WO2008099967A1 - 薄片状化合物 - Google Patents
薄片状化合物 Download PDFInfo
- Publication number
- WO2008099967A1 WO2008099967A1 PCT/JP2008/052916 JP2008052916W WO2008099967A1 WO 2008099967 A1 WO2008099967 A1 WO 2008099967A1 JP 2008052916 W JP2008052916 W JP 2008052916W WO 2008099967 A1 WO2008099967 A1 WO 2008099967A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- compound
- flaky
- flaky compound
- conductive layer
- conductive
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/08—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances oxides
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G23/00—Compounds of titanium
- C01G23/003—Titanates
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G23/00—Compounds of titanium
- C01G23/003—Titanates
- C01G23/005—Alkali titanates
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G33/00—Compounds of niobium
- C01G33/006—Compounds containing, besides niobium, two or more other elements, with the exception of oxygen or hydrogen
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/40—Electric properties
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/42—Magnetic properties
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/252—Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
- Y10T428/294—Coated or with bond, impregnation or core including metal or compound thereof [excluding glass, ceramic and asbestos]
- Y10T428/2942—Plural coatings
- Y10T428/2949—Glass, ceramic or metal oxide in coating
Definitions
- the present invention relates to a flaky compound. Specifically, the present invention relates to a flaky compound used for a conductive film. Background
- JP-A 2 0 0 1-2 7 0 0 2 discloses a flaky compound obtained by exfoliating layered titanium oxide microcrystals. Used as an ultraviolet shielding material.
- An object of the present invention is to provide a flaky compound useful for a conductive film.
- the present invention provides (1) to (7).
- the conductive layer 1 is Ti and the metal element M 1 (M 1 is at least one selected from the group consisting of N b, Ta, Mo, W and Ru) and O
- M 1 is at least one selected from the group consisting of N b, Ta, Mo, W and Ru
- O The flaky compound according to (3), wherein the molar ratio of M ′ / Ti is more than 0 and 1 or less.
- conductive layer is composed of oxygen-defective T I_ ⁇ 2 (3) flake compound according.
- a conductive film comprising the flaky compound according to any one of (1) to (6).
- the flaky compound of the present invention has a conductive layer composed of M and O.
- M is at least one metal element.
- the flaky compound is usually a flaky compound having a thickness of about 0.511111 to about 1 mm 111 and having a major axis divided by the thickness (major axis Z thickness) of about 100 or more. Thickness and major axis are
- the conductive layer is typically on the order of atomic size in thickness, for example, from about 0.5 nm to about 5 nm.
- the flaky compound only needs to have one or more such conductive layers.
- the conductive layer is composed of M and O, and M is selected as follows so that the conductive layer exhibits conductivity.
- M is Sn,! ! Awesome, In Sn,! ! Chobihachi includes single metal elements such as Cu and La, or combinations thereof.
- M is at least a mixed valence
- M is old is an element including a T i indicating the trivalent and tetravalent, suitable conductive layer, Ti and the metal element M 1 (M 1 is selected from the group consisting of Nb, Ta, Mo, W and Ru ) And 0, and a layer in which the molar ratio of MTi is more than 0 and less than 1 can be mentioned.
- M 1 is preferably Nb or Ta.
- the molar ratio of MV ⁇ Ti is preferably 0.0.
- the oxygen-deficient T i 0 2 is used as a suitable conductive layer.
- Oxygen-deficient Ti_ ⁇ 2 specifically, T i 0 2.
- [Delta] (S 0 to a exceeded 0.5 less than 5.) Can be represented by. From the viewpoint of more directly using the flaky composite for a conductive film, ⁇ 5 is preferably more than 0 and 0.25 or less.
- the flaky compound may further have a layer containing an alkali metal element, an alkaline earth metal element, preferably an alkali metal. These may be jobs or combinations.
- the i3 ⁇ 4i method of the flaky compound will be described.
- the flaky compound is formed, for example, by forming a layer using a compound having a conductive layer as a raw material, and peeling the layer, forming a layer using a compound having a non-conductive layer as a raw material, After peeling off, a method of imparting conductivity to the layer may be used.
- the production method will be described by taking as an example a case where M in the flaky compound as a preferred embodiment contains Ti representing trivalent and tetravalent.
- the conductive layer is made of 3 ⁇ 4-containing defective T I_ ⁇ 2, flake compound, for example, step (A1), it may be by a process comprising the thigh this the (A2).
- Compound A A compound having a layer composed of AD Ti and O (hereinafter referred to as Compound A) is used as a raw material, and is subjected to chemical treatment to peel off the flaky compound.
