WO2007148398A1 - Module scellé par résine, module optique et procédé de scellement par résine - Google Patents

Module scellé par résine, module optique et procédé de scellement par résine Download PDF

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Publication number
WO2007148398A1
WO2007148398A1 PCT/JP2006/312510 JP2006312510W WO2007148398A1 WO 2007148398 A1 WO2007148398 A1 WO 2007148398A1 JP 2006312510 W JP2006312510 W JP 2006312510W WO 2007148398 A1 WO2007148398 A1 WO 2007148398A1
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WO
WIPO (PCT)
Prior art keywords
sealing
resin
mounting member
sealing resin
component
Prior art date
Application number
PCT/JP2006/312510
Other languages
English (en)
Japanese (ja)
Inventor
Koji Terada
Jun Matsui
Hiroyuki Nobuhara
Original Assignee
Fujitsu Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Limited filed Critical Fujitsu Limited
Priority to JP2008522210A priority Critical patent/JP4681648B2/ja
Priority to PCT/JP2006/312510 priority patent/WO2007148398A1/fr
Publication of WO2007148398A1 publication Critical patent/WO2007148398A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01077—Iridium [Ir]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Definitions

  • the present invention relates to a resin sealing module and an optical module including mounting members having different linear expansion coefficients, and a resin sealing method in these modules, and in particular, straddling mounting members having different linear expansion coefficients.
  • the present invention relates to a resin-sealed module, an optical module, and a resin-sealing method that are not damaged due to temperature changes even if they are sealed.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2005-252219
  • optical modules have a low parasitic capacitance and a compact mounting state, as when an optical element and its driving IC (Integrated Circuit) are directly connected with a bonding wire. It is summer.
  • IC Integrated Circuit
  • a material having a linear expansion coefficient equivalent to that of an optical element is used for a mounting member on which an optical element is mounted, and a linear expansion equivalent to that of a driving IC is used on a mounting member on which a driving IC is mounted. Since materials with coefficients are used, the linear expansion coefficient of each mounting member is different. And In an optical module having a notable mounting form, mounting members having different linear expansion coefficients are arranged in close proximity.
  • the present invention has been made in view of the above, and is a resin sealing module that does not break due to temperature change even when resin sealing is performed across mounting members having different linear expansion coefficients.
  • An object is to provide an optical module and a resin sealing method.
  • a first mounting member on which a predetermined component is mounted and a linear expansion coefficient different from that of the first mounting member are set.
  • a grease sealing module comprising: a second mounting member; and a connection part for electrically connecting a component on the first mounting member to a component or wiring on the second mounting member, A first sealing resin for resin-sealing components on the first mounting member such that a sealing region does not reach the second mounting member; and a Younger sealing oil than the first sealing resin. It is characterized by comprising a second sealing resin that seals a portion of the connecting portion that is not covered with the first sealing resin, with a low material force.
  • the first sealing resin has lower moisture permeability and more material strength than the second sealing resin.
  • the second sealing resin includes the whole of the first sealing resin in a sealing region. It is characterized by doing.
  • the second sealing resin includes a component on the second mounting member in a sealing region to seal the resin. It is characterized by that.
  • the second sealing resin is a third sealing resin that seals a component on the second mounting member. It is characterized by including grease in the sealing region and sealing with grease.
  • the connection portion is a bonding wire.
  • a first mounting member on which a driving IC is mounted a second mounting member on which an optical element driven by the driving IC is mounted, and the driving IC on the light
  • An optical module including a connection portion that is electrically connected to an element, the first sealing resin sealing the drive IC such that a sealing region does not reach the second mounting member;
  • the second sealing material has a lower Young's modulus than the first sealing resin, and is covered with the first sealing resin in the connecting portion, and the part is sealed with the resin. It is characterized by containing anti-grease.
  • the first sealing resin has lower moisture permeability and more material strength than the second sealing resin.
  • the second sealing resin contains the entire first sealing resin in a sealing region and is sealed with a resin. It is characterized by doing.
