WO2008105144A1 - センサ、センサの温度制御方法及び異常回復方法 - Google Patents

センサ、センサの温度制御方法及び異常回復方法 Download PDF

Info

Publication number
WO2008105144A1
WO2008105144A1 PCT/JP2008/000234 JP2008000234W WO2008105144A1 WO 2008105144 A1 WO2008105144 A1 WO 2008105144A1 JP 2008000234 W JP2008000234 W JP 2008000234W WO 2008105144 A1 WO2008105144 A1 WO 2008105144A1
Authority
WO
WIPO (PCT)
Prior art keywords
sensor
temperature control
abnormality recovery
control method
recovery method
Prior art date
Application number
PCT/JP2008/000234
Other languages
English (en)
French (fr)
Inventor
Yasuji Morita
Hiroshi Hatakeyama
Shigeru Aoshima
Shuji Morio
Isamu Warashina
Original Assignee
Yamatake Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamatake Corporation filed Critical Yamatake Corporation
Priority to CN2008800064805A priority Critical patent/CN101627286B/zh
Priority to KR1020097012612A priority patent/KR101114303B1/ko
Priority to US12/529,017 priority patent/US20100139389A1/en
Priority to EP08710388A priority patent/EP2128573A1/en
Priority to JP2009501118A priority patent/JPWO2008105144A1/ja
Publication of WO2008105144A1 publication Critical patent/WO2008105144A1/ja

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/688—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element
    • G01F1/69—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element of resistive type
    • G01F1/692—Thin-film arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/6845—Micromachined devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/696—Circuits therefor, e.g. constant-current flow meters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F5/00—Measuring a proportion of the volume flow

Landscapes

  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Volume Flow (AREA)
  • Control Of Temperature (AREA)

Abstract

　パッケージを構成する基板のうちの少なくとも一つにヒータパターン２３を設け、パッケージ内のセンサチップ５の周囲温度に応じてヒータパターン２３への通電量を制御することによりパッケージ内の温度を制御する。
PCT/JP2008/000234 2007-02-28 2008-02-15 センサ、センサの温度制御方法及び異常回復方法 WO2008105144A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN2008800064805A CN101627286B (zh) 2007-02-28 2008-02-15 流量传感器、流量传感器的温度控制方法和异常恢复方法
KR1020097012612A KR101114303B1 (ko) 2007-02-28 2008-02-15 센서, 센서의 온도제어방법 및 이상회복방법
US12/529,017 US20100139389A1 (en) 2007-02-28 2008-02-15 Sensor, sensor temperature control method and abnormality recovery method
EP08710388A EP2128573A1 (en) 2007-02-28 2008-02-15 Sensor, sensor temperature control method and abnormality recovery method
JP2009501118A JPWO2008105144A1 (ja) 2007-02-28 2008-02-15 センサ、センサの温度制御方法及び異常回復方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-049468 2007-02-28
JP2007049468 2007-02-28

Publications (1)

Publication Number Publication Date
WO2008105144A1 true WO2008105144A1 (ja) 2008-09-04

Family

ID=39720987

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/000234 WO2008105144A1 (ja) 2007-02-28 2008-02-15 センサ、センサの温度制御方法及び異常回復方法

Country Status (6)

Country Link
US (1) US20100139389A1 (ja)
EP (1) EP2128573A1 (ja)
JP (1) JPWO2008105144A1 (ja)
KR (1) KR101114303B1 (ja)
CN (1) CN101627286B (ja)
WO (1) WO2008105144A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012093099A (ja) * 2010-10-25 2012-05-17 Shimadzu Corp フローセンサおよび赤外線ガス分析計
JP2018124225A (ja) * 2017-02-03 2018-08-09 地方独立行政法人東京都立産業技術研究センター 熱伝導式センサ
JP2020008339A (ja) * 2018-07-04 2020-01-16 アズビル株式会社 熱式流量計

