WO2008010502A1 - Film sec pour guide d'ondes optiques et procédé de fabrication d'un guide d'ondes optiques à l'aide du film sec - Google Patents
Film sec pour guide d'ondes optiques et procédé de fabrication d'un guide d'ondes optiques à l'aide du film sec Download PDFInfo
- Publication number
- WO2008010502A1 WO2008010502A1 PCT/JP2007/064140 JP2007064140W WO2008010502A1 WO 2008010502 A1 WO2008010502 A1 WO 2008010502A1 JP 2007064140 W JP2007064140 W JP 2007064140W WO 2008010502 A1 WO2008010502 A1 WO 2008010502A1
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- WO
- WIPO (PCT)
- Prior art keywords
- layer
- optical waveguide
- film
- clad
- core
- Prior art date
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
- G02B6/1221—Basic optical elements, e.g. light-guiding paths made from organic materials
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
Definitions
- the present invention relates to an optical waveguide dry film and an optical waveguide manufacturing method using the dry film.
- An optical waveguide using a photocurable resin such as plastic is cured by irradiating light compared to an optical waveguide using other materials. There will be no distortion of the rud part or loss of the core part.
- the optical waveguide is a photocurable resin, there is an advantage that a complicated optical waveguide can be easily formed using a process. For these reasons, it is expected to be applied to low-priced and high-performance optical waveguide components, and studies are underway.
- FIGS. 4A to 4C show a conventional method of manufacturing an optical waveguide.
- a lower substrate 93 in which a lower cladding layer 92 is laminated on a lower base film 91 is prepared.
- a core 94 is provided on the lower substrate 93.
- an upper substrate 97 in which a curable resin layer 96 is laminated on the upper base film 95 is prepared.
- the upper force of the lower substrate 93 also presses the upper substrate 97.
- the curable resin layer 96 is deformed because it is soft, and changes to a shape surrounding the periphery of the core 94.
- the curable resin layer 96 is changed to the clad layer 98 by irradiation with light.
- the optical waveguide device 90 in which the clad layers 92 and 98 are formed so as to surround the core 94 is formed (for example, Patent Document 1).
- Patent Document 1 Japanese Patent Laid-Open No. 2005-115047
- the present invention has been made to solve such problems, and an object thereof is to provide a dry film for an optical waveguide and a method for producing an optical waveguide using the dry film.
- the optical waveguide dry film for an optical waveguide is characterized in that the core layer forming composition layer is a photocurable resin layer. It is what.
- the dry film for an optical waveguide according to the fourth aspect of the present invention is the above-described dry film for an optical waveguide, wherein the cladding layer forming composition layer is a photocurable resin layer. To do.
- An optical waveguide dry film according to a fifth aspect of the present invention is the above-described optical waveguide dry film, wherein the base film emits light for curing the curable resin. It is characterized by being allowed to transmit at least%. By using this base film, the light of the base film can be incident on the dry film and the uncured curable resin can be hardened.
- the dry film for optical waveguides according to the sixth aspect of the present invention is the above-described dry film for optical waveguides, which is further laminated with a release film. In this way, handling in the uncured layer can be facilitated.
- an optical waveguide having a core portion for propagating light and a cladding portion disposed so as to surround the core portion is provided.
- the core portion of the first laminated film and the second clad layer of the second laminated film are pasted with a curable resin layer for forming the clad portion interposed therebetween.
- the optical waveguide manufacturing method is characterized in that a curable resin layer for forming a clad sandwiched between the first laminated film and the second laminated film is cured. By doing so, the thickness of the cladding layer in the optical waveguide can be made uniform.
- an optical waveguide having a core portion that propagates light and a cladding portion that is disposed so as to surround the core portion.
- a first base film, a first clad layer formed on the first base film, and the first clad layer formed on the first clad layer A first laminated film having a core part having a higher refractive index than the second laminated film, a second base film, a second clad layer formed on the second base film, and the second
- a second laminated film made of a dry film having a curable resin layer formed of a curable resin for forming a clad and formed on the clad layer, the core of the first laminated film and the first film
- the laminated film 2 is bonded so that the curable resin layer faces the curable resin layer.
- a method for producing an optical waveguide comprising: curing a resin layer. By doing so, the thickness of the cladding layer in the optical waveguide can be made constant.
