WO2007145354A1 - Refroidisseur - Google Patents

Refroidisseur Download PDF

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Publication number
WO2007145354A1
WO2007145354A1 PCT/JP2007/062199 JP2007062199W WO2007145354A1 WO 2007145354 A1 WO2007145354 A1 WO 2007145354A1 JP 2007062199 W JP2007062199 W JP 2007062199W WO 2007145354 A1 WO2007145354 A1 WO 2007145354A1
Authority
WO
WIPO (PCT)
Prior art keywords
groove
heat transfer
transfer member
flow path
cooling fluid
Prior art date
Application number
PCT/JP2007/062199
Other languages
English (en)
Japanese (ja)
Inventor
Tadafumi Yoshida
Yutaka Yokoi
Hiroshi Osada
Original Assignee
Toyota Jidosha Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Jidosha Kabushiki Kaisha filed Critical Toyota Jidosha Kabushiki Kaisha
Priority to CN2007800210366A priority Critical patent/CN101461059B/zh
Priority to DE112007001422T priority patent/DE112007001422B4/de
Priority to US12/304,426 priority patent/US20090145586A1/en
Publication of WO2007145354A1 publication Critical patent/WO2007145354A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/10—Secondary fins, e.g. projections or recesses on main fins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a cooler.
  • the object to be cooled is disposed on the heat transfer member and directed toward the heat transfer member.
  • a cooler that performs cooling by spraying the cooling fluid.
  • Japanese Patent Application Laid-Open No. 3-304557 discloses a semiconductor device cooling method in which a predetermined liquid is supplied to a heat generating part of a semiconductor device to vaporize it, and the heat generating part is cooled by the latent heat of vaporization. According to this cooling method for a semiconductor device, it is disclosed that the cooling efficiency and the reliability of the semiconductor device can be improved, the cooling structure can be simplified and miniaturized, and the corrosiveness and contamination by the cooling fluid can be prevented. .
  • Japanese Patent Publication No. 2 0 0 1-5 2 1 1 3 8 discloses a two-phase cooling apparatus for a cooling apparatus for an electronic element.
  • This two-phase cooling device has a first housing part, a second housing part, and a third housing part.
  • one or more fog nozzles are fixed to the inner surface, and one or more high-power electronic elements are mounted on the outer surface at positions facing the fog nozzle.
  • the coolant is sprayed from the spray nozzle by a pump. It is disclosed that when the cooling liquid comes into contact with the heated part of the second housing part, a part of the cooling liquid is converted into steam, and the remaining part of the cooling liquid returns to the first housing part in the liquid state. Yes.
  • a spray cooling system comprising a body including a wall is disclosed.
  • the outer surface of the heat transfer wall is held against a part of the part It is configured as follows.
  • a sprayer is arranged to spray the cooling fluid onto the inner surface. In this spray cooling system, it is disclosed that it can be efficiently mounted at multiple locations in a complex system.
  • cooling can be performed mainly by the latent heat of vaporization when the cooling fluid evaporates.
  • the cooling fluid when the cooling fluid is sprayed toward the heat transfer member, the cooling fluid flows while taking heat, thereby cooling the object to be cooled.
  • the body to be cooled In order for the body to be cooled to be uniformly cooled, it is preferable that at least a region of the heat transfer member in which the body to be cooled is disposed is cooled uniformly. In order for the heat transfer member to be cooled in a uniform manner, it is preferable that the cooling fluid be uniformly arranged on the surface of the heat transfer member.
  • An object of the present invention is to provide a cooler that can perform uniform cooling.
  • the cooler according to the present invention includes a heat transfer member having a surface on which a cooling fluid is sprayed.
  • the heat transfer member includes a first flow path formed on the surface, and a second flow path formed on the surface and intersecting the first flow path.
  • the first flow path is formed so as to supply the cooling fluid to almost the entire surface.
  • the first flow path is formed so as to discharge the excessive cooling fluid.
  • the second flow path promotes evaporation of the cooling fluid. It is formed to advance.
  • the second flow path is formed so that a shape in a cross section perpendicular to a direction in which the second flow path extends is stepped.
  • the heat transfer member is preferably formed in a convex shape so that the height of the heat transfer member decreases from the central portion toward the outer peripheral portion.
  • the heat transfer member is inclined so that the surface of the heat transfer member decreases in height from the central portion toward the outer peripheral portion.
