WO2007117094A1 - Package handler - Google Patents
Package handler Download PDFInfo
- Publication number
- WO2007117094A1 WO2007117094A1 PCT/KR2007/001637 KR2007001637W WO2007117094A1 WO 2007117094 A1 WO2007117094 A1 WO 2007117094A1 KR 2007001637 W KR2007001637 W KR 2007001637W WO 2007117094 A1 WO2007117094 A1 WO 2007117094A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- package
- jig
- mount
- handler
- block
- Prior art date
Links
- 238000001035 drying Methods 0.000 claims description 14
- 239000011295 pitch Substances 0.000 description 22
- 238000010586 diagram Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 5
- 239000000969 carrier Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009191 jumping Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/021—Loading or unloading of containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Definitions
- the present invention relates to a handler for handling a package, and more particularly, to a package handler.
- the present invention is suitable for a wide scope of applications, it is particularly suitable for accommodating a cut package in a tray by automatically separating the package from a cutting jig and also suitable for loading an uncut package to be cut on the cutting jig automatically.
- a package such as an SD card and the like is used for a mobile phone, a digital camera, or the like. And, the package needs to be processed into a specific shape. For this, a strip provided with a plurality of packages is cut into a plurality of individual packages. Each of the packages is then cut to have a prescribed shape. In particular, since a package such as an SD card tends to have a non-linear portion in a prescribed shape, it is necessary to precisely cut the non-linear portion.
- a package such as an SD card is loaded on a separate cutting jig to be fixed thereto.
- the package is then cut to have a specific shape using such a cutting machine as a water jet, a blade, and the like.
- the present invention is directed to a package handler that substantially obviates one or more problems due to limitations and disadvantages of the related art.
- An object of the present invention is to provide a package handler, by which productivity and work efficiency can be enhanced in a manner of automatically performing a work of unloading a cut package from a cutting jig and a work of loading a new uncut package on the cutting jig.
- a package handler includes a body, an on-loader part provided to one side of the body to have a jig provided with a plurality of slots accommodating a plurality of cut packages therein, a cut tray part in which an empty tray to accommodate a package unloaded from the jig is loaded, an uncut tray part in which a tray accommodating the package to be inserted in the jig is loaded, and a package loading/unloading part unloading the cut package from the jig of the on-loader part, the package loading/ unloading part loading the uncut package in the uncut tray part in the jig.
- the package loading/unloading part includes a mount block having at least one mount portion on which the package unloaded from the jig or transferred from the uncut tray part is mounted, a lift unit lifting the jig up and down to align the packages in the jig with the at least one mount portion of the mount block, and a push unit moving the package from the jig to the mount block, the push unit moving the package on the mount block.
- the at least one or more mount portions of the mount block are arranged to be evenly spaced apart from each other.
- the mount block is provided on a mount block support provided to the body to be horizontally movable by a linear motion system.
- the mount block includes a first mount block on which the package unloaded from the jig is mounted and a second mount block on which the package transferred from the uncut tray part is mounted.
- first and second mount blocks are provided movable individually.
- the jig is provided between the first and second mount blocks.
- the perforated hole is further provided to be downward spaced apart from the mount portion of the first mount block and wherein the perforated hole is provided to enable the package to pass through.
- the lift unit includes a mount block vertically provided to the body, a holder fixing the jig thereto, and a driving means for lifting the holder by a prescribed distance.
- the holder is provided with a plurality of slots corresponding to the slots of the jig, respectively. And, a width of the slot of the holder is smaller than that of the slot of the jig.
- the push unit includes a first push unit provided to one side of the jig to push the package loaded in the slot of the jig to the mount portion of the mount block and a second push unit provided to an opposite side of the first push unit centering on the jig to push the package on the mount block into the slot of the jig.
- the first push unit includes a first push bar inserted into the slot of the jig to push the package out of the slot and a push bar driving means for enabling the first push bar to reciprocate horizontally.
- the second push unit includes a second push bar pushing the package on the mount portion by reciprocating on one side of the mount block in a direction of the jig and a push bar driving means for enabling the second push bar to horizontally reciprocate.
- the push unit includes a lower push bar provided to one side of the first mount block to push the package within the slot of the jig toward the second mount block via the perforated hole of the first mount block, an upper push bar configured to diverge over the lower push bar, the upper push bar pushing the package mounted on the mount portion of the first mount block into the slot of the jig, and a push bar driving means for moving both of the lower and upper push bars simultaneously.