- the method for manufacturing an optical waveguide according to the ninth aspect of the present invention, the method for manufacturing an optical waveguide as described above, wherein the curable resin is allowed to pass through the base film.
- An optical waveguide manufacturing method using light By doing so, the photocurable resin can be easily cured by making light incident on the base film force.
- the optical waveguide manufacturing method according to the tenth aspect of the present invention is the above-described optical waveguide manufacturing method, wherein the relative refractive index difference between the cladding layer and the core layer is 1% or more.
- This is a method of manufacturing an optical waveguide characterized by the above. This allows light to be guided efficiently An optical waveguide can be created.
- the clad layer and the core layer are made of the same constituent materials with different composition ratios. It is a manufacturing method of a waveguide. By using the same constituent materials with different composition ratios, the adhesion between the core portion and the cladding layer can be improved.
- the thickness of the cladding layer around the core portion can be made constant. This makes it possible to improve the optical characteristics of the optical waveguide.
- the clad film thickness is uniform, alignment with the optical component is easy, and the bending durability as a film waveguide is improved.
- FIG. 1A is a diagram showing a first step of a method for manufacturing a lower substrate of an optical waveguide in the present invention.
- FIG. 1B is a diagram showing a second step of a method for manufacturing the lower substrate of an optical waveguide in the present invention.
- FIG. 1C is a diagram showing a third step of the method for manufacturing the lower substrate of the optical waveguide in the present invention.
- FIG. 1D is a diagram showing a fourth step of the method for manufacturing the lower substrate of the optical waveguide in the present invention.
- FIG. 1E is a diagram showing a fifth step of the method of manufacturing the lower substrate of the optical waveguide in the present invention.
- FIG. 2A is a diagram showing a first step of the method of manufacturing the upper substrate of the optical waveguide in the present invention.
- FIG. 1B is a diagram showing a second step of a method for manufacturing the lower substrate of an optical waveguide in the present invention.
- FIG. 1C is a diagram showing a third step of the method for manufacturing the
- FIG. 2C is a diagram showing a second step of the method for manufacturing the upper substrate of the optical waveguide in the present invention.
- FIG. 2C is a diagram showing a third step of the method for manufacturing the upper substrate of the optical waveguide in the present invention.
- FIG. 10 is a diagram showing a fourth step of the method of manufacturing the upper substrate of the optical waveguide in the invention.
- FIG. 3A is a diagram showing a first step of an optical waveguide manufacturing method according to the present invention.
- FIG. 3B is a diagram showing a second step of the method of manufacturing an optical waveguide in the present invention.
- FIG. 3C is a diagram showing a third step of the method of manufacturing an optical waveguide in the present invention.
- FIG. 4A is a diagram showing a first step of a conventional method of manufacturing an optical waveguide.
- FIG. 4B is a diagram showing a second step of the conventional method of manufacturing an optical waveguide.
- FIG. 4C is a diagram showing a third step in the conventional method of manufacturing an optical waveguide.
- the present invention is applied to an optical waveguide dry film and an optical waveguide manufacturing method using the dry film.
- the thickness of the cladding layer around the core is reduced by forming a pre-cured cladding layer above and below the core and sandwiching the core between the cladding layers. It can be made uniform.
- a photocurable resin layer is used as the curable resin layer will be described as an example.
- Examples of the curable composition for an optical waveguide include a resin having a polymerizable functional group such as an ethylenically unsaturated group, Z or urethane (meth) acrylate oligomer, a polymerizable monomer, and initiation of photopolymerization.
- Examples thereof include a composition containing an agent.
- the core composition can make the composition alkali-developable by making the resin having a polymerizable functional group such as an ethylenically unsaturated group alkali-soluble.
- the resin having a polymerizable functional group such as an ethylenically unsaturated group is, for example, carboxy.
- Addition reaction of a compound containing glycidyl group and ethylenically unsaturated group, a compound containing isocyanate group and ethylenically unsaturated group, or acrylic acid chloride to poly (meth) acrylate having sil group or hydroxyl group Can be obtained.
- acrylic acid can be copolymerized with methacrylic acid, and a carboxyl group can be introduced into the resin to obtain a resin capable of developing with a strong force.
