WO2007145241A1 - 重合促進剤、硬化性組成物および硬化物ならびにチオール化合物の製造方法 - Google Patents
重合促進剤、硬化性組成物および硬化物ならびにチオール化合物の製造方法 Download PDFInfo
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- WO2007145241A1 WO2007145241A1 PCT/JP2007/061885 JP2007061885W WO2007145241A1 WO 2007145241 A1 WO2007145241 A1 WO 2007145241A1 JP 2007061885 W JP2007061885 W JP 2007061885W WO 2007145241 A1 WO2007145241 A1 WO 2007145241A1
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- compound
- general formula
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- thiol compound
- meth
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- 125000000217 alkyl group Chemical group 0.000 claims abstract description 16
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- ZFTFAPZRGNKQPU-UHFFFAOYSA-N dicarbonic acid Chemical compound OC(=O)OC(O)=O ZFTFAPZRGNKQPU-UHFFFAOYSA-N 0.000 description 1
- 125000001664 diethylamino group Chemical group [H]C([H])([H])C([H])([H])N(*)C([H])([H])C([H])([H])[H] 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- ZMXDDKWLCZADIW-UHFFFAOYSA-N dimethylformamide Substances CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- GKCPCPKXFGQXGS-UHFFFAOYSA-N ditert-butyldiazene Chemical compound CC(C)(C)N=NC(C)(C)C GKCPCPKXFGQXGS-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 125000005448 ethoxyethyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- DNJIEGIFACGWOD-UHFFFAOYSA-N ethyl mercaptane Natural products CCS DNJIEGIFACGWOD-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- YLQWCDOCJODRMT-UHFFFAOYSA-N fluoren-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3C2=C1 YLQWCDOCJODRMT-UHFFFAOYSA-N 0.000 description 1
- RMBPEFMHABBEKP-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2C3=C[CH]C=CC3=CC2=C1 RMBPEFMHABBEKP-UHFFFAOYSA-N 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 125000003709 fluoroalkyl group Chemical group 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- OLLMEZGFCPWTGD-UHFFFAOYSA-N hexane;methanol Chemical compound OC.OC.CCCCCC OLLMEZGFCPWTGD-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 150000002500 ions Chemical group 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 1
- 229940011051 isopropyl acetate Drugs 0.000 description 1
- GWYFCOCPABKNJV-UHFFFAOYSA-N isovaleric acid Chemical compound CC(C)CC(O)=O GWYFCOCPABKNJV-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- FSPSELPMWGWDRY-UHFFFAOYSA-N m-Methylacetophenone Chemical compound CC(=O)C1=CC=CC(C)=C1 FSPSELPMWGWDRY-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 1
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- 125000001434 methanylylidene group Chemical group [H]C#[*] 0.000 description 1
- HAMGRBXTJNITHG-UHFFFAOYSA-N methyl isocyanate Chemical compound CN=C=O HAMGRBXTJNITHG-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N o-biphenylenemethane Natural products C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 1
- XNTUJOTWIMFEQS-UHFFFAOYSA-N octadecanoyl octadecaneperoxoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCCCCCCCC XNTUJOTWIMFEQS-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- BEZDDPMMPIDMGJ-UHFFFAOYSA-N pentamethylbenzene Chemical compound CC1=CC(C)=C(C)C(C)=C1C BEZDDPMMPIDMGJ-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- JRKICGRDRMAZLK-UHFFFAOYSA-L persulfate group Chemical group S(=O)(=O)([O-])OOS(=O)(=O)[O-] JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 125000005359 phenoxyalkyl group Chemical group 0.000 description 1
- DYUMLJSJISTVPV-UHFFFAOYSA-N phenyl propanoate Chemical compound CCC(=O)OC1=CC=CC=C1 DYUMLJSJISTVPV-UHFFFAOYSA-N 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 235000011118 potassium hydroxide Nutrition 0.000 description 1
- 230000003389 potentiating effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- BWJUFXUULUEGMA-UHFFFAOYSA-N propan-2-yl propan-2-yloxycarbonyloxy carbonate Chemical compound CC(C)OC(=O)OOC(=O)OC(C)C BWJUFXUULUEGMA-UHFFFAOYSA-N 0.000 description 1
- RPTKMZRQBREOMV-UHFFFAOYSA-N propoxymethylbenzene Chemical compound CCCOCC1=CC=CC=C1 RPTKMZRQBREOMV-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 150000003222 pyridines Chemical class 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000002964 rayon Substances 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007784 solid electrolyte Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- NMOALOSNPWTWRH-UHFFFAOYSA-N tert-butyl 7,7-dimethyloctaneperoxoate Chemical compound CC(C)(C)CCCCCC(=O)OOC(C)(C)C NMOALOSNPWTWRH-UHFFFAOYSA-N 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- UFTFJSFQGQCHQW-UHFFFAOYSA-N triformin Chemical compound O=COCC(OC=O)COC=O UFTFJSFQGQCHQW-UHFFFAOYSA-N 0.000 description 1
- ODHXBMXNKOYIBV-UHFFFAOYSA-N triphenylamine Chemical compound C1=CC=CC=C1N(C=1C=CC=CC=1)C1=CC=CC=C1 ODHXBMXNKOYIBV-UHFFFAOYSA-N 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- DGVVWUTYPXICAM-UHFFFAOYSA-N β‐Mercaptoethanol Chemical compound OCCS DGVVWUTYPXICAM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/38—Polymerisation using regulators, e.g. chain terminating agents, e.g. telomerisation
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07B—GENERAL METHODS OF ORGANIC CHEMISTRY; APPARATUS THEREFOR
- C07B61/00—Other general methods
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C319/00—Preparation of thiols, sulfides, hydropolysulfides or polysulfides
- C07C319/02—Preparation of thiols, sulfides, hydropolysulfides or polysulfides of thiols
- C07C319/12—Preparation of thiols, sulfides, hydropolysulfides or polysulfides of thiols by reactions not involving the formation of mercapto groups
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C323/00—Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups
- C07C323/50—Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups containing thio groups and carboxyl groups bound to the same carbon skeleton
- C07C323/51—Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups containing thio groups and carboxyl groups bound to the same carbon skeleton having the sulfur atoms of the thio groups bound to acyclic carbon atoms of the carbon skeleton
- C07C323/56—Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups containing thio groups and carboxyl groups bound to the same carbon skeleton having the sulfur atoms of the thio groups bound to acyclic carbon atoms of the carbon skeleton the carbon skeleton containing six-membered aromatic rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C2601/00—Systems containing only non-condensed rings
- C07C2601/12—Systems containing only non-condensed rings with a six-membered ring
- C07C2601/14—The ring being saturated
Definitions
- the present invention is used in coating materials, UV and thermosetting paints, molding materials, adhesives, inks, optical materials, stereolithography materials, printing plate materials, resist materials, and the like, and is particularly suitable for optical materials.
