WO2008010359A1 - Dispositif de communication et appareil électronique l'utilisant - Google Patents
Dispositif de communication et appareil électronique l'utilisant Download PDFInfo
- Publication number
- WO2008010359A1 WO2008010359A1 PCT/JP2007/061599 JP2007061599W WO2008010359A1 WO 2008010359 A1 WO2008010359 A1 WO 2008010359A1 JP 2007061599 W JP2007061599 W JP 2007061599W WO 2008010359 A1 WO2008010359 A1 WO 2008010359A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- ground
- substrate
- ground region
- amplifier
- communication device
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
Definitions
- the present invention relates to a communication device for wireless communication such as LAN communication and an electronic device using the same.
- FIG. 7 is a diagram showing an upper surface and a lower surface of a conventional communication device.
- a conventional communication device 1 includes a substrate 2 and a semiconductor circuit 3 that is disposed on the lower surface of the substrate 2 and generates a signal via a via 4 that is disposed on the upper surface of the substrate 2 and provided on the substrate 2.
- the communication device 1 includes an amplifier 5 connected to the output side of the semiconductor circuit 3 and an antenna terminal 6 connected to the amplifier 5.
- the conventional communication device 1 includes a ground plate 7 disposed on the lower surface of the substrate 2 and connected to the amplifier 5, and a ground plate disposed inside the substrate 2 and connected to the semiconductor circuit 3. Plate 8.
- the ground plate 7 and the ground plate 8 are connected through a ground via 9.
- the amplifier 5 and the ground plates 7 and 8 are connected via a thermal via 10 for radiating heat from the amplifier 5.
- Patent Document 1 As a prior art document related to the invention of this application, for example, Patent Document 1 is known.
- Patent Document 1 Japanese Unexamined Patent Publication No. 2006-121147
- a communication device includes a substrate, a ground plate disposed on the upper surface, the lower surface, or the inside of the substrate, a semiconductor circuit disposed under the substrate and generating a transmission signal, and the substrate. And an amplifier for amplifying a transmission signal from the semiconductor circuit.
- the ground plate includes a first ground region disposed on the semiconductor circuit and connected to the semiconductor circuit, and a second ground region disposed below the amplifier and connected to the amplifier. The first ground region and the second ground region do not overlap when viewed from the direction.
- the first ground region connected to the semiconductor circuit and the second ground region connected to the amplifier are separated, so that the signal line of the semiconductor circuit is connected to the amplifier without interfering with it.
- a sufficient thermal via can be provided.
- stray inductance is less likely to occur between the amplifier and the ground plate, which can suppress abnormal oscillation of the amplifier.
- FIG. 1 is a diagram showing an upper surface and a lower surface of a communication device according to Embodiment 1 of the present invention.
- FIG. 2 is a diagram showing an upper surface and a lower surface of the communication apparatus according to Embodiment 1 of the present invention.
- FIG. 3 is a diagram showing an upper surface and a lower surface of a communication apparatus according to Embodiment 2 of the present invention.
- FIG. 4 is a diagram showing an upper surface and a lower surface of a communication device according to Embodiment 2 of the present invention.
- FIG. 5 is a cross-sectional view of a communication apparatus according to Embodiment 3 of the present invention.
- FIG. 6 is a diagram showing a top surface and a bottom surface of a communication device and an electronic apparatus using the communication device according to Embodiment 4 of the present invention.
- FIG. 7 is a view showing an upper surface and a lower surface of a conventional communication device.
- Embodiment 1 of the present invention will be described with reference to FIGS.
- FIG. 1 and FIG. 2 are diagrams showing an upper surface and a lower surface of a communication device according to Embodiment 1 of the present invention.
- a communication device 11 is, for example, a chip type, and is connected to an electronic device (not shown) such as a personal computer or a mobile phone and used for wireless communication such as LAN communication.
- the communication device 11 includes a substrate 12, a semiconductor circuit 13 disposed on the lower surface of the substrate 12, an amplifier 14 disposed on the upper surface of the substrate 12 and connected to the semiconductor circuit 13 via a via 15, a substrate 12 And an antenna terminal 16 connected to the output side of the amplifier 14.
- the substrate 12 is, for example, a square substrate and is a multilayer substrate made of a resin such as glass epoxy and having a thickness of 0.5 millimeters or less.
- the substrate 12 is arranged on the upper surface of the substrate 12 and the amplifier 1 4 and a ground plate 18 disposed inside the substrate 12 and connected to the semiconductor circuit 13.
