WO2008078702A1 - 放射線検出器 - Google Patents

放射線検出器 Download PDF

Info

Publication number
WO2008078702A1
WO2008078702A1 PCT/JP2007/074721 JP2007074721W WO2008078702A1 WO 2008078702 A1 WO2008078702 A1 WO 2008078702A1 JP 2007074721 W JP2007074721 W JP 2007074721W WO 2008078702 A1 WO2008078702 A1 WO 2008078702A1
Authority
WO
WIPO (PCT)
Prior art keywords
photoelectric conversion
conversion substrates
gap
radiation detector
substrates
Prior art date
Application number
PCT/JP2007/074721
Other languages
English (en)
French (fr)
Inventor
Shirofumi Yamagishi
Hitoshi Chiyoma
Original Assignee
Kabushiki Kaisha Toshiba
Toshiba Electron Tubes & Devices Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kabushiki Kaisha Toshiba, Toshiba Electron Tubes & Devices Co., Ltd. filed Critical Kabushiki Kaisha Toshiba
Priority to JP2008528277A priority Critical patent/JPWO2008078702A1/ja
Priority to EP07851073.2A priority patent/EP2128651A4/en
Publication of WO2008078702A1 publication Critical patent/WO2008078702A1/ja
Priority to US12/490,462 priority patent/US7772562B2/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16—Measuring radiation intensity
    • G01T1/20—Measuring radiation intensity with scintillation detectors
    • G01T1/2018—Scintillation-photodiode combinations
    • G01T1/20181—Stacked detectors, e.g. for measuring energy and positional information
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16—Measuring radiation intensity
    • G01T1/20—Measuring radiation intensity with scintillation detectors
    • G01T1/2018—Scintillation-photodiode combinations
    • G01T1/20188—Auxiliary details, e.g. casings or cooling
    • G01T1/20189—Damping or insulation against damage, e.g. caused by heat or pressure
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B6/00—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment
    • A61B6/42—Arrangements for detecting radiation specially adapted for radiation diagnosis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers
    • H01L27/14658—X-ray, gamma-ray or corpuscular radiation imagers
    • H01L27/14663—Indirect radiation imagers, e.g. using luminescent members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14665—Imagers using a photoconductor layer
    • H01L27/14676—X-ray, gamma-ray or corpuscular radiation imagers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
    • H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
    • H01L31/115—Devices sensitive to very short wavelength, e.g. X-rays, gamma-rays or corpuscular radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Toxicology (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Molecular Biology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medical Informatics (AREA)
  • Biophysics (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Optics & Photonics (AREA)
  • Pathology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Measurement Of Radiation (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

　複数の光電変換基板（１４）の受光部（１９）全体にわたってシンチレータ層（２１）を直接形成した放射線検出器（１１）において、隣り合う光電変換基板（１４）間に形成される隙間（Ｓ）及び段差（Ｄ）を、それら隙間（Ｓ及び段差（Ｄによる影響が光電変換素子の１個分の影響に相当する範囲内とする。すなわち、隣り合う光電変換基板（１４）間の隙間Ｓは１３３μｍ以下、隣り合う光電変換基板（１４）間の段差Ｄは１００μｍ以下とする。複数の光電変換基板（１４）の受光部（１９）全体にわたってシンチレータ層（２１）を直接形成でき、ＭＴＦや感度の劣化を防止し、製造コストも低減できる。
PCT/JP2007/074721 2006-12-27 2007-12-21 放射線検出器 WO2008078702A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008528277A JPWO2008078702A1 (ja) 2006-12-27 2007-12-21 放射線検出器
EP07851073.2A EP2128651A4 (en) 2006-12-27 2007-12-21 Radiation detector
US12/490,462 US7772562B2 (en) 2006-12-27 2009-06-24 Radiation detector

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006-351820 2006-12-27
JP2006351820 2006-12-27

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/490,462 Continuation US7772562B2 (en) 2006-12-27 2009-06-24 Radiation detector

Publications (1)

Publication Number Publication Date
WO2008078702A1 true WO2008078702A1 (ja) 2008-07-03

Family

ID=39562491

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/074721 WO2008078702A1 (ja) 2006-12-27 2007-12-21 放射線検出器

Country Status (7)

