WO2007099929A1 - Procede et appareil de depot de mince film organique - Google Patents

Procede et appareil de depot de mince film organique Download PDF

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Publication number
WO2007099929A1
WO2007099929A1 PCT/JP2007/053579 JP2007053579W WO2007099929A1 WO 2007099929 A1 WO2007099929 A1 WO 2007099929A1 JP 2007053579 W JP2007053579 W JP 2007053579W WO 2007099929 A1 WO2007099929 A1 WO 2007099929A1
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WO
WIPO (PCT)
Prior art keywords
substrate
thin film
organic thin
mask
vapor deposition
Prior art date
Application number
PCT/JP2007/053579
Other languages
English (en)
Japanese (ja)
Inventor
Toshio Negishi
Koji Hane
Original Assignee
Ulvac, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac, Inc. filed Critical Ulvac, Inc.
Publication of WO2007099929A1 publication Critical patent/WO2007099929A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material

Definitions

  • the present invention relates to an organic thin film deposition method and an organic thin film deposition apparatus for forming, for example, a light emitting layer of an organic EL element.
  • a vacuum deposition apparatus has been used to form a light emitting layer of an organic EL element.
  • a pallet is used in order to efficiently deposit on many substrates.
  • the substrate and the mask are held on a simple carrier, and the vapor deposition is performed while moving as an integrated assembly.
  • Patent Document 1 JP-A-2005-85605
  • Patent Document 2 JP-A-2005-97655
  • the present invention has been made to solve the above-described problems of the conventional technology, and an object of the present invention is to provide an organic thin film vapor deposition method and an organic thin film vapor deposition apparatus that can reduce the installation area.
  • Another object of the present invention is to provide an organic thin film vapor deposition method and an organic thin film vapor deposition apparatus that can improve the alignment accuracy between the carrier and the substrate. Means for solving the problem
  • the present invention which has been made to achieve the above object, deposits an organic thin film on a substrate while the substrate carried in the vacuum chamber is held by a detachable carrier and sequentially conveyed.
  • the transport body in the vacuum chamber, the transport body is detached from the substrate after the deposition, and the transport body is returned to the deposition start position via the upper part of the deposition region, and the vacuum chamber A process of mounting a new substrate carried into the carrier on the carrier.
  • a light emitting layer for an organic EL element is formed on the substrate.
  • the present invention is an organic thin film vapor deposition apparatus that deposits an organic thin film on a substrate while holding the substrate carried in a vacuum chamber by a removable carrier and sequentially carrying the substrate.
  • a transport return unit that transports the transport body detached from the substrate after the completion of the deposition to the deposition start position via the upper part of the deposition region and the vicinity of the substrate carry-in port.
  • an alignment mechanism that aligns the substrate, a mask for forming a vapor deposition pattern, and the carrier from above and below can be provided.
  • a partition part can also be provided between the said vapor deposition area
  • the mask exchange carry-in port can be arranged in a region where the carrier is raised after the vapor deposition.
  • the carrier separated from the substrate after completion of the vapor deposition is returned to the vapor deposition start position via the upper part of the vapor deposition region.
  • the substrate and the carrier can be aligned from above and below, the alignment accuracy between the substrate and the carrier can be improved.
  • the vapor-deposited product can be obtained.
  • Various deposition patterns can be continuously formed while replacing a mask with a new mask.
  • the mask exchange carry-in port when the mask exchange carry-in port is disposed in a region where the carrier after the deposition is lifted, the substrate and the replacement mask are moved as the carrier is raised. You can put them together and put them together.
  • the structure of the mechanism part including the alignment mechanism can be simplified, and the alignment operation can be performed quickly and the tact time can be reduced.
  • an organic thin film deposition apparatus that has a small installation area and that can improve the alignment accuracy of the carrier and the substrate.