  • the first flow path and the second flow path are formed in a groove shape. At least one of the first channel and the second channel is formed so as to gradually become deeper from the central portion of the surface toward the outer peripheral portion.
  • the second flow path is formed in a groove shape. The second flow path is formed so that at least a part thereof causes capillary action.
  • the first flow path and the second flow path are each formed in a groove shape having a bottom surface.
  • the bottom surface of the second channel is formed to be lower than the bottom surface of the first channel.
  • FIG. 1 is a schematic side view of a cooler in the first embodiment.
  • FIG. 2 is a schematic plan view of the heat transfer member in the first embodiment.
  • FIG. 3 is a first schematic cross-sectional view of the first groove of the heat transfer member in the first embodiment.
  • FIG. 4 is a first schematic cross-sectional view of the second groove of the heat transfer member in the first embodiment.
  • FIG. 5 is a second schematic cross-sectional view of the first groove of the heat transfer member in the first embodiment.
  • FIG. 6 is a second schematic cross-sectional view of the second groove of the heat transfer member in the first embodiment.
  • FIG. 7 is a schematic cross-sectional view of another second groove in the first embodiment.
  • FIG. 8 is a schematic cross-sectional view of still another second groove in the first embodiment.
  • FIG. 9 is a schematic plan view of the heat transfer member in the second embodiment.
  • FIG. 10 is a schematic side view of the first cooler in the third embodiment.
  • FIG. 11 is a schematic cross-sectional view of the second cooler in the third embodiment.
  • FIG. 12 is a schematic plan view of the heat transfer member in the fourth embodiment.
  • FIG. 13 is a schematic cross-sectional view of a heat transfer member in the fourth embodiment.
  • FIG. 1 is a schematic side view of a cooler in the present embodiment.
  • the cooler in the present embodiment is a cooler in which cooling is performed by spraying a cooling fluid.
  • the cooler in the present embodiment includes a heat transfer member 1.
  • the heat transfer member 1 is formed in a flat plate shape.
  • heating element 12 On the surface of the heat transfer member 1, a heating element 12 as a body to be cooled is disposed.
  • the heating element 12 is joined to the main surface of the heat transfer member 1.
  • heating element 12 is arranged at the center of the main surface of heat transfer member 1.
  • the cooler in the present embodiment includes a sprayer 11.
  • the sprayer 11 is disposed so as to face the main surface opposite to the side on which the heating element 12 of the heat transfer member 1 is disposed.
  • the sprayer 1 1 is arranged away from the heat transfer member 1.
  • the sprayer 1 1 is formed so that the cooling fluid 2 1 can be sprayed. That is, the sprayer 11 is formed so that the cooling fluid 21 can be ejected in granular form.
  • the sprayer 11 is formed so that the cooling fluid 21 can be sprayed toward the main surface of the heat transfer member 1 on the side opposite to the side where the heating element 12 is disposed.
  • a liquid is used as the cooling fluid.
  • FIG. 2 shows a schematic plan view of the heat transfer member in the present embodiment.
  • the heat transfer member 1 in the present embodiment has a substantially circular planar shape.
  • the heat transfer member 1 has a first groove 1a as a first flow path formed on the surface.
  • Heat transfer member 1 is the above table
  • a second groove lb is formed as a second flow path formed on the surface and intersecting the first groove 1a.
  • the first groove 1a and the second groove 1b in the present embodiment are formed such that the extending directions are perpendicular to each other.
  • the first groove 1a and the second groove 1b communicate with each other.
  • the heating element 12 is disposed in a region corresponding to substantially the center of the region where the first groove 1a and the second groove 1b are formed.
  • first grooves 1a are formed.
  • the first groove l a is formed on almost the entire surface of the heat transfer member 1.
  • the first groove 1a is formed in a straight line.
  • the first grooves 1a are formed to be spaced from each other.
  • the first grooves 1a in the present embodiment are formed at regular intervals.
  • the first grooves 1a are formed so that the extending direction forces are parallel to each other.
  • the first groove la is formed to extend from one end surface of the heat transfer member 1 to the other end surface.
  • the first groove la is formed so that excessive cooling fluid out of the supplied cooling fluid can be discharged to the outside of the heat transfer member 1.
  • a plurality of second grooves 1b are formed.
