WO2007049530A1 - Ensemble porte-matrice, ensemble porte-objet de fabrication, dispositif de microfabrication et procede de montage de matrice - Google Patents

Ensemble porte-matrice, ensemble porte-objet de fabrication, dispositif de microfabrication et procede de montage de matrice Download PDF

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Publication number
WO2007049530A1
WO2007049530A1 PCT/JP2006/321009 JP2006321009W WO2007049530A1 WO 2007049530 A1 WO2007049530 A1 WO 2007049530A1 JP 2006321009 W JP2006321009 W JP 2006321009W WO 2007049530 A1 WO2007049530 A1 WO 2007049530A1
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WO
WIPO (PCT)
Prior art keywords
mold
workpiece
elastic member
holding
pattern
Prior art date
Application number
PCT/JP2006/321009
Other languages
English (en)
Japanese (ja)
Inventor
Takahisa Kusuura
Hitoshi Tambo
Original Assignee
Scivax Corporation
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Filing date
Publication date
Application filed by Scivax Corporation filed Critical Scivax Corporation
Priority to JP2007542551A priority Critical patent/JPWO2007049530A1/ja
Publication of WO2007049530A1 publication Critical patent/WO2007049530A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B29C2043/023—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves
    • B29C2043/025—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves forming a microstructure, i.e. fine patterning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing

Definitions

  • the present invention relates to a mold holder, a workpiece holder, a microfabrication apparatus, and a mold attachment method that can transfer a pattern of a mold uniformly and at high speed.
  • LSI Large Scale Integrated Circuit
  • photolithography a technique called “photolithography” is generally used.
  • the size of the pattern to be formed is reduced, the size of the apparatus is increased, and the cost is increased.
  • a resin melted by heating is poured into a mold heated to a temperature lower than the glass transition temperature of the resin at high speed and high pressure, and solidified while controlling the pressure.
  • Injection molding is also used.
  • the supplied resin is solidified while taking heat away from the mold, so that it is not possible to form a fine shape in which the resin does not easily penetrate into the fine pattern of the mold. It was difficult. It is also conceivable to heat the mold and wait for the resin to enter the fine pattern, and then cool and mold the mold.
  • injection molding it is necessary to pour resin into the mold at a high pressure, so a large mold that can withstand high pressure is required, and the heat capacity of the mold increases. There was a problem that it took S.
  • a mold in which the formed pattern and pattern are formed on the surface is prepared, and a mold heated to a temperature higher than the glass transition temperature is pressed against a resin held at a temperature lower than the glass transition temperature. Then, the resin surface melts and flows, and the pattern of the mold is transferred to the resin. Next, the mold is cooled to solidify the resin, and the mold is released. Thereby, a pattern is formed in the resin.
  • This method does not require an expensive electron beam light source or optical system, and does not require a heater and a pre-heater.
  • a simple structure based on a device can be used.
  • the resin can be penetrated into the fine pattern of the mold without the problem that the resin is deprived of heat and solidified.
  • the temperature can be raised and lowered at high speed, and there is no throughput problem.
  • microchips and microchips such as optical devices such as diffraction gratings, photonic crystals, and waveguides, and fluid devices such as macrochannels and reactors are used. A situation where devices can also be manufactured is being realized.
  • an elastic member such as silicon rubber is disposed between a press body made of a rigid body and a mold, and the mold is formed so as to follow the fine waviness and unevenness of the substrate. Yes (for example, see Patent Document 2).
  • Patent Document 1 US Pat. No. 5772905 (4th paragraph, lines 46-47)
  • Patent Document 2 JP-A-8-6027 (Page 3, Figure 1)
  • the thickness of the elastic member is such that the swell size of the mold or the substrate (processing object), the Young's modulus of the elastic member, the mold and the substrate (processing object). It was not formed in consideration of the level of pressure during pressurization, and was still insufficient to accurately transfer the pattern of the mold to the substrate.
  • the elastic member is thicker than necessary or the elastic member is made of a material having low thermal conductivity such as silicon rubber, the heating means or cooling means provided on the press substrate side may be used.
  • the speed of raising and lowering the mold is very slow, which hinders throughput.
  • the present invention provides a mold holder, a workpiece holder, a microfabrication apparatus, and a mold attachment method capable of uniformly and rapidly transferring a pattern of a mold or a substrate (object to be processed). Objective.
  • a mold holder presses a mold having a predetermined pattern and a workpiece to transfer the pattern of the mold onto the workpiece.