- the present invention relates to a polymerization accelerator used in a curable composition, a curable composition containing the polymerization accelerator, and a cured product that can also provide the curable composition strength, and more specifically, a polymerization comprising a specific thiol compound.
- the present invention relates to an accelerator, a curable composition excellent in thermal stability containing the polymerization accelerator, and a method for producing a cured product and a thiol compound obtained by the ability of the curable composition.
- compositions that are cured by irradiation with actinic rays such as ultraviolet rays include coating materials, UV and thermosetting paints, molding materials, adhesives, inks, resists, optical materials, stereolithography materials, printing plate materials, It is used in a wide range of fields such as dental materials, polymer battery materials, and polymer raw materials.
- actinic rays such as ultraviolet rays
- a curable composition containing a thiol compound as a component is known.
- the required level of each performance has been increased in accordance with the demand for higher functionality in each application field of the optical material and electronic material.
- reactivity and curing characteristics, or optical characteristics such as transmittance and refractive index of the cured product, adhesion to the substrate, and heat resistance.
- This type of curable composition is a one-component or two-component photocuring type, and a compound containing an ethylenically unsaturated double bond and a thiol compound undergo radical polymerization upon irradiation with light. Forces in seconds Cures in a few minutes. However, stability and curing performance are not compatible. Such conventional polyene polythiol-based photocurable compositions have poor thermal stability. If it is kept in a liquid state before use, it thickens and gels.
- Patent Document 1 contains a specific polythiol, one or more kinds of compounds, and a radical photopolymerization initiator.
- a photocurable composition is disclosed, and a photocurable composition having a high refractive index and hardness can be obtained by including a sulfur atom in the cured product.
- JP 2003-277505 A discloses a photocurable resin composition containing a compound having an aromatic ring further substituted with bromine in polyene and polythiol. By containing atoms, a high refractive index is obtained.
- the photocurable resin composition described in JP-A-2003-226718 (Patent Document 1) or JP-A-2003-277505 (Patent Document 2) contains a sulfur atom. By doing so, a highly curable curable composition is obtained, but there are still problems in balancing stability and reactivity, cure shrinkage, and adhesion.
- JP 2001-26608 A discloses a photocurable resin composition containing polyene and a photopolymerization initiator and having a metal ion of 50 ppm or less, By reducing metal ions, the storage stability of the photocurable resin composition can be obtained.
- JP 2004-149755 A discloses a photopolymerization initiator composition comprising a mercapto group-containing thiol compound having a specific substituent and a photopolymerization initiator. Therefore, it is possible to obtain a photosensitive composition having high sensitivity and excellent storage stability.
- Patent Document 1 Japanese Patent Laid-Open No. 2003-226718
- Patent Document 2 JP 2003-277505 A
- Patent Document 3 Japanese Patent Laid-Open No. 2001-26608
- Patent Document 4 Japanese Unexamined Patent Application Publication No. 2004-149755
- the present invention provides a polymerization accelerator and curability excellent in thermal stability containing the polymerization accelerator. It is an object of the present invention to provide a composition and a method for producing a cured product and a thiol compound obtained from the curable composition.
- the present inventors have a structure in which the thiol compound used in the prior art is a primary thiol compound, whereas the ⁇ -position carbon atom has an aryl group relative to the mercapto group.
- the present inventors have found that the above-mentioned problems can be solved by using a thiol hydride compound containing 2 or more as a component of a polymerization initiator in a curable composition, thereby completing the present invention. That is, the present invention has the following items, for example.
- a polymerization accelerator characterized by being a thiol compound having two or more groups represented by the following general formula (1).
- R represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms
- m represents 0 or 1 to
- [3] Polyfunctional alcohol power Alkylene glycol (however, the alkylene group may have 2 to 10 carbon atoms branched), diethylene glycol, dipropylene glycol, glyceronole, diglyceronole, trimethylololepropane, pentaerythritol Nore, dipentaerythritol, cyclohexanediol, cyclohexanedimethanol, norbornene dimethanol, bisphenol A, hydrogenated bisphenol A, 4,4 '-(9-fluorenylide
- the polymerization accelerator according to [2] which is a compound having a selected ability of bis (2-phenoxyethanol).
