WO2007077992A1 - Procede et appareil de nettoyage/sechage, appareil de transfert d’objet a traiter et unite de stockage - Google Patents

Procede et appareil de nettoyage/sechage, appareil de transfert d’objet a traiter et unite de stockage Download PDF

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Publication number
WO2007077992A1
WO2007077992A1 PCT/JP2007/050018 JP2007050018W WO2007077992A1 WO 2007077992 A1 WO2007077992 A1 WO 2007077992A1 JP 2007050018 W JP2007050018 W JP 2007050018W WO 2007077992 A1 WO2007077992 A1 WO 2007077992A1
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WO
WIPO (PCT)
Prior art keywords
processing
cleaning
drying
processed
transporter
Prior art date
Application number
PCT/JP2007/050018
Other languages
English (en)
Japanese (ja)
Inventor
Toshiyuki Yoshida
Takafumi Tsuchiya
Original Assignee
Tokyo Electron Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Limited filed Critical Tokyo Electron Limited
Publication of WO2007077992A1 publication Critical patent/WO2007077992A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

Definitions

  • the present invention relates to a cleaning / drying processing method, a cleaning / drying processing apparatus, and a storage medium for a processing object transporter, and more specifically, for example, a semiconductor wafer or a glass substrate for LCD.
  • the present invention relates to a cleaning / drying processing method, a cleaning / drying processing apparatus, and a storage medium for a processing object transporter installed in a cleaning processing system for performing chemical treatment, water washing processing, drying processing, etc. on a processing body.
  • a cleaning processing system that performs chemical treatment, water washing processing, drying processing, etc. on a target object, for example, an LCD glass substrate or a semiconductor wafer (hereinafter referred to as "wafer") as the target object.
  • a target object for example, an LCD glass substrate or a semiconductor wafer (hereinafter referred to as "wafer") as the target object.
  • processing liquids such as chemicals and rinsing liquids (cleaning liquids)!
  • Examples of contaminants on the wafer surface include particles, metals, organic substances, and oxide films.
  • Various types of chemicals can be used depending on the type of contaminant, and a mixture of ammonia diluted with pure water and hydrogen peroxide (NH OH / H 2 O / H 2 O)
  • the rinse liquid is mainly
  • a wafer before processing carried in from a loading unit is transported to a chemical processing unit, a water washing processing unit and a drying processing unit by a wafer transporter and processed. After that, it is known that the processed wafer is unloaded to the unloading section by a wafer transfer device (see, for example, JP-A-2002 118086).
  • the present invention has been made in view of the above circumstances, and the preceding object to be processed depends on the series of processing types of the preceding object to be processed and the series of processing types of the subsequent object to be processed.
  • Cleaning and drying processing method of the processing target transporter which can reduce the time required for cleaning and drying processing of the target transporter, and improve the throughput, and cleaning and drying processing apparatus.
  • An object of the present invention is to provide a storage medium.
  • the object to be processed before being carried in from the carry-in unit is placed in any one of the chemical treatment unit, the water washing treatment unit, and the drying treatment unit.
  • a cleaning / drying method for a target object transporter that transports and processes a processed target object processed by these units to an unloading unit, wherein a plurality of processes are performed by the target object transporter.
  • a process of sequentially transporting the previous object to be processed, and a type of a series of processes of the preceding object to be processed and a subsequent object to be processed when the object to be processed is transferred by the object carrier A step of switching the processing conditions of the cleaning and drying process for the processing object transport device between the transport of the preceding target object and the transport of the subsequent processing object, depending on the type of processing of
  • the processing condition of the cleaning and drying process omits at least one of the cleaning process and the drying process for the object transporter. It is preferable to include. At this time, the time from the completion of the transfer of the preceding object to be processed to the start of the transfer of the subsequent object to be processed is longer than the time required for the cleaning process and the drying process of the object to be processed transfer unit. Is shorter than the object transporter More preferably, at least one of the cleaning process and the drying process is omitted.
  • “omitted” means that part or all of the processing is omitted or the processing time is shortened in order to simplify the processing.
  • the target object transporter when the target object processed by the target object transporter is transported to the unloading section, the target object transporter and In addition, it is preferable to dry the processed target objects held by the target object transporter at the same time.
  • Another cleaning and drying processing method of the present invention is to transport an object to be processed before being carried in from the carry-in section to any one of the chemical solution processing unit, the water washing processing unit and the drying processing unit, A cleaning / drying method for a target object transporter that transports a processed target object processed by these units to an unloading unit, wherein the target object transporter performs a plurality of preprocessed processes.