  • the mold holder is configured to hold the mold, and is disposed between the mold holding base made of a rigid body and the mold holding base and the mold, and the thickness satisfies the following formula (1): And an elastic member.
  • ⁇ The size of the swell of at least one of the mold and the workpiece a: “Difference between maximum pressure and minimum pressure” with respect to the “average pressure” in the contact surface between the mold and the workpiece Ratio
  • the thickness t of the elastic member is preferably formed so as to satisfy the following formula (2).
  • the elastic member has a thermal conductivity of 0.17 (W / m′K) or more.
  • another mold holder of the present invention is a micromachining apparatus that presses a mold having a predetermined pattern and a workpiece to transfer the pattern of the mold to the workpiece.
  • a mold holding base made of a rigid body, disposed between the mold holding base and the mold, and having a thermal conductivity of 0.17 (W / m'K) or more.
  • the elastic member is made of a rubber-based adhesive. More preferably, the rubber-based adhesive is a processing temperature at which the mold and the workpiece are pressed. It is better to lose adhesion at higher temperatures.
  • the elastic member may be formed to have a magnetic force. In this case, the mold holding base can be formed to include a magnet.
  • the elastic member may have a groove for vacuum-sucking the mold.
  • the micromachining apparatus of the present invention is a micromachining apparatus that presses a mold having a predetermined pattern and a workpiece to transfer the pattern of the mold to the workpiece, and is a mold made of a rigid body.
  • a mold holding unit that holds the mold and includes a holding base and an elastic member that is disposed between the mold holding base and the mold and has a thickness that satisfies the following formula (3): It is characterized by having a tool.
  • ⁇ The size of the swell of at least one of the mold and the workpiece a: “Difference between maximum pressure and minimum pressure” with respect to the “average pressure” in the contact surface between the mold and the workpiece Ratio
  • the thickness t of the elastic member is preferably formed so as to satisfy the following formula (4).
  • the elastic member has a thermal conductivity of 0.17 (W / m′K) or more.
  • another micromachining apparatus of the present invention is a micromachining apparatus that presses a mold having a predetermined pattern and a workpiece to transfer the pattern of the mold to the workpiece.
  • a mold holding base made of a rigid body, and an elastic member disposed between the mold holding base and the mold and having a thermal conductivity of 0.17 (WZm'K) or more. It is characterized by comprising a mold holder for holding the mold.
  • the processing object holder according to the present invention is the above-described processing target in a micromachining apparatus that presses a mold having a predetermined pattern and the processing object to transfer the pattern of the mold to the processing object.
  • a workpiece holding tool for holding a workpiece, which is disposed between a workpiece holding substrate made of a rigid body, the workpiece holding substrate and the workpiece, and a thickness t is expressed by the following formula: (5) an elastic member formed so as to satisfy
  • the thickness t of the elastic member is preferably formed so as to satisfy the following formula (6).
  • the elastic member has a thermal conductivity of 0.17 (W / m′K) or more.
  • another processing object holder is a micro-processing apparatus that presses a mold having a predetermined pattern and a processing object to transfer the pattern of the mold to the processing object.
  • the elastic member is made of a rubber-based adhesive. More preferably, the rubber-based adhesive is a processing temperature at which the mold and the workpiece are pressed. It is better to lose adhesion at higher temperatures.
  • the elastic member may be provided with a groove for vacuum-sucking the workpiece.
  • the micromachining apparatus of the present invention is a micromachining apparatus that presses a mold having a predetermined pattern and a workpiece to transfer the pattern of the mold to the workpiece, and is a machining made of a rigid body.
  • a workpiece holding tool for holding the workpiece is provided.
  • the thickness t of the elastic member is preferably formed so as to satisfy the following formula (8).
  • the elastic member has a thermal conductivity of 0.17 (W / m′K) or more.
  • another micromachining apparatus of the present invention is a micromachining apparatus that presses a mold having a predetermined pattern and a workpiece to transfer the pattern of the mold to the workpiece.
  • a workpiece holding base made of a rigid body and an elastic member having a thermal conductivity of 0.17 (W / m'K) or more and disposed between the workpiece holding base and the workpiece.
  • a workpiece holding tool for holding the workpiece.
  • the mold attachment method of the present invention is a method for holding a mold in a micromachining apparatus that presses a mold having a predetermined pattern and a workpiece to transfer the pattern of the mold to the workpiece.
  • the rubber-based adhesive loses adhesiveness at a temperature higher than the processing temperature when pressing the mold and the workpiece.