- the lit unit includes a mount block vertically provided to the body, a holder provided with a plot corresponding to the slot of the jig, the holder fixing the jig thereto, and a driving means for lifting the holder by a prescribed distance.
- the package handler further includes a package carrier provided over the body to carry the package by moving to the package loading/unloading part, the cut tray part, and the uncut tray part.
- the package carrier includes a fixed frame provided to a topside of the body, a movable frame provided movable along the fixed frame, a head block provided movable up and down along the movable frame, and at least one sucking nozzle provided to the head block to hold the package by vacuum suction.
- the package carrier includes a first package carrier and a second package carrier transferring the package by moving independently.
- the first package carrier includes a fixed frame fixed to the body, a first movable frame provided movable along the fixed frame, a first head block provided movable along the first movable frame, the first head block provided movable up and down by a prescribed distance, and at least one sucking nozzle provided to the first head block to hold the package by vacuum suction.
- the second package carrier includes a fixed frame fixed to the body, a second movable frame provided movable along the fixed frame, a second head block provided movable along the second movable frame, the second head block provided movable up and down by a prescribed distance, and at least one sucking nozzle provided to the second head block to hold the package by vacuum suction.
- the package carrier includes a short frame provided to the topside of the body to pass through or be adjacent to an upper part of the package loading/ unloading part, a head block provided movable along the short frame, the head block provided movable up and down by a prescribed distance, and at least one sucking nozzle provided to the head block to hold the package by vacuum suction.
- the package handler further includes a first tray transfer transferring the uncut tray part by a prescribed distance in a direction orthogonal to the short frame and a second tray transfer transferring the cut tray part by a prescribed distance in the direction orthogonal to the short frame.
- the head block is configured to have a L shape, the sucking nozzle is provided to an end portion of the head block, and the sucking nozzle is projected out of the short frame if the head block is moved to one end portion of the short frame.
- the package handler further includes a cleansing part cleansing the cut package transferred from the package loading/unloading part and a drying part drying the cleansed package.
- a package handler in another aspect of the present invention, includes a body, an on- loader part provided to one side of the body to have a jig provided with a plurality of slots accommodating a plurality of cut packages therein, a cut tray part in which a tray to accommodate a package unloaded from the jig is loaded, an uncut tray part in which a tray accommodating the package to be inserted in the jig is loaded, and a mount block having at least one mount portion provided on a topside to mount the package unloaded from the jig or transferred from the uncut tray part on the at least one mount portion, a lift unit moving the jig up and down to align the packages in the jig with the at least one mount portion of the mount block, a first push unit including a first push bar inserted into the slot of the jig to push out the package toward the mount block and a first push bar driving means for enabling the first push bar to reciprocate, a second push unit including a second push bar insert
- the at least one or more mount portions of the mount block are arranged to be evenly spaced apart from each other.
- the mount block is provided on a mount block support provided to the body to be horizontally movable by a linear motion system.
- the package handler further includes a cleansing part cleansing the cut package transferred from the package loading/unloading part and a drying part drying the cleansed package.
- a cleansing part cleansing the cut package transferred from the package loading/unloading part and a drying part drying the cleansed package.
- the present invention automatically carries out an operation of separating a cut package from a cutting jig, accommodating the package in a tray, and loading an uncut package in the cutting jig, thereby considerably reducing a time taken to load/ unload a package in/from the cutting jig.
- the present invention can enhance work efficiency and productivity.
- FIG. 1 is a schematic layout of a package handler according to a first embodiment of the present invention
- FIG. 2 is a lateral diagram of the package handler shown in FIG. 1;
- FIGs. 3 to 11 are perspective diagrams of a package loading/unloading part of a handler to explain one example of a package loading/unloading operation carried out by the package handler shown in FIG. 1 ;
- FIG. 12 and FIG. 13 are perspective diagrams of a package loading/unloading part of a handler to explain another example of a package loading/unloading operation carried out by the package handler shown in FIG. 1 ;
- FIG. 14 is a schematic layout of a package handler according to a second embodiment of the present invention;
- FIG. 15 is a cross-sectional diagram of a package loading/unloading part of the handler shown in FIG. 14; [46] FIG.
- FIG. 16 is a schematic layout of a package handler according to a third embodiment of the present invention.
- FIG. 17 is a schematic layout of a package handler according to a fourth embodiment of the present invention.
