Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B08—CLEANING
  • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
  • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
  • B29D11/00—Producing optical elements, e.g. lenses or prisms
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V11/00—Screens not covered by groups F21V1/00, F21V3/00, F21V7/00 or F21V9/00
  • F21V11/08—Screens not covered by groups F21V1/00, F21V3/00, F21V7/00 or F21V9/00 using diaphragms containing one or more apertures
  • F21V11/14—Screens not covered by groups F21V1/00, F21V3/00, F21V7/00 or F21V9/00 using diaphragms containing one or more apertures with many small apertures
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
  • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
  • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
  • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/36—Removing material
  • B23K26/38—Removing material by boring or cutting
  • B23K26/382—Removing material by boring or cutting by boring
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/36—Removing material
  • B23K26/38—Removing material by boring or cutting
  • B23K26/382—Removing material by boring or cutting by boring
  • B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/36—Removing material
  • B23K26/40—Removing material taking account of the properties of the material involved
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/36—Removing material
  • B23K26/40—Removing material taking account of the properties of the material involved
  • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
  • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
• • G—PHYSICS
  • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
  • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
  • G09F13/00—Illuminated signs; Luminous advertising
  • G09F13/04—Signs, boards or panels, illuminated from behind the insignia
• • G—PHYSICS
  • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
  • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
  • G09F13/00—Illuminated signs; Luminous advertising
  • G09F13/04—Signs, boards or panels, illuminated from behind the insignia
  • G09F13/06—Signs, boards or panels, illuminated from behind the insignia using individual cut-out symbols or cut-out silhouettes, e.g. perforated signs
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K2101/00—Articles made by soldering, welding or cutting
  • B23K2101/34—Coated articles ; Surface treated articles
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K2101/00—Articles made by soldering, welding or cutting
  • B23K2101/34—Coated articles ; Surface treated articles
  • B23K2101/35—Surface treated articles
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K2103/00—Materials to be soldered, welded or cut
  • B23K2103/08—Non-ferrous metals or alloys
  • B23K2103/10—Aluminium or alloys thereof
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K2103/00—Materials to be soldered, welded or cut
  • B23K2103/30—Organic materials
  • B23K2103/42—Plastics other than composite materials
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K2103/00—Materials to be soldered, welded or cut
  • B23K2103/50—Inorganic materials other than metals or composite materials
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
  • G02B6/04—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings formed by bundles of fibres