  • a first mounting member on which a predetermined component is mounted a second mounting member having a linear expansion coefficient different from that of the first mounting member, and the first mounting member
  • a grease sealing module including a connection portion that electrically connects a component on the mounting member to a component or wiring on the second mounting member, the component on the first mounting member and the connection portion are sealed.
  • a resin sealing method that stops the component on the first mounting member using the first sealing resin so that the sealing region does not reach the second mounting member.
  • the first sealing step and the second sealing resin having a material force having a Young's modulus lower than that of the first sealing resin V, and the first sealing of the connecting portions. It is covered with a resin! /, And a second sealing step for sealing the part with a resin is characterized.
  • a resin sealing module or an optical module including mounting members having different linear expansion coefficients is sealed across the mounting members having different linear expansion coefficients. Parts that are not required are sealed with the first sealing resin, and the parts that need to be sealed across the mounting members with different linear expansion coefficients are low in Young's modulus! Since it is configured to seal, the resin sealing performed by straddling the mounting members with different linear expansion coefficients while the vitality of the characteristics of the first sealing resin is caused by the thermal stress caused by the temperature change Relevant The module can be prevented from being damaged.
  • the first sealing resin is configured to use a material having low moisture permeability and made of a material, failure or performance deterioration due to humidity may occur. If sex can be reduced, it will have a positive effect.
  • the component on the first mounting member and the component or wiring on the second mounting member are connected by wire bonding, the component can be connected at high speed. There is an effect that a resin sealing module capable of operation can be obtained.
  • FIG. 1 is a diagram showing an example of a resin sealing module created by the resin sealing method according to this example according to this example.
  • FIG. 2 is a view showing another example of the resin sealing module created by the resin sealing method according to the present example according to the present example.
  • FIG. 3 is a view showing another example of the resin sealing module created by the resin sealing method according to the present example of the present example.
  • FIG. 4 is a view showing another example of the resin-sealed module created by the resin-sealing method according to this example according to this example.
  • FIG. 5 is a diagram showing an example of an optical module created by the resin sealing method according to the present example according to the present example.
  • FIG. 6 is a diagram showing the periphery of the optical element of the optical module shown in FIG.
  • FIG. 7 is a diagram showing a process of mounting a driving IC on a printed board.
  • FIG. 8 is a diagram showing a process of mounting an optical element on a subcarrier.
  • FIG. 9 is a diagram showing a process of assembling each member.
  • FIG. 10 is a diagram showing a process of performing wire bonding.
  • FIG. 11 is a diagram showing a step of sealing the periphery of the optical element with a resin.
  • FIG. 12 is a diagram showing a step of sealing the periphery of the driving IC with a resin.
  • FIG. 13 is a diagram showing a step of encapsulating the exposed portion of the bonding wire with grease.
  • FIG. 14 is a diagram showing a process of attaching a fiber block.
  • FIG. 15 is a diagram showing an example of a resin sealing module created by a conventional resin sealing method.
  • FIG. 16 is a view showing an example of a resin-sealed module that is resin-sealed across mounting members having different linear expansion coefficients.
  • FIG. 17 is a view showing a surface where the sealing resin is peeled off in the resin sealing module shown in FIG.
  • FIG. 18 is a diagram showing a method conventionally used when connecting parts having different linear expansion coefficients.
  • FIG. 15 is a view showing an example of a resin sealing module produced by a conventional resin sealing method.
  • the component 121 is mounted on the mounting member 111, and the wiring on the mounting member 111 and the component 121 connected by the bonding wires 131 and 132 are sealed with a sealing resin 141. It is the composition to do.
  • the component 121 is, for example, a semiconductor element.
  • the component 121 is mounted on the mounting member 111 for the purpose of supplementing mechanical strength.
  • the mounting member 111 is formed of a material having a linear expansion coefficient equivalent to that of the component 121.
  • the sealing resin 141 is a resin used to protect the component 121 and the bonding wires 131 and 132 from humidity and mechanical shock.
  • the sealing resin 141 peels off from the mounting member 111 due to temperature change, and the resin sealing module 100 was prevented from being damaged.