  • the second groove l b is formed in a straight line shape.
  • the second grooves l b are formed with a space therebetween.
  • the second grooves 1b in the present embodiment are formed at equal intervals.
  • the second grooves l b are formed so that the extending directions are parallel to each other.
  • the second grooves l b are formed so that the lengths in the extending direction are substantially the same.
  • the second groove l b has an end disposed in a region inside the main surface of the heat transfer member 1.
  • the second groove l b is formed so as not to reach the end face of the heat transfer member 1.
  • the second groove l b is formed so that the cooling fluid supplied to the inside is not discharged from the end of the second groove 1 b.
  • FIG. 3 shows a schematic cross-sectional view of the first groove portion of the heat transfer member in the present embodiment.
  • FIG. 3 is a cross-sectional view taken along line III-III in FIG.
  • the first groove la is formed so as to penetrate from one end surface of the heat transfer member 1 to the other end surface.
  • the first groove 1 a is formed to have a constant depth along the extending direction.
  • FIG. 4 shows a schematic cross-sectional view of the second groove portion of the heat transfer member in the present embodiment. 4 is a cross-sectional view taken along the line IV-IV in FIG.
  • the second groove lb is formed to have a constant depth along the extending direction. In this embodiment The second groove lb is formed so that the ends on both sides do not communicate with the outside.
  • heat transfer member 1 in the present embodiment is formed to have a constant thickness in the direction in which first groove la extends and in the direction in which second groove 1 b extends. Yes.
  • Each groove is formed so that the bottom surface is located at a
  • FIG. 5 shows an enlarged schematic cross-sectional view of the first groove in the present embodiment.
  • FIG. 5 is a schematic sectional view taken along a plane perpendicular to the extending direction of the first groove.
  • the first groove la in the present embodiment has a U-shaped cross section.
  • the first groove l a has a bottom surface 9 a.
  • the first groove 1a has a depth d1.
  • FIG. 6 shows an enlarged schematic cross-sectional view of the second groove in the present embodiment.
  • FIG. 6 is a schematic cross-sectional view taken along a plane perpendicular to the direction in which the second groove extends.
  • the second groove l b in the present embodiment is formed so that the cross-sectional shape is stepped.
  • the second groove 1b is formed to have a plurality of steps.
  • the second groove lb is formed so that the central portion in the width direction is deepest.
  • the second groove 2 b ′ has a bottom surface 9 b.
  • the second groove 1b has a depth d2.
  • the depth d2 of the second groove 1b in the present embodiment is formed to be greater than the depth d1 of the first groove 1a. That is, the bottom surface 9 b of the second groove l b is formed to be lower than the bottom surface 9 a of the first groove 1 a.
  • the cooling fluid 2 1 is sprayed from the sprayer 1 1 toward the heat transfer member 1.
  • spraying is performed over substantially the entire main surface of the heat transfer member 1 around the center of the planar circle of the heat transfer member 1.
  • the cooling fluid When there is a shortage of cooling fluid locally, it flows through the first groove 1a and the second groove 1b, and the cooling fluid flows into the shortage area, so that the cooling fluid is almost uniformly distributed.
  • the first groove 1 a and the second groove 1 are not uniformly sprayed from the sprayer 1 1 to the heat transfer member 1 due to a transient change, and even when sprayed in any region.
  • the cooling fluid can be distributed evenly over the bonito, and the heat transfer member is cooled almost uniformly.
  • the cooler in the present embodiment includes the heat transfer member, and the heat transfer member includes the first flow path formed on the surface on which the cooling fluid is sprayed and the second flow path that intersects the first flow path. Including the flow path.
  • the cooling fluid can be disposed substantially uniformly over the entire region where the first groove and the second groove are formed. • In the region where the first and second grooves are formed, the heat transfer member is cooled almost uniformly, and as a result, the member to be cooled can be cooled almost uniformly.
  • second groove 1b in the present embodiment has a stepped portion by forming the cross-sectional shape in a stepped shape.
  • a corner portion is formed in the cross-sectional shape.
  • the first groove is formed so as to supply the cooling fluid to almost the entire surface of the heat transfer member, and further formed so as to discharge the excessive cooling fluid.
  • the second groove l b is formed so as to promote the evaporation of the cooling fluid.
  • depth d 2 of second groove l b is formed to be deeper than depth d 1 of first groove 1 a.