- the acid salt (Cs 2 Ti 5 O u ) can be used.
- These compounds are composed of a layer composed of exactly 1 and 0, and an element selected from an alkali metal element and an alkaline metal element. The layer which consists of.
- the chemical treatment in the step (A1) is performed by collecting the raw material obtained in (A1) and the product obtained by worming the acid ffeK solution such as «, and then grass-curing the resulting product and a base such as ammine. It is to get a colloidal substance by using a chemical compound.
- the content of alkali metal and alkaline earth metal in the flaky compound can be controlled. Specifically, the content of alkali metal and alkaline earth metal in the flaky compound decreases as the acid concentration increases.
- the smaller the content the thinner the flaky compound.
- the larger the content of these the thicker the flaky compound, and the more the layer composed of Ti and 0.
- Examples of the acid i'feK solution include inorganic acids such as, sulfuric acid, and soot; and organic acids such as soot, acetic acid, propionic acid, and the like.
- Examples of the basic compounds include methylamine, ethylamine, n-propylamine, jetylamine, triethylamine, butylamine, pentylamine, hexylamine, octylamine, salts thereof such as ethanolamine, and dietaylamine.
- the layer composed of Ti and O becomes conductive and becomes a conductive layer, and the flaky compound is also given conductivity.
- the treatment is not limited as long as the Ti can be applied to the flaky compound, and the colloidal substance obtained in (A 1) and the S3 ⁇ 4 agent are wormed, and the colloidal substance obtained in (A 1) is dried.
- a heat treatment method in an S3 ⁇ 4 atmosphere for example, a nitrogen atmosphere containing 1 to 10 # 3 ⁇ 4% hydrogen.
- a film is formed by applying a colloidal substance to the substrate, and the film is dried. By processing it, it becomes a guide sickle.
- the heat treatment is usually from room temperature (about 25 ° C.) to about 800 ° C.
- shelves can be used as substrates. If the flaky compound has transparency, the use of a transparent substrate increases the value of the transparent conductive film.
- Specific examples of shelves that make up the effect film include polyethylene (low density, high density), ethylene-propylene copolymer, ethylene-butene copolymer, ethylene-hexene copolymer, ethylene Polyolefin resins such as kuten copolymer, ethylene-norbornene copolymer, ethylene-dmon copolymer, polypropylene, ethylene-vinyl acetate copolymer, ethylene-methyl methacrylate copolymer, ionomer resin; Polyester shelves such as rate, polybutylene terephthalate, polyethylene naphthalate; Nylon-6, Nylon 1, 6, 6, Metaxylenediamine-Adipine orchid polymer; Amide resin such as polymethylmethacrylamide; Polymethyl methacrylate, etc.
- Acrylic resin such as styrene, styrene-acrylonitrile copolymer, styrene-acrylonitrile-butadiene copolymer, polyacrylonitrile, etc. 3 ⁇ 4] ⁇ cellulose resin such as tri-awake cellulose, cellulose diacetate, etc.
- Halogenated resins such as polyvinyl chloride, polyvinylidene chloride, polyvinylidene fluoride, and polytetrafluoroethylene
- hydrogen bonding resins such as polyvinyl alcohol, ethylene-vinyl alcohol copolymer, cellulose derivatives
- polycarbonate resin polysulfone resin Films of engineering plastics such as polyester sulfone resin, polyester ether ketone resin, polyphenylene oxide, polymethylene oxide shelf, polyarylate shelf, liquid crystal resin, etc. It is.
- polyolefin resins such as ethylene-norbornene copolymer and ethylene-monmon copolymer
- polyester resins such as polyethylene terephthalate and polyethylene naphthalate
- Polycarbonate resin Polysulfone resin
- Polyethersulfone resin Polyetheretherketone resin
- Polyphenylene oxide A film having an emphasis on engineering plastic shelves such as transcribing, polymethylene oxide and liquid crystal resin is preferred.
- the conductive layer is composed of Ti and a metal element M 1 (M 1 is at least one selected from the group consisting of Nb, Ta, Mo, W and Ru) and O.
- M 1 is at least one selected from the group consisting of Nb, Ta, Mo, W and Ru
- the flaky compound may be Mi by a method including, for example, the step (B1).
- (B 1) A compound comprising a layer composed of T i and the metal elements M 1 and O and having a molar ratio of M ′ / T i in the above range (hereinafter, the compound is used as a raw material and is subjected to chemical treatment. Peel off the flaky compound.
