WO2008032851A1 - Composition d'agent d'étanchéité photodurcissable et élément comportant une couche de scellement étanche - Google Patents

Composition d'agent d'étanchéité photodurcissable et élément comportant une couche de scellement étanche Download PDF

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Publication number
WO2008032851A1
WO2008032851A1 PCT/JP2007/068021 JP2007068021W WO2008032851A1 WO 2008032851 A1 WO2008032851 A1 WO 2008032851A1 JP 2007068021 W JP2007068021 W JP 2007068021W WO 2008032851 A1 WO2008032851 A1 WO 2008032851A1
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WO
WIPO (PCT)
Prior art keywords
component
meth
acrylate
sealant composition
weight
Prior art date
Application number
PCT/JP2007/068021
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English (en)
Japanese (ja)
Inventor
Kuniaki Nakajima
Original Assignee
Three Bond Co., Ltd.
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Publication date
Application filed by Three Bond Co., Ltd. filed Critical Three Bond Co., Ltd.
Publication of WO2008032851A1 publication Critical patent/WO2008032851A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/20—Esters of polyhydric alcohols or phenols, e.g. 2-hydroxyethyl (meth)acrylate or glycerol mono-(meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F287/00—Macromolecular compounds obtained by polymerising monomers on to block polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2200/02—Inorganic compounds
    • C09K2200/0243—Silica-rich compounds, e.g. silicates, cement, glass
    • C09K2200/0247—Silica
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
    • C09K2200/0615—Macromolecular organic compounds, e.g. prepolymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C09K2200/0617—Polyalkenes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
    • C09K2200/0615—Macromolecular organic compounds, e.g. prepolymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C09K2200/0625—Polyacrylic esters or derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
    • C09K2200/0615—Macromolecular organic compounds, e.g. prepolymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C09K2200/0632—Polystyrenes

