WO2005081812A2 - Refroidissement d’un point chaud par pulverisation - Google Patents

Refroidissement d’un point chaud par pulverisation Download PDF

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Publication number
WO2005081812A2
WO2005081812A2 PCT/US2005/004444 US2005004444W WO2005081812A2 WO 2005081812 A2 WO2005081812 A2 WO 2005081812A2 US 2005004444 W US2005004444 W US 2005004444W WO 2005081812 A2 WO2005081812 A2 WO 2005081812A2
Authority
WO
WIPO (PCT)
Prior art keywords
film
cooling
hotspot
zone
heat flux
Prior art date
Application number
PCT/US2005/004444
Other languages
English (en)
Other versions
WO2005081812A3 (fr
Inventor
Charles L. Tilton
Donald E. Tilton
Thomas D. Weir
Tahir Cader
Paul A. Knight
Original Assignee
Isothermal Systems Research, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Isothermal Systems Research, Inc. filed Critical Isothermal Systems Research, Inc.
Priority to CA002556666A priority Critical patent/CA2556666A1/fr
Priority to EP05722976A priority patent/EP1754011A4/fr
Priority to JP2007500863A priority patent/JP2007538384A/ja
Publication of WO2005081812A2 publication Critical patent/WO2005081812A2/fr
Publication of WO2005081812A3 publication Critical patent/WO2005081812A3/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

La présente invention concerne un dispositif de gestion thermique avec refroidissement par pulvérisation qui refroidit un composant électrique créant une quantité variable de chaleur sur ses surfaces. Un caloporteur liquide est appliqué sur la surface du composant. Dans les zones à proximité de la puce générant des flux thermiques élevés, que l’on nomme généralement « noyau », le caloporteur liquide est appliqué sous forme d’une répartition de gouttes atomisées de manière continue. La répartition des gouttes atomisées crée une fine pellicule refroidissant par évaporation le flux thermique élevé sur une ou plusieurs zones du noyau. Plutôt que d’optimiser la répartition du caloporteur atomisé et le flux pour une vaporisation complète d’une fine pellicule, la présente invention optimise la répartition du caloporteur atomisé pour obtenir des taux maximum d’élimination de chaleur. Tout fluide excédentaire, non vaporisé, s’écoulant hors du point chaud, est utilisé pour refroidir les zones du composant où les flux thermiques sont moins élevés (zones n’appartenant pas au noyau) en créant une épaisse pellicule de caloporteur sur celles-ci.
PCT/US2005/004444 2004-02-24 2005-02-14 Refroidissement d’un point chaud par pulverisation WO2005081812A2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CA002556666A CA2556666A1 (fr) 2004-02-24 2005-02-14 Refroidissement d'un point chaud par pulverisation
EP05722976A EP1754011A4 (fr) 2004-02-24 2005-02-14 Refroidissement d'un point chaud par pulverisation
JP2007500863A JP2007538384A (ja) 2004-02-24 2005-02-14 ホットスポット噴霧冷却（関連出願）なし（連邦政府の後援による研究又は開発に関する記述）本発明は、空軍研究所により発注された＃ｆ３３６１５−０３−ｍ−２３１６契約により政府の支援のもとなされた。政府は、本発明に一定の権利を有する。

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/786,452 2004-02-24
US10/786,452 US20050183844A1 (en) 2004-02-24 2004-02-24 Hotspot spray cooling

Publications (2)

Publication Number Publication Date
WO2005081812A2 true WO2005081812A2 (fr) 2005-09-09
WO2005081812A3 WO2005081812A3 (fr) 2007-08-09

Family

ID=34861775

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/004444 WO2005081812A2 (fr) 2004-02-24 2005-02-14 Refroidissement d’un point chaud par pulverisation

Country Status (5)

Country Link
US (1) US20050183844A1 (fr)
EP (1) EP1754011A4 (fr)
JP (1) JP2007538384A (fr)
CA (1) CA2556666A1 (fr)
WO (1) WO2005081812A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007145354A1 (fr) * 2006-06-13 2007-12-21 Toyota Jidosha Kabushiki Kaisha Refroidisseur