Country Link
US (1) US7772562B2 (ja)
EP (1) EP2128651A4 (ja)
JP (1) JPWO2008078702A1 (ja)
KR (1) KR20080114695A (ja)
CN (1) CN101389979A (ja)
TW (1) TW200842393A (ja)
WO (1) WO2008078702A1 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012509476A (ja) * 2008-11-21 2012-04-19 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ タイル型検出器の組み立て方法
JP2013152160A (ja) * 2012-01-25 2013-08-08 Canon Inc 放射線撮像装置及び放射線撮像システム
JP2014041063A (ja) * 2012-08-22 2014-03-06 Canon Inc 放射線撮像装置及び放射線撮像システム
KR20150008913A (ko) * 2012-05-18 2015-01-23 제네럴 일렉트릭 컴퍼니 타일형 x-선 이미저 패널 및 그 제조 방법
WO2022137843A1 (ja) * 2020-12-23 2022-06-30 浜松ホトニクス株式会社 放射線検出器、放射線検出器の製造方法、及びシンチレータパネルユニット
WO2022137844A1 (ja) * 2020-12-23 2022-06-30 浜松ホトニクス株式会社 放射線検出器、放射線検出器の製造方法、及びシンチレータパネルユニット

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5559471B2 (ja) 2008-11-11 2014-07-23 浜松ホトニクス株式会社 放射線検出装置、放射線画像取得システム、放射線検査システム、及び放射線検出方法
JP5467830B2 (ja) 2009-09-18 2014-04-09 浜松ホトニクス株式会社 放射線検出装置
JP5457118B2 (ja) 2009-09-18 2014-04-02 浜松ホトニクス株式会社 放射線検出装置
JP5295915B2 (ja) 2009-09-18 2013-09-18 浜松ホトニクス株式会社 放射線検出装置
JP5905672B2 (ja) * 2011-06-28 2016-04-20 株式会社東芝 放射線検出器及びその製造方法
JP6671839B2 (ja) * 2014-10-07 2020-03-25 キヤノン株式会社 放射線撮像装置及び撮像システム
WO2016067431A1 (ja) * 2014-10-30 2016-05-06 株式会社島津製作所 放射線検出器

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09260626A (ja) * 1995-10-20 1997-10-03 Canon Inc 光電変換装置及びその作製方法及び物質透過撮像装置及び実装装置
JP2002048870A (ja) * 2000-08-03 2002-02-15 Hamamatsu Photonics Kk 放射線検出器およびシンチレータパネル
JP2002050754A (ja) * 2000-05-08 2002-02-15 Canon Inc 半導体装置とその製造方法、放射線検出装置とそれを用いた放射線検出システム
JP2002048872A (ja) 2000-08-03 2002-02-15 Hamamatsu Photonics Kk 放射線検出器

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5464984A (en) * 1985-12-11 1995-11-07 General Imaging Corporation X-ray imaging system and solid state detector therefor
US6194726B1 (en) * 1994-12-23 2001-02-27 Digirad Corporation Semiconductor radiation detector with downconversion element
JP3347708B2 (ja) * 1999-08-04 2002-11-20 キヤノン株式会社 ２次元画像入力装置及びそれを用いた画像処理システム
US6792159B1 (en) * 1999-12-29 2004-09-14 Ge Medical Systems Global Technology Company, Llc Correction of defective pixels in a detector using temporal gradients
JP2003017676A (ja) * 2001-04-27 2003-01-17 Canon Inc 放射線撮像装置およびそれを用いた放射線撮像システム
US7189971B2 (en) * 2002-02-15 2007-03-13 Oy Ajat Ltd Radiation imaging device and system
US7247858B2 (en) * 2003-04-10 2007-07-24 Agfa Healthcare, N.V. Method for creating a contiguous image using multiple X-ray imagers

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09260626A (ja) * 1995-10-20 1997-10-03 Canon Inc 光電変換装置及びその作製方法及び物質透過撮像装置及び実装装置
JP2002050754A (ja) * 2000-05-08 2002-02-15 Canon Inc 半導体装置とその製造方法、放射線検出装置とそれを用いた放射線検出システム
JP2002048870A (ja) * 2000-08-03 2002-02-15 Hamamatsu Photonics Kk 放射線検出器およびシンチレータパネル
JP2002048872A (ja) 2000-08-03 2002-02-15 Hamamatsu Photonics Kk 放射線検出器

