WO2008078770A1 - 力学量センサおよびその製造方法 - Google Patents
力学量センサおよびその製造方法 Download PDFInfo
- Publication number
- WO2008078770A1 WO2008078770A1 PCT/JP2007/074938 JP2007074938W WO2008078770A1 WO 2008078770 A1 WO2008078770 A1 WO 2008078770A1 JP 2007074938 W JP2007074938 W JP 2007074938W WO 2008078770 A1 WO2008078770 A1 WO 2008078770A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- displacing
- quantity sensor
- mechanical quantity
- manufacturing
- same
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/097—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by vibratory elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
- G01C19/5733—Structural details or topology
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
- G01C19/5769—Manufacturing; Mounting; Housings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C25/00—Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/084—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
- G01P2015/0842—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass the mass being of clover leaf shape
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Manufacturing & Machinery (AREA)
- Pressure Sensors (AREA)
- Gyroscopes (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP07860167.1A EP2096407B1 (en) | 2006-12-27 | 2007-12-26 | Angular velocity and/or acceleration sensor and method for manufacturing the same |
US12/520,343 US8216870B2 (en) | 2006-12-27 | 2007-12-26 | Mechanical quantity sensor and method of manufacturing the same |
JP2008551132A JP5176965B2 (ja) | 2006-12-27 | 2007-12-26 | 力学量センサの製造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006-352488 | 2006-12-27 | ||
JP2006352488 | 2006-12-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008078770A1 true WO2008078770A1 (ja) | 2008-07-03 |
Family
ID=39562560
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/074938 WO2008078770A1 (ja) | 2006-12-27 | 2007-12-26 | 力学量センサおよびその製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8216870B2 (ja) |
EP (1) | EP2096407B1 (ja) |
JP (1) | JP5176965B2 (ja) |
WO (1) | WO2008078770A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010060337A (ja) * | 2008-09-02 | 2010-03-18 | Dainippon Printing Co Ltd | 力学量センサおよび積層体の製造方法 |
JP2010141088A (ja) * | 2008-12-11 | 2010-06-24 | Dainippon Printing Co Ltd | 封止型デバイス、物理量センサ、その製造方法、及びその内部圧力制御方法 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5724342B2 (ja) | 2009-12-10 | 2015-05-27 | 大日本印刷株式会社 | パターン配置方法並びにシリコンウェハ及び半導体デバイスの製造方法 |
WO2016015029A1 (en) * | 2014-07-24 | 2016-01-28 | Spec Sensors, Llc | Electrochemical sensors and packaging and related methods |
US10761046B2 (en) | 2010-11-24 | 2020-09-01 | Sensirion Ag | Electrochemical sensors and packaging and related methods |
JP5541306B2 (ja) | 2011-05-27 | 2014-07-09 | 株式会社デンソー | 力学量センサ装置およびその製造方法 |
US10108649B2 (en) * | 2014-02-25 | 2018-10-23 | Internatonal Business Machines Corporation | Early exit from table scans of loosely ordered and/or grouped relations using nearly ordered maps |