- R to R are each independently a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and m is 1
- a curable composition comprising the thiol compound according to any one of [1] to [8] and a radical polymerizable compound.
- a curable composition comprising the thiol compound according to any one of [1] to [8] and a compound containing an ethylenically unsaturated double bond.
- a method for producing a thiol compound is a thiol compound.
- composition as described above When the composition as described above is used, a conventional primary thiol compound or a secondary secondary thiol compound is used. Even if it is all, the ⁇ -position carbon atom of the mercapto group is bonded to a thiol compound in which the ⁇ -position carbon atom of the mercapto group has a structure having an alkyl group.
- a structure having an alkyl group By adopting a structure having an alkyl group, the addition reaction of the mercapto group to the ethylenically unsaturated double bond is suppressed by the steric hindrance and electronic effect of the aryl group. As a result, a curable composition having improved thermal stability is obtained.
- the mercapto group of the zeolite compound has a radical chain due to radical generation by light or heat of the polymerization initiator. At the same time as the reaction takes place, it becomes a radical polymerization initiator for ethylenically unsaturated double bonds. These are usually forces that reduce the reactivity due to steric hindrance around the mercapto group of the thiol compound, and the alkyl group becomes an aryl group, so the reactivity does not decrease so much. Presumed to be due to electronic effects.
- the polymerization accelerator and curable composition obtained in the present invention include coating materials, UV and thermosetting paints, molding materials, adhesives, inks, optical materials, stereolithographic materials, printing plate materials, resist materials, and the like. In a wide range of fields. However, it is not limited to them.
- a thiol compound having two or more groups represented by the general formula (1) When a thiol compound having two or more groups represented by the general formula (1) is used as a polymerization accelerator, the mercapto group inhibits the addition reaction due to steric hindrance and electronic effect of the aryl group. In addition, since the addition reaction to the ethylenically unsaturated double bond is suppressed, a curable composition having excellent thermal stability can be obtained.
- FIG. 1 is a 1 ⁇ -NMR chart of 3 mercapto-3-phenolpropionic acid synthesized in Synthesis Example 1.
- FIG. 2 is a 1 H-NMR chart of pentaerythritol tetrakis (3 mercapto-3 phenol propionate) synthesized in Synthesis Example 2.
- FIG. 3 is a 1 H-NMR chart of diglycerol tetra (3-mercapto-3-phenolpropionate) synthesized in Synthesis Example 3.
- the thiol compound used in the present invention is a thiol compound having two or more groups represented by the general formula (1), and the curable composition containing the thiol compound is capable of forming an ethylenically unsaturated double bond.
- the addition reaction is suppressed and a curable composition having improved thermal stability is obtained.
- R is a hydrogen atom or an alkyl group having 1 to C0 carbon atoms.
- the alkyl group of L0 may be linear or branched, for example, methyl group, ethyl group, n-propyl group, iso-propyl group, n- Examples thereof include a butyl group, an iso-butyl group, a tert-butyl group, an n-hexyl group, and an n-octyl group, and preferably a hydrogen atom, a methyl group, or an ethyl group.
- m is 0 or an integer of 1 to 2, preferably 0 or 1.
- the thiol compound used in the present invention is a polyfunctional thiol compound having two or more mercapto groups. As described above, it is known that the crosslink density is further increased in the radical polymerization reaction due to the polyfunctionality as compared with the monofunctional compound.
- the group containing a mercapto group represented by the general formula (1) is a carboxylic acid derivative structure represented by the following general formula (8):
- an ether derivative structure represented by the general formula (9) is preferred.
- R represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms
- m represents 0 or 1 to
- R represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms
- m represents 0 or 1 to
- thiol compound having the structure of the general formula (1) of the present invention include the following compounds.
- Trimethylolpropane tris (2-mercapto-2-phenyl acetate), pentaerythritol tetrakis (2-mercapto-2-phenyl acetate), dipentaerythritol hexakis (2-mercapto-2-phenyl acetate), glycerol tris (2-mercapto-2-phenylacetate), diglycerol tetrakis (2-mercapto-2-phenolacetate), ethylene glycol bis (3-mercapto-3-phenolpropionate), propylene glycol bis (3-mercapto) 1-phenol propionate), diethylene glycol bis (3-mercapto 3-phenol propionate), butanediol bis (3-mercapto 3-phenol propionate), octanediol bis (3-mercapto 3-phenol propionate) , Chlorohexane dimethanol bis (3-mercapto-1-phenylpropionate), trimethylolpropane tris (3-mercapto-3-
- examples of the thiol compound having an ether derivative structure represented by the general formula (9) include 2-mercapto-2-phenylmethyl ether group, 2-mercapto-2-phenyl ether group. , 3 mercapto 3 -propylpropyl ether group, and the like, but is not limited thereto.
- examples of the thiol compound include those represented by the following general formula (3), (4) or (5).
- R to R are each independently a hydrogen atom or an alkyl group having 1 to 10 carbon atoms.
- the alkyl group is preferably a linear or branched alkyl group having 1 to 3 carbon atoms. Specific examples include a methyl group, an ethyl group, an n-propyl group, an iso-propyl group, and the like, more preferably a methyl group or an ethyl group.