  • a cleaning / drying process is performed on the processing object transport device according to a preset condition between the process of sequentially transporting the body and the transport of the preceding target object and the subsequent processing object.
  • a series of processing types of the preceding workpiece and the subsequent workpiece are transferred.
  • a step of switching the cleaning / drying processing conditions for the processing object transporter between the preceding processing object and the subsequent processing object from the preset conditions is characterized by.
  • the cleaning / drying processing apparatus for an object-to-be-processed transporter is a pre-process that is carried in from a carry-in unit. To be processed is transported to any one of the chemical solution processing unit, the water washing processing unit, and the drying processing unit, and the processed object processed by these units is transported to the unloading unit.
  • An apparatus for cleaning and drying a body transporter wherein a cleaning unit that performs a cleaning process on the workpiece transporter, and a drying unit that performs a drying process on the body transporter are stored in advance.
  • a control computer that controls the workpiece transporter, the cleaning unit, and the drying unit based on the sequence control program, and based on a control signal from the control computer, Depending on a series of processing types and a series of processing types of subsequent processing objects, the transport of the processing object before the preceding processing and the transporting of the processing object before the subsequent processing are performed.
  • the processing condition of the cleaning' drying process is at least V of the cleaning process and the drying process for the object transporter.
  • U which preferably includes omitting the processing of.
  • the control computer waits until the transport of the subsequent object to be started after the transport of the preceding object to be processed is completed. If it is determined that the time is shorter than the time required for the cleaning process and the drying process of the object transporter, at least the cleaning process and the drying process for the object transporter are shifted. It is preferable to omit the process.
  • the control computer includes a chemical solution used for chemical processing in a series of processes of the preceding target object, and a subsequent processing target.
  • the chemical solution used for the chemical treatment in the series of treatments of the body is of the same type, it is preferable to omit both the cleaning treatment and the drying treatment for the object transporter.
  • the control computer includes a chemical solution used for chemical processing in a series of processes of the preceding target object, and a subsequent processing target.
  • the chemical solution used for the chemical treatment in the series of treatments of the body is of a different type, it is preferable to omit only the drying treatment for the treatment object transporter. Good.
  • the object to be processed that has been processed by the transporter of the object to be processed is based on a control signal from the control computer.
  • the unprocessed object transporter is moved to the drying unit, and the unprocessed object transporter and the processed object to be processed held by the unprocessed object transporter are simultaneously dried.
  • the unprocessed object transporter and the processed object to be processed held by the unprocessed object transporter are simultaneously dried.
  • the unprocessed object transporter and the processed object to be processed held by the unprocessed object transporter are simultaneously dried.
  • Another cleaning and drying apparatus is to process an object to be processed before being carried in from a carry-in section.
  • a drying processing apparatus comprising: a cleaning unit that performs a cleaning process on the object transporter; a drying unit that performs a drying process on the target object transporter; and a sequence control program stored in advance.
  • a control computer for controlling the processing object transporter, the cleaning unit, and the drying unit, and based on a control signal from the control computer, transporting and succeeding the preceding target object
  • a cleaning / drying process is performed on the processing object transporter according to a preset condition between the transport of the object to be processed and the subsequent process before the transport of the preceding object is completed.
  • the transfer of the preceding object to be processed depends on the type of a series of processes on the preceding object to be processed and the type of processes on the subsequent object to be processed. It is characterized in that the processing condition of the cleaning and drying process for the processing object transporter during the subsequent transport of the processing object is switched to the preset condition force.
  • the storage medium of the present invention transports the object to be processed before being carried in from the carry-in section to any one of the chemical treatment unit, the water washing unit and the drying unit.
  • a storage medium storing a program for performing a cleaning / drying process on a processing object transporter that transports a processed target object processed by the unit to a carry-out unit.
  • conveyance of the preceding processing object and subsequent processing objects And a step of switching the processing conditions of the cleaning and drying process for the object transporter during the transport of the process.
  • FIG. 1 is a schematic plan view of a semiconductor wafer cleaning processing system to which a wafer transfer device cleaning / drying processing apparatus according to the present invention is applied.
  • FIG. 2 is a schematic sectional view showing a chemical tank in the cleaning system of FIG.
  • FIG. 3 is a schematic perspective view showing a wafer transfer device and its cleaning apparatus in the cleaning processing system of FIG. 1.
  • FIG. 3 is a schematic perspective view showing a wafer transfer device and its cleaning apparatus in the cleaning processing system of FIG. 1.