  • FIG. 1 is a schematic configuration diagram of an embodiment of an organic thin film forming apparatus of the present invention.
  • FIG. 2 is an overall operation explanatory diagram showing a method for forming an organic thin film using the same embodiment.
  • FIG. 3 (a) (b): An explanatory view showing the alignment operation of the substrate and the mask in the embodiment.
  • [FIG. 4] (a) (b): The alignment operation of the substrate and the mask in the embodiment.
  • FIG. 5 is an overall operation explanatory diagram showing the procedures for mask replacement and alignment in the same embodiment.
  • [FIG. 6] (a) (b): Operation illustrating mask exchange and alignment procedures in the same embodiment.
  • FIG. 7 (a) (b): Operation illustrating mask replacement and alignment procedures in the same embodiment.
  • FIG. 8 is a schematic configuration diagram of another embodiment of the organic thin film forming apparatus of the present invention.
  • FIG. 9 (a) (b): Explanatory drawing showing the alignment operation of the substrate and the mask in the same embodiment.
  • FIG. 1 is a schematic configuration diagram of an organic thin film forming apparatus according to the present embodiment
  • FIG. 2 is an overall operation explanatory view showing an organic thin film forming method using the same embodiment
  • FIGS. 4 (a) and 4 (b) are explanatory views showing the alignment operation of the substrate and the mask in the same embodiment.
  • an organic thin film forming apparatus 1 is an inline-type long vacuum vapor deposition apparatus, and has a vacuum chamber 2 connected to a vacuum exhaust system (not shown). And speak.
  • the vacuum chamber 2 is connected to the pretreatment chamber 3 at one end of the vacuum chamber 2. Then, the pretreated substrate 4 is loaded into the vacuum chamber 2 from the pretreatment chamber 3 through the substrate carry-in port 5! RU
  • the vacuum chamber 2 is connected to, for example, a sputtering chamber 13 at the other end of the vacuum chamber 2. Then, the vapor-deposited substrate 4 is carried into the processing chamber such as the sputtering chamber 13 from the vacuum chamber 2 through the substrate carry-out port 12.
  • the substrate 4 used in the present embodiment also has a transparent glass substrate force, for example, and a filter and a transparent electrode film (not shown) are laminated on the upper surface thereof.
  • An alignment mechanism 8 is provided at the substrate loading position 2 a in the vicinity of the substrate loading port 5 of the vacuum chamber 2. This alignment mechanism 8 filters the substrate 4 loaded from the substrate loading port 5.
  • the ret (conveyance body) 9 is configured to be mounted and held together with the mask 6 in the vertical (vertical) direction.
  • a mask carry-in port 7 for carrying in an unused replacement mask 6a is provided below the alignment mechanism 8 in the vacuum chamber 2.
  • the replacement mask 6a is carried into the external force vacuum chamber 2 in the horizontal direction (in the direction orthogonal to the paper surface in the figure) from the mask carry-in port 7, and is lifted by the carrying mechanism (not shown) to the alignment mechanism 8. I am starting to hand it over.
  • the pallet 9 is also a frame-shaped member that is larger than the substrate 4, and is provided with an opening (not shown) that is slightly smaller than the substrate 4.
  • the mask 6 has substantially the same size as the substrate 4 and is provided with openings (not shown) corresponding to the vapor deposition pattern. Then, the substrate 4 is mounted and held on the pallet 9 via the mask 6 and is transported as a substrate assembly 20 in one piece! / Speak.
  • a plurality of vapor deposition sources 10a to 10e are disposed in the lower part of the vacuum chamber 2.
  • a predetermined organic material (not shown) for forming the light emitting layer of the organic EL element is accommodated in each of the vapor deposition sources 10 a to 1 Oe.
  • the substrate 4 held on the pallet 9 together with the mask 6, that is, the substrate assembly 20 is provided.
  • the substrate is transported in the horizontal direction toward the substrate unloading port 12 via the deposition start position 2 c by a transport mechanism (not shown), and sequentially deposits the deposition region 11 on the deposition sources 10 a to 10 e. It is configured to pass.
  • a separation mechanism (not shown) for separating the substrate 4 and the vaporized replacement mask 6b from the pallet 9 is provided at the substrate removal position 2b in the vicinity of the substrate carry-out port 12 of the vacuum chamber 2.