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4892511B2 (ja) * 2008-04-15 2012-03-07 本田技研工業株式会社 ガスセンサ
TW201113143A (en) * 2009-10-08 2011-04-16 Dragonjet Corp Plastic forming auxiliary system
US20120001273A1 (en) * 2010-07-02 2012-01-05 Siargo Ltd. Micro-package for Micromachining Liquid Flow Sensor Chip
US8546903B2 (en) * 2010-10-07 2013-10-01 Texas Instruments Incorporated Ionic isolation ring
JP5645880B2 (ja) * 2012-06-15 2014-12-24 日立オートモティブシステムズ株式会社 熱式流量計
JP5712975B2 (ja) * 2012-07-06 2015-05-07 東京エレクトロン株式会社 計測用基板、基板処理装置及び基板処理装置の運転方法
TWI512930B (zh) * 2012-09-25 2015-12-11 Xintex Inc 晶片封裝體及其形成方法
WO2014095115A1 (de) * 2012-12-21 2014-06-26 Endress+Hauser Flowtec Ag Messanordnung mit einem trägerelement und einem sensor
KR102063817B1 (ko) 2013-03-04 2020-01-08 삼성전자주식회사 반도체 패키지를 포함하는 반도체 장치의 표면 온도 제어 방법
JP6151544B2 (ja) * 2013-03-28 2017-06-21 日本電産サンキョー株式会社 磁気センサ装置およびロータリエンコーダ
KR101581134B1 (ko) * 2013-10-28 2015-12-29 니혼 덴산 산쿄 가부시키가이샤 센서 장치
KR20150074427A (ko) * 2013-12-24 2015-07-02 삼성전기주식회사 센서 패키지 및 이를 구비하는 휴대 단말기
CN105093228A (zh) 2014-05-08 2015-11-25 光宝科技股份有限公司 超声波感测模块
JP2015225023A (ja) * 2014-05-29 2015-12-14 日本電産サンキョー株式会社 エンコーダ
US20160161307A1 (en) * 2014-12-05 2016-06-09 General Electric Company System and method for metering gas
EP3187881B1 (en) * 2015-12-28 2020-08-26 Sensirion AG Thermal flow sensor
JP6646549B2 (ja) * 2016-08-30 2020-02-14 アズビル株式会社 監視装置、監視方法、およびプログラム。
DE202016107242U1 (de) * 2016-12-21 2018-03-22 Nordson Corp. Sensoreinrichtung zur Bestimmung eines Massenstroms eines flüssigen Heißschmelzklebstoffes
JP6858077B2 (ja) * 2017-05-25 2021-04-14 アズビル株式会社 コントローラ調整システムおよび調整方法
TWI632371B (zh) * 2017-08-31 2018-08-11 研能科技股份有限公司 致動傳感模組
KR101993208B1 (ko) * 2018-02-28 2019-06-27 엠케이프리시젼 주식회사 유량 측정 장치
TWI708933B (zh) * 2018-04-27 2020-11-01 研能科技股份有限公司 致動傳感模組
CN109624194A (zh) * 2018-11-07 2019-04-16 柳州国福科技有限公司 一种正温度系数传感器的加工工艺
US10908006B2 (en) * 2019-02-19 2021-02-02 Siargo Ltd. Method for forming micromachined liquid flow sensor
US11378549B2 (en) * 2020-03-20 2022-07-05 I-Shou University Gas sensor and manufacturing method thereof, and gas sensing system

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60220864A (ja) 1983-12-27 1985-11-05 株式会社山武 流速センサのハウジング
JPH10122925A (ja) * 1996-10-23 1998-05-15 Unisia Jecs Corp 流量検出装置
JP2002168669A (ja) 2000-12-04 2002-06-14 Ckd Corp 熱式流量計
JP2002340646A (ja) * 2001-05-11 2002-11-27 Horiba Ltd マスフローコントローラ用フローセンサおよびフローセンサの製造方法
JP2004327255A (ja) 2003-04-24 2004-11-18 Kyocera Corp セラミックヒータ構造体の製造方法、並びにセラミックヒータ構造体
WO2005121718A1 (ja) 2004-06-10 2005-12-22 Yamatake Corporation 流量計
JP2006052944A (ja) * 2003-05-30 2006-02-23 Hitachi Ltd 熱式流量センサ
JP2006118929A (ja) 2004-10-20 2006-05-11 Yamatake Corp マイクロフローセンサ
JP2007024681A (ja) * 2005-07-15 2007-02-01 Nissan Motor Co Ltd 超音波流体計測装置
JP2007033056A (ja) * 2005-07-22 2007-02-08 Yokogawa Electric Corp フローセンサ

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63177023A (ja) * 1987-01-19 1988-07-21 Nippon Soken Inc 流量センサ
US5798556A (en) * 1996-03-25 1998-08-25 Motorola, Inc. Sensor and method of fabrication
CA2184192A1 (en) * 1996-03-29 1997-09-30 Thaddeus M. Jones Thermostat for controlling relative humidity
JPH116780A (ja) * 1997-06-16 1999-01-12 Tokin Corp 静電容量型圧力センサ
JPH11118639A (ja) * 1997-10-15 1999-04-30 Mitsubishi Electric Corp 半導体圧力センサ
EP1035406A4 (en) * 1997-11-21 2005-03-30 Mitsui Mining & Smelting Co FLOW DETECTOR, TEMPERATURE SENSOR, AND FLOW MEASURING INSTRUMENT
US7258003B2 (en) * 1998-12-07 2007-08-21 Honeywell International Inc. Flow sensor with self-aligned flow channel
JP3468727B2 (ja) * 1999-09-24 2003-11-17 株式会社日立製作所 熱式空気流量計
DE10111840C2 (de) * 2001-03-13 2003-06-05 Bosch Gmbh Robert Verfahren zur Vermeidung von Verschmutzungen auf einem Sensorchip und Verwendung eines Zusatzheizers auf einem Sensorchip
EP1365216B1 (en) * 2002-05-10 2018-01-17 Azbil Corporation Flow sensor and method of manufacturing the same
NL1025617C2 (nl) * 2003-05-13 2004-11-18 Berkin Bv Massadebietmeter.
JP2004045408A (ja) * 2003-07-18 2004-02-12 Hitachi Ltd 熱式空気流量計
JP2005172445A (ja) * 2003-12-08 2005-06-30 Osaka Prefecture フローセンサ
US7036369B2 (en) * 2004-06-30 2006-05-02 Codman & Shurtleff, Inc. Thermal flow sensor having recesses in a substrate
US7181963B2 (en) * 2004-06-30 2007-02-27 Codman & Shurtleff, Inc Thermal flow sensor having streamlined packaging
DE102005016449A1 (de) * 2005-04-11 2006-10-12 Robert Bosch Gmbh Beheizter Heißfilmluftmassenmesser
DE102005016447A1 (de) * 2005-04-11 2006-10-12 Robert Bosch Gmbh Verfahren zum Betrieb von Heißfilmluftmassenmessern