  • FIG. 4 is a flow chart showing an example of semiconductor wafer processing in the cleaning system of FIG. 1.
  • FIG. 5 is a flow chart showing another example of semiconductor wafer processing in the cleaning system of FIG. 1.
  • FIG. 6 is a table showing a pattern of processing conditions in a sequence control program related to cleaning and drying of a wafer transfer device in the cleaning processing system of FIG. 1.
  • the semiconductor wafer cleaning processing system accommodates a plurality of (for example, 25) semiconductor wafers W (hereinafter referred to as "wafer W") in a horizontal state as objects to be processed.
  • Waafer W semiconductor wafers W
  • Loading / unloading section 2 for loading and unloading carrier 1
  • processing section 3 for processing wafer W by liquid processing and cleaning, and drying processing
  • It is mainly composed of the interface part 4 that is located between and performs the transfer of UENO, W, position adjustment and posture conversion.
  • a conveyance path 11 is provided along the interface unit 4 and the processing unit 3, and the X, Y direction (horizontal direction), Z direction (vertical direction), and ⁇ direction (rotation direction) are provided in the conveyance path 11.
  • a wafer transfer device 10 is provided.
  • the loading and unloading unit 2 is located at the side end of the cleaning processing system, It is provided with a carrier carry-in part 5a and a carrier carry-out part 5b, and a wafer delivery part 6. Between the carrier carry-in part 5a and the wafer delivery part 6, a carrier transport robot 7 that delivers the carrier 1 is arranged.
  • the wafer delivery unit 6 opens in the interface unit 4, and a lid opening / closing device 8 is disposed in the opening.
  • the lid (not shown) of the carrier 1 is opened or closed by the lid opening / closing device 8. Therefore, the lid of the carrier 1 that stores the unprocessed wafer W transferred to the wafer delivery unit 6 is removed by the lid opening / closing device 8 so that the wafer W in the carrier 1 can be unloaded, and all the wafers W are unloaded. After that, the lid can be closed again by the lid opening / closing device 8. Also, the lid of the empty carrier 1 transported from the carrier standby unit (not shown) to the wafer delivery unit 6 is removed by the lid opening / closing device 8 so that the wafer W can be carried into the carrier 1. After all the wafers W are loaded, the lid can be closed again by the lid opening / closing device 8.
  • a mapping sensor 9 for detecting the number of wafers W stored in the carrier 1 is disposed near the opening of the wafer delivery unit 6.
  • the interface unit 4 is provided with a wafer transfer arm 20 that holds a plurality of, for example, 25 wafers W in a horizontal state and transfers the wafers W to and from the carrier 1 of the wafer transfer unit 6. Yes.
  • the interface unit 4 is provided with a pitch changer (not shown) that holds a plurality of, for example, 50 wafers W in a vertical state at a predetermined interval.
  • an attitude changing device 21 that converts the attitude of a plurality of, for example, 25 wafers W between a horizontal state and a vertical state.
  • the interface unit 4 is provided with a notch aligner (not shown) for detecting a notch (not shown) provided in the wafer W when the posture of the wafer W is converted to a vertical state.
  • the processing unit 3 includes a plurality of (three in the drawing) processing units 30a, 30b, and 30c in which the chemical tanks 3la, 31b, and 31c and the cleaning tanks 32a, 32b, and 32c are provided.
  • the drying machine 33 for drying the wafer transfer device 10 and the wafer transfer device cleaning device 34 for cleaning the wafer transfer device 10 are adjacent to each other in a square-shaped state. They are arranged in a straight line.
  • the chemical baths 31a, 31b, 31c are the parties attached to the wafer W.
  • the dryer 33 and the wafer transporter cleaning device 34 are disposed on the interface unit 4 side in the processing unit 3, but the wafer transporter cleaning device 34 is not necessarily disposed on the interface unit 4 side. It may be arranged at the end of the stagnation processing unit 3 away from the interface unit 4.
  • a conveyance path 11 is provided in a portion on the front side (lower side in FIG. 1) of each unit 30a to 30c, 33, 34 so as to pass through these units.
  • a wafer transfer device 10 is disposed that can move in the X, Y direction (horizontal direction), Z direction (vertical direction), and ⁇ direction (rotation direction).
  • Each unit 30a to 30c, 33, 34 includes a plurality of chemical tanks (not shown) for storing a chemical liquid at a position opposite to the above-described transport path 11, and a supply source of pure water as a rinsing liquid ( (Not shown), or a housing (not shown) or the like for housing piping equipment is provided.
