WO2007088647A1 - Procede de montage d'un composant electrique - Google Patents

Procede de montage d'un composant electrique Download PDF

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Publication number
WO2007088647A1
WO2007088647A1 PCT/JP2006/314642 JP2006314642W WO2007088647A1 WO 2007088647 A1 WO2007088647 A1 WO 2007088647A1 JP 2006314642 W JP2006314642 W JP 2006314642W WO 2007088647 A1 WO2007088647 A1 WO 2007088647A1
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WO
WIPO (PCT)
Prior art keywords
mounting
wiring board
anisotropic conductive
conductive adhesive
adhesive
Prior art date
Application number
PCT/JP2006/314642
Other languages
English (en)
Japanese (ja)
Inventor
Takashi Matsumura
Hisashi Ando
Shiyuki Kanisawa
Yasuhiro Suga
Kazuaki Suzuki
Original Assignee
Sony Chemical & Information Device Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006024586A external-priority patent/JP2006245554A/ja
Application filed by Sony Chemical & Information Device Corporation filed Critical Sony Chemical & Information Device Corporation
Priority to KR1020087019929A priority Critical patent/KR101271939B1/ko
Publication of WO2007088647A1 publication Critical patent/WO2007088647A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/065—Press rams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B5/00—Presses characterised by the use of pressing means other than those mentioned in the preceding groups
    • B30B5/02—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of a flexible element, e.g. diaphragm, urged by fluid pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75315—Elastomer inlay
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75315—Elastomer inlay
    • H01L2224/75316—Elastomer inlay with retaining mechanisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7598—Apparatus for connecting with bump connectors or layer connectors specially adapted for batch processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Definitions