- the ground plate 17 and the ground plate 18 are electrically connected by a ground via 22 provided inside the substrate 12.
- the semiconductor circuit 13 generates a transmission signal, and includes, for example, an IC configured with a large-scale integrated circuit of a CMOS process.
- the semiconductor circuit 13 is connected to more than 200 signal lines provided inside the substrate 12.
- the amplifier 14 amplifies the transmission signal generated by the semiconductor circuit 13.
- the amplifier 14 and the ground plates 17 and 18 are connected by a thermal via 19 for diffusing heat generated from the amplifier 14.
- the amplifier 14 is an IC integrated by a compound semiconductor process.
- the antenna terminal 16 is made of a conductor such as a connector or a through hole of the substrate 12 or solder.
- the antenna terminal 16 supplies a transmission signal to an antenna (not shown) provided on the output side of the antenna terminal 16.
- the ground plate 18 has a first ground region 20 connected to the semiconductor circuit 13, and the ground plate 17 is disposed below the amplifier 14 and connected to the amplifier 14. Has a zone 21. Further, when viewed from above the substrate 12, the first ground region 20 and the second darland region 21 do not have an overlapping region.
- the first ground region 20 connected to the semiconductor circuit 13 and the second ground region 21 connected to the amplifier 14 are separated, so that the signal line of the semiconductor circuit 13 is obstructed. It is possible to sufficiently provide thermal vias 19 connected to the amplifiers 14 without using them. Therefore, stray inductance is less likely to occur between the amplifier 14 and the ground plates 17 and 18, and abnormal oscillation of the amplifier 14 can be suppressed. Further, by providing sufficient thermal vias 19, the amplifier 14 can sufficiently dissipate heat, and the gain reduction due to self-heating of the amplifier 14 can be suppressed. As a result, it is possible to stabilize the transmission characteristic of the amplifier S.
- the ground plates 17 and 18 are a first high impedance region having a higher impedance value than the first ground region 20 and the second ground region 21 between the first ground region 20 and the second ground region 21. 23 may be included.
- the first high-impedance region 23 shown in FIG. 1 is a first connection that is narrower than the ground plate 24 including the first ground region 20 and the ground plate 25 including the second ground region 21.
- the ground plate 26 can be embodied.
- the first connection ground plate 26 connects the ground plate 24 including the first dull region 20 and the ground plate 25 including the second ground region 21.
- the first connection ground plate 26 is such that the ground plate 24 including the first ground region 20 and the ground plate 25 including the second ground region 21 are short-circuited in terms of DC and open in terms of high-frequency. Has an effect. Thereby, it is possible to suppress the low-frequency noise generated from the semiconductor circuit 13 from entering the amplifier 14.
- the amplifier 14 and the antenna terminal 16 are disposed on the same surface of the substrate 12. As a result, the signal does not pass through vias that electrically connect the upper surface and the lower surface of the substrate 12 in the middle of the transmission line, so that transmission loss can be reduced.
- the amplifier 14 and the antenna terminal 16 may be arranged on different surfaces of the substrate 12. As a result, it is possible to suppress the transmission signal amplified by the amplifier 14 from being coupled to the antenna terminal 16.
- the communication device 11 has been described as a transmission device, but the communication device 11 may be a reception device.
- FIG. 3 and FIG. 4 are diagrams showing the top and bottom surfaces of the communication device according to Embodiment 2 of the present invention.
- a semiconductor circuit 13 includes a signal processing circuit, a MAC (Media Access Control) for a wireless LAN, in addition to a transmission / reception circuit of an RF band (2.4 GHz band or 5 GHz band) used for a wireless LAN. ) Have a digital circuit such as a circuit.
- the ground plates 17 and 18 include a transmission / reception circuit ground region 27 disposed below the RF band transmission / reception circuit of the semiconductor circuit 13 and a digital ground region 28 disposed below the digital circuit. Yes.
- the ground plates 17 and 18 are disposed between the transmission / reception circuit ground region 27 and the digital diode region 28.
- a second high impedance ground region 29 having an impedance value higher than that of the transmission / reception circuit ground region 27 and the digital diode region 28 is provided.
- the second high-impedance ground region 29 shown in FIG. 3 is a second connection having a narrower width than the ground plate 30 including the transmission / reception circuit ground region 27 and the ground plate 31 including the digital ground region 28. It can be embodied as a ground plate 32.