- a compound having a polyethylene oxide structure, a polypropylene oxide structure, or a linear structure having a repeating urethane bond and having 2 to 6 (meth) attalyloyl groups can also be used.
- the urethane (meth) acrylate oligomer is a reaction product of a polyester polyol compound, a polyisocyanate compound, and a hydroxyl group-containing (meth) acrylate.
- Polyol compounds are compounds having two or more hydroxyl groups in the molecule.
- examples of such compounds include aromatic polyether polyols, aliphatic polyether polyols, alicyclic polyether polyols, polyester polyols, polycarbonate polyols, and polystrength prolataton polyols.
- aromatic polyether polyols aliphatic polyether polyols
- alicyclic polyether polyols alicyclic polyether polyols
- polyester polyols polycarbonate polyols
- polystrength prolataton polyols in order to further improve the adhesion between the substrate and the optical waveguide.
- the polyisocyanate compound is a compound having two or more isocyanate groups in the molecule.
- the hydroxyl group-containing (meth) acrylate is a compound having a hydroxyl group and a (meth) attalyloyl group in the molecule.
- the blending ratio of each raw material constituting the urethane (meth) acrylate oligomer of the present invention is, for example, 0.5 to 2 moles of a polyol compound or polyisocyanate compound with respect to 1 mole of a hydroxyl group-containing (meth) acrylate. 1 to 2.5 moles.
- the number average molecular weight (polystyrene equivalent value measured by gel permeation chromatography) of urethane (meth) acrylate oligomer is preferably 1,000-100,000, more preferably 3,000-60,000 Especially preferred is ⁇ 5,000 to 30,000.
- the number average molecular weight is less than 1,000, it is difficult to obtain sufficient bending resistance for the film-like cured product.
- the number average molecular weight exceeds 100,000, the viscosity of the composition becomes too high, and the coating property may be deteriorated.
- the following manufacturing methods 1-4 are mentioned, for example.
- Production method 1 A method in which a polyol compound, a polyisocyanate compound, and a hydroxyl group-containing (meth) acrylate are charged and reacted together.
- Production method 2 A method of reacting a polyol or polyisocyanate compound and then reacting a hydroxyl group-containing (meth) acrylate.
- Production method 3 A method in which a polyisocyanate compound and a hydroxyl group-containing (meth) acrylate are reacted, and then a polyol compound is reacted at V.
- Production method 4 A method in which a polyisocyanate compound and a hydroxyl group-containing (meth) acrylate are reacted, then a polyol compound is reacted, and finally a hydroxyl group-containing (meth) acrylate is reacted.
- production methods 2 to 4 are preferable for controlling the molecular weight distribution.
- examples of the polymerizable monomer include trimethylolpropane tri (meth) acrylate, ditrimethylol propane tetra (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate.
- decane and poly (ethylene oxide or propylene oxide adducts of starting alcohols in the production of these compounds) (Meth) atalylates, oligoesters having two or more (meth) atalyloyl groups in the molecule (meth) atalylates, oligoethers (meth) atalylates, oligourethane (meth) atalylates, and oligoepoxy (Meth) atarylates and the like can be mentioned.
- Examples of the photopolymerization initiator include 2,2-dimethoxy-2-ferulacetophenone and 2-hydride.
- the composition layer comprising a resin having a polymerizable functional group such as an ethylenically unsaturated group and Z or urea (meth) acrylate oligomer, a polymerizable monomer, a photopolymerization initiator, etc.
- each of the above components is mixed with methyl isobutyl ketone, acetone, methyl ethyl ketone, cyclohexanone, tetrahydrofuran, dioxane, ethylene glycol monomethyl ether, ethylene glycol ether ether, diethylene glycol ether ether, toluene.
- a composition dissolved in a solvent such as ethyl acetate is applied to the film by a method such as roll coating, gravure coating, die coating, etc.
- thermosetting composition 2, 2'-azobisisobutyor-tolyl, 2,2'-azobis (2,4 dimethylvale-tolyl), 2,2'-azobis (4-methoxy-l) 2'-Dimethylvalero-tolyl), benzoyl peroxide, lauroyl peroxide, t-butylperoxypiparate, etc. to be used to form a thermosetting composition.