Definitions

  • the present invention relates to a photocurable sealant composition and a member having a seal layer using the photocurable sealant composition, and particularly includes an electronic circuit element such as a hard disk drive and an electronic component.
  • the present invention relates to a sealing technique for an electronic component case. Background art
  • Sealing materials for sealing are used in electronic component cases that contain electronic circuit elements and electronic components, such as hard disk drives, to prevent the entry of dust and the like.
  • a sealing material methods such as punching and bonding rubber sheets have been used, but the mass productivity is low, and a new mold is required to change the design, resulting in a low degree of design freedom.
  • CIPG sealing method
  • a method As a sealing method, a method (FIPG) is generally known in which a liquid sealant is held between members to be sealed and then the sealant is cured by an appropriate method.
  • FIPG a method
  • electronic device parts such as hard disk drives
  • by-products and unreacted gases generated during the curing of the sealant stay inside the sealed parts, which are used in electronic circuit elements and electronic components. May be adversely affected. Therefore, in the sealing of electronic equipment members, C I P G G is more preferable than F I P G in terms of workability and reliability.
  • a method for curing the sealing agent a method of applying energy such as heat or light is known. However, it has little effect on electronic circuit elements and electronic parts, has excellent productivity, and the sealing agent during curing. However, photocuring is preferred as a method of easily maintaining the shape.
  • Conventional photocurable sealant compositions include unsaturated polyester resins and epoxy resins.
  • the acrylic resin such as cis (meth) acrylate and urethane (meth) acrylate is added with a photopolymerization initiator, or the epoxy resin is added with a photopolymerization initiator.
  • those using urethane (meth) acrylate are easy to impart flexibility to the cured product, and therefore have been proposed to be used as a photo-curable sealing agent composition (Japanese Patent Laid-Open No. 20 0 5-1 3 9 4 6 No. 1).
  • the photo-curing sealant composition using urethane (meth) acrylate is excellent in mass production, freedom of design, elongation of cured product, etc., and is excellent as a sealing material for the purpose of dust prevention. It is. On the other hand, the moisture permeability was not sufficiently high, and an excellent moisture-resistant sealing function could not be realized in the electronic component case.
  • a sealing agent composition having excellent moisture resistance a sealing agent composition comprising an isoprene block and another block copolymer as a main component (Japanese Patent Laid-Open No. 5-29500). No. 3), gasket materials (Japanese Patent Laid-Open No. 1-11 3 2 3 0 69) and the like have been proposed. In order to form a seal layer, these require a process of forming a seal layer with an extruder, injection molding machine, etc., and then affixing to an applicable member. This is a problem in terms of mass productivity and design flexibility. Hot.
  • the object of the present invention is to solve the above-mentioned problems, and in particular, it has high moisture resistance, and a CI PG seal layer can be formed by applying a sealant composition onto a component and irradiating it with light. It is another object of the present invention to provide a highly reliable photo-curable sealing agent composition and a member with a sealing layer, which are excellent in design freedom and in which a seal layer can follow the movement of the member. Summary of invention
  • the present invention first,
  • R 1 is a divalent aliphatic hydrocarbon group having 3 to 15 carbon atoms in the main chain, and R 2 and R 3 are each independently a hydrogen atom or a methyl group
  • At least one bifunctional (meth) acrylate represented by
  • R 4 is an alkyl group having 6 to 20 carbon atoms, and R 5 is a hydrogen atom or a methyl group
  • At least one monofunctional (meth) acrylate represented by
  • a photocurable sealant composition comprising (C) a styrene-isobutylene block copolymer, (D) a photopolymerization initiator, and (E) silica powder.
  • the amount of each component is based on the total weight of the composition. ⁇ 20 wt%, (B) component 40 to 80 wt%, (C) component 10 to 50 wt%, (D) component 0.1 to L: 0 wt%, and (E ) It is preferred that the component is 0.
  • the component (C) a triblock-structure styrene monoisoptylene-styrene copolymer is particularly preferable.
  • the present invention is a member having a sealing layer formed by applying the above-mentioned photocurable sealing agent composition and curing it by irradiating light.
  • the member is preferably an electronic component housing such as a hard disk drive.
  • the photocurable sealant composition of the present invention is a seal for an electronic component case containing an electronic circuit element such as a hard disk drive or an electronic component case, and the like, by sealing the sealant composition on the member.
  • mass productivity and design freedom are high, and because it has excellent elasticity, it has good follow-up to the movement of members, and is particularly suitable for CIPG applications. Therefore, it is possible to solve the problem of outgas that occurs, and to form a sealing layer having excellent moisture resistance.
  • the photocurable sealant composition of the present invention comprises (A) a bifunctional (meth) acrylate and (B) a monofunctional (meth) acrylate that reacts with light to generate radicals. (D) A photopolymerization initiator Based on the polymerization reaction.
  • (Meth) acrylate” is a general term for acrylate and methacrylate.
  • the bifunctional (meth) acrylate of the component (A) of the present invention is used for the purpose of improving the adhesive strength and heat resistance of the photocurable sealing agent composition.
  • Bifunctional is a compound having two (meth) acryloyl groups contributing to the reaction in the molecule.
  • the bifunctional (meth) acrylate of the component (A) is a compound represented by the general formula (1), and R 1 is a divalent aliphatic hydrocarbon group having 3 to 15 carbon atoms in the main chain. As long as it has a branched chain It may also have an unsaturated bond (double bond) in addition to the saturated bond. R 1 is preferably an alkylene group having 3 to 15 carbon atoms in the main chain.
  • component (A) 1,3-butanediol di (meth) acrylate, 2-ethyl-2-butylpropanediol di (meth) acrylate, 1,4-butanediol di (meth) acrylate , Neopentyl alcoholic (meth) acrylate, 1,6-hexanediol (meth) acrylate, 3-methyl-1,5-pentanedio ⁇ / di (meth) acrylate, 1,9-nonanediol Di (meth) acrylate, 2,4-jetyl_ 1,5-pentanediol di (meth) acrylate, 2-methyl-1,8-octanediol di (meth) acrylate, 1, 10 0-decanediol di (Meth) acrylate, 2_ethyl-2-butylpropanediol (meth) acrylate, 1, 10 0-decanedi