Citations (8)
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---|---|---|---|---|
JPH10213441A (ja) * | 1997-01-29 | 1998-08-11 | Murata Mfg Co Ltd | 外力検出装置およびその製造方法 |
US6266862B1 (en) | 1997-03-14 | 2001-07-31 | Chicago Bridge & Iron Company | Weld seam opening regulator for cylindrical tank building process |
JP2002350138A (ja) | 2001-05-28 | 2002-12-04 | Wacoh Corp | 加速度と角速度との双方を検出する装置 |
WO2004003936A1 (ja) * | 2002-06-28 | 2004-01-08 | Sumitomo Precision Products Co., Ltd. | 可動電気回路用導電体および振動式ジャイロ |
JP2004012326A (ja) * | 2002-06-07 | 2004-01-15 | Hiroaki Niitsuma | 物理量検出器及び物理量検出器の製造方法 |
JP2004361394A (ja) * | 2003-05-13 | 2004-12-24 | Seiko Instruments Inc | 容量型力学量センサ |
JP2006329885A (ja) * | 2005-05-27 | 2006-12-07 | Dainippon Printing Co Ltd | 角速度センサおよびその製造方法 |
JP2006344573A (ja) * | 2005-05-13 | 2006-12-21 | Gunma Prefecture | 加速度スイッチ及び電子装置 |
Family Cites Families (30)
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US5233213A (en) * | 1990-07-14 | 1993-08-03 | Robert Bosch Gmbh | Silicon-mass angular acceleration sensor |
US5461916A (en) * | 1992-08-21 | 1995-10-31 | Nippondenso Co., Ltd. | Mechanical force sensing semiconductor device |
JPH08304450A (ja) * | 1995-05-12 | 1996-11-22 | Zexel Corp | 加速度センサ及び加速度センサの製造方法 |
FR2732467B1 (fr) * | 1995-02-10 | 1999-09-17 | Bosch Gmbh Robert | Capteur d'acceleration et procede de fabrication d'un tel capteur |
DE19632060B4 (de) | 1996-08-09 | 2012-05-03 | Robert Bosch Gmbh | Verfahren zur Herstellung eines Drehratensensors |
DE10066435B4 (de) * | 1999-07-26 | 2012-03-08 | Denso Corporation | Halbleitersensor für eine physikalische Größe |
US6400009B1 (en) * | 1999-10-15 | 2002-06-04 | Lucent Technologies Inc. | Hermatic firewall for MEMS packaging in flip-chip bonded geometry |
US6973829B2 (en) * | 2000-08-29 | 2005-12-13 | Denso Corporation | Semiconductor dynamic quantity sensor with movable electrode and fixed electrode supported by support substrate |
JP4248222B2 (ja) * | 2002-10-24 | 2009-04-02 | 株式会社ワコー | 角速度センサ |
US7394138B2 (en) * | 2003-05-22 | 2008-07-01 | Seiko Instruments Inc. | Capacitance-type dynamic-quantity sensor and manufacturing method therefor |
EP1491901A1 (en) | 2003-06-25 | 2004-12-29 | Matsushita Electric Works, Ltd. | Semiconductor acceleration sensor and method of manufacturing the same |
JP2005049209A (ja) * | 2003-07-28 | 2005-02-24 | Matsushita Electric Works Ltd | 角速度センサ及びその製造方法 |
JP2005221450A (ja) * | 2004-02-09 | 2005-08-18 | Yamaha Corp | 物理量センサ |
US7042076B2 (en) * | 2004-03-09 | 2006-05-09 | Northrop Grumman Corporation | Vacuum sealed microdevice packaging with getters |
JP4989037B2 (ja) * | 2004-04-05 | 2012-08-01 | セイコーインスツル株式会社 | 容量型力学量センサおよび半導体装置 |
US7178400B2 (en) * | 2004-04-14 | 2007-02-20 | Denso Corporation | Physical quantity sensor having multiple through holes |
US20050253283A1 (en) * | 2004-05-13 | 2005-11-17 | Dcamp Jon B | Getter deposition for vacuum packaging |