- FIG. 18 is a schematic layout of a package handler according to a fifth embodiment of the present invention.
- FIG. 19 is a schematic layout of a package handler according to a sixth embodiment of the present invention.
- FIG. 20 is a schematic layout of a package handler according to a seventh embodiment of the present invention.
- FIG. 21 is a cross-sectional diagram of a cutting jig and a handler jig applied to a package handler according to the present invention. Best Mode for Carrying Out the Invention
- FIG. 1 is a schematic layout of a package handler according to a first embodiment of the present invention
- FIG. 2 is a lateral diagram of the package handler shown in FIG. 1
- FIGs. 3 to 11 are perspective diagrams of a package loading/unloading part of a handler to explain one example of a package loading/unloading operation carried out by the package handler shown in FIG. 1
- FIG. 12 and FIG. 13 are perspective diagrams of a package loading/unloading part of a handler to explain another example of a package loading/unloading operation carried out by the package handler shown in FIG. 1.
- a package handler includes a body 1, an on-loader part 10 provided to one side of the body 1, an uncut tray part 30 accommodating uncut packages (UP) to be cut (hereinafter called uncut packages), a cut tray part 20 on which an empty tray is put to accommodate cut packages (CP), and a package carrier 40 provided to an upper side of the body 1 to be movable in X-Y-Z directions and to carry the package to the on-loader part 10, the uncut tray part 20, or the cut tray part 30.
- UP uncut packages
- CP cut packages
- package carrier 40 provided to an upper side of the body 1 to be movable in X-Y-Z directions and to carry the package to the on-loader part 10, the uncut tray part 20, or the cut tray part 30.
- a cutting jig 5 is provided to the on-loader part 10. In cutting a package to be cut, the cutting jig 5 supports the package to be fixed to a prescribed position. So, the package can be cut without moving.
- the cutting jig 5 is provided with a plurality of slots 5a.
- Each of a plurality of the slots 5a is a space to fixedly accommodate the package therein and has a perforated configuration shown in FIG. 2.
- a plurality of the slots 5a can be configured to have a regular arrangement structure to be evenly spaced apart from each other.
- the regular arrangement structure is provided to consider work facilitation of packages loaded in a plurality of the slots 5 of the cutting jig 5.
- a gap between the respective slots 5a provided to the cutting jig 5 is called a pitch on a Z-axis. Namely, a distance between two slots vertically adjacent to each other corresponds to one pitch on the Z-axis.
- the on-loader part 10 is provided with a lift unit 50 enabling the cutting jig 5 to move up and down, a mount block 60 having a plurality of mount portions 61 concavely formed on its topside to mount cut packages CP and uncut packages UP thereon, respectively, a first push unit 71 transferring the cut package CP cut by the cutting jig 5 to the mount block 60, and a second push unit 72 transferring the uncut package UP on the mount block 60 to the corresponding slot 5a of the cutting jig 5.
- the lift unit 50 can include any means for enabling the cutting jig 5 to move vertically.
- the lift unit 50 can have the configuration shown in FIG. 2.
- the lift unit 50 shown in FIG. 2 includes a mount block 51 vertically provided to the body 1, a holder 52 supporting the cutting jig 5 to be fixed thereto, a guide member (not shown in the drawing) extending from the mount block 51 in a vertical direction to guide a vertical movement of the holder 52, and a driving device lifting the holder 52 step by step with a prescribed distance.
- the driving device can include a motor and a ball screw.
- the driving device includes a plurality of pulleys, a belt, and a motor rotating the belt and one of the pulleys.
- the driving device includes a linear motion system such as a linear motor system.
- a plurality of correspondent slots 52a respectively corresponding to a plurality of the former slots 5a of the cutting jig 5 are provided to the holder 52 to be evenly aligned in a vertical direction.
- each of the latter slots 52a of the holder 52 has a width smaller than that of the corresponding former slot 5a of the cutting jig 5. More preferably, each of the latter slots 52a of the holder 52 has a width smaller than a size of the package P and greater than a size of a first push bar 71a of the first push unit 71.
- the holder 52 is able to fix the cutting jig 5 by vacuum suction or a separate fixing device such as a clamp, a bracket moving by an air pressure cylinder, and the like.
- the mount block 60 is configured to move in a direction of a Y-axis to a prescribed distance on a mount block support 65 provided to extend from the body 1.