  • FIG. 16 is a diagram showing an example of a resin sealing module in which mounting members having different linear expansion coefficients are close to each other.
  • the resin sealing module 200 has a component 221 mounted on the mounting member 211, and the wiring on the mounting member 211 and the component 221 are connected by a bonding wire 231.
  • the component 221 is, for example, a semiconductor element.
  • the component 221 is mounted on the mounting member 211 for the purpose of supplementing mechanical strength.
  • the mounting member 211 is formed of a material having a linear expansion coefficient equivalent to that of the component 221.
  • the mounting member 212 is a mounting member on which a component (not shown) of a different type from the component 221 is mounted, and has a linear expansion coefficient different from that of the mounting member 211. Since the component and the component 221 mounted on the mounting member 212 need to exchange signals at high speed, the mounting member 211 and the mounting member 212 are arranged adjacent to each other.
  • the sealing resin 241 is a resin used to protect the component 221 and the bonding wires 231 and 232 from humidity and mechanical impact.
  • the sealing resin 241 seals the parts 221 and the like across the mounting member 211 and the mounting member 212, but the mounting member 21 Since the linear expansion coefficient of 1 and the mounting member 212 are different, it is not possible to match the linear expansion coefficient with at least one of them.
  • FIG. 18 is a diagram showing an example of a resin sealing module that performs resin sealing without straddling between mounting members.
  • the resin sealing module 300 has a component 321 mounted on a mounting member 311, and the wiring on the mounting member 311 and the component 321 connected by a bonding wire 331 are sealed.
  • the resin is sealed with the resin 341, the wiring connected to the bonding wire 331 is drawn out of the sealing region, and the wiring and the optical element package 322 are connected with the lead wires 332 and 333.
  • the sealing resin 341 is peeled off from the mounting member 311 due to a temperature change, and the resin sealing module. It is possible to prevent the Le 300 from being damaged. Further, by providing the lead wires 332 and 333 with sufficient mechanical strength, the strength of the connecting portion can be ensured without sealing with grease.
  • the resin sealing method according to the present embodiment will be described.
  • the Young's modulus is used in the resin sealing method according to this example.
  • Low (soft) soft resin is used as the sealing resin.
  • This table is based on the above formula, taking as an example a glass filler-containing epoxy resin that has been widely used as a sealing resin, and a modified attalate resin having a low Young's modulus. It is used to determine the approximate value of thermal stress. According to this calculation, it is possible to reduce the generation of thermal stress to about 1Z30 by using a low Young's modulus resin as the sealing resin.
  • a sealing resin having a low Young's modulus is used as the sealing resin, it is necessary to pay attention to moisture permeation of the resin.
  • a low Young's modulus resin has a rough network of molecular chains and many gaps through which water molecules permeate. For this reason, a low Young's modulus resin usually has high moisture permeability. Therefore, even if the components on the mounting member are sealed only with a low Young's modulus resin, the moisture resistance of those components cannot be sufficiently secured, and there is a high possibility.
  • a sealing resin having a low moisture permeability which has been conventionally used, is used for the Young's modulus. Use with low sealing grease.
  • An example of a resin sealing module created by the resin sealing method according to this example is shown below.
  • FIG. 1 is a diagram showing an example of a resin sealing module created by the resin sealing method according to the present example. As shown in the figure, the resin sealing module 400 is sealed with two types of sealing resins: a sealing resin 441 and a sealing resin 442.
  • the sealing resin 441 is a resin having a high Young's modulus and a low moisture permeability, and is made of, for example, a glass filler-containing epoxy resin.
  • the sealing resin 441 seals the component 421 mounted on the mounting member 411 and the bonding wires 431 and 432 connected to the component 421.
  • the linear expansion coefficients of the sealing resin 441 and the mounting member 411 are substantially matched.
  • the component 421 is a component that is sensitive to humidity, is mounted on the mounting member 411 having the same linear expansion coefficient, and is electrically connected to a wiring (not shown) on the mounting member 411 by the bonding wire 431.
