WO2007102662A1 - Display module - Google Patents
Display module Download PDFInfo
- Publication number
- WO2007102662A1 WO2007102662A1 PCT/KR2007/000888 KR2007000888W WO2007102662A1 WO 2007102662 A1 WO2007102662 A1 WO 2007102662A1 KR 2007000888 W KR2007000888 W KR 2007000888W WO 2007102662 A1 WO2007102662 A1 WO 2007102662A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit board
- printed circuit
- support member
- flexible printed
- display module
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Definitions
- Embodiments relate to a display module.
- a flat panel display (FPD) module is used in mobile devices as well as large-sized display devices.
- the FPD module includes a panel displaying images, a printed circuit board (PCB) driving the panel, and a flexible printed circuit board (FPCB) electrically connecting the panel to the PCB.
- Various flat display devices are used as the panel. Especially, liquid crystal panels are used in small-sized mobile devices.
- the PCB may be in a different plane from that of the panel. For example, the PCB may be located behind the panel. Flexible member such as the
- FPCB is appropriate for connecting the panel to the PCB.
- the FPCB has a restoring force since the FPCB is flexible. When the FPCB is folded, it tends to be unfolded by the restoring force. [7] Therefore, when the PCB is located behind the panel, the gap between the panel and the PCB is generated by the restoring force of the FPCB.
- An embodiment of the present invention provides a display module comprising a panel displaying images, a printed circuit board (PCB) supplying driving signals to the panel, a flexible printed circuit board (FPCB) electrically connecting the PCB to the panel, and a support member formed on the FPCB.
- PCB printed circuit board
- FPCB flexible printed circuit board
- An embodiment of the present invention provides a display module comprising a panel displaying images, a printed circuit board (PCB) supplying driving signals to the panel, and a flexible printed circuit board (FPCB) electrically connecting the PCB to the panel, wherein the FPCB includes a base layer, a first copper foil pattern and a first cover layer formed on a first surface of the base layer, and a second copper foil pattern and a second cover layer formed on a second surface of the base layer, and the first cover layer formed on an outer surface of the folded FPCB is partially removed.
- PCB printed circuit board
- FPCB flexible printed circuit board
- An embodiment of the present invention provides a device comprising a first electric device, a printed circuit board (PCB) supplying driving signals to the first electric device, a flexible printed circuit board (FPCB) electrically connecting the PCB to the first electric device, and a support member formed on the FPCB.
- PCB printed circuit board
- FPCB flexible printed circuit board
- Embodiments prevent a panel from coming off a PCB caused by a FPCB.
- FIGS. 1 and 2 are views illustrating the configuration of a display module
- FIGS. 1 and 2 are views illustrating the configuration of a display module.
- FIGS. 3 through 6 are views illustrating the shape of the FPCB 103 applied to the display module.
- FIG. 3 is a front view of the FPCB 103.
- FIG. 3 is a front view of the FPCB 103.
- FIG. 4 is a sectional view of the FPCB 103.
- FIG. 5 is a rear view of the FPCB 103.
- the FPCB 103 includes a base layer 111, a first cover layer 113, a first copper foil pattern 115, a second copper foil pattern 117, and a second cover layer 119.
- the first copper foil pattern 115 is electrically connected to the PCB 105, and the second copper foil pattern 117 is electrically connected to the panel 101.
- the first copper foil pattern 115 is electrically connected to the second copper foil pattern 117 through a via hole (not shown) formed in the base layer 111.
- FPCB 103 can be considered as a tensile surface, and the second cover layer 119 formed on the inner surface of the folded FPCB 103 can be considered as a shrinkage surface.
- the restoring force of the FPCB 103 is reduced by removing a portion of the tensile surface.
- FIGS. 7 through 9 are views illustrating the configuration of a display module according to an embodiment.
- FIG. 7 is a front view of the display module.
- FIG. 8 is a side view of the display module.
- FIG. 9 is a rear view of the display module.
- FIG. 10 is a conceptional view illustrating the display module which is assembled according to an embodiment.
- the display module according to an embodiment includes a panel 201, a FPCB 203, a PCB 205, and a support member 207.
- the panel 201 displays images.
- the PCB 205 supplies driving signals to the panel
- the PCB 205 is electrically connected to the panel 201 using the FPCB 203.
- the support member 207 is formed on the FPCB 203.
- the FPCB 203 may have the same configuration as illustrated in FIG. 4.
- the support member 207 may be formed on the second cover layer 119.
- the outer surface of the folded FPCB 203 can be considered as a tensile surface, and the inner surface of the folded FPCB 203 can be considered as a shrinkage surface.
- the support member 207 may be formed on the shrinkage surface.
- the support member 207 is formed of a material having no restoring force when the material is deformed.
- the support member 207 may be a metal tape formed of a thin metal layer and an adhesive layer.
- the support member 207 may be an adhesive tape including aluminum-based or copper-based light metals.
- the support member 207 may be an adhesive metal tape which is made by making an aluminum-based or a copper-based light metal into a sheet, and then applying an adhesive to the light metal sheet.
- the FPCB 203 has the restoring force
- the support member 207 has no restoring force. Hence, the restoring force of the FPCB 203 can be restrained.
- the folded FPCB 203 has a restoring force.
- the support member 207 restrains the restoring force of the FPCB 203.
- the restoring force can be adjusted by controlling the material and thickness of the support member 207.
- the support member 207 is selected considering a restoring force of the
- PCB 205 remain folded.
- the PCB 205 may have a circuit formed around the edge of the PCB 205 and no circuit in a portion of the inside of the PCB 205.
- the PCB 205 may have various shapes.