  • the cooling fluid flowing into the first groove 1a can be easily distributed to the second groove 1b.
  • the cooling fluid can be retained at a uniform depth at the bottom of the second groove 1b, and fluctuations in cooling performance can be reduced.
  • FIG. 7 shows a schematic cross-sectional view of another second groove in the present embodiment.
  • the other second groove 1c is formed so that the cross-sectional shape is substantially U-shaped.
  • Second groove inner surface of lc A plurality of recesses 7 are formed.
  • the recesses 7 are formed at intervals.
  • FIG. 8 shows a schematic cross-sectional view of still another second groove in the present embodiment. Further, the other second groove Id is formed in a substantially U-shaped cross section. A plurality of convex portions 8 are formed on the inner surface of the second groove Id. The convex portions 8 are formed with a space therebetween.
  • a convex portion or a concave portion is formed on the surface of the second flow path, whereby a corner portion can be formed in the cross-sectional shape of the second groove, and the cooling fluid Can be held in the second groove.
  • the surface area of the second groove can be increased, and evaporation can be promoted.
  • the structure for promoting the evaporation of the second groove is not limited to any one of these structures.
  • a porous material may be disposed on the surface of the second groove.
  • a corner portion or a step portion in the cross-sectional shape may be formed as described above.
  • the second groove may be filled with whisker.
  • the second groove may be formed so that at least a part thereof causes capillary action.
  • the cooling fluid moves along the second groove due to the capillary phenomenon, and the cooling fluid can be disposed in almost the entire second groove.
  • the width of the second groove may be small enough to cause capillary action.
  • the end of the second groove in the present embodiment is disposed inside the main surface of the heat transfer member, but the present invention is not limited to this form, and the end of the second groove is formed on the end surface of the heat transfer member. It may be formed to reach. With this configuration, the excessive cooling fluid supplied to the second groove can be directly discharged without passing through the first groove.
  • the first groove and some of the second grooves in the present embodiment have a U-shaped cross-section, but the present invention is not limited to this shape, and any shape can be adopted.
  • the cross-sectional shape may be V-shaped.
  • the heat transfer member in the present embodiment is formed in a flat plate shape, but is not limited to this form, and any shape can be adopted.
  • the heat transfer member is not limited to a plate shape, and may be formed in a rectangular parallelepiped shape.
  • material Although it is not limited, it is preferably formed of a material having excellent heat conduction.
  • the object to be cooled is arranged on the surface of the heat transfer member.
  • the present invention is not limited to this form, and the heat transfer member may be formed as a part of the object to be cooled.
  • the first flow path and the second flow path may be formed on the surface of the casing of the member to be cooled, and the cooling fluid may be sprayed toward the surface.
  • the cooler in the present invention can be applied to a cooler that cools an arbitrary object to be cooled.
  • Embodiment 2 of the present invention With reference to FIG. 9, a cooler according to Embodiment 2 of the present invention will be described.
  • the cooler in the present embodiment is different from the first embodiment in the configuration of the first flow path and the second flow path of the heat transfer member.
  • FIG. 9 is a schematic plan view of the heat transfer member in the present embodiment.
  • the heat transfer member 2 is formed in a flat plate shape.
  • the heat transfer member 2 has a substantially circular planar shape.
  • the heat transfer member 2 in the present embodiment has a first groove 2a as a first flow path and a second groove 2b as a second flow path.
  • the first groove 2a and the second groove 2b are formed on the surface on which the cooling fluid is sprayed.
  • the first groove 2a and the second groove 2b are formed so as to cross each other.
  • the first groove 2a and the second groove 2b communicate with each other.
  • the heating element 12 as a cooled body in the present embodiment is disposed on the main surface opposite to the main surface on which the first groove 2 a and the second groove 2 b are formed.
  • the heating element 12 is disposed at a substantially central portion of a region corresponding to the region where the first groove 2a and the second groove 2b are formed.
  • a plurality of first grooves 2a are formed.
  • the first groove 2a is formed in a straight line.
  • the first grooves 2 a are formed such that the extending directions thereof are radial.
  • the first groove 2 a is formed so as to extend from the center of the planar circle of the heat transfer member 2 toward the outer periphery.
  • the outer end of the first groove 2 a reaches the end surface of the heat transfer member 2.