  • These bifunctional (meth) acrylates need to have 3 to 15 carbon atoms in the main chain hydrocarbon in order not to impair the adhesive strength and heat resistance of the cured product.
  • the total number of carbon atoms in R 1 is not particularly limited, but is preferably 3-20.
  • the addition amount is preferably 0.1 to 20% by weight, and more preferably 0.5 to 10% by weight.
  • the monofunctional (meth) acrylate of the component (B) of the present invention is a compound represented by the general formula (2), and is used for the purpose of enhancing the flexibility and curability of the photocurable sealing agent composition.
  • the R 4 is not particularly limited as long as it is an alkyl group having 6 to 20 carbon atoms, and may have a branched chain.
  • the carbon number of the alkyl group of the component (B) becomes too small, the flexibility of the cured product decreases or the adhesiveness of the surface increases, making it difficult to use as a sealing agent. If the value is too large, the curability is deteriorated and the productivity is lowered.
  • Monofunctional (meth) acrylates having an alkyl group with 6 to 20 carbon atoms are preferred, and those with 8 to 18 carbon atoms are preferred in order to give moderate flexibility to the cured product and excellent curability to the uncured product. Is more preferable.
  • the addition amount is preferably 40 to 80% by weight, and more preferably 50 to 70% by weight. If the added amount is 40% by weight or less, the cured product becomes too hard, and if it is 80% by weight or more, it becomes too soft when used in a high temperature environment, and the sealing performance is deteriorated.
  • the styrene-isobutylene block copolymer of component (C) of the present invention is used for the purpose of imparting moisture resistance and flexibility to the photocurable sealant composition.
  • the component (C) may be a block copolymer having a polystyrene block composed of a styrene monomer and a polyisobutylene block composed of an isobutylene monomer.
  • a styrene-isobutylene-styrene triblock having a triploc structure may be used.
  • a polymer is more preferred.
  • the polymer preferably has a styrene block content of 10 to 40% by weight, more preferably 15 to 35% by weight.
  • the amount of the component (C) is preferably 10 to 50% by weight, more preferably 20 to 40% by weight. If the amount added is less than 10% by weight, sufficient moisture permeation resistance cannot be imparted to the composition, and if it exceeds 50% by weight, it will be sufficient in the components (A) and (B). Incompatible or dispersible.
  • Commercially available products of the triblock copolymer include SIBSTAR 072 T and SIBSTARR1 0 2 T (manufactured by Kane force Co., Ltd.).
  • the cured product of the photocurable sealant composition is It can have excellent elasticity, and it exhibits high sealing performance in CIPG applications. It should be noted that if the amount of each component deviates significantly from the amount described above, it will be difficult to obtain the required inertia.
  • the photopolymerization initiator of component (D) of the present invention is used for the purpose of curing the photocurable sealant composition.
  • the component (D) may be an initiator that generates radicals by light irradiation. If it is not specifically limited, a well-known thing can be used.
  • the silica powder of component (E) of the present invention is used to give thixotropic properties to the liquid composition before curing.
  • silica powder is added to achieve this.
  • This silica powder has a surface treatment with an average primary particle diameter of 1 to 100 nm, preferably 5 to 50 nm, and has been surface-treated or not surface-treated. Either can be used Is possible.
  • the surface-treated products include alumina-containing silica and titanium oxide that coexist with chlorides such as titanium chloride, aluminum chloride, and iron chloride when hydrolyzing silicon tetrachloride in hydrogen peroxide.
  • chlorides such as titanium chloride, aluminum chloride, and iron chloride when hydrolyzing silicon tetrachloride in hydrogen peroxide.
  • examples thereof include finely divided silica such as silica containing iron, silica containing iron oxide, and the like, and those obtained by hydrophobizing the surface of hydrophilic finely divided silica are particularly preferable.
  • Hydrophobic fine-powdered silica is a surface of normal hydrophilic fine-powdered silica.
  • Alkyl, aryl, aralkyl silane coupling agents having a hydrophobic group such as n-octyltrialkoxysilane, dimethyldichlorosilane, hexamethyldi It is obtained by treating with a silylating agent such as silazane, a polydimethylsiloxane having a hydroxyl group at the terminal, a higher alcohol such as stearyl alcohol, or a higher fatty acid such as stearic acid.
  • a silylating agent such as silazane, a polydimethylsiloxane having a hydroxyl group at the terminal, a higher alcohol such as stearyl alcohol, or a higher fatty acid such as stearic acid.
  • These finely divided silicas may be used alone or in combination of two or more.
  • the addition amount is preferably 0.1 to 30% by weight, and more preferably 1.0 to 15% by weight.
  • inorganic fillers other than silica powder such as calcium carbonate and carbon black
  • Thixotropy cannot be expressed because it does not disperse.
  • the curable composition of the present invention achieves curing by irradiation with light, if a silica powder having an extremely high concealing property is selected, the curability may be hindered.
  • components (A) to (E) can be added to the photocurable sealant composition of the present invention as necessary.
  • the component to be added include a stabilizer, a colorant, a thermal polymerization initiator, an adhesion promoter, an anti-aging agent, and a dispersion aid.
  • an adhesion assistant As the adhesion aid, a silane coupling agent, a titanium coupling agent, and the like can be applied, but a silane-powered coating agent is preferable from the viewpoint of storage stability and compatibility of the composition.
  • a silane coupling agent having at least one functional group selected from an epoxy group, a (meth) acrylic group, a biel group, and a strong rubamate group in the molecule and a silicon atom-bonded hydroxyl group is preferable.
  • the member having the seal layer of the present invention is formed by applying the sealant composition on the member and then curing it by light irradiation.
  • Application can be done by any method,
  • the light source can be a high pressure mercury lamp, an ultra high pressure mercury lamp, a metal halide lamp, a mercury xenon lamp, a xenon lamp, or an LED.
  • the irradiation ambient temperature is usually in the range of 10 to 200 ° C, and the wavelength of the irradiation light is (D) the absorption wavelength band of the photopolymerization initiator.
  • the evaluation contents of the sealant composition are two items, ie, moisture permeability of the cured product, water vapor permeability coefficient and elasticity as elongation.