  • the thickness of the elastic member is set to be equal to that of the mold and the workpiece. Is formed as thin as possible with a thickness that can make the pressure between them uniform, so that the mold or workpiece can be heated quickly and throughput can be improved.
  • the elastic member is formed of a rubber-based adhesive
  • the mold holder and the mold can be reliably held without a gap. Can be heated quickly to improve the throughput. Moreover, the mold can be easily attached to the mold holder.
  • the mold having a ferromagnetic force can be easily attached by applying a magnetic force to the mold holder.
  • the rubber adhesive loses adhesiveness at a temperature higher than the processing temperature when pressing the mold and the object to be processed.
  • the mold and the elastic member can be easily removed by heating.
  • FIG. 1 is a front view showing a microfabrication apparatus of the present invention.
  • FIG. 2 is a perspective view showing a mold holder of the present invention.
  • FIG. 3 is a front view for explaining the thickness of the elastic member according to the present invention.
  • FIG. 4 is a plan view showing another mold holder of the present invention.
  • FIG. 5 is a cross-sectional view of the mold holder as seen from the direction of the arrow 1_1 in FIG.
  • FIG. 6 is a plan view showing a processing object holder of the present invention.
  • FIG. 7 is a photograph of the thin film of Example 1.
  • FIG. 8 is a photograph of the thin film of Comparative Example 1.
  • FIG. 9 is a photograph of the thin film of Comparative Example 2.
  • the microfabrication apparatus 1 of the present invention presses a mold 100 having a predetermined pattern and a workpiece 200 to transfer the pattern of the mold 100 to the cache object 200.
  • the relative position of the mold 100 with respect to the workpiece 200 and the position of the mold holder 2 for holding the mold 100, the workpiece holder 12 for holding the workpiece 200, and the position thereof Displacement means 5 capable of adjusting the displacement speed to change the position, position detection means 7 for detecting the relative position of the mold 100 with respect to the workpiece 200, and the pressure between the mold 100 and the workpiece 200 are detected.
  • the pressure detecting means 8, the mold heating means 3 for heating the mold 100, the mold cooling means 4 for cooling the mold 100, the mold temperature detecting means 31 for detecting the temperature of the mold 100, and the workpiece 200 are heated.
  • Heating object heating means 13, Heating object cooling means 14 for cooling the heating object 200, and processing Based on the detection information of the processing object temperature detection means 131 for detecting the temperature of the object 200, the position detection means 7, the pressure detection means 8, the mold temperature detection means 31 and the processing object temperature detection means 131, the displacement means 5, a mold heating means 3, a mold cooling means 4, a heating object heating means 13 and a control means 300 for controlling the operation of the workpiece cooling means 14.
  • the mold holder 2 includes a mold holding base 21 made of a rigid body, and the mold holding base 2 1 and an elastic member 22 disposed between the mold 100 and the mold 100.
  • the mold holding base 21 is formed of a material having high rigidity, for example, a metal such as Nikkenore or stainless steel. Further, the mold holding base 21 is formed with a flat surface on the side holding the mold 100. It is preferable that the flatness of this surface is formed as high as possible, for example, 1 zm or less, preferably lOOnm or less, more preferably 10 nm or less, and even more preferably lnm or less. Note that the mold holding base 21 can of course be formed in a curved surface or a roll shape on the side on which the mold 100 is held.
  • the elastic member 22 is a flat sheet disposed between the mold holding base 21 and the mold 100, and when the mold 100 and the workpiece 200 are pressed, the mold 100 and the workpiece It is intended to absorb the fine swells and irregularities of the object 200. Therefore, the elastic member 22 needs to be formed with a thickness that absorbs fine waviness and unevenness of the mold 100 or the workpiece 200 and realizes a uniform stress distribution.
  • the Young's modulus of the elastic member 22 is E
  • the thickness of the elastic member 22 is t
  • the workpiece 200 is
  • the swell size (flatness) is ⁇
  • the average pressure between the mold 100 and the workpiece 200 is ⁇
  • the maximum deformation amount in the pressing direction of the elastic member 22 is At and the pressure at that time is ⁇ (Fig.
  • the equation (12) is transformed to the thickness t of the elastic member 22 and deformed.
  • the size (flatness) of the waviness of the workpiece 200 is
  • the swell size (flatness) of the mold 100 is larger than the swell size (flatness) of the workpiece 200. Degree) is good even if ⁇ .