- L is a group containing a mercapto group represented by the general formula (1).
- the thiolic compound represented by the general formula (3) has two groups containing a mercapto group, which is obtained using a diol having 2 carbon atoms in the alkylene main chain as a polyfunctional alcohol. .
- the thiol compound represented by the general formula (4) has three groups containing a mercapto group obtained using trimethylolpropane as a polyfunctional alcohol.
- the thiol compound represented by the general formula (5) has four groups containing a mercapto group obtained by using pentaerythritol as a polyfunctional alcohol.
- the molecular weight of the thiol compound of the present invention is not particularly limited, but preferably 2
- the thiol compound used in the present invention can be synthesized, for example, by esterification of a mercapto group-containing carboxylic acid represented by the general formula (2) and an alcohol.
- the compound after the esterification reaction can be made into a polyfunctional thiol compound.
- the mercapto group-containing carboxylic acid represented by the general formula (2) includes 2 mercapto 2-phenolacetic acid, 3-mercapto-3-phenylpropionic acid, 4-mercapto-4-phenylbutane. Examples are acids.
- Examples of the polyfunctional alcohol include alkylene glycol (wherein the carbon chain of the alkylene group is preferably 2 to 10 and the carbon chain thereof may be branched), diethylene glycol, glycerin, diglycerin, dipropylene glycol. , Trimethylolpropane, pentaerythritol, dipentaerythritol, cyclohexanediol, cyclohexane dimethanol, norbornene dimethanol, norbornane dimethanol, polycarbonate diol, hydroxypolysilicone at both ends, polyol containing aromatic ring, etc. Can be illustrated.
- alkylene glycol examples include ethylene glycol, trimethylene glycol, 1,2 propylene glycol, 1,2 butanediol, 1,3 butanediol, 2,3 butanediol, tetramethylene glycol, and 1,5 pentanediol. 1, 6 hexanediol and the like.
- polyol containing an aromatic ring examples include bisphenol A, hydrogenated bisphenol A, bisphenol A dihydroxyethyl ether, 4,4 '-(9-fluore-lidene) diphenol, 4,4' One (9 fluoroureidene) bis (2 phenoxyethanol)
- the polyfunctional alcohol is alkylene glycol (however, the alkylene group may be branched with 2 to 10 carbon atoms), diethylene glycol, dipropylene glycol, glycerin, diglycerin, triglyceride. Methylolpropane, pentaerythritol, dipentaerythritol, cyclohexanediol, cyclohexanedimethanol, norbornene dimethylanol, bisphenol A, hydrogenated bisphenol A, 4,4 '-(9-fluorureidene) bis (2-phenol) Ciethanol) and the like.
- the method for producing the thiol compound of the present invention is not particularly limited, but the ester of a mercapto group-containing carboxylic acid and an alcohol is represented by the general formula (2) described above. It can be obtained by reacting a mercapto group-containing carboxylic acid and an alcohol according to a conventional method to form an esterol.
- the target thiol compound can be obtained by the following method.
- the mercapto group-containing carboxylic acid represented by the general formula (2) shown above is obtained by stirring and heating thiourethane in a mineral acid aqueous solution and further bonding the phenyl group to the unsaturated double bond in the aqueous solution.
- a thiu-mouth salt can be obtained, and further, it can be obtained by hydrolyzing the thiuron salt with an alkaline aqueous solution such as caustic soda.
- the mineral acid used at this time is not particularly limited.
- sulfuric acid, nitric acid, hydrochloric acid, and the like can be used, and a preferable acid is hydrochloric acid.
- the alkali inorganic alkali is preferable among inorganic alkalis such as caustic soda, caustic potash, sodium carbonate, or organic base compounds such as ammonia, jetylamine, and triethylamine. More preferable is caustic soda. It is done.
- the temperature of heating and stirring is preferably 80 to 140, more preferably 90 to 120 ° C.
- carboxylic acid compound in which a phenyl group is bonded to the unsaturated double bond is, for example, a force such as cinnamic acid, 4-furan 3-butenoic acid, and the like. It is not something.
- the solvent is preferably an azeotropic dehydration solvent such as benzene, toluene, xylene, mesitylene, pentamethylbenzene, and azole, or a solvent such as tetrahydrofuran or tetrahydropyran.
- azeotropic dehydration solvent such as benzene, toluene, xylene, mesitylene, pentamethylbenzene, and azole
- a solvent such as tetrahydrofuran or tetrahydropyran.
- examples include ether solvents.
- the acid catalyst include mineral acids such as sulfuric acid, and organic acids such as methanesulfonic acid, p-toluenesulfonic acid, and naphthenesulfonic acid.
- the amount of the acid catalyst added is preferably 0.5 to 5% by weight, more preferably 1.0 to 3% by weight, based on the mercapto group-containing carboxylic acid.
- the addition amount of the mercapto group-containing carboxylic acid is preferably such that the mole number of the carboxylic acid group is 1.0 to 1.5 relative to the mole number of the alcohol group, and more preferably 1.1. It is a ratio of ⁇ 1.3.
- the conditions for the ester reaction are not particularly limited, and can be appropriately selected from conventionally known reaction conditions.
- the curable composition according to the present invention contains the thiol compound and the radical polymerizable compound.
- the radical polymerizable compound include compounds having an ethylenically unsaturated double bond.
