WO2008102419A1 - 発光体の形成方法及び金型 - Google Patents

発光体の形成方法及び金型 Download PDF

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Publication number
WO2008102419A1
WO2008102419A1 PCT/JP2007/001394 JP2007001394W WO2008102419A1 WO 2008102419 A1 WO2008102419 A1 WO 2008102419A1 JP 2007001394 W JP2007001394 W JP 2007001394W WO 2008102419 A1 WO2008102419 A1 WO 2008102419A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
emitting devices
light emitter
metal mold
cavities
Prior art date
Application number
PCT/JP2007/001394
Other languages
English (en)
French (fr)
Inventor
Kazuki Kawakubo
Shinji Takase
Original Assignee
Towa Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corporation filed Critical Towa Corporation
Priority to EP07849827A priority Critical patent/EP2071639A1/en
Priority to US12/438,335 priority patent/US20100006215A1/en
Priority to CN200780028411XA priority patent/CN101496185B/zh
Publication of WO2008102419A1 publication Critical patent/WO2008102419A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3433—Feeding the material to the mould or the compression means using dispensing heads, e.g. extruders, placed over or apart from the moulds
    • B29C2043/3438—Feeding the material to the mould or the compression means using dispensing heads, e.g. extruders, placed over or apart from the moulds moving during dispensing over the moulds, e.g. laying up
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/0022—Multi-cavity moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms
    • B29L2011/0016—Lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations

Abstract

　レンズ部材６と発光器１とを有する発光体４（製品）の生産性を効率良く向上させる。 　発光体の形成用金型１１を用いて、上型１２に設けたセット部１４に所要数の発光器１を装着した成形接合前フレーム２をセットし、且つ、下型１３に発光器１に対応して各別に設けたキャビティブロック１８のキャビティ１７内にディスペンサー２３にて所要量の透明性を有する液状の樹脂材料２４を各別に供給すると共に、金型１１・１２を型締めして発光器１の発光面３にキャビティ１７の開口部２２側を各別に弾性押圧することにより、前記したキャビティ１７内の樹脂を当該キャビティの形状に対応したレンズ部材６に圧縮成形し、且つ、同時に、このレンズ部材６を発光器１の発光面３に接合して発光体４を形成して成形接合済フレーム５を得る。
PCT/JP2007/001394 2007-02-20 2007-12-13 発光体の形成方法及び金型 WO2008102419A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP07849827A EP2071639A1 (en) 2007-02-20 2007-12-13 Method of forming light emitter and metal mold
US12/438,335 US20100006215A1 (en) 2007-02-20 2007-12-13 Method of forming light emitter and molding die
CN200780028411XA CN101496185B (zh) 2007-02-20 2007-12-13 发光体的形成方法及金属模

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-038962 2007-02-20
JP2007038962A JP2008205149A (ja) 2007-02-20 2007-02-20 発光体の形成方法及び金型

Publications (1)

Publication Number Publication Date
WO2008102419A1 true WO2008102419A1 (ja) 2008-08-28

Family

ID=39709704

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/001394 WO2008102419A1 (ja) 2007-02-20 2007-12-13 発光体の形成方法及び金型

Country Status (7)

Country Link
US (1) US20100006215A1 (ja)
EP (1) EP2071639A1 (ja)
JP (1) JP2008205149A (ja)
KR (1) KR20090046783A (ja)
CN (1) CN101496185B (ja)
TW (1) TWI430471B (ja)
WO (1) WO2008102419A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2466633A (en) * 2008-12-12 2010-07-07 Glory Science Co Ltd Method of manufacturing a light emitting unit

