系半導体の製造方法および製造装置 |
EP2641996A1 (en) | 2012-03-23 | 2013-09-25 | Stanley Electric Co., Ltd. | Method for growing magnesium-zinc-oxide-based crystal |
JP2012236761A (ja) * | 2012-07-06 | 2012-12-06 | Tokyo Univ Of Agriculture & Technology | ホモエピタキシャル結晶成長装置および半導体装置 |
JP5943345B2 (ja) * | 2012-07-27 | 2016-07-05 | 東京エレクトロン株式会社 | ZnO膜の製造装置及び製造方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05294768A (ja) * | 1992-04-18 | 1993-11-09 | Taiyo Yuden Co Ltd | 透明導電膜のエッチング方法 |
JPH107497A (ja) * | 1996-06-26 | 1998-01-13 | Sumitomo Electric Ind Ltd | Ii−vi族化合物半導体結晶の成長方法 |
JP2001270799A (ja) * | 2000-03-27 | 2001-10-02 | Toyo Ink Mfg Co Ltd | 酸化亜鉛薄膜およびその製造方法 |
JP2003243695A (ja) * | 2002-02-21 | 2003-08-29 | Sony Corp | 発光素子およびその製造方法並びに表示装置 |
JP2004200560A (ja) * | 2002-12-20 | 2004-07-15 | Mitsubishi Heavy Ind Ltd | 金属膜作製装置及び金属膜作製方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004075428A (ja) * | 2002-08-13 | 2004-03-11 | Sumitomo Electric Ind Ltd | Ii−vi族化合物半導体結晶の育成方法 |
JP2007016119A (ja) * | 2005-07-07 | 2007-01-25 | Tokyo Univ Of Agriculture & Technology | 酸化亜鉛蛍光体の製造方法およびその利用 |
-
2007
- 2007-03-26 JP JP2007079938A patent/JP5052174B2/ja active Active
-
2008
- 2008-03-21 WO PCT/JP2008/055237 patent/WO2008117742A1/ja active Application Filing
- 2008-03-25 TW TW97110591A patent/TW200849341A/zh unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05294768A (ja) * | 1992-04-18 | 1993-11-09 | Taiyo Yuden Co Ltd | 透明導電膜のエッチング方法 |
JPH107497A (ja) * | 1996-06-26 | 1998-01-13 | Sumitomo Electric Ind Ltd | Ii−vi族化合物半導体結晶の成長方法 |
JP2001270799A (ja) * | 2000-03-27 | 2001-10-02 | Toyo Ink Mfg Co Ltd | 酸化亜鉛薄膜およびその製造方法 |
JP2003243695A (ja) * | 2002-02-21 | 2003-08-29 | Sony Corp | 発光素子およびその製造方法並びに表示装置 |
JP2004200560A (ja) * | 2002-12-20 | 2004-07-15 | Mitsubishi Heavy Ind Ltd | 金属膜作製装置及び金属膜作製方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2008243987A (ja) | 2008-10-09 |
JP5052174B2 (ja) | 2012-10-17 |
TW200849341A (en) | 2008-12-16 |
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