  • a value obtained by combining the swell size (flatness) of the workpiece 200 and the swell size (flatness) of the mold 100 may be set as I.
  • the pressure ( ⁇ ) at which the material adheres and cannot be peeled is the upper limit of the pressure, and the processing temperature max
  • the storage modulus of the molding material obtained from rheological data analysis in other words, the minimum pressure ( ⁇ ) at which the pattern can be transferred to the molding material is set to the lower limit of pressure and mm.
  • ⁇ actually used depends on the accuracy desired, but is preferably 100 or less, preferably 20 or less, more preferably 10 or less, and even more preferably 5 or less. 1 or less is good tool more preferably 1 X 10_ 2 or less good tool more preferably 1 X 10_ 3 or less is good.
  • the lower limit a range that can be industrially management, preferably in IX 10_ 6 or more.
  • the mold 100 has the elastic member 22 (the mold holder 2) attached thereto by the mold heating means 3 or the mold cooling means 4. Therefore, if the thickness of the elastic member 22 is too large, the temperature raising / lowering rate (throughput) decreases. Therefore, the thickness t of the elastic member 22 is at least the following formula (15).
  • the thermal conductivity of the elastic member 22 is formed to be 0.17 (W / mK) or more, preferably 0.2 (W / m * K) or more, more preferably 0.3 (W / mK). / m'K) or better, more preferably l (W / m'K) or better, more preferably 2 (W / mK) or better, more preferably 4 (W / m ⁇ K) or better.
  • the heat resistance temperature of the elastic member 22 must be at least the glass transition temperature (Tg) or higher, preferably the glass transition temperature. + 20 ° C (Tg + 20 ° C) or better, more preferably glass transition temperature + 40 ° C (Tg + 40 ° C) or better, more preferably glass transition temperature It should be formed at + 60 ° C (Tg + 60 ° C) or higher.
  • the heat resistance temperature of the elastic member 22 is set to 138 ° C or higher.
  • it is formed at 158 ° C or higher, more preferably 178 ° C or higher, and more preferably 198 ° C or higher.
  • elastic members 22 having such thermal conductivity and heat-resistant temperature.
  • fluorinated rubber perfluoroelastomer
  • nitrile rubber urethane rubber
  • chloroprene rubber butinole rubber
  • styrene rubber natural rubber
  • ethylene propylene rubber foaming resin such as acrylic foam, etc.
  • boron nitride (BN) silicon nitride (Si N), nitride
  • the elastic member 22 may use a rubber-based adhesive so that the mold 100 can be securely held on the mold holding base 21.
  • a rubber adhesive may be applied to at least one of the mold holding base 21 and the mold 100, and the mold holding base 21 and the mold 100 may be bonded together. Accordingly, the mold holding base 21 and the mold 100 can be reliably held without a gap, so that the heat transfer rate from the mold heating means 3 to the mold 100 can be improved. This effect becomes more remarkable in the imprint process under a vacuum atmosphere. Further, it is preferable that this rubber-based adhesive loses its adhesiveness at a temperature higher than the processing temperature when pressing the mold 100 and the workpiece 200.
  • the mold 100 and the elastic member 22 can be easily removed from the mold holding base 21 by heating the elastic member 22 to a temperature at which the adhesiveness is lost (hereinafter referred to as the peeling temperature).
  • a rubber-based adhesive an acrylic adhesive that is a thermoplastic resin, such as siloquinone AP (manufactured by Gyltech Co., Ltd.), siloxane TP (manufactured by Gieltech Co., Ltd.), or the like can be used.
  • siloquinone AP manufactured by Gyltech Co., Ltd.
  • siloxane TP manufactured by Gieltech Co., Ltd.
  • the present invention is not limited to these.
  • the mold holder 2 may be formed so as to include a vacuum chuck capable of adsorbing the mold 100 so that the mold 100 can be easily removed.
  • the elastic member 22 is formed with a vacuum suction groove 23 and a suction port 25 connected to a suction path 24 formed in the mold holding base 21.
  • the suction path 24 of the mold holding base 21 is connected to gas suction means 26 such as a vacuum pump.
  • the groove 23 is formed outside the surface on which the pattern of the mold is formed (pattern surface 100a), and is sized to adsorb the portion outside the area occupied by the pattern formed on the mold. .
  • the elastic member 22 also functions as a seal.
  • the mold 100 can be reliably adsorbed and held.
  • the mold holder 2 can also be formed so as to have a magnetic force capable of attracting and holding a mold (mold 100) made of a ferromagnetic material.