  • Wafer boats 35 that can be moved up and down are disposed in the chemical tanks 31 &, 31b, 31c and the cleaning tanks 32a, 32b, 32c.
  • the wafer boat 35 delivers wafers W to and from the wafer transporter 10 and also transfers the wafers W received from the wafer transporter 10 in the chemical tanks 3 la, 31b, 31c or the cleaning tanks 32a, 32b, 32c. It will come in and out of the tank!
  • the chemical tank 31a contains Ueno and W, and stores a chemical liquid body 36 for storing chemical liquid, that is, dilute hydrofluoric acid (DHF), and a supply pipe for supplying the chemical liquid into the chemical liquid tank body 36. 37 and a discharge means 38 for discharging the chemical solution in the chemical solution tank main body 36.
  • the chemical tank 31a includes a chemical solution replenishing means 39 for replenishing the auxiliary chemical liquid in the chemical liquid tank body 36, and a pure water supply means 40 for supplying pure water (DIW) as a rinse liquid into the chemical liquid tank body 36. It is provided.
  • the chemical tank main body 36 accommodates the wafer W whose surface is held vertically by the wafer boat 35, and overflows from the inner tank 36a made of, for example, quartz, which stores the chemical liquid.
  • the outer tank 36b made of, for example, polytetrafluoroethylene (PTFE) that receives the chemical solution is configured.
  • PTFE polytetrafluoroethylene
  • a pair of left and right liquid chemical supply nodes are provided on the bottom side of the inner tank 36a.
  • a nozzle 36c is disposed, and the chemical solution supply nozzle 36c and the outer tub 36b are connected to each other through a supply pipe 37.
  • the supply pipe 37 is provided with a circulation pump P0, a temperature adjustment heater 41, and a filter F in that order in the outer tank 36b side force. Accordingly, the chemical liquid stored in the chemical liquid tank body 36 is circulated and supplied by the supply pipe 37 and the chemical liquid supply nozzle 36c, and is maintained at a predetermined temperature (for example, 23 ° C.
  • the discharge means 38 includes a discharge pipe 38a connected to a discharge hole (not shown) provided in the bottom of the inner tank 36a, and an opening / closing valve VI provided in the discharge pipe 38a. Yes.
  • the chemical solution replenishing means 39 includes a hydrofluoric acid storage tank 39a for storing hydrofluoric acid (DHF) (hereinafter referred to as "DHF tank 39a"! And the DHF in the DHF tank 39a in the inner tank 36a.
  • DHF tank 39a hydrofluoric acid
  • a DHF supply pipe 39b to be supplied and a DHF supply pipe 39c branched from the DHF supply pipe 39b to replenish DHF into the outer tank 36b are provided.
  • an on-off valve V2 is interposed in the DHF supply pipe 39b.
  • the DHF replenishment pipe 39c is provided with an open / close valve V3 and a DHF supply pump P1.
  • the pure water supply means 40 is connected to a pure water supply source 40a to supply pure water (DIW) into the inner tank 36a, and a pure water supply pipe 40b branched from the pure water supply pipe 40b to And a pure water replenishment pipe 40c for replenishing water (DIW) into the outer tank 36b.
  • a pure water supply pipe 40b branched from the pure water supply pipe 40b to And a pure water replenishment pipe 40c for replenishing water (DIW) into the outer tank 36b.
  • an open / close valve V4 is interposed in the pure water supply pipe 40b.
  • the pure water replenishment pipe 40c is provided with an on-off valve V5.
  • the on-off valves V2, V3 and the DHF supply pump P1 constituting the chemical liquid replenishing means 39 are connected to the control computer 50 via signal lines, respectively. It is controlled based on the sequence control program stored in the control computer 50 in advance!
  • the wafer carrier 10 includes a lower holding member 12 that holds the lower portion of the wafer W and a pair of side holding portions that hold the sides of the wafer W on both sides of the lower holding member 12.
  • the members 13 and 14 are provided.
  • a plurality of, for example, 50 holding grooves 12a, 13a, 14a are arranged in each holding member 12, 13, 14.
  • a disk-shaped scattering prevention plate 15 is mounted on the base side of each holding member 12, 13, 14 so as to be orthogonal to the longitudinal direction. This scattering prevention plate 15 prevents the pure water (DIW), which is a cleaning liquid, from scattering and adhering to the drive unit side of the wafer transfer device 10 when the wafer transfer device 10 is cleaned!