- the mount block 60 (not shown in detail in the drawings) configured to move along a topside of the mount block support 65 can employ a linear motion system similar to the driving device for moving the holder 52 of the lift unit 52.
- the prescribed distance to which the mount block moves can be configured with reference to the distance between the mount portions 61 provided on the mount block 60.
- the mount block 60 is able to move to the distance (hereinafter called one pitch on the Y-axis) between two mount portions neighboring to each other or to two pitches on the Y-axis in a manner of jumping over one mount portion to a next mount portion.
- the first push unit 71 is provided next to one side of the holder 52 of the lift unit 50.
- the first push unit 71 includes a first push bar 71a penetrating the slot 52a of the holder 52 and the slot 5a of the cutting jig 5 to push out the cut package CP within the cutting jig 5 and a push bar driving device enabling the first push bar 71a to horizontally reciprocate with a prescribed stroke.
- the push bar driving device can include any configuration enabling the first push bar 71a to move straight.
- the push bar driving device can include an air pressure cylinder or one of other linear motion systems.
- the second push unit 72 is provided next to one side of the mount block 60. And, the second push unit 72 includes a second push bar 72a pushing out the uncut package UP on the mount block 60 into the slot 5a of the cutting jig 5 and a push bar driving device enabling the second push bar 72a to horizontally reciprocate with a prescribed stroke.
- the push bar device of the second push unit 72 can include an air pressure cylinder or one of other linear motion systems.
- the package carrier 40 includes a fixed frame 41 configured to extend from the body in a direction of an X-axis, a movable frame 42 movably provided to the fixed frame 41 in a direction of the X-axis, a head block 43 movably provided to the movable frame 41 in a direction of the Y-axis and a direction of the Z- axis, and a plurality of sucking nozzles 44 evenly aligned on the head block 43 to hold the packages CP and UP by vacuum suction.
- a plurality of the sucking nozzles 44 are aligned with the same pitch of the mount portions 61 of the mount block 60.
- a plurality of the sucking nozzles 44 are provided to correspond to a plurality of the mount portions 61, respectively. More preferably, a number of a plurality of the sucking nozzles 44 can be smaller than that of a plurality of the mount portions 61 by at least one.
- FIGs. 3 to 13 An operation of the above-configured package handler according to one embodiment of the present invention is explained with reference to FIGs. 3 to 13 as follows.
- a cut package CP is represented by white, whereas an uncut package UP is represented as black. Color of the cut package CP is substantially identical to that of the uncut package UP. Yet, the cut and uncut packages CP and UP differ from each other in outline only.
- a worker puts at least one cutting jig 5 into the on- loader part 10 and then fixes the at least one cutting jig 5 to the holder 52 of the lift unit 50. Subsequently, the lift unit 50 moves the holder 52 upward or downward by a prescribed distance to align the first slot 5a of the cutting jig 5 with the corresponding the mount portion 61 of the mount block 60.
- the package carrier 40 carries the uncut packages UP to the mount block 60 in a manner that the sucking nozzles 44 corresponding to the even numbers (in case of numbering from a right side in the drawing) hold the uncut packages UP in the uncut tray part 20.
- the package carrier 40 descends down to mount the uncut packages UP on the mount portions 61 corresponding to the even numbers (in case of numbering from a right side in the drawing), respectively.
- the package carrier 40 then ascends.
- the package carrier 40 moves to another uncut tray part 20 to hold new uncut packages UP by vacuum suction.
- the mount block 60 then moves right by one pitch on the Y-axis along the mount block support 65 to align the second mount portion 61 with the slot 5a of the cutting jig 5.
- the second push bar 72a of the second push unit 72 inserts the uncut package UP on the second mount portion 61 into the slot 5a of the cutting jig 5.
- the cutting jig 5 ascends by one pitch on the Z-axis. If so, the cut package CP in the cutting jig 5 is sequentially pulled out to the mount portions 61 of the mount block and the uncut package UP is inserted into the slot 5a of the cutting jig 5.
- the mount block 60 moves by one pitch on the Y-axis to have the last empty mount portion 61 aligned with the slot 5a of the cutting jig 5.
- the sucking nozzles 44 of the package carrier 40 stand by in a manner of holding new uncut packages UP by vacuum suction over the mount block 60 and then descends to mount the uncut packages UP, as shown in FIG. 10, on the empty mount portions 61 of the mount block 60.