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202005003832U1 (de) * 2004-03-26 2005-05-12 Ebm-Papst St. Georgen Gmbh & Co. Kg Wärmeaufnehmer
CN2701074Y (zh) * 2004-04-29 2005-05-18 鸿富锦精密工业（深圳）有限公司 液冷散热装置
US7392660B2 (en) * 2004-08-05 2008-07-01 Isothermal Systems Research, Inc. Spray cooling system for narrow gap transverse evaporative spray cooling
TWI279256B (en) * 2005-12-13 2007-04-21 Ind Tech Res Inst A compact spray cooling module
US7760778B2 (en) * 2006-03-06 2010-07-20 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Thin-film evaporative cooling for side-pumped laser
US20080047701A1 (en) * 2006-05-23 2008-02-28 Purdue Research Foundation Electrowetting based heat spreader
US20090014158A1 (en) * 2007-07-12 2009-01-15 Honeywell International Inc. Nano shower for chip-scale cooling
WO2010141482A2 (fr) * 2009-06-01 2010-12-09 The Board Of Trustees Of The University Of Illinois Microcomposants recouverts d'une nanofibre et procédé de refroidissement du microcomposant
US20120090825A1 (en) * 2009-06-01 2012-04-19 The Board Of Trustees Of The University Of Illinois Nanofiber covered micro components and methods for micro component cooling
CN102209452B (zh) * 2010-03-29 2013-06-26 研能科技股份有限公司 雾化散热冷却系统
CN102451802B (zh) * 2010-10-14 2015-03-11 研能科技股份有限公司 用以去除气泡式的封闭式雾化系统
CN102322751B (zh) * 2011-09-01 2013-09-25 东南大学 用于高热流热源冷却的喷雾冷却装置
JP6061944B2 (ja) * 2011-12-09 2017-01-18 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 加熱管を冷却する熱交換器、蒸発器の加熱管、加熱管を備える蒸発器および蒸発器の加熱管を冷却する方法
US9713286B2 (en) * 2015-03-03 2017-07-18 International Business Machines Corporation Active control for two-phase cooling
CN106288501B (zh) * 2016-08-29 2019-04-02 江苏大学 一种高负荷cpu喷雾相变制冷装置冷却液循环系统及其控制方法
US10651112B2 (en) 2016-11-01 2020-05-12 Massachusetts Institute Of Technology Thermal management of RF devices using embedded microjet arrays
DE112018003730T5 (de) * 2017-07-21 2020-04-16 Massachusetts Institute Of Technology Modulare Mikrojet-Kühlung von gepackten elektronischen Komponenten
CN110270387B (zh) * 2019-06-11 2021-09-28 南京理工大学 一种基于介质上电润湿的精确散热装置及其控制方法
CN110099555A (zh) * 2019-06-13 2019-08-06 北京丰联奥睿科技有限公司 一种漏斗式分区液冷服务器机柜
US11507153B2 (en) 2019-06-27 2022-11-22 Hypertechnologie Ciara Inc. Microgap system for cooling electronics with direct contact
US11963337B2 (en) * 2022-03-22 2024-04-16 Baidu Usa Llc Contactless device and chip thermal management plate