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2128651A4

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012509476A (ja) * 2008-11-21 2012-04-19 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ タイル型検出器の組み立て方法
JP2013152160A (ja) * 2012-01-25 2013-08-08 Canon Inc 放射線撮像装置及び放射線撮像システム
KR20150008913A (ko) * 2012-05-18 2015-01-23 제네럴 일렉트릭 컴퍼니 타일형 x-선 이미저 패널 및 그 제조 방법
JP2015522799A (ja) * 2012-05-18 2015-08-06 ゼネラル・エレクトリック・カンパニイ タイル貼り式ｘ線イメージャパネルおよびそれを形成する方法
KR102154133B1 (ko) 2012-05-18 2020-09-10 제네럴 일렉트릭 컴퍼니 타일형 x-선 이미저 패널 및 그 제조 방법
JP2014041063A (ja) * 2012-08-22 2014-03-06 Canon Inc 放射線撮像装置及び放射線撮像システム
WO2022137843A1 (ja) * 2020-12-23 2022-06-30 浜松ホトニクス株式会社 放射線検出器、放射線検出器の製造方法、及びシンチレータパネルユニット
WO2022137844A1 (ja) * 2020-12-23 2022-06-30 浜松ホトニクス株式会社 放射線検出器、放射線検出器の製造方法、及びシンチレータパネルユニット
JP7470631B2 (ja) 2020-12-23 2024-04-18 浜松ホトニクス株式会社 放射線検出器、放射線検出器の製造方法、及びシンチレータパネルユニット

Also Published As

Publication number Publication date
KR20080114695A (ko) 2008-12-31
US20100019162A1 (en) 2010-01-28
TW200842393A (en) 2008-11-01
CN101389979A (zh) 2009-03-18
JPWO2008078702A1 (ja) 2010-04-22
EP2128651A1 (en) 2009-12-02
EP2128651A4 (en) 2017-03-22
US7772562B2 (en) 2010-08-10

Similar Documents

Publication Publication Date Title
WO2008078702A1 (ja) 放射線検出器
WO2008127297A3 (en) Dual band imager with visible or swir detectors combined with uncooled lwir detectors
WO2008133123A3 (en) Radiation detecting apparatus and radiation detecting system
WO2009060968A3 (en) Manufacturing method of radiation detecting apparatus, and radiation detecting apparatus and radiation imaging system
WO2008117821A1 (ja) シンチレータパネル及び放射線検出器
WO2010031011A3 (en) Thin active layer fishbone photodiode with a shallow n+ layer and method of manufacturing the same
TW200631134A (en) Light shield for CMOS imager
TW200942854A (en) Dual-screen digital radiographic imaging detector array
TW200729471A (en) Shared-pixel-type image sensors for controlling capacitance of floating diffusion region
WO2011135486A3 (en) X-ray detector with improved spatial gain uniformity and resolution and method of fabricating such x-ray detector
WO2009053612A3 (fr) Scintillateur pour dispositif d'imagerie, module scintillateur, dispositif d'imagerie avec un tel scintillateur et procédé de fabrication d'un scintillateur
WO2011023603A3 (en) Single and few-layer graphene based photodetecting devices
WO2008146602A1 (ja) 放射線検出器、放射線検出器の製造方法及び支持基板の製造方法
WO2009024277A3 (en) Sensor cap assembly with a lens
WO2012080927A3 (en) Radiation detector with photodetectors
TW200633199A (en) Solid-state imaging device
WO2010122433A3 (en) Imaging measurement system with a printed organic photodiode array
WO2009069551A1 (ja) 光電変換素子用電極基板
WO2009066732A1 (ja) 放射線検出器及びその製造方法
WO2009099282A3 (en) Solar cell having multiple transparent conductive layers and manufacturing method thereof
TW200639378A (en) A sensor
WO2010141374A3 (en) Anti-reflective coating for sensors suitable for high throughput inspection systems
WO2008152889A1 (ja) 光電変換素子、光電変換素子の製造方法、イメージセンサおよび放射線画像検出器
WO2008084347A3 (en) Fast radiation detectors
WO2005119806A3 (de) Röntgendetektor

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 2008528277

Country of ref document: JP

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07851073

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 200780006712.2

Country of ref document: CN

Ref document number: 1020087020845

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 2007851073

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: DE