  • the first groove 2a is formed so that excess cooling fluid can be discharged outside.
  • a plurality of second grooves 2b are formed.
  • the second groove 2b is formed so as to extend in a substantially circular shape when viewed from above.
  • the second groove 2b is closed when viewed in plan Have
  • the plurality of second grooves 2 b are formed concentrically when viewed from above.
  • the second grooves 2b are formed at equal intervals.
  • the second groove 2 b is formed so as not to reach the end face of the heat transfer member 2.
  • the cooling fluid can be arranged almost uniformly in the region where the first groove and the second groove of the heat transfer member are formed, and the object to be cooled is almost even. Can be cooled.
  • Embodiment 3 of the present invention With reference to FIGS. 10 and 11, a cooler according to Embodiment 3 of the present invention will be described.
  • the shape of the heat transfer member is different from that of the first embodiment.
  • FIG. 10 is a schematic side view of the first cooler in the present embodiment.
  • the first cooler in the present embodiment includes a heat transfer member 3.
  • the heat transfer member 3 has a convex surface on the surface where the first groove and the second groove are formed.
  • the heat transfer member 3 has a substantially circular planar shape.
  • the heat transfer member 3 is formed so that the height of the surface on which the cooling fluid 21 is sprayed decreases from the center toward the outer periphery.
  • the surface of the heat transfer member 3 is inclined.
  • the heat transfer member 3 is formed such that the portion facing the sprayer 11 is the thickest and becomes thinner toward the outer periphery.
  • the heat transfer member 3 is formed so that the central portion is thickest and becomes thinner toward the outer peripheral portion.
  • the sprayer 11 is disposed directly above the center of the heat transfer member 3.
  • the first groove 3 a is formed along the surface facing the sprayer 11.
  • the first groove 3a is formed to have a constant depth.
  • the first groove 3 a is formed so as to reach the end face of the heat transfer member 3.
  • the second groove (not shown) is formed so as to have a constant depth, and is formed so as to reach the end face of the heat transfer member 3.
  • the cooling fluid 21 sprayed from the sprayer 11 flows toward the outer periphery in the first groove 3a as indicated by an arrow 32.
  • the surface of the heat transfer member 3 where the first and second grooves are formed is formed in a convex shape. • Excess cooling fluid can be discharged by gravity.
  • FIG. 11 is a schematic cross-sectional view of the second cooler in the present embodiment.
  • the second cooler in the present embodiment includes a heat transfer member 4.
  • the heat transfer member 4 has a first groove 4 &.
  • the heat transfer member 4 has a surface in which the first groove 4a and the second groove are formed in a convex shape.
  • the heat transfer member 4 has a substantially arcuate surface shape when cut along a surface along the direction in which the first groove 4a extends.
  • the first groove 4 a is formed so as to reach the end face of the heat transfer member 4.
  • the second groove (not shown) is formed so as to reach the end face of the heat transfer member 4.
  • the heat transfer member 4 has a substantially arcuate surface shape when cut along a surface along the direction in which the second groove extends.
  • the nebulizer 11 is disposed directly above the thickest part of the heat transfer member 4. Also in the second cooler in the present embodiment, as shown by an arrow 33, the excessive cooling fluid 21 can be discharged outward by gravity.
  • the heat transfer member in the present embodiment has a convex surface shape in the direction in which the first groove extends and the direction in which the second groove extends, but is not limited to this form, and the first groove extends
  • the cross-sectional shape may be a convex shape in either one of the direction and the direction in which the second groove extends.
  • FIG. 12 is a schematic plan view of the heat transfer member of the cooler in the present embodiment.
  • the cooler in the present embodiment includes a heat transfer member 5.
  • the heat transfer member 5 is formed in a flat plate shape.
  • the heat transfer member 5 has a planar shape that is substantially circular.
  • a first groove 5 a as a first flow path and a second groove 5 b as a second flow path are formed on the surface of the heat transfer member 5 on which the cooling fluid is sprayed.
  • Each of the first groove 5a and the second groove 5b is formed in a straight line.
  • the first groove 5a and the second groove 5b are formed so as to be orthogonal to each other.
  • a plurality of first grooves 5a are formed.
  • the first grooves 5a are spaced at almost equal intervals. It is formed so as to be separated.
  • a plurality of second grooves 5 b are arranged.