- the second connection dielectric board 32 connects the ground board 30 including the transmission / reception circuit ground area 27 and the ground board 31 including the digital ground area 28.
- the second connection ground plate 32 has an effect that the ground plate 30 including the transmission / reception circuit ground region 27 and the ground plate 31 including the digital ground region 28 are short-circuited in terms of DC and open in terms of high-frequency. . As a result, it is possible to suppress the low-frequency noise generated from the digital circuit from being mixed into the transmitting / receiving circuit.
- Embodiment 3 according to the present invention will be described with reference to FIG. Note that the same components as those in the first embodiment are denoted by the same reference numerals, description thereof is omitted, and differences will be described in detail.
- FIG. 5 is a cross-sectional view of the communication device according to Embodiment 3 of the present invention.
- a spacer substrate 33 made of a resin such as glass epoxy is disposed along the peripheral edge of the lower surface of the substrate 12.
- the height (L 1) of the spacer substrate 33 is larger than the component height (L 2) of the semiconductor circuit 13.
- the shield case 34 is disposed on the substrate 12 so as to cover an electronic component (not shown) including the amplifier 14, and fixes the end surface of the substrate 12 and the end surface of the spacer substrate 33.
- the electronic components include resistors, capacitors, and coils that are required only by the amplifier 14. This As a result, the connection reliability between the substrate 12 and the spacer substrate 33 can be improved.
- the shield case 34 can also be soldered to the mother board 35.
- FIG. 6 is a diagram showing an upper surface and a lower surface of a communication device and an electronic apparatus using the communication device according to Embodiment 4 of the present invention.
- the communication device 11 is connected to an interface bus 37 from a microcomputer having a CPU 36.
- An antenna 38 is connected to the antenna terminal 16.
- the communication device 11 can be controlled by the CPU 36 mounted on the electronic device, the electronic device having the communication device with improved transmission characteristics described in the first to third embodiments is realized. It becomes possible to do.
- the communication device has an effect of suppressing the abnormal oscillation of the amplifier, and is useful for an electronic device for a portable terminal or a vehicle.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Transceivers (AREA)
- Amplifiers (AREA)
- Structure Of Printed Boards (AREA)
- Telephone Set Structure (AREA)
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP07767067A EP2031761A1 (en) | 2006-07-20 | 2007-06-08 | Communication device and electronic apparatus using the same |
US12/373,154 US8014161B2 (en) | 2006-07-20 | 2007-06-08 | Communication device and electronic apparatus using the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006197903A JP2008028612A (ja) | 2006-07-20 | 2006-07-20 | 通信装置およびそれを用いた電子機器 |
JP2006-197903 | 2006-07-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008010359A1 true WO2008010359A1 (fr) | 2008-01-24 |
Family
ID=38956694
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/061599 WO2008010359A1 (fr) | 2006-07-20 | 2007-06-08 | Dispositif de communication et appareil électronique l'utilisant |
Country Status (5)
Country | Link |
---|---|
US (1) | US8014161B2 (ja) |
EP (1) | EP2031761A1 (ja) |
JP (1) | JP2008028612A (ja) |
CN (1) | CN101490967A (ja) |
WO (1) | WO2008010359A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4978639B2 (ja) * | 2009-02-18 | 2012-07-18 | ブラザー工業株式会社 | プリント基板及び無線通信端末 |
US9761506B2 (en) * | 2012-02-23 | 2017-09-12 | Rohm Co., Ltd. | Semiconductor device and fabrication method for the same |