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60220864A (ja) 1983-12-27 1985-11-05 株式会社山武 流速センサのハウジング
JPH10122925A (ja) * 1996-10-23 1998-05-15 Unisia Jecs Corp 流量検出装置
JP2002168669A (ja) 2000-12-04 2002-06-14 Ckd Corp 熱式流量計
JP2002340646A (ja) * 2001-05-11 2002-11-27 Horiba Ltd マスフローコントローラ用フローセンサおよびフローセンサの製造方法
JP2004327255A (ja) 2003-04-24 2004-11-18 Kyocera Corp セラミックヒータ構造体の製造方法、並びにセラミックヒータ構造体
JP2006052944A (ja) * 2003-05-30 2006-02-23 Hitachi Ltd 熱式流量センサ
WO2005121718A1 (ja) 2004-06-10 2005-12-22 Yamatake Corporation 流量計
JP2006118929A (ja) 2004-10-20 2006-05-11 Yamatake Corp マイクロフローセンサ
JP2007024681A (ja) * 2005-07-15 2007-02-01 Nissan Motor Co Ltd 超音波流体計測装置
JP2007033056A (ja) * 2005-07-22 2007-02-08 Yokogawa Electric Corp フローセンサ

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012093099A (ja) * 2010-10-25 2012-05-17 Shimadzu Corp フローセンサおよび赤外線ガス分析計
JP2018124225A (ja) * 2017-02-03 2018-08-09 地方独立行政法人東京都立産業技術研究センター 熱伝導式センサ
JP2020008339A (ja) * 2018-07-04 2020-01-16 アズビル株式会社 熱式流量計
JP7034852B2 (ja) 2018-07-04 2022-03-14 アズビル株式会社 熱式流量計

Also Published As

Publication number Publication date
KR101114303B1 (ko) 2012-03-14
CN101627286B (zh) 2012-10-17
EP2128573A1 (en) 2009-12-02
CN101627286A (zh) 2010-01-13
KR20090086439A (ko) 2009-08-12
US20100139389A1 (en) 2010-06-10
JPWO2008105144A1 (ja) 2010-06-03

Similar Documents

Publication Publication Date Title
WO2008105144A1 (ja) センサ、センサの温度制御方法及び異常回復方法
WO2008117200A3 (en) Integrated microfluidic device with reduced peak power consumption
WO2006071967A3 (en) Capacitance-based moisture sensor and controller
WO2008021668A3 (en) Heating and cooling of substrate support
WO2009001104A3 (en) Ice protection heater system
WO2006121654A3 (en) Control circuits for hot melt adhesive heater circuits and applicator heads
WO2007096746A3 (en) Decorating with powder material
WO2008075292A3 (en) Power-on temperature sensor/spd detect
TW200745357A (en) Evaporation source
WO2005070171A3 (en) Active thermal control system for testing
WO2010036307A3 (en) Method of assembling integrated circuit elements with a chip substrate using a thermal activatable barrier layer and the resulting product thereof
WO2008069930A3 (en) Flexible substrates having a thin-film barrier
WO2009105582A3 (en) Structured photovoltaic roofing elements, systems and kits
WO2009134072A3 (en) Laundry machine
WO2011140491A3 (en) Circuit for controlling temperature and enabling testing of a semiconductor chip
WO2009092794A3 (fr) Objet muni d'un element graphique reporte sur un support et procede de realisation d'un tel objet
WO2008011688A3 (en) GROWTH OF MONOCRYSTALLINE GeN ON A SUBSTRATE
WO2012036459A3 (ko) 발열체 및 이의 제조방법
TW200733352A (en) Phase change memory device and method of forming the same
WO2009012239A3 (en) Reduced cycle time manufacturing processes for thick film resistive devices
WO2009155090A3 (en) Fast substrate support temperature control
WO2009114851A3 (en) Method for preparing electrically conducting materials and devices including same
TW200630294A (en) Microfluidic chip
ATE443213T1 (de) Ventilbatterie
WO2006001830A3 (en) Anti-icing system for radomes

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880006480.5

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08710388

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2009501118

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 1020097012612

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 12529017

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2008710388

Country of ref document: EP