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Structure Of Printed Boards (AREA)
- Telephone Set Structure (AREA)
- Liquid Crystal (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007800007352A CN101331428B (zh) | 2006-03-08 | 2007-02-21 | 显示模块 |
US11/997,519 US7808597B2 (en) | 2006-03-08 | 2007-02-21 | Display module |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060021717A KR100793549B1 (ko) | 2006-03-08 | 2006-03-08 | 액정표시모듈 및 이를 구비하는 이동통신 단말기 |
KR10-2006-0021717 | 2006-03-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2007102662A1 true WO2007102662A1 (en) | 2007-09-13 |
Family
ID=38475067
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2007/000888 WO2007102662A1 (en) | 2006-03-08 | 2007-02-21 | Display module |
Country Status (4)
Country | Link |
---|---|
US (1) | US7808597B2 (zh) |
KR (1) | KR100793549B1 (zh) |
CN (1) | CN101331428B (zh) |
WO (1) | WO2007102662A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017113135A1 (zh) * | 2015-12-30 | 2017-07-06 | 深圳市大富精工有限公司 | 电子设备的折叠保护套 |
CN109507236A (zh) * | 2018-11-23 | 2019-03-22 | 歌尔股份有限公司 | 金属粘连性检测电路及检测装置 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4407722B2 (ja) * | 2007-05-23 | 2010-02-03 | ソニー株式会社 | 表示装置 |
JP4746703B1 (ja) * | 2010-03-29 | 2011-08-10 | 株式会社東芝 | 電子機器、ハードディスクドライブ |
US20120266434A1 (en) * | 2011-04-19 | 2012-10-25 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Methods and apparatuses for protecting flexible (flex) circuits of optical transceiver modules from being damaged during manufacturing and assembly of the modules |
TWI468785B (zh) * | 2011-11-30 | 2015-01-11 | Au Optronics Corp | 顯示模組 |
KR101932127B1 (ko) | 2012-09-19 | 2018-12-26 | 삼성디스플레이 주식회사 | 표시장치 및 그 제조방법 |
KR102357508B1 (ko) | 2014-09-04 | 2022-02-04 | 삼성디스플레이 주식회사 | 표시장치 |
KR102674665B1 (ko) * | 2016-11-10 | 2024-06-11 | 엘지이노텍 주식회사 | 웨어러블 장치 |
TWI611241B (zh) * | 2017-01-05 | 2018-01-11 | 友達光電股份有限公司 | 複合膠帶 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6211936B1 (en) * | 1998-06-16 | 2001-04-03 | Kabushiki Kaisha Toshiba | Liquid crystal display device and method of making the same |
US20030117543A1 (en) * | 2001-09-26 | 2003-06-26 | Ching-Yun Chang | Structure of a display device |
US20050151918A1 (en) * | 2004-01-09 | 2005-07-14 | Jin-Hee Park | Display apparatus |
US20050185127A1 (en) * | 2004-02-25 | 2005-08-25 | Natsuko Fujiyama | Method of manufacturing liquid crystal display |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06268724A (ja) * | 1993-03-15 | 1994-09-22 | Hitachi Ltd | 携帯用折たたみ式電子機器 |
KR20010008874A (ko) * | 1999-07-05 | 2001-02-05 | 김영환 | 표준자판이 부착된 휴대용 무선전화기 |
JP3983120B2 (ja) * | 2001-07-30 | 2007-09-26 | 富士通日立プラズマディスプレイ株式会社 | Icチップの実装構造及びディスプレイ装置 |
CN2510886Y (zh) * | 2001-11-21 | 2002-09-11 | 胜华科技股份有限公司 | 防止液晶显示模块导线断裂的结构 |
JP4156407B2 (ja) * | 2003-03-05 | 2008-09-24 | 三菱電機株式会社 | 携帯型折畳式電子機器 |
KR100652622B1 (ko) * | 2003-12-19 | 2006-12-06 | 엘지전자 주식회사 | 휴대용 단말기의 힌지부 신호연결 장치 |
CN1687830A (zh) * | 2005-05-30 | 2005-10-26 | 友达光电股份有限公司 | 背光结构及其光源模块 |
-
2006
- 2006-03-08 KR KR1020060021717A patent/KR100793549B1/ko active IP Right Grant
-
2007
- 2007-02-21 CN CN2007800007352A patent/CN101331428B/zh active Active
- 2007-02-21 US US11/997,519 patent/US7808597B2/en active Active
- 2007-02-21 WO PCT/KR2007/000888 patent/WO2007102662A1/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6211936B1 (en) * | 1998-06-16 | 2001-04-03 | Kabushiki Kaisha Toshiba | Liquid crystal display device and method of making the same |
US20030117543A1 (en) * | 2001-09-26 | 2003-06-26 | Ching-Yun Chang | Structure of a display device |
US20050151918A1 (en) * | 2004-01-09 | 2005-07-14 | Jin-Hee Park | Display apparatus |
US20050185127A1 (en) * | 2004-02-25 | 2005-08-25 | Natsuko Fujiyama | Method of manufacturing liquid crystal display |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017113135A1 (zh) * | 2015-12-30 | 2017-07-06 | 深圳市大富精工有限公司 | 电子设备的折叠保护套 |
CN109507236A (zh) * | 2018-11-23 | 2019-03-22 | 歌尔股份有限公司 | 金属粘连性检测电路及检测装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20070091925A (ko) | 2007-09-12 |
US7808597B2 (en) | 2010-10-05 |
US20080310090A1 (en) | 2008-12-18 |
CN101331428A (zh) | 2008-12-24 |
CN101331428B (zh) | 2011-03-09 |
KR100793549B1 (ko) | 2008-01-14 |
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