  • the present invention relates to a technique for mounting an electrical component such as a semiconductor chip or a flexible printed wiring board on a wiring board, and more particularly to a technology for mounting an electrical component using an adhesive.
  • COG COG ON GLASS
  • COF CHP ON FLEX
  • a predetermined glass substrate 101 provided with an LCD panel is provided.
  • An anisotropic conductive adhesive film 104 is placed in the mounting area 10 la, and an IC chip 105 or a flexible printed wiring board 106 is mounted thereon.
  • a flat crimping head (not shown) is used to place the IC chip 105.
  • Etc. are pressurized and heated to cure the anisotropic conductive adhesive film 104 and perform thermocompression mounting.
  • the area around the mounted IC chip 105 and flexible printed wiring board 106 is sealed with a sealing resin in order to prevent corrosion of the ITO electrode on the glass substrate 101. Yes.
  • the present invention has been made in order to solve the problems of the conventional technology, and provides a mounting method capable of efficiently mounting electrical components of different mounting methods using an adhesive. With the goal.
  • thermocompression bonding head having a compression bonding member made of a predetermined elastomer on the head body. Then, after the adhesive is entirely disposed in the mounting region on the wiring board, the thermocompression bonding is performed, in which electric components of different mounting methods are disposed in the mounting region, and the pressure bonding member has a size corresponding to the adhesive.
  • the method includes a step of collectively thermocompression bonding the electrical components using a head.
  • a COG type electrical component is used as the electrical component.
  • an FOG type electrical component is used as the electrical component.
  • an anisotropic conductive adhesive is used as the adhesive.
  • the wiring substrate is a glass substrate for a liquid crystal display device.
  • mounting may be performed by arranging a plurality of adhesives on the entire mounting region on the wiring board.
  • belt-shaped adhesive agent in the said invention, can also be used as said adhesive agent.
  • the present invention performs thermocompression bonding with an elastic pressure-bonding member having a predetermined elastomeric force.
  • a plurality of electrical components having different heights can be collectively packaged with high reliability. Therefore, after the adhesive is completely disposed in the mounting area on the wiring board, electric components of different mounting methods (for example, COG method, FOG method) are disposed in the mounting area and correspond to the adhesive.
  • COG method COG method
  • FOG method FOG method
  • the present invention it is also possible to provide a sealing function for, for example, an ITO electrode by curing the adhesive disposed entirely on the mounting region on the wiring board by thermocompression bonding.
  • the conventional sealing process can be omitted.
  • the number of steps can be greatly reduced, so that, for example, the efficiency of mounting using an anisotropic conductive adhesive when manufacturing a liquid crystal display device is greatly increased. It becomes possible to improve.
  • FIG. 1] (a) to (d) are partial cross-sectional explanatory views showing steps of an embodiment of the present invention.
  • FIG. 2 is a perspective view showing a main part of the present embodiment.
  • FIG. 3 is a partial cross-sectional explanatory view showing a main part of another embodiment of the present invention.
  • FIGS. 4 (a) and 4 (b) are partial cross-sectional explanatory views showing the main parts of another embodiment of the present invention.
  • FIG. 5 is a perspective view showing a main part of the same embodiment.
  • FIG. 6 (a) and (b) are perspective views showing an example of a conventional mounting method.
  • Anisotropic conductive adhesive film (Anisotropic conductive adhesive)
  • FIGS. L (a) to (d) are partial cross-sectional explanatory views showing the steps of the present embodiment, and FIG. 2 is a perspective view showing the main part of the same embodiment.
  • a glass substrate (wiring substrate) 1 on which an unillustrated wiring pattern is formed and an LCD panel 2 is provided is prepared.
  • the glass substrate 1 is placed on a base (not shown), and a heater 1 is provided in the base.
  • anisotropic conductive adhesive film (anisotropic conductive adhesive) 4 is stuck on the entire mounting region 3 of the glass substrate 1.
  • This anisotropic conductive adhesive film 4 is one in which conductive particles are dispersed in a binder resin.
  • the melt viscosity as the adhesive handled in the present invention is not affected by whether or not the conductive particles are dispersed.
  • an IC chip 5 which is a COG-type electrical component, for example, is mounted on a predetermined position of the anisotropic conductive adhesive film 4 and temporarily crimped.
  • the edge of one side of the anisotropic conductive adhesive film 4 is mounted with the edge of the flexible printed wiring board 6 that is, for example, an FOG type electric component. Decide the position and perform temporary crimping.
  • thermocompression bonding head 7 the IC chip 5 and the flexible printed wiring board 6 are collectively bonded together using the thermocompression bonding head 7.
  • thermocompression bonding head 7 has a head main body 8 made of a predetermined metal, and a heater for heating (not shown) is provided therein.
  • a concave portion 8a is provided in a portion of the head body 8 facing the glass substrate 1, and a crimp member 9 made of a plate-like elastomer is attached to the concave portion 8a so as to be in close contact with the inner wall of each concave portion 8a. It has been.
  • the crimping member 9 of the present embodiment is arranged so that the planar crimping surface 9a is horizontal. Then, the crimping surface 9a of the crimping member 9 is slightly larger than the size of the anisotropic conductive adhesive film 4, for example, so as to correspond to the size of the anisotropic conductive adhesive film 4 on the mounting region 3 of the glass substrate 1. It is structured as follows.
  • the thickness of the crimping member 9 has the largest thickness among the electrical components from the viewpoint of pressing the top of each electrical component and the fillet portion of the adhesive during thermocompression bonding with an optimum pressure.
  • U preferably set to be equal to or better than the ones.
  • the type of elastomer of the pressure-bonding member 9 is not particularly limited, but from the viewpoint of improving the connection reliability, one having a rubber hardness of 40 or more and 80 or less is used. It is preferable.
  • Elastomers with a rubber hardness of less than 40 have the disadvantage that the pressure on each electrical component is insufficient and the initial resistance and connection reliability are inferior.
  • Elastomers with a rubber hardness of more than 80 have a pressure on the fillet part. Inadequate, and voids are generated in the binder resin of the adhesive, resulting in inferior connection reliability.
  • JIS S 6050 describes the following method for measuring rubber hardness.
  • the measurement location of the test piece is divided into three equal parts, and each central part is measured one by one, and the median value is taken as the hardness of the test piece.
  • Remark 1 The height of the push needle is 2.54 ⁇ 0.02mm when the scale force is 0, and Omm when the scale is 100.
  • Remark 2 The scale force is related to the force of the needle (N). 0 0 0.54, 10 1. 32, 2 0 2. 2. 11, 25 2. 2. 50, 30 2. 89, 40 3. 68, 50 4.46, 60 0 5.25, 70 6.03, 75 6.42, 80 6.82, 90 7.60, 10:00 8. 39.
  • silicone rubber From the viewpoint of 1S heat resistance and pressure resistance, it is preferable to use silicone rubber.