- the compound containing an ethylenically unsaturated double bond used in the present invention is a compound that can be cured by radical polymerization (or crosslinking) reaction and addition reaction, that is, an aryl alcohol derivative, ethylene.
- Examples of the ethylenically unsaturated aromatic compound include styrene, ⁇ -methylstyrene, o-methylolstyrene, m-methylolstyrene, p-methylolstyrene, p-tert-butylstyrene, diisopropenolenebenzene, o-chlorostyrene, m-chlorostyrene, p-chlorostyrene, 1, 1-diphenylethylene, ⁇ -methoxystyrene, ⁇ , ⁇ -dimethyl-p-aminostyrene, ⁇ , ⁇ -jetyl ⁇ -aminostyrene, ethylenic Unsaturated pyridine, ethylenically unsaturated imidazole, etc.
- Phenoxyalkyl (meth) atalylates such as benzoate; methoxyethyl (meth) acrylate, ethoxyethyl (meth) acrylate, propoxycetyl (meth) acrylate, butoxychetyl (meth) acrylate, methoxybutyl (meth) ) Alkoxyalkyl (meth) acrylates such as attalylate; polyethylene glycol mono (meth) acrylate, ethoxydiethylene diol (meth) acrylate, methoxy polyethylene glycol (meth) acrylate, phenoxy polyethylene glycol (meth) acrylate , Polyethylene glycol (meth) acrylates such as nourphenoxy polyethylene glycol (meth) acrylate; polypropylene glycol mono (meth) acrylate, methoxy polypropylene glycol Polypropylene glycol (meth) acrylates such as dimethyl (meth) acrylate, eth
- Urethane (meth) acrylates include alcohols such as 2- (meth) attaroyloxyschetilisocyanyloxymethyl) methyl isocyanate and 4- (meth) attaroyloxyphenyl isocyanate. It is a compound added to active hydrogen.
- examples include compounds obtained by adding the above isocyanate compounds to polyols such as isocyanurates, polycarbonate diols, both-end hydroxypolysilicone, and bisphenol A ethoxylates. These may be used alone or in combination of two or more.
- the compound containing an ethylenically unsaturated double bond can be used as long as it has an ethylenically unsaturated group and can be polymerized, and is not limited to the above.
- the compound containing an ethylenically unsaturated double bond may be one containing an ethylenically unsaturated double bond in the high molecular weight product.
- the above-mentioned compound containing a thiol compound and an ethylenically unsaturated double bond is a molar ratio of the mercapto group of the thiol compound and the ethylenically unsaturated double bond. It is preferable to blend in the range of 1:99 to 50:50, particularly in the range of 5:95 to 20:80 in terms of molar ratio.
- the polymerization initiator that can be used together with the thiol compound in the present invention, for example, a photopolymerization initiator or a thermal polymerization initiator can be used.
- the photopolymerization initiator can cause a polymerization reaction and an addition reaction by irradiation with active energy rays such as ultraviolet rays, visible rays, or electron beams to obtain a cured product.
- photopolymerization initiators include 1-hydroxycyclohexyl phenyl ketone, 2,2'-dimethoxy-2-phenylacetophenone, xanthone, fluorene, fluorenone, benzaldehyde, anthraquinone, triphenylamine, Carbazole, 3-methylacetophenone, 4-clobenbenzophenone, 4,4'-dimethoxybenzophenone, 4,4'-diaminobenzophenone, 4,4 'bis ( ⁇ , ⁇ diethylamino) benzophenone, Michler's ketone, Benzylpropyl ether, benzoyl ether, benzyldimethyl ketal, 1— (4-Isopropylphenol) —2-hydroxy-2-methylpropane-1-one, 2-hydroxy-2-methyl-1-phenolpropane 1 ON, thixanthone, jetylthioxanthone, 2-isopropylthio
- a cured product can also be obtained by causing a polymerization reaction by heat. That is, a curable composition can be obtained by adding a thermal polymerization initiator. In some cases, the addition reaction can occur without the presence of a thermal polymerization initiator.
- thermal polymerization initiators examples include azobisdiphenylmethane and 2,2 'azobisisobutane.
- Azo compounds such as tyro-trinole and dimethinole 2,2'-azobis (2-methylpropionate), or disilver oxides, ketone peroxides, hydroperoxides, dialkyl peroxides, Organic peroxides such as peroxyesters, persulfates and the like can be used, and these can be used singly or in combination of two or more.
- organic peroxides include benzoyl peroxide, 3,5,5 trimethylhexanoyl peroxide, lauroyl peroxide, stearoyl peroxide, otatanyl peroxide, and di-propyl peroxide.
- Dicarbonate diisopropyl peroxydicarbonate, bis (4-tert-butylcyclohexyl) peroxydicarbonate, di-2-ethoxychetinoreperoxydicarbonate, di-2-ethylhexoxyoxy Carbonate, di-2-methoxybutyl dioxydicarbonate, di (3-methyl-3-methoxybutyl) peroxydicarbonate, 1,1,3,3-tetramethylbutylperoxyneodecanate, 1-cyclo Xylou 1 methyl ethyl peroxyneodecanate, t-hexoxyloxyneo Canate, tert-butylperoxyneodecanate, tert-hexoxyloxybivalate, tert-butyl valoxybivalate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, 1-cyclohexyl 1 methylethylperoxy-2-
- the amount of the polymerization initiator used is not particularly limited.
