WO2008087902A1 - 硫酸の電解装置、電解方法及び基板の処理装置 - Google Patents

硫酸の電解装置、電解方法及び基板の処理装置 Download PDF

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Publication number
WO2008087902A1
WO2008087902A1 PCT/JP2008/050263 JP2008050263W WO2008087902A1 WO 2008087902 A1 WO2008087902 A1 WO 2008087902A1 JP 2008050263 W JP2008050263 W JP 2008050263W WO 2008087902 A1 WO2008087902 A1 WO 2008087902A1
Authority
WO
WIPO (PCT)
Prior art keywords
sulfuric acid
electrolysis
chamber
cathode
anode
Prior art date
Application number
PCT/JP2008/050263
Other languages
English (en)
French (fr)
Inventor
Nobuo Kobayashi
Yukihiro Shibata
Naoya Hayamizu
Masaaki Kato
Original Assignee
Shibaura Mechatronics Corporation
Kabushiki Kaisha Toshiba
Chlorine Engineers Corp., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corporation, Kabushiki Kaisha Toshiba, Chlorine Engineers Corp., Ltd. filed Critical Shibaura Mechatronics Corporation
Priority to CN200880000338XA priority Critical patent/CN101542020B/zh
Priority to JP2008533807A priority patent/JP4734416B2/ja
Publication of WO2008087902A1 publication Critical patent/WO2008087902A1/ja
Priority to US12/274,681 priority patent/US8236161B2/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B1/00—Electrolytic production of inorganic compounds or non-metals
    • C25B1/01—Products
    • C25B1/28—Per-compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B1/00—Electrolytic production of inorganic compounds or non-metals
    • C25B1/01—Products
    • C25B1/28—Per-compounds
    • C25B1/29—Persulfates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Abstract

　隔膜（４）によって陰電極（５ａ）が設けられた陰極室（５）と陽電極（６ａ）が設けられた陽極室（６）とが隔別形成された電解槽（１）と、硫酸が貯えられる硫酸タンクと、硫酸タンクと陰極室の流入口を接続した給液管（１４）と、陰極室の流出口と陽極室の流入口を接続した接続管（１７）と、給液管に設けられ硫酸タンクの硫酸を陰極室に給液管を通じて供給する第１の供給ポンプ（１３）と、陽極室の流出口に接続され電気分解によって陽極室で生成された酸化性の化学種を含む溶液を貯液槽に供給する排出管（１８）とを具備する。
PCT/JP2008/050263 2007-01-15 2008-01-11 硫酸の電解装置、電解方法及び基板の処理装置 WO2008087902A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN200880000338XA CN101542020B (zh) 2007-01-15 2008-01-11 硫酸的电解装置、电解方法和基板的处理装置
JP2008533807A JP4734416B2 (ja) 2007-01-15 2008-01-11 硫酸の電解装置、電解方法及び基板の処理装置
US12/274,681 US8236161B2 (en) 2007-01-15 2008-11-20 Apparatus for electrolyzing sulfuric acid, method of performing electrolysis, and apparatus for processing a substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007006017 2007-01-15
JP2007-006017 2007-01-15

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/274,681 Continuation US8236161B2 (en) 2007-01-15 2008-11-20 Apparatus for electrolyzing sulfuric acid, method of performing electrolysis, and apparatus for processing a substrate

Publications (1)

Publication Number Publication Date
WO2008087902A1 true WO2008087902A1 (ja) 2008-07-24

Family

ID=39635906

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050263 WO2008087902A1 (ja) 2007-01-15 2008-01-11 硫酸の電解装置、電解方法及び基板の処理装置

Country Status (6)