- FIGS. 1A to 1E show a manufacturing method of the lower substrate and the core part in the manufacturing method of the optical waveguide according to the present embodiment.
- a solution obtained by dissolving a first photocurable resin in a solvent is applied onto the lower substrate film 11.
- the photocured resin layer 12 for forming a clad is laminated on the lower substrate film 11 by evaporating the solvent.
- the photocured resin layer 12 for forming a clad changes to the lower clad layer 13 when irradiated with light.
- the lower substrate portion 10 in which the lower clad layer 13 is laminated on the lower base film 11 is formed (see FIG. 1B).
- the lower substrate portion 10 has a refractive index higher than that of the lower cladding layer 13 and is adjusted to be a layer. Apply a second photocurable resin solution. Then, the core-forming photocurable resin layer 21 is laminated by evaporating the solvent (see FIG. 1C). In the photocurable resin layer 21 for forming a core part, the core part 22 is formed by irradiating light while masking the part other than the position to become the core part (see FIG. 1D). Portions other than the core portion 22 are removed by development. In this way, the core part is formed (see FIG. 1E).
- FIGS. 2A to 2D an upper substrate manufacturing method in the optical waveguide manufacturing method according to the present embodiment is shown in FIGS. 2A to 2D.
- a solution of the first photocurable resin in a solvent is applied on the upper base film 31.
- the photocuring resin layer 32 for forming a clad is laminated on the upper base film 31 by evaporating the solvent (see FIG. 2A).
- Photocuring for clad formation The resin layer 32 changes to the upper clad layer 33 when irradiated with light (see Fig. 2B).
- the photocuring resin layer 34 for forming a cladding is laminated on the upper cladding layer 33 by evaporating the solvent (see FIG. 2C).
- the composition for forming the clad-forming photocured resin layer 34 and the upper cladding layer 33 the same composition may be used, or different compositions may be used.
- the clad forming photocured resin layer 34 has a thickness of 1 to 1.2 times the height of the core portion 22.
- the film thickness of the light curing resin layer 34 for forming the clad is thinner than the height of the core part 22, the lower clad layer 13 and the clad forming layer are then bonded to the laminate on which the core part 22 is formed. This is because voids may be formed between the photocured resin layers 34.
- the thickness of the light-curing resin layer 34 for clad formation exceeds S of the height of the S core 22, the workability when the laminate with the core 22 is bonded is poor. It is to do.
- a release film 35 for facilitating handling as a dry film can also be formed on the photocured resin layer 34 for clad formation (see FIG. 2D). In this way, the upper substrate part 30 is formed.
- FIGS. 3A to 3C a method for manufacturing an optical waveguide according to the present embodiment is shown in FIGS. 3A to 3C.
- the clad-forming photocured resin layer 34 has not yet been cured. Therefore, the clad forming photocured resin layer 34 is in a soft state. Therefore, as shown in FIG. 3A, the side of the lower substrate portion 10 where the core portion 22 is formed and the upper substrate portion 30 photocladding resin layers 34 for clad formation are bonded together.
- the release film 35 is formed on the clad-forming photocured resin layer 34, the release film 35 needs to be peeled off.
- the clad forming photocured resin layer 34 is positioned around the core portion 22 as shown in FIG. 3B.
- the photocuring resin layer 34 for forming a clad may protrude from the lower clad layer 13, but the protruding portion is removed.
- the lower substrate portion 10 and the upper substrate portion 30 are bonded together, they are bonded so that the core portion 22 and the upper cladding layer 33 are in contact with each other.
- the photocuring resin layer 34 for forming a clad is cured and changed to the clad layer 36 (see FIG. 3C).
- the clad forming photocured resin layer 34 is cured with the cured upper clad layer 33 and sandwiched between the lower clad layer 13 and the upper clad layer 13.
- the core portion 22 sandwiched between the lid layer 33 and the lower cladding layer 13 functions as a spacer. That is, the thickness of the cladding layer between the upper base film 31 and the lower base film 11 can be made constant. Further, since the gap between the core portion 22 and the upper base film 31 and the space between the core portion 22 and the lower base film 11 are the pre-cured clad layers 13 and 33, they are positioned above and below the core portion 22. It is possible to make the thickness of the clad layer uniform. Thus, the thickness of the cladding layer around the core portion 22 can be made uniform, so that the optical characteristics of light propagating through the core portion 22 can be improved.