  • a magnet material having a Curie point equal to or higher than the processing temperature in the imprint process.
  • the magnet may be formed as a permanent magnet or an electromagnet, and all or part of the elastic member 22 or the mold holding base 22 may be formed as a magnet.
  • the mold 100 is made of, for example, "metal such as nickel”, “ceramics”, “carbon material such as glassy carbon”, “silicon”, or the like, and has a predetermined surface on one end surface (pattern surface 100a). Pattern is formed. This pattern can be formed by applying precision mechanical processing to the pattern surface 100a. In addition, after a predetermined pattern is formed on a silicon substrate or the like, which is the master of the mold 100, by a semiconductor micromachining technique such as etching, an electric fabrication (elect mouth forming) method such as a nickel plating method is performed on the surface of the silicon substrate. Thus, the metal plating can be applied, and the metal plating layer can be peeled off to form a pattern.
  • the material and manufacturing method of the mold 100 are not particularly limited as long as a fine pattern can be formed.
  • the width of this pattern depends on the type of workpiece 200 used, but is 100 ⁇ or less, 10 ⁇ or less, 2 / im or less, 1 / im or less It is formed in various sizes such as lOOnm or less, 10nm or less.
  • the depth of this pattern (vertical dimension of the workpiece 200) is 10 nm or more, 100 ⁇ m or more, 200 nm or more, 500 or more, ⁇ ⁇ ⁇ or more, ⁇ ⁇ ⁇ or more, ⁇ ⁇ ⁇ or more, etc. Formed in various sizes.
  • there are various aspect ratios of this pattern such as 0.2 or more, 0.5 or more, 1 or more, 2 or more.
  • the mold 100 when the mold 100 is pressed against the workpiece 100, the mold 100 has a thickness that can deform the undulations and irregularities of the mold 100 or the workpiece 200 toward the elastic member 22 side, for example, 0.001 to 2 mm. It is formed.
  • the mold 100 since the mold 100 is heated and cooled during the imprint process, it is preferable to make the mold 100 as thin as possible and reduce its heat capacity.
  • the mold heating means 3 is provided on the side facing the mold 100 with respect to the mold holder 2, and for example, a carbon heater having very good responsiveness is used.
  • a single-bon heater (die heating means 3) is controlled by a control means 300 from a power source (not shown). Supply is controlled and mold 100 can be maintained at a predetermined constant temperature.
  • a heat transfer heater, ceramic heater, halogen heater, or IH heater can be used as the heater.
  • the mold cooling means 4 is provided on the side facing the mold 100 with respect to the mold holder 2, and is formed of a metal having high thermal conductivity such as aluminum or copper, for example.
  • a cooling flow path capable of cooling the mold 100 can be used by flowing a cooling liquid such as water or oil, or a cooling gas such as air or inert gas inside the container.
  • the mold holder 2 is provided with a mold temperature detecting means 31 for detecting the temperature of the mold 100, for example, a thermocouple.
  • the mold temperature detecting means 31 is electrically connected to the control means 300 and is formed so as to transmit the detected information on the temperature of the mold 100 to the control means 300.
  • the workpiece holder 12 includes a rigid workpiece holding base 121 and an elastic member disposed between the workpiece holding base 121 and the workpiece 200. It is composed of member 122.
  • the workpiece holding base 121 is made of a highly rigid material, for example, a metal such as nickel or stainless steel. Further, the workpiece holding base 121 has a flat surface on the side holding the workpiece 200. It is preferable that the flatness of this surface is formed as high as possible, for example, 1 ⁇ or less, preferably lOOnm or less, more preferably 10 nm or less, and even more preferably lnm or less. Of course, the workpiece holding base 121 can be formed in a roll shape. Of course, the workpiece holding base 121 can be formed in a curved surface or a roll shape on the side on which the workpiece 200 is held.
  • the elastic member 122 is a flat sheet disposed between the workpiece holding base 121 and the workpiece 200, and when the die 100 and the workpiece 200 are pressed, Absorbs the fine swells and irregularities of 100 and 200 Caloe objects. Therefore, the elastic member 122 needs to be formed with a thickness that absorbs fine waviness and unevenness of the mold 100 or the workpiece 200 and realizes a uniform stress distribution.
  • the Young's modulus of the elastic member 122 is E
  • the thickness of the elastic member 122 is t
  • the workpiece 200 And the average pressure between the mold 100 and the workpiece 200 is ⁇
  • the ratio of ⁇ ⁇ to the average pressure ⁇ is less than or equal to the predetermined value / 3 (/ 3 is the mold 100 and the Caloe object 200
  • the equation (20) is transformed to the thickness t of the elastic member 122 and deformed.