- the amount of the polymerization initiator is 0.1 to 0.1 when 100 parts by weight of the compound containing an ethylenically unsaturated double bond is used. A value within the range of 20 parts by weight is preferred. More preferably, the value is in the range of 0.5 to 10 parts by weight. This is because when the amount of the polymerization initiator used is less than 0.1 part by weight, the polymerization rate is slow, or the polymerization is likely to be inhibited by oxygen or the like. On the other hand, when the amount of the polymerization initiator used exceeds 20 parts by weight, the termination reaction in the polymerization reaction increases, which affects the resulting adhesion strength and transparency.
- the thiol compound is usually contained in the polymerization initiator composition in a proportion of 10 to 90% by weight.
- the curable composition of the present invention includes a sensitizer, a silane coupling agent, Additives such as adhesion improvers such as acidic phosphate esters, antioxidants, dyes, fillers, pigments, thixotropic pea imparting agents, plasticizers, surfactants, lubricants and antistatic agents can be added.
- adhesion improvers such as acidic phosphate esters, antioxidants, dyes, fillers, pigments, thixotropic pea imparting agents, plasticizers, surfactants, lubricants and antistatic agents can be added.
- the cured composition of the present invention includes a thiolic compound having two or more secondary mercapto groups having an aryl group at the ⁇ -position carbon atom of the mercapto group, and an ethylenically unsaturated compound.
- the above curable composition can be blended and adjusted as follows.
- the compound of the present invention, a compound containing an ethylenically unsaturated double bond, and a polymerization initiator are mixed with a mixer such as a mixer, a ball mill, or a three-roller at room temperature or under heating conditions, or Solvents and the like can be added as a diluent and dissolved, blended and adjusted.
- the above-mentioned solvents may be used as examples of the thiol compound and the compound containing an ethylenically unsaturated double bond.
- the solvent include esters such as ethyl acetate, butyl acetate, and isopropyl acetate.
- Ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone and cyclohexanone
- cyclic ethers such as tetrahydrofuran and dioxane
- amides such as ⁇ , ⁇ -dimethylformamide
- aromatic hydrocarbons such as toluene
- halogenated hydrocarbons such as methylene chloride.
- the curing method of the curable composition is not particularly limited.
- the curable composition is applied on a substrate to form a coating film, and then irradiated with radiation or heated. Furthermore, it can be hardened by using these in combination.
- the thickness of the coating film is preferably set to a value in the range of 1 to 200 m for evaluation, but can be appropriately set depending on the application.
- Examples of the coating method include coating by a die coater, spin coater, spray coater, curtain coater, roll coater, etc., coating by screen printing, coating by dipping and the like.
- the radiation used here is not particularly limited, but an electron beam or a light source with an ultraviolet power in the infrared range is preferable.
- ultra-high pressure mercury or metal halide light source for ultraviolet rays, metal halide or hadogen light source for visible light, and neurogen light source for infrared rays. can be used. If infrared rays are used, thermal curing can be performed.
- the radiation dose can also be appropriately set according to the type of light source, the film thickness of the coating film, and the like.
- the curable compositions shown above are resists (solder resists, etching resists, color filter resists, spacers, etc.), sealings (waterproof sealings, etc.), paints (antifouling paints, fluorine paints, Water-based paints, etc.), adhesives (adhesives, dicing tapes, etc.), printing plates (CTP plates, offset plates, etc.), print proofing (color proofs, etc.), lenses (contact lenses, microlenses, optical waveguides, etc.) It can be used for applications such as dental materials, surface treatment (optical fiber coating, disk coating, etc.), battery materials (solid electrolyte, etc.).
- MPPA 3-mercapto 3-phenolpropionic acid
- the 1 H-NMR chart of MPPA is shown in FIG. ipi— NMR is JEOL Ltd. ®J NM-AL400 was used and the measurement was performed in heavy black mouth form.
- PEMPP pentaerythritol tetrakis (3-mercapto-3-phenolpropionate)
- Pentaerythritol manufactured by Tokyo Chemical Industry Co., Ltd. 2g, 5g three-neck flask, 100g of o-xylene (manufactured by Tokyo Chemical Industry Co., Ltd.), 13.7g of MPPA, p-toluenesulfonic acid (manufactured by Tokyo Chemical Industry Co., Ltd.) ) 0. 143g was put in, and the Dean-Stark apparatus and the cooling pipe were installed. The contents were heated at 155 ° C with stirring. After 8 hours from the start of the reaction, the reaction mixture was allowed to cool, washed with 100 ml of ion-exchanged water, and neutralized with 200 mL of 10% aqueous sodium hydrogen carbonate solution.
- reaction solution was further washed three times with ion exchanged water, and then dehydrated and dried with anhydrous magnesium sulfate (manufactured by Junsei Chemical Co., Ltd.). Next, o-xylene was distilled off under reduced pressure and vacuum-dried to obtain PEMPP10.Og (yield 84.0%).
- the 1 H-NMR chart of PEMPP is shown in FIG. ⁇ H-NMR was measured using JEOL Co., Ltd. ® J NM-AL400 in heavy-cloned form.
- DGMP P diglycerol tetra (3-mercapto 3-phenolpropionate)
- Fig. 3 shows the 1 H-NMR chart of PEMPP. ⁇ H-NMR was measured using JEOL Co., Ltd. ® J NM-AL400 in heavy-cloned form.