- a film that transmits light for curing the photocurable resin used in the above-described manufacturing method may be used as the lower base film 11 or the upper base film 31 . This is a force that allows the light for curing the photocurable resin to be incident by passing through the base film. By doing so, the photocurable resin can be easily cured.
- the relative refractive index difference ⁇ between the cladding layers 13, 33, 36 and the core portion 22 is 1% or more.
- This relative refractive index difference ⁇ is a value expressed by the following equation.
- nl is the refractive index of the core portion 22
- n2 is the refractive index of the cladding layers 13, 33, and 36.
- the core portion 22 and the cladding layers 13, 33, and 36 are made of the same constituent materials with different composition ratios. It is possible to improve the adhesion between the core portion 22 and the clad layers 13, 33, and 36 by being made of the same constituent material with the composition ratio changed.
- ultraviolet light may be used as light for curing the photocurable resin. This is because a transparent base film and rosin can be used by using ultraviolet light.
- the clad-forming photocured resin layer 34 is located between the cured lower clad layer 13 and the cured upper clad layer 33.
- the core portion 22 can be surrounded by the clad-forming photocured resin layer 34.
- the cured upper clad layer 33 and the core portion 22 are in contact with each other. Therefore, the thickness between the lower base film 11 and the upper base film 31 is uniquely determined.
- the thickness of the upper clad layer 33 on the upper base film 31 side of the core portion 22 and the thickness of the lower clad layer 13 on the lower base film 11 side are both photocured in advance, the thickness is constant. It can be made thick. For these reasons, the position of the core portion 22 in the cladding layer can be made uniform. Therefore, alignment with an optical component is easy, and the bending durability as a film waveguide is improved.
- the curable resin may be a thermosetting resin that is not limited to the photocurable resin.
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Integrated Circuits (AREA)
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007800268757A CN101490590B (zh) | 2006-07-18 | 2007-07-18 | 一种光导波路的制造方法 |
JP2008525871A JP5309994B2 (ja) | 2006-07-18 | 2007-07-18 | 光導波路用ドライフィルム及びそのドライフィルムを用いた光導波路の製造方法 |
US12/373,564 US7916992B2 (en) | 2006-07-18 | 2007-07-18 | Dry film for optical waveguide and method for manufacturing optical waveguide by using the dry film |
EP07790895.2A EP2042901A4 (en) | 2006-07-18 | 2007-07-18 | DRY FILM FOR OPTICAL WAVEGUIDE AND METHOD FOR MANUFACTURING OPTICAL WAVEGUIDE USING THE DRY FILM |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006-195081 | 2006-07-18 | ||
JP2006195081 | 2006-07-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008010502A1 true WO2008010502A1 (fr) | 2008-01-24 |
Family
ID=38956833
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/064140 WO2008010502A1 (fr) | 2006-07-18 | 2007-07-18 | Film sec pour guide d'ondes optiques et procédé de fabrication d'un guide d'ondes optiques à l'aide du film sec |
Country Status (7)
Country | Link |
---|---|
US (1) | US7916992B2 (ja) |
EP (1) | EP2042901A4 (ja) |
JP (1) | JP5309994B2 (ja) |
KR (1) | KR20090038015A (ja) |
CN (1) | CN101490590B (ja) |
TW (1) | TW200811495A (ja) |