  • the wiring is electrically connected to the wiring (not shown) on the mounting member 412 by the bonding wire 432.
  • the mounting member 412 is a mounting member on which a component (not shown) having a linear expansion coefficient different from that of the component 421 is mounted, and has a linear expansion coefficient equivalent to that of the mounted component. That is, the mounting member 412 Has a linear expansion coefficient different from that of the mounting member 411. Since the component and the component 421 mounted on the mounting member 412 need to exchange signals at high speed, the mounting member 412 is disposed adjacent to the mounting member 411.
  • the sealing resin 441 seals the entire part 421 in order to protect the part 421 from humidity and mechanical shock.
  • the entire bonding wire 431 is sealed to protect the bonding wire 431 that connects the component 421 to the wiring on the mounting member 411 from the mechanical shock.
  • the sealing resin 441 does not entirely seal the bonding wire 432 that connects the component 421 to the wiring on the mounting member 412. This is because when the sealing resin 441 seals the entire bonding wire 432, the region where the sealing resin 441 having a high Young's modulus seals the resin extends to the mounting member 412 having a different linear expansion coefficient. This is because if the sealing resin 441 is peeled off from the mounting member 412 due to the thermal stress caused by the temperature change and the bonding wire 432 is disconnected, there is a high possibility that another failure will occur.
  • the portion of the bonding wire 432 that has been sealed with grease may be broken by a mechanical impact in the state where the bonding wire 432 is exposed as it is. Therefore, in the resin sealing module 400, the exposed portions of the sealing resin 441 and the bonding wire 432 are sealed with the sealing resin 442.
  • the sealing resin 442 is a resin having a low Young's modulus, and is made of, for example, a modified acrylated resin.
  • the bonding wire 432 can be protected from a disconnection force due to a mechanical impact. Even if the sealing resin 442 has a different coefficient of linear expansion from the mounting member 411, the mounting member 412, and the sealing resin 441, the Young's modulus is low, so that the thermal stress caused by the temperature change is small. None do.
  • the bonding wire 432 is generally made of a material that is not easily affected by humidity, such as a gold wire, and the component 421 that is sensitive to humidity is already covered with the sealing resin 441 having low moisture permeability. Therefore, there is no problem even if the sealing resin 442 has high moisture permeability.
  • the sealing resin 442 covers the entire sealing resin 441.
  • the sealing resin 441 and the sealing resin 442 Is bonded with sufficient strength, a structure in which a part of the sealing resin 441 is exposed to the sealing region force by the sealing resin 442 as in the resin sealing module 401 shown in FIG. You can also
  • the force with which the component 421 is connected to the wiring on the mounting member 412 by the bonding wire 432 is the resin sealing shown in FIG.
  • the part 421 may be directly connected to the part 422 on the mounting member 412 by the bonding wire 433.
  • the sealing resin 442 is included in order to protect the mechanical impact force of the part 4 22 and the bonding wire 434 for connecting the part 422 to the wiring (not shown) on the mounting member 412.
  • the structure is sealed with grease.
  • the component 422 when it is necessary to protect the component 422 in the same manner as the component 421, the component 422 is passed through like the grease sealing module 403 shown in FIG. A structure in which the whole or a part of the sealing resin 443 is sealed with the sealing resin 442 after being sealed with the low-humidity sealing resin 443. At this time, it is necessary that the linear expansion coefficients of the sealing resin 443 and the mounting member 412 are substantially matched.
  • the resin sealing method according to the present embodiment is preferably applied to a small optical module having a low parasitic capacitance, and can be applied to, for example, the optical module 500 shown in FIG.
  • the optical module 500 is configured by connecting an optical element 522 and a driving IC 521. Due to the demand for higher speed (for example, about lOGbpsZch) and downsizing, the optical element 522 and the driving IC 521 are directly electrically connected by the bonding wire 532, and the subcarrier 513 mounting the optical element 522 and the driving IC 521 are mounted.
  • the printed circuit board 511 on which is mounted is disposed in proximity.