  • thermocompression bonding head 7 Using such a thermocompression bonding head 7, the pressure bonding surface 9a of the thermocompression bonding head 7 is pressed against the tops of the IC chip 5 and the flexible printed wiring board 6 through a protective film (not shown), and the main compression bonding is performed under the following conditions. I do.
  • each electrical component side is kept at a predetermined temperature during the main crimping. It is preferable to heat the glass substrate 1 and heat the glass substrate 1 side at a temperature higher than the predetermined temperature described above.
  • the heater of the thermocompression bonding head 7 is controlled so that the temperature of the pressure bonding member 9 is about 100 ° C, and the temperature of the binder resin of the anisotropic conductive adhesive film is about 200 ° C.
  • the base heater is controlled so that
  • the adhesive anisotropic conductive adhesive film 4 has a melt viscosity of 1.
  • melt viscosity of the anisotropic conductive adhesive film 4 at the time of thermocompression bonding is less than 1.
  • OX 10 2 mPa-s there is a void with a large fluidity of the binder resin at the time of thermocompression bonding. If the melt viscosity is greater than 1.
  • OX 10 5 mPa's the binder resin cannot be completely removed at the connection part during thermocompression bonding, resulting in voids. Inferior initial resistance and connection reliability are disadvantageous.
  • the pressure at the time of final crimping is about 100N for each electrical component and about 15 seconds.
  • the top of the IC chip 5 and the flexible printed wiring board 6 is pressed against the glass substrate 1 with a predetermined pressure by applying pressure with the above-described pressure-bonding member 9 made of elastomer.
  • the adhesive fillet portion on the side of the IC chip 5 and the flexible printed wiring board 6 can be pressed with a pressure smaller than the pressure applied to the top portion, whereby the IC chip 5 and the flexible printed wiring board 6 and the glass can be pressed.
  • Board 1 While sufficient pressure can be applied to the connection portion, the fillet portions around the IC chip 5 and the flexible printed wiring board 6 can be pressurized so as not to generate voids.
  • each mounting process (adhesive placement, provisional pressure bonding, main pressure bonding), which has been conventionally performed for each IC chip 5 and flexible printed wiring board 6, can be performed at once. Become ⁇ .
  • the binding force of the anisotropic conductive adhesive film 4 disposed entirely on the mounting region 3 on the glass substrate 1 is cured by thermocompression bonding.
  • the number of steps can be greatly reduced, so that the efficiency of mounting using an anisotropic conductive adhesive in manufacturing a liquid crystal display device is greatly increased. Can be improved.
  • the other electrical components 10 are also temporarily crimped in the same manner as the IC chip 5 and the flexible printed wiring board 6 and are collectively crimped together under the same conditions as in the above embodiment.
  • FIG. 4 (a) and 4 (b) are explanatory views showing the main part of another embodiment of the present invention, and FIG. It is a perspective view which shows the principal part of a form,
  • symbol is attached
  • the anisotropic conductive adhesive a plurality (three in this example) of strip-shaped anisotropic conductive materials are used. Adhesive adhesive films 4a, 4b, and 4c are used, and these strip-like anisotropic conductive adhesive films 4a to 4c are adhered to the mounting region 3 of the glass substrate 1 over the entire surface.
  • the anisotropic conductive adhesive films 4a to 4c are arranged as close as possible. It is preferable.
  • each anisotropic conductive adhesive film 4a, 4b, 4c is not particularly limited, but the viewpoint power to improve the connection reliability depends on the optimum condition according to the electric component to be mounted. It is preferable to select one (binder material, conductive particle type, film size, thickness, etc.).
  • the pressure-bonding surface 9a of the thermocompression bonding head 7 corresponds to the overall size of the anisotropic conductive adhesive films 4a to 4c on the mounting region 3 of the glass substrate 1.
  • the size of the anisotropic conductive adhesive films 4a to 4c should be slightly larger than the size of the pasting area.
  • a plurality of IC chips 5 and other electrical components 10 are mounted side by side on the anisotropic conductive adhesive films 4a and 4b, and each is temporarily crimped. Mount the edge of the flexible printed wiring board 6 on the edge of the film 4c and perform temporary crimping. Thereafter, as in the above embodiment, the IC chip 5, other electrical components 10, and the flexible printed wiring board 6 are collectively pressure bonded together using the thermocompression bonding head 7.
  • the anisotropic conductivity under optimum conditions according to the electrical component to be mounted since mounting can be performed using the adhesive films 4a to 4c, connection reliability can be further improved. Since other configurations and operational effects are the same as those of the above-described embodiment, a detailed description thereof will be omitted.
  • a plurality of strip-shaped anisotropic conductive adhesive films are used. Although the case has been described as an example, the present invention is not limited to this, and a plurality of anisotropically conductive adhesive films having various shapes such as a square, a rectangle, and the like can also be used.
  • a strip-shaped anisotropic conductive adhesive film by using a strip-shaped anisotropic conductive adhesive film, a plurality of anisotropic conductive adhesive films can be arranged on the wiring board so as to avoid each alignment mark, so that mounting with higher accuracy is performed. be able to.
  • the pressure-bonding member of the thermocompression bonding head is not limited to the above-described embodiment, and various forms can be used.
  • one provided with a plurality of crimping members corresponding to the electrical component to be mounted can be used.
  • a frame or a protruding portion can be provided on the head main body, or a notch can be provided on the crimping member. Further, it is possible to adjust the pressing force by forming the gap by forming the crimping member with a plurality of blocks.
  • the present invention can be applied not only when mounting electrical components on a glass substrate for a liquid crystal display device but also when mounting electrical components on various wiring substrates.
  • the present invention can improve the mounting efficiency by reducing the number of man-hours when mounting electrical parts on a glass substrate for a liquid crystal display device.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention concerne un procédé de montage dans lequel des composants électriques de différents systèmes de montage peuvent être montés efficacement avec un adhésif. On utilise un procédé de montage d'un composant électrique sur un substrat de verre (1) grâce à l'utilisation d'une tête de soudage (7) par thermocompression incluant un corps principal (8) de tête et, disposé sur celui-ci, un élément de soudage par compression (9) d'un élastomère donné. Ce procédé comprend les étapes consistant à agencer un film adhésif conducteur anisotrope (4) sur la surface complète de la zone de montage (3) de la surface supérieure du substrat de verre (1), ensuite superposer des composants électriques de différents systèmes de montage sur la zone de montage (3) et exécuter un soudage par thermocompression des composants électriques grâce à l'utilisation de l'élément de soudage par compression (9) présentant une taille correspondant à celle du film adhésif conducteur anisotrope (4). Une puce de circuit intégré de système COG (5) et une carte de câblage imprimé souple de système FOG (6) peuvent être utilisées de manière appropriée en tant que composants électriques.
PCT/JP2006/314642 2006-02-01 2006-07-25 Procede de montage d'un composant electrique WO2007088647A1 (fr)