- Acrylic copolymer with carboxyl group and ethylenically unsaturated group (AP): A four-necked flask equipped with a dropping funnel, thermometer, condenser, stirrer, and nitrogen inlet tube was charged with methacrylate (Mitsubishi Rayon). 7.38 parts by mass, p-methylstyrene (Deltech Corp.) 8.63 parts by mass, mercaptoethanol (manufactured by Wako Pure Chemical Industries, Ltd.) 0.05 parts by mass, PGME 23.45 parts by mass The atmosphere in the four-necked flask was replaced with nitrogen at 90 ° C for 0.5 hour.
- methacrylate Mitsubishi Rayon
- p-methylstyrene Deltech Corp.
- mercaptoethanol manufactured by Wako Pure Chemical Industries, Ltd.
- the acrylic copolymer having a carboxyl group obtained above was charged into a four-necked flask equipped with a thermometer, a cooling tube, a stirrer, and an air introduction tube, and triphenylphosphine (Tokyo Kasei ( 2. 30 parts by mass, Hydone quinone (manufactured by Tokyo Chemical Industry Co., Ltd.) 0.16 parts by mass, glycidyl metatalylate (Mitsubishi Rayon Co., Ltd.) Butyl acrylate glycidyl ether (manufactured by Nippon Kaisei Co., Ltd.) 16.
- Tokyo Kasei 2. 30 parts by mass, Hydone quinone (manufactured by Tokyo Chemical Industry Co., Ltd.) 0.16 parts by mass, glycidyl metatalylate (Mitsubishi Rayon Co., Ltd.)
- Butyl acrylate glycidyl ether manufactured by Nippon Kaisei Co., Ltd.
- Epicoat 1004 (Bisphenol A type epoxy resin Japan Epoxy Resin Co., Ltd., epoxy equivalent 925) 185 parts by mass, acrylic acid 14.4 parts by mass, hydroquinone 0.20 parts by mass, diethylene glycol monoethyl ether acetate (hereinafter “ Abbreviated as “DGEA” manufactured by Daicel Chemical Co., Ltd.) 197 parts by mass, heated to 95 ° C., and after confirming that the above mixture had dissolved uniformly, charged with 2.0 parts by mass of triphenylphosphine, The mixture was heated to 100 ° C and reacted for about 30 hours to obtain a reaction product having an acid value of 0.5 mgKOHZg.
- DGEA diethylene glycol monoethyl ether acetate
- Titanium black 13MC Made by Mitsubishi Materials Corporation
- Ajisper PB822 Dispersant Ajinomoto Fine Techno Co., Ltd. [Preparation of photopolymerizable composition]
- this composition was filtered through a filter having a pore size of 0.8 ⁇ m (Kiriyama filter paper for GFP) to obtain a photopolymerizable composition of the present invention.
- a photopolymerizable composition was prepared in the same manner as in Example 1 except that the photopolymerization initiator shown in Table 1 was added.
- the sensitivity of the obtained photopolymerizable composition was evaluated in the same manner as in Example 1, and the results are shown in Table 1.
- a photopolymerizable composition was prepared in the same manner as in Example 1 except for the blending of the photopolymerization initiator shown in Table 1, and was further heated at 60 ° C for 30 hours.
- the sensitivity was evaluated in the same manner as in Example 1, and the results are shown in Table 1.
- a photopolymerizable composition shown in Table 1 was prepared in the same manner as in Example 1 except that PEMB was used as the thiol compound.
- the sensitivity of the obtained photopolymerizable composition was evaluated in the same manner as in Example 1, and the results are shown in Table 1.
- Example 3 A photopolymerizable composition was prepared in the same manner as in Example 1 except that PEMB was used as the thiol compound, and the photopolymerizable composition obtained by heating at 60 ° C. for 30 hours was used in Example 1. The sensitivity was evaluated in the same manner as in Table 1. The results are shown in Table 1.
- the obtained photopolymerizable composition was spin-coated on a glass substrate (size 100 ⁇ 100 mm) so that the dry film thickness was about 1.5 m, and dried at room temperature for 2 minutes and at 90 ° C. for 3 minutes.
- the film thickness after drying is accurately measured with a film thickness meter (SURFCOM130A, manufactured by Tokyo Seimitsu Co., Ltd.), and then exposed to an ultra high pressure mercury lamp (trade name “Multilight ML— 251AZB ”) and photocured by irradiating the photopolymerizable composition with light through a quartz photomask at different exposures.
- the amount of exposure was measured with a UV integrated light meter (trade name “UIT-150”, photo detector “UVD-S365”, manufactured by Usio Electric Co., Ltd.).
- the exposed film was alkali-imaged with a 0.1% aqueous sodium carbonate solution (25 ° C) for a predetermined time.
- the development time was set to 1.5 times the time when the film before exposure was completely dissolved by alkali development: tD.
- the tD was determined by repeating the experiment of observing the degree of dissolution of the film by changing the alkali development time, and determining the time until the film was completely dissolved as tD.
- the glass substrate was dried by washing with water and air spray, the film thickness of the remaining film (resist) was measured, and the remaining film rate was calculated.
- the remaining film rate was calculated from the following formula:
- Remaining film ratio (%) 100 X (film thickness after alkali development) / (film thickness before alkali development)
- the residual film ratio when the exposure amount was lOOmiZcm 2 was measured and the sensitivity was compared.