  • the thickness t of the elastic member 122 is formed so as to satisfy at least Formula (21).
  • the swell size of the mold 100 is larger than the force S with the swell size (flatness) of the workpiece 200 as I; the force S and the swell size (flatness) of the workpiece 200 (flatness).
  • the swell size (flatness) of the mold 100 may be ⁇ .
  • a value obtained by combining the swell size (flatness) of the workpiece 200 and the swell size (flatness) of the mold 100 may be used.
  • the pressure ( ⁇ ) at which the material adheres and cannot be peeled is the upper limit of the pressure, and the processing temperature max
  • the storage modulus of the molding material obtained from rheological data analysis in other words, the minimum pressure ( ⁇ ) at which the pattern can be transferred to the molding material is set to the lower limit of pressure and mm.
  • ⁇ actually used depends on the desired accuracy, but is preferably 100 or less, preferably 20 or less, more preferably 10 or less, even more preferably 5 or less, and even more preferably 1 the following is a good tool and more preferably 1 X 10_ 2 or less good tool more preferably 1 X 10_ 3 or less is good.
  • the lower limit a range that can be industrially management, preferably in IX 10_ 6 or more.
  • the workpiece 200 is heated and cooled by the workpiece heating means 13 or the workpiece cooling means 14 via the elastic member 122 (workpiece holder 12). If the thickness of 122 is too large, the heating / cooling speed (throughput) will decrease. Therefore, it is preferable that the thickness t of the elastic member 122 be formed to a size satisfying at least the following formula (21).
  • the thermal conductivity of the elastic member 122 is 0.17 (W / m- K) or better, preferably 0.2 (W / m * K) or better, more preferably 0.3 (W / m'K) or better, more preferably l ( W / m'K) or better, more preferably 2 (W / m ⁇ K) or better, more preferably 4 (W / m ⁇ K) or better.
  • the elastic member 122 is disposed between the workpiece heating means 13 and the workpiece 200 to be heated, it is necessary to have heat resistance at least equal to or higher than the processing temperature in the imprint process.
  • the heat resistance temperature of the elastic member 122 needs to be at least equal to or higher than the glass transition temperature (Tg), preferably the glass transition temperature. + 20 ° C (Tg + 20 ° C) or better, more preferably glass transition temperature + 40 ° C (Tg + 40 ° C) or better, more preferably glass transition It should be formed at a temperature higher than + 60 ° C (Tg + 60 ° C).
  • the heat resistance temperature of the elastic member 122 is 138 ° C or higher.
  • it is formed at 158 ° C or higher, more preferably 178 ° C or higher, and more preferably 198 ° C or higher.
  • elastic members 122 having such thermal conductivity and heat-resistant temperature, and force that can be freely selected, for example, fluorine-based rubber (perfluoroelastomer), nitrile rubber, urethane, etc. Rubber, chloroprene rubber, butyl rubber, styrene rubber, natural rubber, ethylene propylene rubber, foaming resins such as acrylic foam, and the like can be used.
  • fluorine-based rubber perfluoroelastomer
  • Rubber chloroprene rubber, butyl rubber, styrene rubber, natural rubber, ethylene propylene rubber, foaming resins such as acrylic foam, and the like
  • foaming resins such as acrylic foam, and the like
  • the elastic member 122 may use a rubber adhesive so as to be securely held by the workpiece holding base 121.
  • the workpiece holding base 121 and the elastic member 122 can be formed without gaps, so that the heat transfer rate from the workpiece heating means 13 to the workpiece 200 can be improved. This effect becomes more remarkable in the imprint process under a vacuum atmosphere.
  • this rubber-based adhesive It is preferable that the adhesive loses its adhesiveness at a temperature higher than the processing temperature when pressing the object 200. This is because the elastic member 122 can be easily detached from the workpiece holding base 121 by heating the elastic member 122 to a temperature at which the adhesiveness is lost (hereinafter referred to as a peeling temperature).
  • an acrylic adhesive which is a thermoplastic resin such as siloquinone AP (manufactured by Gyltech Co., Ltd.) or siloquinone TP (manufactured by Gyltech Co., Ltd.) can be used.
  • siloquinone AP manufactured by Gyltech Co., Ltd.
  • siloquinone TP manufactured by Gyltech Co., Ltd.
  • Various objects can be used as the processing object 200.