  • the elongation and water vapor transmission coefficient were measured by the following methods.
  • Form forms a uniform film-shaped 1 mm thick light-curing sealant compositions of the present invention prior to curing, their respective Thereto light 3000 m J cm 2 each side using a high-pressure mercury lamp It hardened
  • the tensile speed of the universal tensile testing machine was 50 Omm per minute, and the stretched part was measured with a vernier caliper specified by JISB 7503 or a caliper with equivalent or better performance. The median value obtained when the test was performed three times was adopted as the elongation value.
  • the photocurable sealant composition of the present invention before curing is formed into a uniform film having a thickness of 0.5 mm, and 300 Om J / cm 2 of light is applied to each side using a high-pressure mercury lamp. Each was cured by irradiation on both sides to obtain a sheet-like cured product. This sheet was cut into a 15.2 cm 2 circular test piece, and a differential pressure vapor permeability measurement device was installed. The water vapor permeation coefficient was measured using a device (GTR-30XA3B, manufactured by GTR Tech).
  • a cured product was produced by irradiating 300 OmJZcm 2 of light on each side, and the water vapor transmission coefficient and the elongation were measured. As shown in Table 1, all obtained good results.
  • R 1 is a bifunctional acrylate with a main chain of 5 carbon atoms and side chains (2,
  • Example 4_Jetyl 1,5-pentenediol diacrylate was used in the same procedure as in Example 1 to obtain a sealant composition.
  • a cured product was prepared and measured in the same manner as in Example 1. As shown in Table 1, both the water vapor transmission coefficient and the elongation were good.
  • the sealing agent composition was the same as in Example 1, except that bifunctional acrylate (1,12-dodecanediol diacrylate) in which R 1 is an alkylene group having 12 carbon atoms was used as component (A).
  • a cured product was prepared and measured in the same manner as in Example 1. As shown in Table 1, both the water vapor transmission coefficient and the elongation were good.
  • Example 4 A sealant composition was obtained in the same procedure as in Example 1 except that a mixture of Tisooctylacrylate and isostearylacrylate was used as the component (B). A cured product was prepared and measured in the same manner as in Example 1. As shown in Table 1, both the water vapor transmission coefficient and the elongation were good.
  • Example 2 Similar to Example 1 except that a triblock styrene-isobutylene-styrene block copolymer (styrene content: 15% by weight: manufactured by SIBSTAR 1 0 2 T Kane force Co., Ltd.) was used as the component.
  • a sealant composition was obtained by the procedure.
  • a cured product was prepared and measured in the same manner as in Example 1. As shown in Table 1, both the water vapor transmission coefficient and the elongation were good.
  • Example 2 A procedure similar to that of Example 1 except that a styrene-isobutylene block copolymer having a diblock structure (styrene content: 20% by weight, number average molecular weight: about 30, 00) was used as the component (C). A sealant composition was obtained. A cured product was prepared and measured in the same manner as in Example 1. As shown in Table 1, both the water vapor transmission coefficient and the elongation were good.
  • a sealant composition was obtained in the same procedure as in Example 1, except that 1,16-hexadecanediol diacrylate was used in place of the component (A).
  • 1,16-hexadecanediol diacrylate was used in place of the component (A).
  • a cured product was prepared and measured in the same manner as in Example 1, neither the elongation rate nor the water vapor transmission coefficient was satisfactory. Comparative Example 4
  • a sealant composition was obtained in the same procedure as in Example 1, except that PO modified bisphenol A diacrylate was used instead of the component (A).
  • a cured product was prepared and measured in the same manner as in Example 1, neither the elongation rate nor the water vapor transmission coefficient was satisfactory. Comparative Example 5
  • a sealant composition was obtained in the same procedure as in Example 1, except that 1,5-pentanediol acrylate was used in place of the component (B).
  • 1,5-pentanediol acrylate was used in place of the component (B).
  • a sealant composition was obtained in the same procedure as in Example 1 except that pentyl acrylate was used in place of the component (B).
  • pentyl acrylate was used in place of the component (B).
  • a sealant composition was obtained in the same procedure as in Example 1, except that isoponyl acrylate was used in place of the component (B).
  • isoponyl acrylate was used in place of the component (B).
  • a sealant composition was obtained in the same procedure as in Example 1, except that methacryloylated liquid polyisoprene (UC-2203, manufactured by Kuraray Co., Ltd.) was used instead of the component (C).
  • methacryloylated liquid polyisoprene UC-2203, manufactured by Kuraray Co., Ltd.
  • a sealant composition was obtained in the same manner as in Example 1 except that styrene-ethylene butylene-styrene block copolymer (manufactured by Kraton G 1 7 2 6 Kraton Polymer Co., Ltd.) was used instead of the component (C). It was.
  • styrene-ethylene butylene-styrene block copolymer manufactured by Kraton G 1 7 2 6 Kraton Polymer Co., Ltd.
  • Example 2 A sealant composition was obtained in the same procedure as in Example 1, except that a styrene-ethylene / propylene-styrene block copolymer (manufactured by Kuraray Co., Ltd.) was used instead of the component. .
  • a cured product was prepared and measured in the same manner as in Example 1. As shown in Table 1, although an excellent result was obtained with respect to the elongation, the water vapor transmission coefficient was not satisfactory.
  • a sealant composition was obtained in the same procedure as in Example 1, except that the component (E) was not used. It was confirmed that this sealant composition was inadequate for CIPG use because its shape retention was poor and the bead shape could not be retained after application. table 1
  • E AEROSIL 200 6 6 6 6 6 6 6 6 6 6 Water vapor transmission coefficient (gZm 2 ⁇ 24h ⁇ atm) 15 16 15 14 17 15 Elongation (%) 100 120 100 90 160 90
  • the photocurable sealant composition and the member with the sealant obtained from the present invention have an electronic component housing containing an electronic circuit element such as an eight-sided disk or an electronic component because of its excellent moisture permeation resistance and elasticity. It is useful as a moisture-permeable sealant for body seals and other members that require moisture permeability.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Sealing Material Composition (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