  • the linear expansion coefficient of a general printed circuit board including the printed circuit board 511 is about 20E-6Z ° C. If the subcarrier 513 is an iridium phosphorus (InP) substrate, its linear expansion coefficient is about 4E-6Z ° C. In this way, there is a difference of about 5 times in the linear expansion coefficient between the two mounting members.
  • the optical element 522 and the driving IC 521 are sealed with grease to protect them from mechanical impact and the like, they are sealed due to temperature changes. There is a possibility that the sealant may peel off any mounting member force and cause a failure such as disconnection of the bonding wire 5 32.
  • the resin sealing method according to the present embodiment is applied to the optical module 500.
  • the driving IC521 which is sensitive to humidity, is sealed with a low moisture-permeable sealing resin 541 such as a glass filler-containing epoxy resin so that the sealing area does not extend outside the printed board 511. ing.
  • a low moisture-permeable sealing resin 541 such as a glass filler-containing epoxy resin so that the sealing area does not extend outside the printed board 511.
  • the exposed portion of the bonding wire 532 that connects the optical element 522 and the driving IC 521 is sealed with a sealing resin 542 having a low Young's modulus such as a modified atalylate-based resin.
  • the sealing resin 541 has a linear expansion coefficient equivalent to that of the printed board 511. Therefore, the sealing resin 542 seals the bonding wire 532 across the parts of the sealing resin 541 and the subcarrier 513 that have different linear expansion coefficients by about 5 times. However, since the sealing resin 542 has a low Young's modulus, the subcarrier 513 isotropic force that does not generate a large thermal stress due to a temperature change does not occur, and a failure such as disconnection of the bonding wire 532 does not occur. .
  • the driving IC 521 is mounted on a printed board 511, connected to a wiring (not shown) on the printed board 511 by a bonding wire 531, and an optical element 522 mounted on a subcarrier 513. Connected by bonding wire 532.
  • Sealing resin 541 is a low moisture-permeable resin having a linear expansion coefficient equivalent to that of printed board 511, and within a range where the sealing area does not extend outside printed board 511, and driving IC 521 and bonding wire 531 The whole is sealed. Also, the sealing resin 541 seals a part of the bonding wire 532 in the vicinity of the joint between the driving IC 521 and the bonding wire 532!
  • the optical element 522 is mounted on the subcarrier 513, and the subcarrier 513 is housed in the housing 512.
  • the casing 512 is combined with the printed board 511 to provide a fiber block. Connected with lock 560.
  • the casing 512 is made of, for example, Kovar with a linear expansion coefficient that is weaker and thinner than the printed board 511, for example.
  • the sealing resin 542 is a resin having a low Young's modulus and seals the exposed portion of the bonding wire 532.
  • the subcarrier 513 is arranged substantially perpendicular to the printed board 511.
  • the configuration in which the subcarrier 513 is arranged vertically is a configuration necessary for simply optically coupling input / output light to the module to the optical element 522.
  • a planar optical element (V CSEL array, PIN-PD array, etc.) that inputs and outputs light perpendicular to the substrate surface is often used.
  • the input / output of light to / from the optical module 500 is performed in the front-rear direction of the module, that is, in the horizontal direction with the printed circuit board 511.
  • the subcarrier 513 on which the optical element 522 is mounted needs to be set substantially vertically.
  • the bonding wire 532 By sealing the bonding wire 532 with the sealing resin 541 only partly and sealing the other part with the sealing resin 542 having a low hang ratio, the bonding wire 532 is also mechanically impacted. While protecting, the thermal stress acting on the interface between the subcarrier 513 and the sealing resin 541 can be reduced, and the sealing resin peeling can be suppressed.
  • the subcarrier 513 is arranged substantially perpendicular to the printed board 511 in order to reduce the distance between the driving IC 521 and the optical element 522 and realize high-speed operation. Is also known as lj.
  • Fig. 6 shows a detailed configuration around the optical element 522.
  • the optical element 522 is disposed on the back surface of the subcarrier 513 when viewed from the drive IC 521.