WO (1) | WO2008010502A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014052405A (ja) * | 2012-09-05 | 2014-03-20 | International Business Maschines Corporation | シングルモードのポリマー導波路アレイコネクターを形成する方法 |
JP6090655B2 (ja) * | 2013-02-12 | 2017-03-08 | パナソニックIpマネジメント株式会社 | 光導波路用ドライフィルム、それを用いた光導波路及び光電気複合配線板、並びに光電気複合配線板の製造方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004027472A1 (ja) * | 2002-09-20 | 2004-04-01 | Toppan Printing Co., Ltd. | 光導波路及びその製造方法 |
JP2005062346A (ja) * | 2003-08-08 | 2005-03-10 | Ricoh Co Ltd | 光導波路素子 |
JP2005099514A (ja) * | 2003-09-25 | 2005-04-14 | Matsushita Electric Works Ltd | 光導波路の製造方法 |
JP2005115047A (ja) | 2003-10-08 | 2005-04-28 | Japan Aviation Electronics Industry Ltd | 導波路基板およびその製造方法 |
WO2006038691A1 (ja) * | 2004-10-07 | 2006-04-13 | Hitachi Chemical Company, Ltd. | 光学材料用樹脂組成物、光学材料用樹脂フィルム及びこれを用いた光導波路 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7035518B2 (en) * | 2001-04-13 | 2006-04-25 | Hitachi Cable, Ltd. | Polymer waveguides and process for producing the same |
CN1318737A (zh) | 2001-05-29 | 2001-10-24 | 中国科学院长春光学精密机械与物理研究所 | 硅基有机微光机声压传感器芯片制备方法 |
JP4168910B2 (ja) * | 2003-11-04 | 2008-10-22 | 日本電気株式会社 | 光導波路および光導波路の製造方法 |
TWI285664B (en) * | 2003-12-25 | 2007-08-21 | Kansai Paint Co Ltd | Curable resin composition for optical waveguide, curable dry film for optical waveguide, waveguide, and, method for manufacturing optical waveguide |
DE102004006047A1 (de) * | 2004-02-02 | 2005-08-18 | Micro Resist Technology Gmbh | Polymerwellenleiter für opto-elektrische Schaltungsträger |
JP4490183B2 (ja) * | 2004-02-16 | 2010-06-23 | 日東電工株式会社 | 光導波路およびその製造方法 |
JP2005258000A (ja) * | 2004-03-11 | 2005-09-22 | Jsr Corp | 光導波路形成用感光性組成物および光導波路 |
US20090196562A1 (en) * | 2004-06-28 | 2009-08-06 | Omron Corporation | Film waveguide, method of manufacturing film waveguide, and electronic device |
-
2007
- 2007-07-17 TW TW096126030A patent/TW200811495A/zh unknown
- 2007-07-18 EP EP07790895.2A patent/EP2042901A4/en not_active Withdrawn
- 2007-07-18 US US12/373,564 patent/US7916992B2/en not_active Expired - Fee Related
- 2007-07-18 WO PCT/JP2007/064140 patent/WO2008010502A1/ja active Application Filing
- 2007-07-18 JP JP2008525871A patent/JP5309994B2/ja not_active Expired - Fee Related
- 2007-07-18 CN CN2007800268757A patent/CN101490590B/zh not_active Expired - Fee Related
- 2007-07-18 KR KR1020097003208A patent/KR20090038015A/ko active Search and Examination
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004027472A1 (ja) * | 2002-09-20 | 2004-04-01 | Toppan Printing Co., Ltd. | 光導波路及びその製造方法 |
JP2005062346A (ja) * | 2003-08-08 | 2005-03-10 | Ricoh Co Ltd | 光導波路素子 |
JP2005099514A (ja) * | 2003-09-25 | 2005-04-14 | Matsushita Electric Works Ltd | 光導波路の製造方法 |
JP2005115047A (ja) | 2003-10-08 | 2005-04-28 | Japan Aviation Electronics Industry Ltd | 導波路基板およびその製造方法 |
WO2006038691A1 (ja) * | 2004-10-07 | 2006-04-13 | Hitachi Chemical Company, Ltd. | 光学材料用樹脂組成物、光学材料用樹脂フィルム及びこれを用いた光導波路 |
Non-Patent Citations (1)
Title |
---|
See also references of EP2042901A4 * |
Also Published As
Publication number | Publication date |
---|---|
CN101490590A (zh) | 2009-07-22 |
EP2042901A4 (en) | 2013-10-23 |
EP2042901A1 (en) | 2009-04-01 |
TW200811495A (en) | 2008-03-01 |
US20090317043A1 (en) | 2009-12-24 |
JPWO2008010502A1 (ja) | 2009-12-17 |
CN101490590B (zh) | 2010-12-08 |
US7916992B2 (en) | 2011-03-29 |
KR20090038015A (ko) | 2009-04-17 |
JP5309994B2 (ja) | 2013-10-09 |
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