L'invention concerne une composition d'agent d'étanchéité photodurcissable, contenant (A) un ou plusieurs (méth)acrylates bifonctionnels ayant un groupe (méth)acryloyle aux deux extrémités d'un hydrocarbure aliphatique facultativement ramifié, la chaîne principale ayant 3-15 atomes de carbone, (B) un ou plusieurs (méth)acrylates monofonctionnels ayant un groupe (méth)acryloyle à une extrémité d'un squelette d'alkyle à chaîne facultativement ramifiée ayant 6-20 atomes de carbone, (C) un copolymère à blocs styrène-isobutylène, (D) un initiateur de photopolymérisation et (E) une poudre de silice. L'invention concerne également un élément, tel qu'un boîtier de composants électroniques qui présente une couche de scellement étanche obtenue par l'application de la composition d'agent d'étanchéité photodurcissable sur l'élément et l'irradiation de la composition par de la lumière.
PCT/JP2007/068021 2006-09-15 2007-09-11 Composition d'agent d'étanchéité photodurcissable et élément comportant une couche de scellement étanche WO2008032851A1 (fr)

Applications Claiming Priority (2)

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JP2006250723A JP2008069302A (ja) 2006-09-15 2006-09-15 光硬化性シール剤組成物及びシール層付き部材
JP2006-250723 2006-09-15

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JP2014148645A (ja) * 2013-02-04 2014-08-21 Bridgestone Corp 光硬化性エラストマー組成物、ハードディスクドライブ用ガスケットおよびハードディスクドライブ
JP2014148650A (ja) * 2013-02-04 2014-08-21 Bridgestone Corp 光硬化性エラストマー組成物、シール材、ハードディスクドライブ用ガスケットおよび装置
JP2014148644A (ja) * 2013-02-04 2014-08-21 Bridgestone Corp 光硬化性エラストマー組成物、シール材、及び装置

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JP5526398B2 (ja) * 2008-12-11 2014-06-18 島根県 光硬化性組成物、その色素増感型太陽電池用シーリング材としての使用、及び色素増感型太陽電池
DE102011085034A1 (de) * 2011-10-21 2013-04-25 Tesa Se Klebemasse insbesondere zur Kapselung einer elektronischen Anordnung
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JP2016135860A (ja) * 2015-01-15 2016-07-28 三菱化学株式会社 硬化性組成物及びそれを用いた封止材料
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