  • a lens 525 having a light receiving portion (not shown) as a focal point is formed on one surface of the optical element 522, and an electrode 523 is formed on the other surface.
  • the subcarrier 513 has a bonding wire 532 and wire bonding on one side.
  • a bonding pad 572 to be further connected is formed, and a flip chip mounting pad 573 for connecting to the optical element 522 is formed on the other surface.
  • the bonding pad 572 and the flip chip mounting pad 573 are electrically connected by a via 571.
  • the optical element 522 and the subcarrier 513 are fixed by connecting the electrode 523 and the flip chip mounting pad 573 with a noder 524.
  • the configuration in which one surface of the subcarrier 513 is connected to the driving IC 521 by the bonding wire 532 and the other surface is flip-flop connected to the optical element 522 is an arrangement like the lead wire 332 shown in FIG. Since no line drawing is required, the parasitic capacitance is small and high-speed operation is easy to realize.
  • the via 571 that electrically connects the bonding wire 532 and the optical element 522 is preferably small in diameter, and the thickness of the subcarrier 513 is also small.
  • the thickness is preferably thin as long as the mechanical strength is maintained.
  • the sealing resin 580 shown in FIG. 6 covers the electrode 523 side and the side surface of the optical element 522 and does not cover the lens 525 side.
  • the electrode 523 side of the optical element 522 must be sealed with grease in order to protect the humidity force, but the lens 525 side is not particularly sensitive to humidity, and the optical element 522 has an AR (Anti-Reflective) structure. This is because the coating (formed on the back surface including the back lens) is designed against the air and is not covered with the sealing resin 580 because of its superior characteristics.
  • sealing resin 580 for example, an epoxy-based resin containing glass filler in which the linear expansion coefficient is matched with the linear expansion coefficient (about 4E-6Z ° C) of the optical element 522 and the subcarrier 513 is used. It can be done.
  • the driving IC 521 is bonded to the print plate 511 using an adhesive having high thermal conductivity, such as silver paste 590.
  • the optical element 522 is flip-chip mounted on the subcarrier 513.
  • the electrode 523 of the optical element 522 is patterned with solder 524 such as AnSu.
  • the optical element 522 is placed at a predetermined position of the subcarrier 513 and heated to the solder melting temperature or higher.
  • the electrode 523 force of the optical element 522 is connected to the flip chip mounting pad 573 of the subcarrier 513.
  • each member is assembled. Specifically, as shown in FIG. 9, a printed board 511 and a subcarrier 513 are attached to a housing 512, and are fixed using an adhesive (for example, an epoxy adhesive).
  • an adhesive for example, an epoxy adhesive
  • wire bonding is performed. Specifically, one end of the bonding wire 531 is bonded to the driving IC 521 by wire bonding, and the other end is bonded to the wiring on the printed board 511. Then, after one end of the bonding wire 532 is bonded to the driving IC 521 by wire bonding, the casing 512 is rotated by 90 °, and the other end of the bonding wire 532 is bonded to the subcarrier 513. Since the optical module 500 has a structure in which the subcarrier 513 stands vertically with respect to the printed board 511, it is necessary to rotate the casing 512 by 90 ° during the wire bonding process.
  • the periphery of the drive IC 521 is sealed with a sealing resin 541.
  • the sealing resin 541 is prevented from protruding the printed board 511.
  • the bonding wire 532 connecting the driving IC 521 and the subcarrier 513 is exposed except for the vicinity of the junction with the driving IC 521.
  • the periphery of the bonding wire 532 is sealed with a sealing grease 542 as shown in FIG.
  • the sealing resin 542 is bonded to the subcarriers 513 and the casing 512 having different linear expansion coefficients. Since the sealing resin 542 has a small Young's modulus, a large thermal stress is applied to the bonding surface. There is no possibility of disconnection of the bonding wire 532 due to peeling of the sealing resin 542 that does not occur. It should be noted that the bonding wire 532 is prevented from being disconnected due to a deviation of both sealing resins at the interface between the sealing resin 541 and the sealing resin 542. Therefore, it is necessary to sufficiently bond the sealing resin 541 and the sealing resin 542.