TWI712358B (zh) * | 2019-12-03 | 2020-12-01 | 上銀科技股份有限公司 | 電路板裝置 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0983233A (ja) * | 1995-09-20 | 1997-03-28 | Hitachi Ltd | 携帯無線端末 |
JPH11145570A (ja) * | 1997-11-10 | 1999-05-28 | Mitsubishi Electric Corp | プリント基板 |
JP2001313443A (ja) * | 2000-04-28 | 2001-11-09 | Kyocera Corp | 配線基板 |
JP2002077338A (ja) * | 2000-08-29 | 2002-03-15 | Seiko Epson Corp | 携帯型情報端末 |
JP2003101283A (ja) * | 2001-09-20 | 2003-04-04 | Hitachi Cable Ltd | 基板装着用デバイス |
JP2005341489A (ja) * | 2004-05-31 | 2005-12-08 | Toko Inc | 高周波モジュール |
JP2006121147A (ja) | 2004-10-19 | 2006-05-11 | Alps Electric Co Ltd | 携帯電話機用高周波モジュール |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4480240A (en) * | 1982-09-30 | 1984-10-30 | Gould Harry J | Apparatus for separating rf ground plane from housing |
US4449174A (en) * | 1982-11-30 | 1984-05-15 | Bell Telephone Laboratories, Incorporated | High frequency DC-to-DC converter |
US4612512A (en) * | 1984-06-15 | 1986-09-16 | Trw Inc. | Amplifier circuit packaging construction |
US5510758A (en) * | 1993-04-07 | 1996-04-23 | Matsushita Electric Industrial Co., Ltd. | Multilayer microstrip wiring board with a semiconductor device mounted thereon via bumps |
US5500789A (en) * | 1994-12-12 | 1996-03-19 | Dell Usa, L.P. | Printed circuit board EMI shielding apparatus and associated methods |
US5912809A (en) * | 1997-01-21 | 1999-06-15 | Dell Usa, L.P. | Printed circuit board (PCB) including channeled capacitive plane structure |
US6150895A (en) * | 1999-01-25 | 2000-11-21 | Dell Usa, L.P. | Circuit board voltage plane impedance matching |
US6885035B2 (en) * | 1999-12-22 | 2005-04-26 | Lumileds Lighting U.S., Llc | Multi-chip semiconductor LED assembly |
US6337798B1 (en) * | 2000-01-25 | 2002-01-08 | Dell Usa, L.P. | Digital circuit decoupling for EMI reduction |
JP4079699B2 (ja) * | 2001-09-28 | 2008-04-23 | 富士通株式会社 | 多層配線回路基板 |
US7110263B2 (en) * | 2004-03-09 | 2006-09-19 | Intel Corporation | Reference slots for signal traces |
US7515436B2 (en) * | 2004-06-18 | 2009-04-07 | Cell Cross Corporation | Communication unit |
US7294791B2 (en) * | 2004-09-29 | 2007-11-13 | Endicott Interconnect Technologies, Inc. | Circuitized substrate with improved impedance control circuitry, method of making same, electrical assembly and information handling system utilizing same |
US7679005B2 (en) * | 2005-03-23 | 2010-03-16 | Endicott Interconnect Technologies, Inc. | Circuitized substrate with shielded signal lines and plated-thru-holes and method of making same, and electrical assembly and information handling system utilizing same |
TWI287421B (en) * | 2005-06-27 | 2007-09-21 | Delta Electronics Inc | Communication circuit module |
JP5025376B2 (ja) * | 2006-09-11 | 2012-09-12 | キヤノン株式会社 | プリント配線板及び電子機器 |
-
2006
- 2006-07-20 JP JP2006197903A patent/JP2008028612A/ja active Pending
-
2007
- 2007-06-08 CN CNA2007800275765A patent/CN101490967A/zh active Pending
- 2007-06-08 US US12/373,154 patent/US8014161B2/en not_active Expired - Fee Related
- 2007-06-08 WO PCT/JP2007/061599 patent/WO2008010359A1/ja active Application Filing
- 2007-06-08 EP EP07767067A patent/EP2031761A1/en not_active Withdrawn
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0983233A (ja) * | 1995-09-20 | 1997-03-28 | Hitachi Ltd | 携帯無線端末 |
JPH11145570A (ja) * | 1997-11-10 | 1999-05-28 | Mitsubishi Electric Corp | プリント基板 |
JP2001313443A (ja) * | 2000-04-28 | 2001-11-09 | Kyocera Corp | 配線基板 |
JP2002077338A (ja) * | 2000-08-29 | 2002-03-15 | Seiko Epson Corp | 携帯型情報端末 |
JP2003101283A (ja) * | 2001-09-20 | 2003-04-04 | Hitachi Cable Ltd | 基板装着用デバイス |
JP2005341489A (ja) * | 2004-05-31 | 2005-12-08 | Toko Inc | 高周波モジュール |
JP2006121147A (ja) | 2004-10-19 | 2006-05-11 | Alps Electric Co Ltd | 携帯電話機用高周波モジュール |
Also Published As
Publication number | Publication date |
---|---|
US8014161B2 (en) | 2011-09-06 |
US20090290315A1 (en) | 2009-11-26 |
EP2031761A1 (en) | 2009-03-04 |
JP2008028612A (ja) | 2008-02-07 |
CN101490967A (zh) | 2009-07-22 |
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