Definitions

• the Field of the technical subject matter relates to methods for filling a via with a light transmissive material and products produced through use of such methods.
• Examples include but are not limited to computer keyboards that include indication lights for functions such as “Caps Lock” or “Num Lock”; computer monitors that include an "on/off light automobiles that include lights to indicate whether heated seats are on or off, or whether an air bag is on or off; televisions with indicator lights, and a whole host of other consumer electronics.
• a common way to provide for such lighting is to provide a projecting light that is visible when the light is off and brightly lit to indicate when the light is on.
• a collection of lights, or holes for lights, may be disruptive to the objectives of an industrial designer.
• the method comprises drilling a via in a panel and filling the via with an optically transmissive material.
• Panels made according to methods disclosed herein are also disclosed.
• a housing having a light transmissive panel wherein the light transmissive panel is an optically transmissive polymer captured by at least one via in the panel.
• a housing having a light transmissive section is formed by a method comprising drilling a via in the light transmissive section, filling the via with a curable polymer and curing the polymer.
• FIG. 1 is a schematic representation of the sequence of method of the present disclosure
• FIG. 2 is a schematic representation of a conically-shaped via or hole geometry
• FIG. 3 are SEM micrographs taken of a panel having conically-shaped vias showing the first or back side of a panel with the larger via opening;
• FIG. 4 are SEM micrographs of vias showing the second or visible side of the panel having the smaller opening of the conical via
• FIG. 5 is a SEM micrograph of the visible side of the panel having the smaller opening of the exemplary vias with the filler material in the vias;
• Fig 6. is an optical micrograph of the visible side of the panel having the exemplary vias filled with the filler material and having backlighting to show transmission of light through the conical vias as viewed from the visible side of the panel;
• FIG. 7 is an enlarged optical micrograph of the visible side of the panel shown in FIG. 6;
• FIG. 8 is a SEM micrograph cross-section of several vias filled with the filler material
• FIG. 9 is an enlarged SEM micrograph cross-section of a filled conical via shown in FIG. 8;
• FIG. 10 is a schematic representation of an alternate configuration of the filler material on the visible side of the panel
• FIG. 11 is a SEM micrograph of the alternate filler material configuration shown in FIG. 10;
• FIG. 12 is an optical micrograph of the alternate filler material configuration shown in FIG. 11;
• FIG. 13 is a schematic representation of an alternate configuration of the filler material on the visible side of the panel
• FIG. 14 is a SEM micrograph of the alternate filler material configuration shown in FIG. 12;
• FIG. 15 is an optical micrograph of the alternate filler material configuration shown in FTG. 14;
• FIG. 16 is a schematic representation of an alternate configuration of the filler material on the visible side of the panel
• FIG. 17 is a SEM micrograph of the alternate filler material configuration shown in FIG. 16;
• FIG. 18 is an optical micrograph of the alternate filler material configuration shown in FIG. 17.
• FIG. 19 is a schematic representation of a housing utilizing a light transmissive panel including filled vias.
• FIGS. 1-18 methods for filling at least one via with a light transmissive material are shown and described below.
• FIG. 19 illustrates a product resulting from one of the methods.
• the disclosure utilizes via drilling techniques to create a micro via that is then filled with a light transmissive material. Via drilling is known in the unrelated field of electronics manufacturing. Vias are created in multi-layered interconnected substrates and lined with a conductor, such as copper, to permit an electrical connection between different layers in a circuit.
• a conductor such as copper
• FIG. 1 A method 10 and steps for filling a via with light transmissive material are illustrated in FIG. 1.
• a panel or substrate 12 is provided.
• Panel 12 as shown is a relatively thin continuous sheet of material.
• Panel 12 includes a first or back side 14 and an opposing second or front side 18 defining a panel thickness 20.
• Front side 18 is relatively smooth and substantially unbroken to the naked eye.
• Panel 12 may be made from anodized aluminum or other materials known to those skilled in the art.
• the method 10 includes drilling one or a plurality of micro-vias or holes 30 through the panel 12.
• the vias 30 are conical-shaped having sidewalls 34 and a first opening 40 in panel first side 14 and an opposing second opening 44 on panel side 18.
• First via opening 40 is larger in diameter than second via opening 44.
• first via opening 40 is approximately 90 - 100 micrometers ( ⁇ m) in diameter
• second via opening 44 is approximately 30 - 40 micrometers ( ⁇ m) in diameter. It is understood that larger or smaller conical openings and other via shapes and configurations may be used.
• the vias shown are drilled or machined out of the panel using a laser 24, such as a diode-pumped solid-state pulsed laser, in a circular or spiral pattern. It has been shown that a Nd:YAG 355 nm spot 22 with a pulse repetition rate of 3OkHz and ⁇ 60 nanosecond pulse width is useful in machining out the preferred conical-shaped vias 30. Drilling of the exemplary vias 30 is accomplished from back side 14 through panel 12 toward the front side 18. Other types of lasers with different characteristics and other machining processes from drilling vias known to those skilled in the art may be used to suit the particular application. [0032] The method 10 optionally includes the step 46 of cleaning the drilled vias 30 to remove any debris or deposits formed during the machining process.
• a laser 24 such as a diode-pumped solid-state pulsed laser
• CO 2 snow jet cleaning and isopropyl are effective in cleaning the vias.
• Other via cleaning techniques known by those skilled in the art may also be used.
• ultrasonic cleaning using, for example, ultrasonic baths may be used.
• high-pressure air like the snow jet, may be made from a source movably located in a similar manner to the drill 24 to clean the vias.
• the method 10 includes applying a filler material coating 50 into the vias 30.
• the filler material 50 may be a visible light transmissive material.
• filler material 50 is an optically transparent ultraviolet (UV) — curable, acrylate polymer that is in a liquid phase at the time of application to panel 12.
• UV optically transparent ultraviolet
• Other plastics or polymers with light transmissive properties may also be used.
• the exemplary UV curable filler material is substantially clear when cured.
• the filler material 50 can be applied to the panel second side 18 over the top of the second, optionally smaller openings 44, of vias 30.
• filler material 50 may be applied to back side 14 so the filler material 50 flows through the via 30 from back side 14 toward front side 18 in a similar manner as described.
• method 10 may include the step 16 of curing the exemplary liquid phase silica-based filler material 50 by exposing the filler 50 to UV light. Exposure to UV light 76 initiates free-radical polymerization of the silicate filler material 50 inside and through the vias 30. In one method of applying the UV light, the UV light is applied to back side 14 and via 30 (i.e., the large openings 40) to promote curing of filler material 50 in the vias 30. When cured, the exemplary filler material 50 is optically transparent permitting passage of visible light through the filler 50 and panel 12 through vias 30.
• Method 10 includes the step 82 of removing any excess or uncured filler material deposits 66 from the panel visible, front side 18 as shown in FIG. 1.
• filler excess deposits 66 may be removed from front side 18 through a simple isopropanol wipe, leaving a visibly smooth and clean surface.
• Other methods and techniques for removing excess deposits 66 may be used.
• Method 10 may optionally include the step 90 of exposing the filler material
• the filler material 50 most adjacent to the panel visible surface 18 may be slightly below front side 18 forming a recess 94 between the filler 50 and front side 18.
• treatment of the filler material directly adjacent to the visible panel surface 18 may be varied to change or enhance the visual appearance of the filler material 40 and visible light passing therethrough for a user.
• cured excess filler deposits 66 may take a convex shape or form as opposed to being recessed into vias 30 as shown in FIG. 9. For example, FIGS. 10-12 and FIGS.
• FIGS. 13-15 illustrate two such convex forms for the cured excess filler deposits 66.
• the convex shape extends beyond and surrounds the second via opening 44.
• the convex shape is approximately limited to the area of the second via opening 44.
• the visible light passing through the filler material 50 may be altered to produce a different visual appearance or effect to the user similar to altering the shape or configuration of a lens.
• FIGS. 16-18 illustrate, instead of a concave or convex shape, a flush fill, that is, an embodiment where the filler material 50 is flush with the surface of the second, or front, side 18.
• FIG. 19 illustrates a panel 12 including a back light 70, which may be an LED, fluorescent or incandescent light, or other lighting devices. Panel 12 may be a section inserted into a housing or may be an integral section of the housing 72 as shown in FIG. 19.
• the resultant panel 12 can be used in all manner of applications including hand-held electronic devices, for example, MP3 players, computers, cellular phones, DVD players and the like.
• the disclosed method and resultant panel is applicable in virtually all applications where a visually continuous and uninterrupted panel surface is desired having the capability to produce illuminated messages, images or other perceptible characteristics for the user.