- the sucking nozzles 44 holds the cut package CP on the mount block 60 by vacuum suction and then carries the corresponding package to an empty tray of the cut tray part 30 (cf. FIG. 1). So, the cut packages CP are sequentially loaded in the empty tray.
- the cut package CP in the cutting jig 5 is withdrawn to the last mount portion of the mount block 60 by the first push bar 71a.
- the mount block 60 then moves by one pitch on the Y-axis in a direction opposite to the former direction to load/unload the packages (UP and CP).
- the cutting jig 5 descends by one pitch on the Z-axis. If so, the cut package CP in the cutting jig 5 is withdrawn to the mount portion 61 of the mount block 60 one by one and the uncut package UP is loaded in the slot 5a of the cutting jig 5.
- the process is initiated by calculating a sequence from a right end of the mount portions 61 of the mount block 60, it can be also initiated by calculating a sequence from a left end.
- the method of loading/unloading the packages in/from the cutting jig 5 can be executed in the following manner.
- the sucking nozzles 44 of the package carrier 40 mount the uncut packages UP on the other mount portions 61 (first to fourth from a right side on the drawing) of the mount block 60 and simultaneously hold the cut packages CP mounted on the mount portions 61 to carry the held cut packages CP to the cut tray part 30 (cf. FIG. 1).
- the uncut packages UP mounted on the mount portions 61 of the mount block 60 are inserted one by one into the cutting jig 5 by the second push bar 72a.
- the mount block 60 moves left by one pitch on the Y-axis. If so, the mount portion 61 having the uncut package UP mounted thereon is aligned with the empty slot 5a of the cutting jig 5.
- the uncut package UP is loaded in the slot 5a of the cutting jig 5. Namely, if the mount block 60 moves left by one pitch on the Y-axis, the cutting jig 5 descends by one pitch on the Z-axis. So, the uncut packages UP can be completely loaded in the slots 5a by the second push bar 72a.
- the mount block 60 ascends by a plurality of pitches (five pitches on the Z-axis in the present embodiment) on the Z-axis to prepare for unloading the next cut packages CP.
- FIG. 14 and FIG. 15 show a package handler according to a second embodiment of the present invention.
- FIG. 14 is a schematic layout of a package handler according to a second embodiment of the present invention and FIG. 15 is a cross-sectional diagram of a package loading/unloading part of the handler shown in FIG. 14.
- a package handler according to a second embodiment of the present invention enables both an operation of unloading a cut package CP from a cutting jig 5 and an operation of loading an uncut package UP in the cutting jig 5 to be simultaneously carried out using one push unit 270.
- the package handler according to the second embodiment of the present invention includes the same uncut tray part 20, cut tray part 30 and package carrier 40 of the package handler according to the first embodiment of the present invention.
- An on-loader part 10 of the package handler according to the second embodiment of the present invention includes a pair of mount block supports 263 and 267 provided parallel with each other, a first mount block 261 on the mount block support 263 to have a plurality of mount portions 262 on its topside and reciprocate horizontally in a direction of a Y-axis, and a second mount block 265 on the mount block support 267 to have a plurality of mount portions 266 on its topside and reciprocate horizontally in the direction of the Y-axis.
- Uncut packages UP carried from the uncut tray part 20 are mounted on the first mount block 261, while cut packages CP unloaded from the cutting jig 5 are mounted on the second mount block 265.
- the cutting jig 5 is provided between the first and second mount blocks 261 and 265 to be movable up and down by the lift unit 250.
- the cutting jig 5 is supported by the holder 252.
- the holder 252 is provided with slots 252a respectively corresponding to the slots 5a of the cutting jig 5.
- a size of the slot 252a of the holder 252 shown in FIG. 14 is equal to that of the slot 5a of the cutting jig 5.
- the mount portion 262 is provided to the topside of the first mount block 261 and a perforated hole 264 is provided under the mount portion 262 to be spaced apart from the mount portion 262.
- the perforated hole 264 enable a package to be loaded/unloaded therein/therefrom like the mount portion 262.
- the mount portion 262 is perforated as well to enable a package mounted thereon to be moved by a push bar 271 of a push unit 270 that is explained in the following description.
- a push unit 270 is provided next to one side of the first mount block 261 to simultaneously unload a cut package CP from the cutting jig 5 and load an uncut package UP therein. And, the push unit 270 includes a push bar 271 configured to have upper and lower diverging legs.
- a length of an upper push bar 271a of the push bar 271 is smaller than that of a lower push bar 271b of the push bar 271.