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KR1020087019929A KR101271939B1 (ko) 2006-02-01 2006-07-25 전기 부품의 실장 방법

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JP2006-024586 2006-02-01
JP2006024586A JP2006245554A (ja) 2005-02-02 2006-02-01 電気部品の実装方法

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WO2010095311A1 (fr) * 2009-02-17 2010-08-26 シャープ株式会社 Procédé d'assemblage par pression et appareil d'assemblage par pression
WO2011043097A1 (fr) * 2009-10-05 2011-04-14 シャープ株式会社 Structure de montage pour support, dispositif d'affichage équipé d'une telle structure et procédé de montage de ladite structure
CN102346319A (zh) * 2010-08-03 2012-02-08 株式会社日立高新技术 Fpd组件的acf粘贴装置

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Publication number Priority date Publication date Assignee Title
KR102210523B1 (ko) * 2014-07-17 2021-02-02 삼성디스플레이 주식회사 표시장치 및 이의 제조방법

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Publication number Priority date Publication date Assignee Title
JP2000068633A (ja) * 1998-08-25 2000-03-03 Seiko Epson Corp 圧着方法および圧着装置
JP2003124256A (ja) * 2001-10-12 2003-04-25 Matsushita Electric Ind Co Ltd フレキシブル基板の実装方法
JP2005032952A (ja) * 2003-07-11 2005-02-03 Sony Chem Corp 電気部品の実装方法及び実装装置

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Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000068633A (ja) * 1998-08-25 2000-03-03 Seiko Epson Corp 圧着方法および圧着装置
JP2003124256A (ja) * 2001-10-12 2003-04-25 Matsushita Electric Ind Co Ltd フレキシブル基板の実装方法
JP2005032952A (ja) * 2003-07-11 2005-02-03 Sony Chem Corp 電気部品の実装方法及び実装装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010095311A1 (fr) * 2009-02-17 2010-08-26 シャープ株式会社 Procédé d'assemblage par pression et appareil d'assemblage par pression
WO2011043097A1 (fr) * 2009-10-05 2011-04-14 シャープ株式会社 Structure de montage pour support, dispositif d'affichage équipé d'une telle structure et procédé de montage de ladite structure
CN102346319A (zh) * 2010-08-03 2012-02-08 株式会社日立高新技术 Fpd组件的acf粘贴装置

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KR20080101909A (ko) 2008-11-21
KR101271939B1 (ko) 2013-06-07
TWI420995B (zh) 2013-12-21
TW200733834A (en) 2007-09-01

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