Country Link
US (1) US8236161B2 (ja)
JP (1) JP4734416B2 (ja)
KR (1) KR101082812B1 (ja)
CN (1) CN101542020B (ja)
TW (1) TWI439571B (ja)
WO (1) WO2008087902A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011155336A1 (ja) * 2010-06-07 2011-12-15 栗田工業株式会社 洗浄システムおよび洗浄方法
WO2012121270A1 (ja) * 2011-03-08 2012-09-13 クロリンエンジニアズ株式会社 硫酸電解装置及び硫酸電解方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9142424B2 (en) * 2010-06-07 2015-09-22 Kurita Water Industries Ltd. Cleaning system and cleaning method
TW201207155A (en) * 2010-08-11 2012-02-16 Prometheus Energy Technology Co Electrolysis device for producing oxyhydrogen gas
US8992691B2 (en) 2011-04-05 2015-03-31 International Business Machines Corporation Partial solution replacement in recyclable persulfuric acid cleaning systems
US9831016B2 (en) * 2012-11-29 2017-11-28 Abb Schweiz Ag Stripping structure and method for removing enamel insulation from lead ends
JP5667674B1 (ja) * 2013-08-20 2015-02-12 サーモス株式会社 金属容器を洗浄する洗浄装置
JP6359925B2 (ja) * 2014-09-18 2018-07-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6861039B2 (ja) * 2016-03-30 2021-04-21 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
EP3680364B1 (en) * 2017-09-07 2022-01-05 De Nora Permelec Ltd Electrolytic device
KR102346529B1 (ko) * 2019-06-24 2021-12-31 세메스 주식회사 액 공급 유닛, 그리고 이를 가지는 기판 처리 장치 및 방법
KR102319966B1 (ko) * 2019-12-31 2021-11-02 세메스 주식회사 액 공급 유닛, 기판 처리 장치, 그리고 기판 처리 장치를 이용한 기판 처리 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11269685A (ja) * 1998-03-18 1999-10-05 Permelec Electrode Ltd 不溶性金属電極の製造方法及び該電極を使用する電解槽
JP2004532352A (ja) * 2001-04-27 2004-10-21 アイレンブルガー エレクトロリーゼ− ウント ウムヴェルトテヒニク ゲゼルシャフト ミット ベシュレンクテル ハフツング 亜二チオン酸ナトリウム及びペルオキソ二硫酸ナトリウムを電気化学的に同時に製造する方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT310100B (de) * 1970-12-07 1973-09-10 Hartkorn Karl Heinz Verfahren zur Reinigung von wässerigen Flüssigkeiten, die mit störenden Stoffen belastet sind
CA1059943A (en) * 1976-07-20 1979-08-07 Pierre L. Claessens Electrolytically forming peroxosulfuric acid to oxidize organic material in sulfuric acid
JP3277404B2 (ja) * 1993-03-31 2002-04-22 ソニー株式会社 基板洗浄方法及び基板洗浄装置
DE19954299A1 (de) 1999-11-11 2001-05-17 Eilenburger Elektrolyse & Umwelttechnik Gmbh Verfahren zur gleichzeitigen elektrochemischen Herstellung von Natriumdithionit und Natriumperoxodisulfat
JP2001192874A (ja) 1999-12-28 2001-07-17 Permelec Electrode Ltd 過硫酸溶解水の製造方法
KR100684064B1 (ko) * 2002-04-02 2007-02-16 페르메렉덴꾜꾸가부시끼가이샤 기능수, 및 이의 제조방법 및 제조장치
JP4194027B2 (ja) 2002-12-05 2008-12-10 日本化学工業株式会社 リチウム二次電池正極活物質用コバルト酸リチウムの製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11269685A (ja) * 1998-03-18 1999-10-05 Permelec Electrode Ltd 不溶性金属電極の製造方法及び該電極を使用する電解槽
JP2004532352A (ja) * 2001-04-27 2004-10-21 アイレンブルガー エレクトロリーゼ− ウント ウムヴェルトテヒニク ゲゼルシャフト ミット ベシュレンクテル ハフツング 亜二チオン酸ナトリウム及びペルオキソ二硫酸ナトリウムを電気化学的に同時に製造する方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011155336A1 (ja) * 2010-06-07 2011-12-15 栗田工業株式会社 洗浄システムおよび洗浄方法
JP5751426B2 (ja) * 2010-06-07 2015-07-22 栗田工業株式会社 洗浄システムおよび洗浄方法
WO2012121270A1 (ja) * 2011-03-08 2012-09-13 クロリンエンジニアズ株式会社 硫酸電解装置及び硫酸電解方法
JP5997130B2 (ja) * 2011-03-08 2016-09-28 デノラ・ペルメレック株式会社 硫酸電解装置及び硫酸電解方法

Also Published As

Publication number Publication date
TW200844263A (en) 2008-11-16
US20090078582A1 (en) 2009-03-26
TWI439571B (zh) 2014-06-01
JPWO2008087902A1 (ja) 2010-05-06
KR101082812B1 (ko) 2011-11-11
JP4734416B2 (ja) 2011-07-27
CN101542020A (zh) 2009-09-23
KR20090039676A (ko) 2009-04-22
CN101542020B (zh) 2011-02-16
US8236161B2 (en) 2012-08-07

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