- the length of the upper push bar 271a is set in a manner that an end of the upper push bar 27 Ia reaches an end portion of the slot 252a of the holder 252 of the lift unit 250 when the push bar 271 moves toward the first and second mount blocks 261 and 265.
- the lower push bar 271b is configured to penetrate the perforated hole 264 and then reach the second mount block 265 via the first mount block 261.
- the push bar 271 of the push unit 270 moves.
- the upper push bar 271a loads the uncut package UP on the first mount block 261 in the corresponding slot 5a of the cutting jig 5 and the lower push bar 271b unloads the cut package CP from the corresponding slot 5a of the cutting jig 5 to the second mount block 265, simultaneously.
- FIG. 16 is a schematic layout of a package handler according to a third embodiment of the present invention.
- the package handler according to the third embodiment of the present invention further includes a cleansing part 380 cleansing a cut package CP separated from a cutting jig 5 and a drying part 390 drying the cleansed package CP before the separated cut package is carried to a cut tray unit 30.
- the packages CP are carried to the cleansing part 380. After the packages CP have been cleansed, they are dried. The dried packages are then carried to the cut tray unit 30 to be accommodated therein.
- a fourth embodiment of the present invention is carried out in a manner of performing an operation of carrying cut packages CP to a cleansing part 480, a drying part 490, and a cut tray part 30 and an operation of supplying uncut packages UP to a mount block 261 separately using a pair of package carriers 441 and 445 which are independently driven.
- FIG. 17 is a schematic layout of a package handler according to a fourth embodiment of the present invention.
- a package handler includes a first mount block 261, a second mount block 265, a lift unit 250, a push unit 250, an uncut tray part 20, a cut tray part 30 aligned to oppose the uncut tray part 20 centering on the first and second mount blocks 261 and 265, a first package carrier 441, a second package carrier 445, a cleansing part 480, and a drying part 490.
- the first package carrier 441 includes a first movable frame 442 movably provided to a fixed frame 440, which extends in a direction of an X-axis of a body 1, in a direction of the X-axis, a first head block 443 provided movable in a direction of a Y- axis to the first movable frame 442 to be movable up and down to a prescribed distance, and a plurality of sucking nozzles 444 provided to a lower end of the first head block 443 to hold packages UP by vacuum suction.
- the second package carrier 445 includes a second movable frame 446 provided to the fixed frame 440 to be independently movable in a direction of the X-axis, a second head block 447 provided movable in a direction of the Y-axis to the second movable frame 446 to be movable up and down to a prescribed distance, and a plurality of sucking nozzles 448 provided to a lower end of the second head block 447 to hold packages CP by vacuum suction.
- the first package carrier 441 holds the uncut packages UP in the uncut tray part 20 by vacuum suction and then carries then over the first mount block 261.
- the second package carrier 445 holds the cut packages CP on the second mount block 265 by vacuum suction, carries them to the cleansing part 480 and the drying unit 490 sequentially, and then loading them in empty spaces of the cut tray part 30. In doing so, the first and second package carriers 441 and 445 are independently operated.
- a package handler according to a fifth embodiment of the present invention is explained with reference to FIG. 18 as follows.
- FIG. 18 is a schematic layout of a package handler according to a fifth embodiment of the present invention.
- a package handler includes a lift unit 50 lifting a cutting jig 5 up and down, a first push unit 71, a second push unit 72, a mount block 560, an uncut tray part 20, a cut tray part 30, and a package carrier 540.
- Configurations of the lift unit 50, the first push unit 71, and the second push unit 72 are similar to those of the lift unit 50, the first push unit 71 and the second push unit 72 of the package handler according to the first embodiment of the present invention, of which details are omitted in the following description.
- the mount block 560 is fixed to the body 1 and includes a single mount portion 561 only.
- the uncut tray part 20 is moved by one pitch in a direction of an X-axis by a first tray transfer 525 provided to the body 1 in the X-axis direction.
- the cut tray part 30 is moved by one pitch in a direction of an X-axis by a second tray transfer 535 provided to the body 1 in the X-axis direction.
- Each of the first and second tray transfers 525 and 535 can include a general linear motion system including a pair of pulleys, a belt, and a motor, a linear motor, a motor and a ball screw, or the like for example.
- the package carrier 540 is configured to move in directions of Y- and Z-axes only.