  • DIW pure water
  • each holding member 12, 13, and 14 is a member having excellent corrosion resistance and chemical resistance. Specifically, for example, a resin such as polyetheretherketone (PEEK) or polychloroethylene (PCTFE). Formed from!
  • PEEK polyetheretherketone
  • PCTFE polychloroethylene
  • the wafer transfer device 10 configured as described above is connected to the control computer 50 via a signal line, and is configured to be controllable based on a sequence control program stored in the control computer 50 in advance. . That is, based on the control signal from the control computer 50, the wafer transporter 10 receives the wafer W for one lot before processing (that is, for example, 50 batches of wafers W) also received by the pitch changer. Transport to chemical tanks 31a, 31b, 31c, washing tanks 32a, 32b, 32c and dryer 33 of predetermined processing units 30a, 30b, 30c of processing unit 3, and process appropriately in processing unit 3 One lot of processed Ueno, W that has been subjected to is delivered to the pitch changer.
  • the wafer transfer device cleaning device 34 includes a cleaning liquid such as pure water and a nitrogen (N) gas.
  • 2 A gas such as soot is jetted to the holding grooves 12a, 13a, 14a of the holding members 12, 13, 14 by force.
  • 2 Fluid supply nozzle 34a and pure water (DIW) as a cleaning liquid are held by the holding members 12, 13, And a cleaning liquid supply nozzle 34b that injects the nozzle 14 toward the outer peripheral surface.
  • this wafer transporter cleaning device 34 uses a dry gas such as N gas to hold the holding grooves 12a,
  • the gas used is N gas.
  • the two-fluid supply nozzle 34a, the cleaning liquid supply nozzle 34b, the secondary drying gas supply nozzle 34c, and the secondary drying gas supply nozzle 34d are arranged in the nozzle box 34e.
  • a cover having an opening at the lower end is extended, and this cover scatters cleaning liquid, etc. to the side periphery when the wafer transfer device is cleaned or dried. Is suppressed.
  • This nozzle box 34e is connected to the movable part 34g of the air cylinder 34f and is configured to move back and forth in the horizontal direction (+ Y, —Y direction) along the longitudinal direction of the holding members 12, 13, and 14. Being sung.
  • the wafer transfer device cleaning device 34 is connected to the control computer 50 via a signal line, and is configured to be controllable based on a sequence control program stored in the control computer 50 in advance. !
  • the control computer 50 includes a control means 50a (hereinafter referred to as “CPU50a”) that also has a central processing unit (CPU) power, an input / output unit 50b connected to the CPU50a, and a sequence. It includes a display unit 50c that displays an input screen for creating a control program, and a storage medium 50d that is inserted in the input / output unit 50b and stores a sequence control program.
  • CPU50a central processing unit
  • the storage medium 50d is provided in a fixed manner in the control computer 50, or is detachably inserted in a reading device provided in the control computer 50 and can be read by this reading device. Also good.
  • the storage medium 50d is a hard disk drive in which a sequence control program is installed by a serviceman of the manufacturer of the substrate processing apparatus.
  • the storage medium 50d is a read-only removable disk such as a CD-ROM or DVD-ROM in which a sequence control program is written, and such a removable disk is controlled. It is read by an optical reader provided in the computer 50.
  • the storage medium 50d may be of any form of RAM (random access memory) or ROM (read only memory), and the storage medium 50d may be of a cassette type ROM. . In short, any storage medium known in the technical field of computers can be used as the storage medium 50d.
  • the control computer 50 configured as described above, the chemical baths 31a, 3 lb, 31c and the washing baths 32a, 32b of the wafer transfer unit 10 and the processing units 30a, 30b, 30c are performed. 32c, the wafer transfer device cleaning device 34, the dryer 33, and the like are controlled so that various process conditions defined by a predetermined sequence control program are realized.
  • the storage medium 50d of the control computer 50 has a storage medium 50d as shown in FIG.
  • the processing conditions of the cleaning / drying process for the wafer transporter 10 specifically include, for example, at least the cleaning process and / or the drying process! It means the condition.
  • “omitted” means omitting part or all of the processing in order to simplify the processing and shortening the processing time.
  • the wafer transfer device 10 transports the preceding (starting) wafer W to the chemical tank 31a to perform SPM processing (step 4 1), and into the chemical tank 3 la.