  • the fiber block 560 is connected as shown in FIG.
  • the driving IC 521 is operated so that the optical element 522 receives and emits light, and this and the core of the optical fiber in the fiber block 560 are aligned and fixed with an adhesive (not shown).
  • Fixing adhesives need to be cured in a short time, and UV curable adhesives that cure in a few minutes are suitable.
  • the material of the fiber block 560 is preferably a glass-based material that transmits UV light.
  • the resin sealing module, the optical module, and the resin sealing method according to the present invention provide a resin sealing across mounting members having different linear expansion coefficients in order to realize a compact form. This is useful in the case of carrying out the process, and particularly suitable for the case where the damage due to the peeling of the resin seal due to the temperature change is prevented.

Abstract

Module scellé par résine qui, même lorsqu'un scellement par résine est effectué à cheval sur des éléments montés présentant différents coefficients de dilatation linéique, ne subit aucun dommage dû à un changement de température ; et module optique pertinent et procédé de scellement par résine. La présente invention fournit un module scellé par résine (400) ayant un élément monté (411) et un élément monté (412) en tant qu'éléments montés présentant différents coefficients de dilatation linéique, dans lequel une partie (421) est scellée au moyen d'une résine de scellement (441) de peur que la région de scellement n'atteigne l'élément monté (412), et dans lequel la partie exposée du fil de connexion (432) est scellée au moyen d'une résine de scellement (442) avec un faible module d'élasticité de Young.
PCT/JP2006/312510 2006-06-22 2006-06-22 Module scellé par résine, module optique et procédé de scellement par résine WO2007148398A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008522210A JP4681648B2 (ja) 2006-06-22 2006-06-22 樹脂封止モジュール、光モジュールおよび樹脂封止方法
PCT/JP2006/312510 WO2007148398A1 (fr) 2006-06-22 2006-06-22 Module scellé par résine, module optique et procédé de scellement par résine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/312510 WO2007148398A1 (fr) 2006-06-22 2006-06-22 Module scellé par résine, module optique et procédé de scellement par résine

Publications (1)

Publication Number Publication Date
WO2007148398A1 true WO2007148398A1 (fr) 2007-12-27

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JP (1) JP4681648B2 (fr)
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JP2014116409A (ja) * 2012-12-07 2014-06-26 Denso Corp 電子装置
WO2015033633A1 (fr) * 2013-09-03 2015-03-12 株式会社村田製作所 Élément laser émettant en surface à cavité verticale (vcsel), plaquette semi-conductrice et module électroluminescent comportant un élément laser émettant en surface à cavité verticale et procédé de fabrication d'un élément laser émettant en surface à cavité verticale
KR20160093948A (ko) * 2015-01-30 2016-08-09 앰코 테크놀로지 코리아 주식회사 칩 적층형 반도체 패키지 및 이의 제조 방법

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US20160111581A1 (en) * 2014-10-16 2016-04-21 Semiconductor Components Industries, Llc Packaged semiconductor devices and related methods

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JPH05175375A (ja) * 1991-12-25 1993-07-13 Hitachi Ltd 樹脂封止型半導体装置
JPH0722576A (ja) * 1993-07-05 1995-01-24 Mitsubishi Electric Corp 半導体パワーモジュールおよび複合基板、並びに半導体パワーモジュールの製造方法
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Publication number Priority date Publication date Assignee Title
JP2014116409A (ja) * 2012-12-07 2014-06-26 Denso Corp 電子装置
WO2015033633A1 (fr) * 2013-09-03 2015-03-12 株式会社村田製作所 Élément laser émettant en surface à cavité verticale (vcsel), plaquette semi-conductrice et module électroluminescent comportant un élément laser émettant en surface à cavité verticale et procédé de fabrication d'un élément laser émettant en surface à cavité verticale
KR20160093948A (ko) * 2015-01-30 2016-08-09 앰코 테크놀로지 코리아 주식회사 칩 적층형 반도체 패키지 및 이의 제조 방법
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