  • resins such as polycarbonate and polyimide
  • metals such as aluminum, glass, quartz glass, silicon, gallium arsenide, sapphire, and magnesium oxide
  • a material in which the molding material is in the shape of a substrate as it is can be used.
  • the surface of the substrate body made of silicon, glass, etc., with a coating layer such as “resin”, “photoresist”, or “metal such as aluminum, gold, or silver for forming the wiring pattern” It can also be used.
  • the object to be processed 200 may of course have a shape other than the substrate, such as a film.
  • the workpiece holder 12 may be formed to include a vacuum chuck capable of attracting the workpiece 200 so that the workpiece 200 can be easily removed.
  • the elastic member 122 is formed with a vacuum suction groove 123 and a suction port 125 connected to a suction path formed in the workpiece holding base 121.
  • the suction path of the workpiece holding base 121 is connected to gas suction means such as a vacuum pump.
  • the elastic member 122 also serves as a seal, and the force S that reliably holds the workpiece 200 by suction can be achieved.
  • a workpiece heating means 13 for heating the workpiece 200 to be held for example, a very responsive carbon heater is provided below the holding stage.
  • the carbon heater is controlled by the control means 300 to supply a current from a power source (not shown), and can maintain the workpiece 200 on the holding stage at a predetermined constant temperature.
  • a power source not shown
  • the heater for example, a heat transfer heater, a ceramic heater, a halogen heater, an IH heater, or the like can be used.
  • the workpiece holder 12 can be provided with a workpiece cooling means 14 for cooling the workpiece 200.
  • the workpiece cooling means 14 includes, for example, a coolant such as water or oil, air or an inert gas in the inside of the cage holder 12 formed of a metal having high thermal conductivity such as aluminum or copper.
  • a cooling flow path capable of cooling the workpiece 200 can be used by flowing a cooling gas such as.
  • the workpiece holder 12 is provided with an object temperature detector 131 for detecting the temperature of the workpiece 200, for example, a thermocouple. Further, the workpiece temperature detection means 131 is electrically connected to the control means 300 and is configured to transmit information regarding the detected temperature of the workpiece 200 to the control means 300.
  • the displacing means 5 includes, for example, a ball screw 51 arranged in the vertical direction and an electric motor 52 that rotationally drives the ball screw 51. Further, the lower end portion of the ball screw 51 and the upper surface of the mold holder 2 are connected via a pressing portion 53 and a bearing mechanism 54. Then, by rotating the ball screw 51 with the electric motor 52, the pressing portion 53 is placed on the mold 100 and the workpiece 200 against a plurality of, for example, four columns 56 provided between the base 50 and the upper base 55. Can be displaced in the direction of contact / separation (hereinafter referred to as the Z direction).
  • the Z direction the direction of contact / separation
  • the displacing means 5 can adjust the position of the mold 100 relative to the workpiece 200 by a displacement amount not more than the depth of the pattern of the mold 100. Specifically, it is preferable that the amount of displacement can be adjusted to 100 ⁇ or less, preferably 10 / im or less, more preferably 1 / im or less, more preferably lOOnm or less, more preferably 10 nm or less, More preferably, one that can be adjusted to 1 nm or less is preferred.
  • the displacement means 5 is capable of adjusting the displacement speed of the mold 100 with respect to the workpiece 200. Specifically, those that can be adjusted at 100 xm / sec or less are preferable, preferably 10 z mZ seconds or less, more preferably seconds or less, more preferably lOOnmZ seconds or less, more preferably 1 OnmZ seconds or less, more preferably lnm. Things that can be adjusted in less than / second are good. This is because the control means 300 detects the displacement based on the information detected by the pressure detection means 8. The force that controls the operation of stage 5 and adjusts the pressure between the mold 100 and the workpiece 200 It takes some time to feed back the information detected by the pressure detection means 8 to the displacement means 5. . Therefore, if the displacement speed is too high, feedback of the information detected by the pressure detection means 8 to the displacement means 5 is delayed, and the actual pressure between the mold 100 and the workpiece 200 can be accurately controlled. Because it disappears.
  • the displacement means 5 is not limited to a ball screw and an electric motor as long as the relative displacement amount and displacement speed between the mold 100 and the workpiece 200 can be adjusted. It is also possible to use a piezoelectric element that can change the size (dimension) by adjusting, and a magnetostrictive element that can change the size (dimension) by adjusting the magnetic field. Of course, it is possible to use both a ball screw and an electric motor and a piezoelectric element or a magnetostrictive element.