  • the wafer W is washed in the water washing tank 32a (step 4-2). Thereafter, the wafer transfer device 10 is moved to the wafer transfer device cleaning device 34, and the wafer transfer device 10 is cleaned (step 4-3). After that, the wafer transfer device 10 transfers the succeeding (later) wafer W to another chemical bath 31b for SC1 treatment (Steps 4-4), and this wafer is washed in the washing bath 32b attached to the chemical bath 3 lb. Wash W with water (steps 4-5). The preceding (starting) wafer W that has been washed with water is transferred to the dryer 33 by the wafer transfer device 10 and dried together with the wafer transfer device 10 (step 4-6). Carried out to Part 2.
  • the wafer transfer unit 10 is once cleaned by the wafer transfer unit cleaning device 34 and then dried by the dryer 33 after the chemical treatment and water washing process of the preceding wafer W.
  • the subsequent wafer W is treated with a chemical solution in a chemical tank of another processing unit, and compared with the case where the preceding wafer W is transferred, the drying process for the wafer transfer device 10 itself after the transfer of the preceding wafer W is omitted. be able to.
  • the time for the cleaning process for the wafer W may be variously changed!
  • the wafer transfer device 10 transfers the preceding (starting) wafer W to the chemical bath 31b to perform the SC1 process (step 5-1), and is attached to the chemical bath 31b. Wash the Ueno and W in the washing tank 32b (Step 5-2).
  • the wafer transfer device 10 transfers the subsequent (later) wafer W to the chemical bath 31b and performs SC1 treatment (Step 5-3), and the wafer W is washed in the water washing bath 32b attached to the chemical bath 31b. (Step 5-4).
  • the preceding (starting) wafer W that has been washed with water is transferred to the dryer 33 by the wafer transfer device 10 and dried together with the wafer transfer device 10 (step 5-5), and then loaded and unloaded. Carried out to Part 2.
  • the wafer transfer device 10 is once cleaned by the wafer transfer device cleaning device 34 and then dried by the dryer 33 after the chemical treatment and water washing treatment of the preceding wafer W.
  • the cleaning / drying process for the wafer transfer device 10 itself after the transfer of the preceding wafer W can be omitted.
  • wafer transfer Wafer and W can be transferred by the wafer transfer device 10 by changing the processing conditions of the cleaning and drying process for the device 10.
  • the time from the completion of the transfer of the preceding (first) wafer W to the start of the transfer of the subsequent (later) wafer W is longer than the time required for the cleaning process and the drying process for the wafer transfer unit 10. If it is short, at least one of the cleaning process and the drying process for the wafer transfer device 10 may be omitted. In this case, in order to further improve the quality of the wafer W, the cleaning process for the wafer transfer device 10 may be omitted and the cleaning process time may be shortened instead.
  • the cleaning / drying process is normally performed on the wafer transfer device 10 under normal conditions set in advance between the transfer of the preceding wafer W and the transfer of the subsequent wafer W.
  • a series of processing of the preceding wafer W is possible.
  • the processing conditions of the cleaning / drying process for the wafer transporter 10 between the transfer of the preceding wafer W and the transfer of the subsequent wafer W are determined in advance according to the type of the wafer and the series of processing of the subsequent wafer W. It is possible to switch from the normal conditions that have been set.

Abstract

La présente invention concerne un procédé de nettoyage/séchage d’un appareil (10) qui transfert un objet à traiter. Dans ce procédé, l’objet (W) à traiter, qui est apporté depuis un secteur d’arrivée avant d’être traité, est transféré à l’un de ces centres de traitement : un centre de traitement chimique, un centre de lavage à l’eau de l’objet et/ou un centre de séchage, suite à quoi l’objet traité (W) par ces centres est transporté vers un secteur d’évacuation. Plus spécifiquement, une pluralité d’objets (W) sont successivement transférés par l’appareil (10) avant d’être traités. A ce moment-là, les conditions de traitement concernant le nettoyage/séchage de l’appareil (10) entre le transfert de l’objet précédent (W) et le transfert de l’objet suivant (W) sont commutés, selon le type de séries de traitements de l’objet précédent (W) et le type de séries de traitements de l’objet suivant (W).
PCT/JP2007/050018 2006-01-06 2007-01-05 Procede et appareil de nettoyage/sechage, appareil de transfert d’objet a traiter et unite de stockage WO2007077992A1 (fr)

Applications Claiming Priority (2)

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JP2006001186A JP2009087958A (ja) 2006-01-06 2006-01-06 洗浄・乾燥処理方法及びその装置並びにそのプログラム
JP2006-001186 2006-01-06

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WO2007077992A1 true WO2007077992A1 (fr) 2007-07-12

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