- the package carrier 540 includes a short frame 541 provided on the body 1 to extend in the Y-axis direction, a head block 542 provided movable in the Y-axis direction along the short frame 541, and a pair of sucking nozzles 543 provided to the head block 542 to hold a package by vacuum suction.
- the short frame 541 is provided to penetrate an upper part of the mount block 560.
- a pair of the sucking nozzles 543 are provided only. So, since the mount block 560 includes the single mount portion only 561, the sucking nozzle 543 is configured to pick up a package mounted on the mount portion 561 and the other sucking nozzle 543 is configured to pick up a package mounted on the uncut tray part 30 or the cut tray part 20. This is to minimize the time taken for the head block 542 to carry the package along the short frame 541.
- the package carrier 540 can be provided with one sucking nozzle 543 only.
- packages are carried to the uncut tray part 20, the mount block 60, and the cut tray part 30 as the head block 540 and the sucking nozzle 543 of the package carrier 540 are repeatedly moved in the Y-axis direction while the mount block 560 is fixed.
- the former package handler according to the fifth embodiment of the present invention is modified into a package handler according to a sixth embodiment of the present invention.
- FIG. 19 is a schematic layout of a package handler according to a sixth embodiment of the present invention.
- a package handler according to a sixth embodiment of the present invention has the almost same configuration of the former handler according to the fifth embodiment of the present invention.
- a plurality of mount portions 661 are provided to a mount block 660.
- the mount block 660 is provided movable on a mount block support 665 by a unit of a prescribed distance.
- the number of sucking nozzles 543 is set greater than the number of the mount portions 551 to enable a fast package carrying process.
- the former package handler according to the sixth embodiment of the present invention is modified into a package handler according to a seventh embodiment of the present invention.
- FIG. 20 is a schematic layout of a package handler according to a seventh embodiment of the present invention.
- a package handler according to a seventh embodiment of the present invention has the almost same configuration of the former handler according to the sixth embodiment of the present invention.
- a head block of a package carrier 740 is configured to have an L shape. And, a plurality of sucking nozzles 743 are provided to an end portion of the head block 742.
- the cutting jig 5 for cutting the packages CP and UP is directly inputted to the handler and fixed to the holder 53 of the lift unit 50.
- the cut packages in the cutting jig 5 are transferred to be loaded on a separate handler jig instead of fixing the cutting jig 5 to the holder 52 of the lift unit 50 directly, the handler jig is fixed to the holder 52 of the lift unit 50 of the handler, the package loading and unloading operation is performed, the uncut package loaded in the handler jig is then transferred to be loaded on the cutting jig to continue the cutting work.
- FIG. 21 shows a package loading example of transferring cut packages CP in a cutting jig 5 to a handler jig J and transferring uncut packages UP in the handler jig J to the cutting jig 5.
- a plurality of slots 5a of a cutting jig 5 are provided adjacent to a plurality of slots Ja of a handler jig J to oppose each other by one-to-one correspondence.
- a pusher P is inserted in the corresponding slots 5a or Ja from one side of the cutting or handler jig 5 or J to push the cut packages CP in the cutting jig 5 into the handler jig J or the uncut packages UP in the handler jig J into the cutting jig 5.
- a width t2 of the slot Ja of the handler jig J is formed slightly grater than a width tl of the slot 5a of the cutting jig 5.
- an entrance of the slot Ja of the handler jig J is configured to have a bottleneck shape to prevent a package CP loaded in the slot Ja from escaping from the slot Ja easily.
- the present invention has an industrial applicability.
- the package handler automatically carries out an operation of separating a cut package from a cutting jig, accommodating the package in a tray, and loading an uncut package in the cutting jig, which considerably reduces a time taken to load/unload a package in/from the cutting jig.
- Furthermor as mentioned above, the package handler can enhance work efficiency and productivity.