  • the second grooves 5b are formed so as to be spaced apart from each other at substantially equal intervals.
  • the heat transfer member 5 in the present embodiment has a discharge groove 5 c 5 d formed so as to surround the area where the first groove 5 a and the second groove 5 b are formed.
  • the discharge groove 5 c is formed so as to communicate with the first groove 5 a.
  • the discharge groove 5 c is formed so as to extend in a direction substantially perpendicular to the direction in which the first groove 5 a extends.
  • the discharge groove 5 c is arranged at both end portions of the first groove 5 a.
  • the discharge groove 5 d is formed so as to communicate with the second groove 5 b.
  • the discharge groove 5 d is formed to extend in a direction substantially perpendicular to the direction in which the second groove 5 b extends.
  • the discharge groove 5d is arranged at both end portions of the second groove 5b.
  • the discharge grooves 5 C and 5 d extend to the end surface of the heat transfer member 5.
  • the discharge grooves 5 c and 5 d are formed so that the cooling fluid can be discharged outside the heat transfer member 5.
  • FIG. 13 is a schematic cross-sectional view of the cooler in the present embodiment.
  • FIG. 13 is a cross-sectional view taken along line X I I I -X I I in FIG.
  • the discharge grooves 5 c and 5 d in the present embodiment have a U-shaped cross section.
  • the first groove 5 a in the present embodiment is formed so that the depth gradually increases from the central part to the peripheral part of the surface of the heat transfer member 1.
  • the surface of the heat transfer member 1 is formed in a flat shape so that the first groove 5a gradually becomes deeper toward the discharge groove 5c.
  • the second groove 5b is formed so as to gradually become deeper toward the discharge groove 5d.
  • the cooling fluid is sprayed from the sprayer 11 toward the heat transfer member 5.
  • the cooling fluid sprayed on the first groove 5 a flows toward the discharge groove 5 c as indicated by an arrow 36. Excess cooling fluid in the first groove 5a is guided to the discharge groove 5c.
  • the cooling fluid is positively discharged by being formed so that the depth gradually increases from the central portion toward the outer peripheral portion. Referring to FIG. 12, excess cooling fluid that has flowed into discharge groove 5 c is discharged from heat transfer member 5 as indicated by arrow 3 4.
  • first groove and the second groove are formed so as to gradually become deeper toward the outside of the heat transfer member.
  • the present invention is not limited to this configuration, and the first groove and the second groove Any one of the grooves may be formed so as to gradually become deeper from the central portion to the peripheral portion of the surface of the heat transfer member.
  • the present invention can be applied to, for example, a cooler for cooling a semiconductor element constituting an electric device (PCU: power control unit) that controls a rotating electric machine for driving a hybrid vehicle.
  • PCU power control unit

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • General Details Of Gearings (AREA)

Abstract

L'invention concerne un refroidisseur comprenant un élément de transfert de chaleur (1) comportant une surface sur laquelle un fluide de refroidissement doit être pulvérisé. L'élément de transfert de chaleur (1) comprend une première rainure (1a) créée sur la surface, et une deuxième rainure (1b) créée sur la surface et qui croise la première rainure (1a).
PCT/JP2007/062199 2006-06-13 2007-06-12 Refroidisseur WO2007145354A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2007800210366A CN101461059B (zh) 2006-06-13 2007-06-12 冷却器
DE112007001422T DE112007001422B4 (de) 2006-06-13 2007-06-12 Kühler
US12/304,426 US20090145586A1 (en) 2006-06-13 2007-06-12 Cooler

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006-163584 2006-06-13
JP2006163584A JP4554557B2 (ja) 2006-06-13 2006-06-13 冷却器

Publications (1)

Publication Number Publication Date
WO2007145354A1 true WO2007145354A1 (fr) 2007-12-21

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DE102020208712A1 (de) 2020-07-13 2022-01-13 Mahle International Gmbh Kühlsystem
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WO2022207345A1 (fr) 2021-03-31 2022-10-06 Mahle International Gmbh Ensemble de refroidissement pour système de pile à combustible
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US20090145586A1 (en) 2009-06-11
DE112007001422T5 (de) 2009-04-23
CN101461059A (zh) 2009-06-17
JP4554557B2 (ja) 2010-09-29
DE112007001422B4 (de) 2012-09-20
JP2007335517A (ja) 2007-12-27

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