- a compound in which “ ⁇ of Ti in the compound A is substituted with M 1 and the molar ratio of M 1 ZT i is in the above range may be used.
- K a8 T i A compound represented by Ma! C ⁇ may be used, and the chemical treatment in the step (B1) may be performed in the same manner as the chemical treatment in the step (A 1).
- the flaky compound may be subjected to the reduction treatment in the step (A2). Further, a conductive film may be obtained by applying the colloidal substance in the step (B1) to the substrate to form a film, and drying the film. Further, if the heat treatment is performed in an atmosphere, the conductive film can be made more conductive. An electrically conductive film having an improved thickness can be obtained.
- a compound represented by Ka8Ti LS 0 4 -a (0 ⁇ ⁇ 0 ⁇ 9) and having no ⁇ 1 instead of the compound B in the step (B 1) the conductive layer but flake compound comprising an oxygen-deficient T i0 2 is obtained.
- the flaky compound is useful as a conductive filler, and is usually used in a mixture with embellishment.
- Applications of conductive fillers include, for example, display 'personal computer' ⁇ -deprocessor, CD player, MD player, DVD player, headphone stereo, mobile phone, PHS, PDA (electronic hand !! Mobile information terminal). Walkie-talkie.
- Video camera Digital camera 'Camera' Electrophotographic photocopier ⁇ Printer ⁇ Facsimile coating Paints for fabrics, structural parts or packaging materials, sheets for semiconductor elements, films, trays, carriers, wafer baskets or packages, electronic parts or concealed items, conductive worktables, flat package type IC leads Less chip carrier type ICs ⁇ Connectors such as flexible printed circuit boards or anisotropic conductive films, for electrical connection of printed circuit boards ⁇ Conductivity for pattern formation 'Electrical best, inductors &capacitors' resonators, etc. Conductives for ceramics structures' [raw pastes, LCDs, electrochromic, electroluminescent luminescence, solar cells, light control films, antistatics for display electronics components such as optical shutters, etc.
- conductive films made of flaky compounds are used as display elements (liquid crystal displays).
- LCD liquid crystal display
- PDP plasma display
- EL electroluminescence element
- various light receiving eaves such as solar cells, light emitting eaves, transistors, electrodes of electronic devices such as lasers, etc.
- various heat-resistant reflective films for automobiles and buildings, anti-static ih, and freezing anti-fogging books such as refrigerated showcases can be mentioned.
- a colloidal material is obtained in the same manner as in Example 1 except that a tetrabutylammonium aqueous solution is used instead of the dimethyl etheramine aqueous solution.
- a substrate obtained by immersing a glass substrate in an aqueous solution of poly (diaryldimethylammonium chloride) and washing with pure water is immersed in a colloidal substance and pulled up to form a colloidal substance in the form of a film on the substrate. Wash with. The operation of immersing, pulling up and washing is repeated 5 times, and nitrogen gas is blown and dried to obtain lead.
- K 2 C0 3 potassium carbonate
- titanium dioxide Ti 0 2
- K as Ti u 0 4 — ⁇ (0 ⁇ ⁇ 0.9) is obtained by annealing at 1100 ° C in an atmosphere of nitrogen containing ⁇ %.
- K. . 8 T i u ⁇ 4 — s (0 ⁇ ⁇ 0. 9) is sprinkled in a 3.5% aqueous solution.
- the resulting product is collected and dried to obtain a dried product.
- a colloidal substance is obtained by stirring worms and dimethyl etheramine while stirring them.
- a sickle obtained by immersing a glass substrate in an aqueous solution of poly (diaryldimethylammonium chloride) and washing with a colloidal material is crushed and pulled up to form a colloidal material in the form of a film on the substrate. Wash with water. Dipping, pulling up, and washing operations are repeated 5 times, and nitrogen gas is blown into the thighs to obtain a conductive film.
- K 2 C 3 potassium carbonate
- Li i 2 C 0 3 lithium carbonate
- titanium dioxide T i 0 2
- the flaky compound of the present invention is suitably used for induction.
- the flaky compound can be obtained by a simple method and an inexpensive method.