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JP5174630B2 (ja) * 2008-11-26 2013-04-03 Ｔｏｗａ株式会社 光学成形品の圧縮成形方法
JP5327042B2 (ja) * 2009-03-26 2013-10-30 豊田合成株式会社 Ｌｅｄランプの製造方法
JP5359732B2 (ja) * 2009-09-18 2013-12-04 豊田合成株式会社 発光装置の製造方法
KR101102912B1 (ko) * 2009-11-05 2012-01-11 삼성전기주식회사 압축 몰딩 시스템
KR101126038B1 (ko) 2010-07-23 2012-03-20 세크론 주식회사 전자 부품 몰딩 장치
KR101190320B1 (ko) 2010-07-23 2012-10-11 세크론 주식회사 전자 부품 몰딩 장치
CN102456813A (zh) * 2010-10-29 2012-05-16 展晶科技(深圳)有限公司 发光二极管及制造方法
CN102779910A (zh) * 2011-05-10 2012-11-14 弘凯光电股份有限公司 发光二极管封装方法
JP5723800B2 (ja) * 2012-02-02 2015-05-27 Ｔｏｗａ株式会社 半導体チップの圧縮樹脂封止成形方法及び装置
KR101345206B1 (ko) 2012-10-23 2013-12-26 한국생산기술연구원 발광 다이오드 패키지 제조용 가압기구 및 이를 사용한 발광 다이오드 패키지 제조방법
CN102922661A (zh) * 2012-11-05 2013-02-13 苏州东山精密制造股份有限公司 一种led模压封装工艺及一种led组件
JP6208967B2 (ja) * 2013-04-03 2017-10-04 アピックヤマダ株式会社 Ｌｅｄ装置の製造方法
KR101504475B1 (ko) * 2013-08-23 2015-03-20 주식회사 지앤아이솔루션 광학 렌즈, 광학 렌즈 제조 장치 및 제조 방법
CN105202507A (zh) * 2015-10-23 2015-12-30 李峰 深水led照明密封结构
CN107437577A (zh) * 2016-05-25 2017-12-05 孔东灿 一种发光二极管芯片的封胶方法
KR102543179B1 (ko) * 2016-08-22 2023-06-14 삼성전자주식회사 발광다이오드 모듈 제조방법
CN109177008A (zh) * 2018-09-30 2019-01-11 深圳市华夏光彩股份有限公司 一种用于led模组的灌胶模具及其灌胶方法
US11351744B2 (en) * 2019-03-29 2022-06-07 The Boeing Company Molten extrusion loading for compression molds using chopped prepreg fiber
US11014140B2 (en) * 2019-04-15 2021-05-25 Raytheon Technologies Corporation Ceramic core setter
GB2594998A (en) * 2020-05-15 2021-11-17 Ams Sensors Asia Pte Ltd Wafer level chip scale packaging

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05218508A (ja) * 1992-02-04 1993-08-27 Sharp Corp 光半導体装置の製造方法
JP2005305954A (ja) * 2004-04-26 2005-11-04 Towa Corp 光素子の樹脂封止成形方法
JP2006027098A (ja) * 2004-07-16 2006-02-02 Apic Yamada Corp 樹脂モールド方法および樹脂モールド装置
JP2006106479A (ja) * 2004-10-07 2006-04-20 Towa Corp 透光性部材、光デバイス、及び光デバイスの組立方法
JP2006351970A (ja) * 2005-06-17 2006-12-28 Takara Seisakusho:Kk 樹脂封止型光チップの製造装置及び製造方法

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Publication number Priority date Publication date Assignee Title
US7985357B2 (en) * 2005-07-12 2011-07-26 Towa Corporation Method of resin-sealing and molding an optical device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05218508A (ja) * 1992-02-04 1993-08-27 Sharp Corp 光半導体装置の製造方法
JP2005305954A (ja) * 2004-04-26 2005-11-04 Towa Corp 光素子の樹脂封止成形方法
JP2006027098A (ja) * 2004-07-16 2006-02-02 Apic Yamada Corp 樹脂モールド方法および樹脂モールド装置
JP2006106479A (ja) * 2004-10-07 2006-04-20 Towa Corp 透光性部材、光デバイス、及び光デバイスの組立方法
JP2006351970A (ja) * 2005-06-17 2006-12-28 Takara Seisakusho:Kk 樹脂封止型光チップの製造装置及び製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2466633A (en) * 2008-12-12 2010-07-07 Glory Science Co Ltd Method of manufacturing a light emitting unit

Also Published As

Publication number Publication date
KR20090046783A (ko) 2009-05-11
CN101496185B (zh) 2011-03-30
TWI430471B (zh) 2014-03-11
CN101496185A (zh) 2009-07-29
JP2008205149A (ja) 2008-09-04
TW200901509A (en) 2009-01-01
EP2071639A1 (en) 2009-06-17
US20100006215A1 (en) 2010-01-14

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