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4352392A (en) * 1980-12-24 1982-10-05 Thermacore, Inc. Mechanically assisted evaporator surface
US4450472A (en) * 1981-03-02 1984-05-22 The Board Of Trustees Of The Leland Stanford Junior University Method and means for improved heat removal in compact semiconductor integrated circuits and similar devices utilizing coolant chambers and microscopic channels
US4567505A (en) * 1983-10-27 1986-01-28 The Board Of Trustees Of The Leland Stanford Junior University Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like
JP2708495B2 (ja) * 1988-09-19 1998-02-04 株式会社日立製作所 半導体冷却装置
US5183104A (en) * 1989-06-16 1993-02-02 Digital Equipment Corporation Closed-cycle expansion-valve impingement cooling system
JPH0330457A (ja) * 1989-06-28 1991-02-08 Hitachi Ltd 半導体装置の冷却方法および半導体装置
JPH0461259A (ja) * 1990-06-29 1992-02-27 Hitachi Ltd 半導体集積回路装置の冷却方法および冷却構造
US5263536A (en) * 1991-07-19 1993-11-23 Thermo Electron Technologies Corp. Miniature heat exchanger
US5220804A (en) * 1991-12-09 1993-06-22 Isothermal Systems Research, Inc High heat flux evaporative spray cooling
US5247426A (en) * 1992-06-12 1993-09-21 Digital Equipment Corporation Semiconductor heat removal apparatus with non-uniform conductance
JPH06104358A (ja) * 1992-09-04 1994-04-15 Hitachi Ltd 液体により冷却される電子装置
US5441102A (en) * 1994-01-26 1995-08-15 Sun Microsystems, Inc. Heat exchanger for electronic equipment
US5412536A (en) * 1994-03-28 1995-05-02 International Business Machines Corporation Local condensation control for liquid impingement two-phase cooling
US5675472A (en) * 1995-12-22 1997-10-07 Apple Computer, Inc. Quick-change, blind-mate logic module
US5718117A (en) * 1996-04-10 1998-02-17 Motorola, Inc. Apparatus and method for spray-cooling an electronic module
US5719444A (en) * 1996-04-26 1998-02-17 Tilton; Charles L. Packaging and cooling system for power semi-conductor
US5768103A (en) * 1996-08-30 1998-06-16 Motorola, Inc. Circuit board apparatus and apparatus and method for spray-cooling an electronic component
US5901037A (en) * 1997-06-18 1999-05-04 Northrop Grumman Corporation Closed loop liquid cooling for semiconductor RF amplifier modules
US5924482A (en) * 1997-10-29 1999-07-20 Motorola, Inc. Multi-mode, two-phase cooling module
US6108201A (en) * 1999-02-22 2000-08-22 Tilton; Charles L Fluid control apparatus and method for spray cooling
US6205799B1 (en) * 1999-09-13 2001-03-27 Hewlett-Packard Company Spray cooling system
US6349760B1 (en) * 1999-10-22 2002-02-26 Intel Corporation Method and apparatus for improving the thermal performance of heat sinks
US6377458B1 (en) * 2000-07-31 2002-04-23 Hewlett-Packard Company Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump
US6604370B2 (en) * 2001-02-22 2003-08-12 Hewlett-Packard Development Company, L.P. Variably configured sprayjet cooling system
US6550263B2 (en) * 2001-02-22 2003-04-22 Hp Development Company L.L.P. Spray cooling system for a device
US6484521B2 (en) * 2001-02-22 2002-11-26 Hewlett-Packard Company Spray cooling with local control of nozzles
US6667548B2 (en) * 2001-04-06 2003-12-23 Intel Corporation Diamond heat spreading and cooling technique for integrated circuits
US6571569B1 (en) * 2001-04-26 2003-06-03 Rini Technologies, Inc. Method and apparatus for high heat flux heat transfer
US6498725B2 (en) * 2001-05-01 2002-12-24 Mainstream Engineering Corporation Method and two-phase spray cooling apparatus
US6606251B1 (en) * 2002-02-07 2003-08-12 Cooligy Inc. Power conditioning module
US7836706B2 (en) * 2002-09-27 2010-11-23 Parker Intangibles Llc Thermal management system for evaporative spray cooling
US6650542B1 (en) * 2003-01-06 2003-11-18 Intel Corporation Piezoelectric actuated jet impingement cooling

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of EP1754011A4 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007145354A1 (fr) * 2006-06-13 2007-12-21 Toyota Jidosha Kabushiki Kaisha Refroidisseur
JP2007335517A (ja) * 2006-06-13 2007-12-27 Toyota Motor Corp 冷却器

Also Published As

Publication number Publication date
US20050183844A1 (en) 2005-08-25
EP1754011A4 (fr) 2009-08-05
JP2007538384A (ja) 2007-12-27
EP1754011A2 (fr) 2007-02-21
CA2556666A1 (fr) 2005-09-09
WO2005081812A3 (fr) 2007-08-09

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