- PEMPP Pentaeryth'Rule Tetrakis (3-Mercapto-3-phenylpropionate) (* 2)
- DG PP Diglyceride Tetratetra (3-Mercap! ⁇ -3-Phenylpropionate)
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EP07767111A EP2030989A4 (en) | 2006-06-13 | 2007-06-13 | POLYMERIZATION ACCELERATOR, CURABLE COMPOSITION, CURED PRODUCT AND PROCESS FOR PRODUCING THIOL COMPOUND |
JP2008521231A JP5234632B2 (ja) | 2006-06-13 | 2007-06-13 | 重合促進剤、硬化性組成物および硬化物ならびにチオール化合物の製造方法 |
KR1020097000579A KR101148521B1 (ko) | 2006-06-13 | 2007-06-13 | 중합 촉진제, 경화성 조성물, 경화물 및 티올 화합물의 제조 방법 |
US12/304,560 US20100029876A1 (en) | 2006-06-13 | 2007-06-13 | Polymerization accelerator, curable composition, cured product, and process for producing thiol compound |
CN2007800219271A CN101466741B (zh) | 2006-06-13 | 2007-06-13 | 聚合促进剂、固化性组合物和固化物以及硫醇化合物的制造方法 |
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WO2017154428A1 (ja) * | 2016-03-07 | 2017-09-14 | 昭和電工株式会社 | 活性エネルギー線硬化性組成物及びその硬化物 |
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CN102603583A (zh) * | 2012-02-28 | 2012-07-25 | 湘潭大学 | 一种多巯基羧酸酯的制备方法 |
EP2931704B1 (en) * | 2012-12-11 | 2019-10-02 | Akzo Nobel Coatings International B.V. | Thiol-functional compound |
JP6255139B2 (ja) | 2015-04-21 | 2017-12-27 | 昭和電工株式会社 | ラジカル重合性樹脂組成物、その硬化方法、その製造方法、ラジカル重合性樹脂組成物の用途、及びその使用方法 |
KR20200017559A (ko) * | 2016-05-20 | 2020-02-18 | 쇼와 덴코 가부시키가이샤 | 탄소 섬유 강화 수지용 조성물, 탄소 섬유 강화 수지 조성물, 경화물 |
CN107417818B (zh) * | 2016-05-23 | 2021-09-21 | 北京利和知信科技有限公司 | 一种用于烯烃聚合的催化剂组分、制备方法及催化剂 |
KR101902974B1 (ko) | 2017-03-31 | 2018-10-02 | 에스케이씨 주식회사 | 폴리티올 화합물의 탈수 방법 |
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- 2007-06-13 CN CN2007800219271A patent/CN101466741B/zh not_active Expired - Fee Related
- 2007-06-13 KR KR1020097000579A patent/KR101148521B1/ko not_active IP Right Cessation
- 2007-06-13 EP EP07767111A patent/EP2030989A4/en not_active Withdrawn
- 2007-06-13 WO PCT/JP2007/061885 patent/WO2007145241A1/ja active Application Filing
- 2007-06-13 JP JP2008521231A patent/JP5234632B2/ja not_active Expired - Fee Related
- 2007-06-13 TW TW096121397A patent/TW200806727A/zh unknown
- 2007-06-13 US US12/304,560 patent/US20100029876A1/en not_active Abandoned
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JP2001026608A (ja) | 1999-05-10 | 2001-01-30 | Denki Kagaku Kogyo Kk | 光硬化性樹脂組成物 |
JP2003226718A (ja) | 2002-02-07 | 2003-08-12 | Mitsubishi Gas Chem Co Inc | 高屈折率光硬化性組成物およびその硬化物 |
JP2004149755A (ja) | 2002-02-28 | 2004-05-27 | Showa Denko Kk | チオール化合物、光重合開始剤組成物および感光性組成物 |
JP2003277505A (ja) | 2002-03-25 | 2003-10-02 | Denki Kagaku Kogyo Kk | ポリエン−ポリチオール系光硬化性樹脂組成物 |
JP2004264435A (ja) * | 2003-02-28 | 2004-09-24 | Showa Denko Kk | カラーフィルタ用感光性組成物およびこれを用いたカラーフィルタ |
JP2005076018A (ja) * | 2003-09-04 | 2005-03-24 | Denki Kagaku Kogyo Kk | 光硬化性樹脂組成物 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009060708A1 (ja) * | 2007-11-05 | 2009-05-14 | Omron Corporation | 新規樹脂組成物およびこれを含有する複合材料、並びにその利用 |
JP2009114279A (ja) * | 2007-11-05 | 2009-05-28 | Omron Corp | 金属と成形材料とを接着するための接着剤およびこれを含有する複合材料、並びにその利用 |
WO2017154428A1 (ja) * | 2016-03-07 | 2017-09-14 | 昭和電工株式会社 | 活性エネルギー線硬化性組成物及びその硬化物 |
US11015007B2 (en) | 2016-03-07 | 2021-05-25 | Showa Denko K.K. | Active energy ray-curable composition and cured product thereof |
Also Published As
Publication number | Publication date |
---|---|
US20100029876A1 (en) | 2010-02-04 |
EP2030989A1 (en) | 2009-03-04 |
KR101148521B1 (ko) | 2012-05-30 |
KR20090031559A (ko) | 2009-03-26 |
JP5234632B2 (ja) | 2013-07-10 |
CN101466741B (zh) | 2012-09-19 |
CN101466741A (zh) | 2009-06-24 |
EP2030989A4 (en) | 2011-08-31 |
JPWO2007145241A1 (ja) | 2009-11-05 |
TW200806727A (en) | 2008-02-01 |
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