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• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Optics & Photonics (AREA)
• Mechanical Engineering (AREA)
• Plasma & Fusion (AREA)
• General Physics & Mathematics (AREA)
• Theoretical Computer Science (AREA)
• General Engineering & Computer Science (AREA)
• Health & Medical Sciences (AREA)
• Manufacturing & Machinery (AREA)
• Ophthalmology & Optometry (AREA)
• Illuminated Signs And Luminous Advertising (AREA)

Priority Applications (4)

Applications Claiming Priority (4)

Publications (2)

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ID=38801988

Family Applications (1)

Country Status (7)

Cited By (3)

Families Citing this family (6)

Family Cites Families (48)

• 2007
  • 2007-05-24 WO PCT/US2007/012600 patent/WO2007142909A2/en not_active Ceased
  • 2007-05-24 SG SG2011036860A patent/SG172615A1/en unknown
  • 2007-05-24 EP EP07795410A patent/EP2024767A4/en not_active Withdrawn
  • 2007-05-24 JP JP2009513225A patent/JP5124568B2/ja not_active Expired - Fee Related
  • 2007-05-24 KR KR1020087032264A patent/KR101435224B1/ko not_active Expired - Fee Related
  • 2007-05-29 TW TW96119145A patent/TWI471074B/zh not_active IP Right Cessation
• 2013
  • 2013-03-12 US US13/797,891 patent/US9568167B2/en not_active Expired - Fee Related
• 2017
  • 2017-01-04 US US15/398,171 patent/US20170114982A1/en not_active Abandoned

Non-Patent Citations (2)

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