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/296,199 US20090047104A1 (en) | 2006-04-07 | 2007-04-04 | Package handler |
JP2009504122A JP2009533840A (en) | 2006-04-07 | 2007-04-04 | Package handler |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2006-0032010 | 2006-04-07 | ||
KR1020060032010A KR100777784B1 (en) | 2006-04-07 | 2006-04-07 | Package Handler |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2007117094A1 true WO2007117094A1 (en) | 2007-10-18 |
Family
ID=38581335
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2007/001637 WO2007117094A1 (en) | 2006-04-07 | 2007-04-04 | Package handler |
Country Status (6)
Country | Link |
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US (1) | US20090047104A1 (en) |
JP (1) | JP2009533840A (en) |
KR (1) | KR100777784B1 (en) |
CN (1) | CN101415628A (en) |
TW (1) | TW200739789A (en) |
WO (1) | WO2007117094A1 (en) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101380822B1 (en) * | 2008-04-25 | 2014-04-10 | 한미반도체 주식회사 | Apparatus and Method for Processing Memory Cards |
KR101425542B1 (en) * | 2008-06-13 | 2014-08-06 | 한미반도체 주식회사 | Apparatus for Processing Memory Cards |
SG10202108561UA (en) * | 2013-11-26 | 2021-09-29 | Kla Tencor Corp | Pick-and-place head and method for picking workpieces |
US10446728B2 (en) * | 2014-10-31 | 2019-10-15 | eLux, Inc. | Pick-and remove system and method for emissive display repair |
CN108910179B (en) * | 2018-05-02 | 2020-09-18 | 湖北新华光信息材料有限公司 | Flexible picking and sorting and placing device for pressed concave-convex lens blank after stress annealing |
US10977539B1 (en) | 2019-12-20 | 2021-04-13 | Capital One Services, Llc | Systems and methods for use of capacitive member to prevent chip fraud |
US10817768B1 (en) | 2019-12-20 | 2020-10-27 | Capital One Services, Llc | Systems and methods for preventing chip fraud by inserts in chip pocket |
US11049822B1 (en) | 2019-12-20 | 2021-06-29 | Capital One Services, Llc | Systems and methods for the use of fraud prevention fluid to prevent chip fraud |
US10810475B1 (en) | 2019-12-20 | 2020-10-20 | Capital One Services, Llc | Systems and methods for overmolding a card to prevent chip fraud |
US10888940B1 (en) | 2019-12-20 | 2021-01-12 | Capital One Services, Llc | Systems and methods for saw tooth milling to prevent chip fraud |
KR102133877B1 (en) * | 2020-02-18 | 2020-07-14 | 에스에스오트론 주식회사 | Automatic replacement device for jig to boat for semiconductor package |
KR102133881B1 (en) * | 2020-02-18 | 2020-07-14 | 에스에스오트론 주식회사 | Automatic replacement device for tray to jig for semiconductor package |
KR102133878B1 (en) * | 2020-02-18 | 2020-07-14 | 에스에스오트론 주식회사 | Automatic replacement device for jig to tray for semiconductor package |
KR102114636B1 (en) * | 2020-03-19 | 2020-05-25 | 에스에스오트론 주식회사 | Process device for semiconductor package |
US11715103B2 (en) | 2020-08-12 | 2023-08-01 | Capital One Services, Llc | Systems and methods for chip-based identity verification and transaction authentication |
CN113451180B (en) * | 2021-07-12 | 2022-09-02 | 深圳市宸芯科技有限公司 | Packaging plastic packaging equipment with peculiar smell removing function for integrated circuit |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999060611A1 (en) * | 1998-05-20 | 1999-11-25 | Applied Komatsu Technology, Inc. | In-situ substrate transfer shuttle |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW437002B (en) * | 1998-11-06 | 2001-05-28 | Disco Abrasive System Ltd | CSP substrate dividing apparatus |
-
2006
- 2006-04-07 KR KR1020060032010A patent/KR100777784B1/en not_active IP Right Cessation
-
2007
- 2007-04-03 TW TW096111746A patent/TW200739789A/en unknown
- 2007-04-04 CN CNA2007800125950A patent/CN101415628A/en active Pending
- 2007-04-04 WO PCT/KR2007/001637 patent/WO2007117094A1/en active Application Filing
- 2007-04-04 JP JP2009504122A patent/JP2009533840A/en active Pending
- 2007-04-04 US US12/296,199 patent/US20090047104A1/en not_active Abandoned
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999060611A1 (en) * | 1998-05-20 | 1999-11-25 | Applied Komatsu Technology, Inc. | In-situ substrate transfer shuttle |
Also Published As
Publication number | Publication date |
---|---|
CN101415628A (en) | 2009-04-22 |
US20090047104A1 (en) | 2009-02-19 |
JP2009533840A (en) | 2009-09-17 |
KR100777784B1 (en) | 2007-11-21 |
TW200739789A (en) | 2007-10-16 |
KR20070100566A (en) | 2007-10-11 |
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