  • the substrate 4 detached from the pallet 9 is transferred from the substrate carry-out port 12 to, for example, the sputtering chamber 13! /.
  • a mask carry-out port 14 for carrying out the deposited replacement mask 6b is provided below the substrate take-out position 2b.
  • a transport return unit 15 is provided in the upper part of the vacuum chamber 2.
  • the transport return unit 15 includes a transport mechanism 15a that also has, for example, roller force. And The pallet 9 and the mask 6 from which the substrate 4 has been detached and the mask 6 (only the pallet 9 when replacing the mask 6) are placed above the deposition region 11 (for example, the position immediately above) in the direction opposite to the deposition direction, that is, to the substrate carry-in entrance 5 It is comprised so that it may convey toward.
  • a partition 16 for preventing contamination is provided between the vapor deposition region 11 and the transport return unit 15.
  • a plurality of pallets 9 with masks 6 are arranged in advance on the above-described transport return unit 15.
  • the substrate 4 is carried into the vacuum chamber 2 from the substrate carry-in entrance 5 and placed at a position above the pallet 9 with the mask 6 of the alignment mechanism 8.
  • the substrate 4 and the mask 6 are made to face each other.
  • the substrate 4 and the mask 6 are aligned by the alignment mechanism 8, and the pallet 9 is moved upward to attach the substrate 4 and the mask 6 together as shown in FIG. 4 (a).
  • the board assembly 20 is assumed.
  • the substrate assembly 20 is moved to the deposition start position 2c, and a predetermined organic material is deposited on the surface of the substrate 4 through the mask 6.
  • the substrate 4 is detached from the pallet 9 with respect to the substrate assembly 20 that has reached the substrate extraction position 2b after vapor deposition, and this substrate 4 is removed from the substrate carry-out port 12 to the sputtering chamber 13. Transport to.
  • the pallet 9 with the mask 6 is moved above the substrate take-out position 2b, transferred to the carry-back unit 15, and conveyed toward the substrate carry-in position 2a.
  • a new substrate 4 is sequentially carried into the vacuum chamber 2, and the substrate 4 is mounted on the mask 6 on the pallet 9 in the above-described procedure, and the organic material is deposited via the deposition start position 2c.
  • the pallet 9 is transported to the board loading position 2a.
  • the above-described procedure is performed and the mask 6 is used a plurality of times. After that, replace it.
  • FIG. 5, FIG. 6 (a) (b) and FIG. 7 (a) (b) are operation explanatory views showing the procedures of mask replacement and alignment in the present embodiment.
  • the substrate 4 is detached from the pallet 9 and transferred to the sputtering chamber 13 at the substrate extraction position 2b.
  • the deposited replacement mask 6b is detached from the pallet 9 and carried out from the mask carry-out port 14 to the outside of the vacuum chamber 2.
  • the pallet 9 is moved above the substrate take-out position 2b, transferred to the transfer return unit 15, and transferred toward the substrate carry-in position 2a.
  • the pallet 9 positioned above the substrate loading position 2a is lowered and placed at the position below the alignment mechanism 8.
  • the replacement mask 6a is carried in from the mask carry-in port 7 in the horizontal direction, and as shown in FIG. 6 (b), the replacement mask 6a is raised in the vertical direction and then carried in the horizontal direction. Then, place it at a position above the pallet 9 of the alignment mechanism 8.
  • the substrate 4 is carried into the vacuum chamber 2 from the substrate carry-in entrance 5, and is disposed at a position above the mask 6 of the alignment mechanism 8, so that the substrate 4 Make mask 6 face each other.
  • the alignment mechanism 8 aligns the substrate 4 and the mask 6, and
  • the substrate assembly 20 is moved to the deposition start position 2c, and a predetermined organic material is deposited on the surface of the substrate 4 through the mask 6 as described above.
  • the pallet 9 (and the mask 6) from which the force of the substrate 4 after the vapor deposition is also released is transferred to the transport return unit above the vapor deposition region 11. Since the substrate 15 is returned to the substrate loading position 2a via 15, the area for returning the pallet 9 does not need to be provided adjacent to the vapor deposition area 11, thereby reducing the installation area of the vacuum chamber 2.