JP4445340B2 (ja) * | 2004-08-02 | 2010-04-07 | セイコーインスツル株式会社 | 封止型mems及び封止型memsの製造方法 |
JP2006153481A (ja) * | 2004-11-25 | 2006-06-15 | Seiko Instruments Inc | 力学量センサ |
JP2006226770A (ja) * | 2005-02-16 | 2006-08-31 | Seiko Instruments Inc | 力学量センサ |
JP4610447B2 (ja) * | 2005-08-31 | 2011-01-12 | Okiセミコンダクタ株式会社 | 半導体装置とその製造方法及び検査方法 |
JP4979283B2 (ja) * | 2006-06-29 | 2012-07-18 | 株式会社日立製作所 | 半導体装置の製造方法および半導体装置 |
JP2008008820A (ja) * | 2006-06-30 | 2008-01-17 | Hitachi Ltd | 慣性センサおよびその製造方法 |
JP4972350B2 (ja) * | 2006-06-30 | 2012-07-11 | 株式会社日立製作所 | 半導体装置の製造方法 |
WO2008029654A1 (en) * | 2006-09-06 | 2008-03-13 | Hitachi Metals, Ltd. | Semiconductor sensor device and method for manufacturing same |
US8329491B2 (en) * | 2006-11-20 | 2012-12-11 | Dai Nippon Printing Co., Ltd. | Mechanical quantity sensor and method of manufacturing the same |
JP4792143B2 (ja) * | 2007-02-22 | 2011-10-12 | 株式会社デンソー | 半導体装置およびその製造方法 |
JP4994098B2 (ja) * | 2007-04-25 | 2012-08-08 | 株式会社リコー | 半導体センサ及びその製造方法 |
JP4924238B2 (ja) * | 2007-06-26 | 2012-04-25 | 大日本印刷株式会社 | 角速度センサの製造方法 |
JP2009008438A (ja) * | 2007-06-26 | 2009-01-15 | Dainippon Printing Co Ltd | 角速度センサおよびその製造方法 |
-
2007
- 2007-12-26 JP JP2008551132A patent/JP5176965B2/ja not_active Expired - Fee Related
- 2007-12-26 WO PCT/JP2007/074938 patent/WO2008078770A1/ja active Application Filing
- 2007-12-26 EP EP07860167.1A patent/EP2096407B1/en not_active Not-in-force
- 2007-12-26 US US12/520,343 patent/US8216870B2/en not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10213441A (ja) * | 1997-01-29 | 1998-08-11 | Murata Mfg Co Ltd | 外力検出装置およびその製造方法 |
US6266862B1 (en) | 1997-03-14 | 2001-07-31 | Chicago Bridge & Iron Company | Weld seam opening regulator for cylindrical tank building process |
JP2002350138A (ja) | 2001-05-28 | 2002-12-04 | Wacoh Corp | 加速度と角速度との双方を検出する装置 |
JP2004012326A (ja) * | 2002-06-07 | 2004-01-15 | Hiroaki Niitsuma | 物理量検出器及び物理量検出器の製造方法 |
WO2004003936A1 (ja) * | 2002-06-28 | 2004-01-08 | Sumitomo Precision Products Co., Ltd. | 可動電気回路用導電体および振動式ジャイロ |
JP2004361394A (ja) * | 2003-05-13 | 2004-12-24 | Seiko Instruments Inc | 容量型力学量センサ |
JP2006344573A (ja) * | 2005-05-13 | 2006-12-21 | Gunma Prefecture | 加速度スイッチ及び電子装置 |
JP2006329885A (ja) * | 2005-05-27 | 2006-12-07 | Dainippon Printing Co Ltd | 角速度センサおよびその製造方法 |
Non-Patent Citations (1)
Title |
---|
See also references of EP2096407A4 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010060337A (ja) * | 2008-09-02 | 2010-03-18 | Dainippon Printing Co Ltd | 力学量センサおよび積層体の製造方法 |
JP2010141088A (ja) * | 2008-12-11 | 2010-06-24 | Dainippon Printing Co Ltd | 封止型デバイス、物理量センサ、その製造方法、及びその内部圧力制御方法 |
Also Published As
Publication number | Publication date |
---|---|
EP2096407B1 (en) | 2016-11-16 |
EP2096407A1 (en) | 2009-09-02 |
EP2096407A4 (en) | 2012-02-29 |
US8216870B2 (en) | 2012-07-10 |
JPWO2008078770A1 (ja) | 2010-04-30 |
US20100083755A1 (en) | 2010-04-08 |
JP5176965B2 (ja) | 2013-04-03 |
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