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geology (AREA)
- Conductive Materials (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Paints Or Removers (AREA)
- Non-Insulated Conductors (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/525,745 US8119232B2 (en) | 2007-02-16 | 2008-02-14 | Flake compound |
CN2008800048569A CN101611458B (zh) | 2007-02-16 | 2008-02-14 | 薄片状化合物 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-035907 | 2007-02-16 | ||
JP2007035907A JP2008204632A (ja) | 2007-02-16 | 2007-02-16 | 薄片状化合物 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008099967A1 true WO2008099967A1 (ja) | 2008-08-21 |
Family
ID=39690187
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/052916 WO2008099967A1 (ja) | 2007-02-16 | 2008-02-14 | 薄片状化合物 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8119232B2 (ja) |
JP (1) | JP2008204632A (ja) |
CN (1) | CN101611458B (ja) |
TW (1) | TW200849283A (ja) |
WO (1) | WO2008099967A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5376822B2 (ja) * | 2007-04-16 | 2013-12-25 | 花王株式会社 | 透明導電膜の製造方法 |
WO2014183036A1 (en) | 2013-05-10 | 2014-11-13 | University Of Houston System | Non-lithium metal ion battery electrode material architecture |
JP6445332B2 (ja) * | 2015-01-13 | 2018-12-26 | 大塚化学株式会社 | レピドクロサイト型チタン酸塩及びその製造方法、それを含有する無機複合材、樹脂組成物並びに摩擦材 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61197422A (ja) * | 1985-02-27 | 1986-09-01 | Otsuka Chem Co Ltd | 導電性チタン酸アルカリ金属塩及び製法 |
JPH02221106A (ja) * | 1989-02-21 | 1990-09-04 | Mitsubishi Electric Corp | 金属酸化物系イオン導電体の製法 |
JPH10340629A (ja) * | 1997-06-06 | 1998-12-22 | Sumitomo Osaka Cement Co Ltd | 透明導電膜付き基板およびその製造方法 |
JP2006291065A (ja) * | 2005-04-12 | 2006-10-26 | Kaneka Corp | 高分子組成物およびそれからなる高分子フィルム並びに高分子電解質膜 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3513589B2 (ja) | 2000-03-24 | 2004-03-31 | 独立行政法人物質・材料研究機構 | チタニア超薄膜およびその製造方法 |
EP1419994B1 (en) | 2001-08-20 | 2009-02-18 | Otsuka Chemical Company, Limited | Layered titanic acid; lamellar titanic acid; lamellar titanium oxide and method for producing lamellar titanic acid |
DE60238931D1 (de) * | 2001-10-29 | 2011-02-24 | Otsuka Chemical Co Ltd | Lithiumkaliumtitanat vom lepidocrocit-typ, herstellungsverfahren dafür und reibungsmaterial |
AU2003252512B2 (en) | 2002-07-23 | 2006-09-14 | Otsuka Chemical Co., Ltd. | Electroconductive compound in flake form and electroconductive composition |
JP4831595B2 (ja) | 2005-01-24 | 2011-12-07 | 独立行政法人物質・材料研究機構 | 磁気光学材料、磁気光学材料の製造方法、及び磁気光学材料を用いた磁気光学素子 |
JP5051978B2 (ja) | 2005-01-31 | 2012-10-17 | 大塚化学株式会社 | チタン酸膜コーティング樹脂基板の製造方法 |
-
2007
- 2007-02-16 JP JP2007035907A patent/JP2008204632A/ja active Pending
-
2008
- 2008-02-14 US US12/525,745 patent/US8119232B2/en not_active Expired - Fee Related
- 2008-02-14 WO PCT/JP2008/052916 patent/WO2008099967A1/ja active Application Filing
- 2008-02-14 CN CN2008800048569A patent/CN101611458B/zh not_active Expired - Fee Related
- 2008-02-15 TW TW097105298A patent/TW200849283A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61197422A (ja) * | 1985-02-27 | 1986-09-01 | Otsuka Chem Co Ltd | 導電性チタン酸アルカリ金属塩及び製法 |
JPH02221106A (ja) * | 1989-02-21 | 1990-09-04 | Mitsubishi Electric Corp | 金属酸化物系イオン導電体の製法 |
JPH10340629A (ja) * | 1997-06-06 | 1998-12-22 | Sumitomo Osaka Cement Co Ltd | 透明導電膜付き基板およびその製造方法 |
JP2006291065A (ja) * | 2005-04-12 | 2006-10-26 | Kaneka Corp | 高分子組成物およびそれからなる高分子フィルム並びに高分子電解質膜 |
Also Published As
Publication number | Publication date |
---|---|
US20100062280A1 (en) | 2010-03-11 |
TW200849283A (en) | 2008-12-16 |
CN101611458A (zh) | 2009-12-23 |
JP2008204632A (ja) | 2008-09-04 |
US8119232B2 (en) | 2012-02-21 |
CN101611458B (zh) | 2012-06-20 |
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