  • the alignment mechanism 8 that aligns the vertical force of the substrate 4, the mask 6, and the pallet 9 is provided, the alignment accuracy of the substrate 4 and the mask 6 is provided. Thus, a high-definition pattern can be formed on the substrate 4.
  • the partitioning portion 16 is provided between the vapor deposition region 11 and the transport return portion 15, the vaporization is performed without causing vapor contamination of the evaporation material. be able to.
  • the mask carry-in port 7 for carrying in the unused replacement mask 6a and the mask carry-out port 14 for carrying out the deposited exchange mask 6b are provided.
  • Various deposition patterns can be continuously formed while carrying in and replacing a new replacement mask 6a in place of the deposited replacement mask 6b.
  • the organic thin film deposition apparatus 1 for an organic EL element capable of continuously and rapidly forming a high-definition pattern with a small installation area of the vacuum chamber 2 is provided. Can be provided.
  • FIG. 8 and FIG. 9 (a) and (b) show other embodiments of the present invention.
  • parts corresponding to those of the above-described embodiments are denoted by the same reference numerals. Detailed description is omitted.
  • the organic thin film deposition apparatus 1 A of the present embodiment is configured by providing an alignment mechanism 8 above the substrate extraction position 2 b in the vacuum chamber 2.
  • a substrate carry-in port 17 for carrying the substrate 4 and a replacement mask 6a A mask inlet 7 is provided for carrying in.
  • the substrate carry-in port 17 is disposed above the mask carry-in port 7 and is configured to carry in the base 4 or the mask 6 in the horizontal direction, respectively.
  • a folded region 2d for lowering the substrate assembly 20 and transporting it to the deposition start position 2c is provided at a portion corresponding to the substrate carry-in position 2a of the above embodiment. ing.
  • the substrate 4 is detached from the pallet 9 and transferred to the sputtering chamber 13 at the substrate extraction position 2b.
  • the pallet 9 with the mask 6 is moved above the substrate take-out position 2b and placed below the alignment mechanism 8.
  • the substrate 4 is horizontally loaded into the vacuum chamber 2 from the upper substrate loading port 17, and Arrange the positioning mechanism 8 above the pallet 9 and make the substrate 4 and the mask 6 face each other.
  • the alignment mechanism 8 aligns the substrate 4 and the mask 6, as shown in Fig. 9 (b). In this way, the pallet 9 with the mask 6 is raised and the substrate 4 and the mask 6 are mounted together.
  • the substrate assembly 20 is moved to the deposition start position 2c via the folded region 18, and as described above, a predetermined organic material is deposited on the surface of the substrate 4 via the mask 6. I do.
  • the substrate 4 is detached from the pallet 9 and transferred to the sputtering chamber 13 at the substrate extraction position 2 b.
  • the deposited replacement mask 6b is detached from the pallet 9 and carried out from the mask outlet 14. Further, the pallet 9 is moved above the substrate take-out position 2b and disposed below the alignment mechanism 8.
  • the substrate 4 is carried into the vacuum chamber 2 from the substrate carry-in port 17, and the replacement mask 6 a including the mask carry-in port 7 is carried into the vacuum vessel 2. Then, the substrate 4 and the replacement mask 6a are arranged at a position above the pallet 9 of the alignment mechanism 8 so that the substrate 4 and the replacement mask 6a face each other.
  • the alignment mechanism 8 aligns the substrate 4 and the replacement mask 6a, and raises the pallet 9 to attach the substrate 4 and the replacement mask 6a together. Thereafter, the above-described substrate transfer and mask vapor deposition operations are performed.
  • the present embodiment having such a configuration, in addition to the same effects as those of the above-described embodiment, it is possible to align the substrate 4 and the mask 6 as the pallet 9 is raised.
  • the configuration of the mechanism portion including the alignment mechanism 8 can be simplified.
  • the alignment operation can be performed quickly to shorten the tact time.
  • the present invention can be applied not only to a vacuum vapor deposition apparatus for forming a light emitting layer of an organic EL element but also to various organic thin film forming apparatuses.
  • the present invention is applied to an apparatus for forming a light emitting layer of an organic EL element. Is the most effective.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

