WO2008081836A1 - 発光素子封止用樹脂組成物およびランプ - Google Patents

発光素子封止用樹脂組成物およびランプ Download PDF

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Publication number
WO2008081836A1
WO2008081836A1 PCT/JP2007/075014 JP2007075014W WO2008081836A1 WO 2008081836 A1 WO2008081836 A1 WO 2008081836A1 JP 2007075014 W JP2007075014 W JP 2007075014W WO 2008081836 A1 WO2008081836 A1 WO 2008081836A1
Authority
WO
WIPO (PCT)
Prior art keywords
emitting device
lamp
resin composition
light
sealing unit
Prior art date
Application number
PCT/JP2007/075014
Other languages
English (en)
French (fr)
Inventor
Tomoyuki Takei
Hiroshi Uchida
Original Assignee
Showa Denko K.K.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007146749A external-priority patent/JP2008179756A/ja
Application filed by Showa Denko K.K. filed Critical Showa Denko K.K.
Priority to US12/303,347 priority Critical patent/US7901785B2/en
Publication of WO2008081836A1 publication Critical patent/WO2008081836A1/ja

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/22—Cyclic ethers having at least one atom other than carbon and hydrogen outside the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

　本発明の発光素子封止用樹脂組成物は、二つ以上のオキセタニル基を含有するシルセスキオキサン樹脂と、カチオン重合開始剤と、金属酸化物微粒子とを含有する発光素子封止用樹脂組成物である。また、本発明のランプは、封止部を備えたパッケージと、前記封止部の底部に露出された電極と、前記底部に配置され、前記電極と電気的に接続された発光素子とを備え、前記封止部内に充填された前記発光素子封止用樹脂組成物によって前記発光素子が封止されるランプである。
PCT/JP2007/075014 2006-12-28 2007-12-26 発光素子封止用樹脂組成物およびランプ WO2008081836A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/303,347 US7901785B2 (en) 2006-12-28 2007-12-26 Resin composition for sealing light-emitting device and lamp

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2006356533 2006-12-28
JP2006-356533 2006-12-28
JP2007-146749 2007-06-01
JP2007146749A JP2008179756A (ja) 2006-12-28 2007-06-01 発光素子封止用樹脂組成物およびランプ

Publications (1)

Publication Number Publication Date
WO2008081836A1 true WO2008081836A1 (ja) 2008-07-10

Family

ID=39588518

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/075014 WO2008081836A1 (ja) 2006-12-28 2007-12-26 発光素子封止用樹脂組成物およびランプ

Country Status (1)

Country Link
WO (1) WO2008081836A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101794855B (zh) * 2009-01-30 2013-04-03 日亚化学工业株式会社 半导体发光装置及半导体发光装置的制造方法
WO2019187988A1 (ja) * 2018-03-28 2019-10-03 日本板硝子株式会社 樹脂組成物の硬化物、積層体、及び樹脂組成物

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05315652A (ja) * 1992-04-02 1993-11-26 Nec Corp 光半導体装置
JP2005089601A (ja) * 2003-09-17 2005-04-07 Stanley Electric Co Ltd 熱硬化性樹脂組成物、該熱硬化性樹脂組成物で発光素子を封止した発光ダイオードおよび色変換型発光ダイオード
JP2005161111A (ja) * 2003-11-28 2005-06-23 Jsr Corp ジルコニア粒子分散液、その製造方法及び光硬化性組成物
JP2005290141A (ja) * 2004-03-31 2005-10-20 Nippon Steel Chem Co Ltd オキセタン樹脂組成物
JP2006111823A (ja) * 2004-10-18 2006-04-27 Nitto Denko Corp 光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置
JP2006176586A (ja) * 2004-12-21 2006-07-06 Sumitomo Bakelite Co Ltd 透明複合体組成物及び光学シート並びに表示素子用プラスチック基板
JP2007001995A (ja) * 2005-06-21 2007-01-11 Nippon Futsuso Kogyo Kk コーティング層および塗料
JP2007217242A (ja) * 2006-02-17 2007-08-30 Sumitomo Osaka Cement Co Ltd 無機酸化物透明分散液と透明複合体、発光素子封止用組成物及び発光素子並びに透明複合体の製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05315652A (ja) * 1992-04-02 1993-11-26 Nec Corp 光半導体装置
JP2005089601A (ja) * 2003-09-17 2005-04-07 Stanley Electric Co Ltd 熱硬化性樹脂組成物、該熱硬化性樹脂組成物で発光素子を封止した発光ダイオードおよび色変換型発光ダイオード
JP2005161111A (ja) * 2003-11-28 2005-06-23 Jsr Corp ジルコニア粒子分散液、その製造方法及び光硬化性組成物
JP2005290141A (ja) * 2004-03-31 2005-10-20 Nippon Steel Chem Co Ltd オキセタン樹脂組成物
JP2006111823A (ja) * 2004-10-18 2006-04-27 Nitto Denko Corp 光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置
JP2006176586A (ja) * 2004-12-21 2006-07-06 Sumitomo Bakelite Co Ltd 透明複合体組成物及び光学シート並びに表示素子用プラスチック基板
JP2007001995A (ja) * 2005-06-21 2007-01-11 Nippon Futsuso Kogyo Kk コーティング層および塗料
JP2007217242A (ja) * 2006-02-17 2007-08-30 Sumitomo Osaka Cement Co Ltd 無機酸化物透明分散液と透明複合体、発光素子封止用組成物及び発光素子並びに透明複合体の製造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101794855B (zh) * 2009-01-30 2013-04-03 日亚化学工业株式会社 半导体发光装置及半导体发光装置的制造方法
WO2019187988A1 (ja) * 2018-03-28 2019-10-03 日本板硝子株式会社 樹脂組成物の硬化物、積層体、及び樹脂組成物
JP6606316B1 (ja) * 2018-03-28 2019-11-13 日本板硝子株式会社 樹脂組成物の硬化物、積層体、及び樹脂組成物
CN111918899A (zh) * 2018-03-28 2020-11-10 日本板硝子株式会社 树脂组合物的固化物、层积体以及树脂组合物
CN111918899B (zh) * 2018-03-28 2023-05-16 日本板硝子株式会社 树脂组合物的固化物、层积体以及树脂组合物
US11912870B2 (en) 2018-03-28 2024-02-27 Nippon Sheet Glass Company, Limited Cured product of resin composition, laminate, and resin composition

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