La présente invention concerne un procédé de dépôt de mince film organique qui permet d'aligner avec précision un dispositif de transport avec un substrat. L'invention porte aussi sur un appareil de dépôt de mince film organique. Dans l'appareil de formation de mince film organique, les substrats (4) acheminés dans la chambre sous vide (2) sont maintenus par des palettes amovibles (9) et au cours du transfert successif des substrats (4), de minces films organiques se forment par dépôt sur les substrats. Une section de retour de transfert (15) est disposée entre une position d'extraction de substrat (2b) et une position de début de dépôt (2c) dans la chambre sous vide (2) en vue de transférer la palette (9), séparée du substrat (4) à la suite du dépôt, vers la position de début du dépôt (2c) par une section supérieure d'une zone de dépôt (11). La position d'alimentation en substrat (2a) dans la chambre sous vide (2) comprend le substrat (4), un masque (6) destiné à former un motif de dépôt et un mécanisme d'alignement (8) destiné à aligner la palette (9) suivant la direction verticale.
PCT/JP2007/053579 2006-02-28 2007-02-27 Procede et appareil de depot de mince film organique WO2007099929A1 (fr)

Applications Claiming Priority (2)

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JP2006-052961 2006-02-28
JP2006052961 2006-02-28

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010080228A (ja) * 2008-09-25 2010-04-08 Hitachi High-Technologies Corp 有機ｅｌデバイス製造装置及び成膜装置並びにシャドウマスク交換装置及び同交換方法
US20130216709A1 (en) * 2012-02-17 2013-08-22 Semiconductor Energy Laboratory Co., Ltd. Film Formation Apparatus, Method for Forming Film and Method for Cleaning Shadow Mask
JP2014005536A (ja) * 2012-06-22 2014-01-16 Samsung Display Co Ltd 有機層蒸着装置、これを用いる有機発光ディスプレイ装置の製造方法、及びこれにより製造された有機発光ディスプレイ装置
JPWO2012039383A1 (ja) * 2010-09-22 2014-02-03 株式会社アルバック 真空処理装置及び有機薄膜形成方法
JP2014019954A (ja) * 2012-07-16 2014-02-03 Samsung Display Co Ltd 有機層蒸着装置、これを用いる有機発光ディスプレイ装置の製造方法、及びこれによって製造された有機発光ディスプレイ装置
JP2014096363A (ja) * 2012-11-09 2014-05-22 Samsung Display Co Ltd 有機層蒸着装置、それを利用した有機発光ディスプレイ装置の製造方法、及びそれによって製造された有機発光ディスプレイ装置
JP2014224306A (ja) * 2013-05-16 2014-12-04 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． 有機層蒸着装置、及びそれを利用した有機発光ディスプレイ装置の製造方法
WO2015063103A1 (fr) * 2013-10-29 2015-05-07 Leybold Optics Gmbh Chambre à vide et procédé pour faire fonctionner une chambre à vide
CN108411249A (zh) * 2018-03-28 2018-08-17 江苏集萃有机光电技术研究所有限公司 一种基片样品架、掩模板及基片更换方法及蒸镀设备

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JPH09279341A (ja) * 1996-04-17 1997-10-28 Anelva Corp トレイ搬送式インライン成膜装置
JP2004292863A (ja) * 2003-03-26 2004-10-21 Ulvac Japan Ltd マスク装置及び真空成膜装置
JP2005056673A (ja) * 2003-08-04 2005-03-03 Nec Plasma Display Corp プラズマディスプレイパネルの成膜装置、該パネルの製造方法及びプラズマ表示装置の製造方法
JP2005085605A (ja) * 2003-09-09 2005-03-31 Ulvac Japan Ltd 成膜装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09279341A (ja) * 1996-04-17 1997-10-28 Anelva Corp トレイ搬送式インライン成膜装置
JP2004292863A (ja) * 2003-03-26 2004-10-21 Ulvac Japan Ltd マスク装置及び真空成膜装置
JP2005056673A (ja) * 2003-08-04 2005-03-03 Nec Plasma Display Corp プラズマディスプレイパネルの成膜装置、該パネルの製造方法及びプラズマ表示装置の製造方法
JP2005085605A (ja) * 2003-09-09 2005-03-31 Ulvac Japan Ltd 成膜装置

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010080228A (ja) * 2008-09-25 2010-04-08 Hitachi High-Technologies Corp 有機ｅｌデバイス製造装置及び成膜装置並びにシャドウマスク交換装置及び同交換方法
JP5634522B2 (ja) * 2010-09-22 2014-12-03 株式会社アルバック 真空処理装置及び有機薄膜形成方法
JPWO2012039383A1 (ja) * 2010-09-22 2014-02-03 株式会社アルバック 真空処理装置及び有機薄膜形成方法
US20130216709A1 (en) * 2012-02-17 2013-08-22 Semiconductor Energy Laboratory Co., Ltd. Film Formation Apparatus, Method for Forming Film and Method for Cleaning Shadow Mask
JP2014005536A (ja) * 2012-06-22 2014-01-16 Samsung Display Co Ltd 有機層蒸着装置、これを用いる有機発光ディスプレイ装置の製造方法、及びこれにより製造された有機発光ディスプレイ装置
JP2014019954A (ja) * 2012-07-16 2014-02-03 Samsung Display Co Ltd 有機層蒸着装置、これを用いる有機発光ディスプレイ装置の製造方法、及びこれによって製造された有機発光ディスプレイ装置
JP2014096363A (ja) * 2012-11-09 2014-05-22 Samsung Display Co Ltd 有機層蒸着装置、それを利用した有機発光ディスプレイ装置の製造方法、及びそれによって製造された有機発光ディスプレイ装置
JP2014224306A (ja) * 2013-05-16 2014-12-04 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． 有機層蒸着装置、及びそれを利用した有機発光ディスプレイ装置の製造方法
US11335892B2 (en) 2013-05-16 2022-05-17 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display apparatus using the same
US11778890B2 (en) 2013-05-16 2023-10-03 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display apparatus using the same
WO2015063103A1 (fr) * 2013-10-29 2015-05-07 Leybold Optics Gmbh Chambre à vide et procédé pour faire fonctionner une chambre à vide
CN108411249A (zh) * 2018-03-28 2018-08-17 江苏集萃有机光电技术研究所有限公司 一种基片样品架、掩模板及基片更换方法及蒸镀设备
CN108411249B (zh) * 2018-03-28 2024-02-09 江苏集萃有机光电技术研究所有限公司 一种基片样品架、掩模板及基片更换方法及蒸镀设备

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