  • a ball screw and an electric motor are applied when the mold 100 and the workpiece 200 are largely displaced, and a piezoelectric element or a magnetostrictive element is used when the mold 100 and the workpiece 200 are displaced by a small amount.
  • a piezoelectric element or a magnetostrictive element is used when the mold 100 and the workpiece 200 are displaced by a small amount.
  • the mold holder 2 that holds the mold 100 is moved up and down, and the pattern surface of the mold 100 is moved with respect to the workpiece 200 that is held by the workpiece holder 12.
  • 100a can be closely approached, pressed and separated.
  • the position detecting means 7 is formed by a linear scale arranged on the mold holder 2, for example. Using this linear scale, the distance between the workpiece 200 and the mold holder 2 is measured, and the value force is also detected by calculating the relative position and displacement speed of the mold 100 with respect to the workpiece 200. Power S can be. Further, the position detection means 7 is electrically connected to the control means 300, and is formed so as to transmit information on the detected position and displacement speed of the mold 100.
  • the position detection means 7 is not limited to a linear scale, and various types can be used. For example, the position of the workpiece 200 can be determined using a laser length measuring device provided on the mold holder 2 side.
  • the resolution of the position detection means 7 is preferably one that can be detected with a value that is at least the size of the pattern of the mold 100 in the depth direction (Z direction) or less than the amount of displacement that the displacement means 5 can adjust.
  • those that can be detected at 100 zm or less are preferable, preferably 10 zm or less, more preferably 1 ⁇ or less, more preferably lOOnm or less, more preferably 10 nm or less, more preferably lnm or less.
  • Those that can be detected by are preferable.
  • the position detecting means 7 By configuring the position detecting means 7 in this way, the position of the pattern surface 100a of the mold 100 relative to the workpiece 200 according to the size of the pattern and the pressure between the mold 100 and the workpiece 200. Can be precisely adjusted, so that the pattern transferability and releasability can be improved.
  • the pressure detecting means 8 detects the pressure between the mold 100 and the workpiece 200.
  • a load cell that measures the load between the mold 100 and the workpiece 200 may be used. it can. As a result, if the load is measured and divided by the area of the pattern surface 100a of the mold 100, the pressure between the mold 100 and the workpiece 200 can be detected. Further, the pressure detection means 8 is electrically connected to the control means 300, and is configured to transmit information on the detected pressure.
  • the control means 300 is based on the displacement means 5, the pressing means 6, and the mold heating.
  • a computer can be used for controlling the operation of the means 3, the mold cooling means 4, the workpiece heating means 13, and the workpiece cooling means 14, for example.
  • Imprinting is performed by using SCIVAX imprinting equipment (VX-2000N-US), heating the mold and workpiece to 145 ° C, and pressing at 2.5 MPa for 10 seconds. went.
  • the mold is made of nickel with a pattern that allows the honeycomb structure to be transferred to the workpiece (a pattern in which the honeycomb structure is reversed) when transferred to the workpiece, and the transferable area is 50mm x 50mm ( (The outer shape of the mold is 55mm x 55mm): Mold with a square area of 2500mm 2 Was used.
  • the honeycomb structure has a line width of 250 nm, a line height of 380 nm (aspect ratio of about 1.5), and a single cell (hexagon) with a maximum inner diameter of 2 ⁇ (that is, a maximum outer diameter including the line width). 2.5 ⁇ ) was used.
  • a sheet-like elastic member made of polyimide having a thickness satisfying the formula (13) was disposed between the mold holding base and the mold (Example 1).
  • the size of the waviness ( ⁇ 2) was about 2.4 ⁇ m (2.4 ⁇ 10 6 m).
  • Equation (14) Substituting into Equation (14) as the IMPa of the theoretical value derived from the max mm logic data,
  • a sheet-like elastic member made of polyetherimide having a thickness of 200 ⁇ that does not satisfy the formula (13) is arranged (Comparative Example 1) and an elastic member that does not use an elastic member (ratio) Comparative Example 2) was also evaluated for imprints.
  • FIGS. 7 to 9 show photographs of the thin film on the silicon substrate after the transfer, respectively.
  • the pattern of the mold is almost 100% transferred (see FIG. 7). In contrast, only about 40% of the mold pattern was transferred to the thin film of Comparative Example 1 (see Fig. 8). See). In the thin film of Comparative Example 2, most of the pattern of the mold was not transferred except for the outer peripheral portion (see FIG. 9).
  • a pattern of a mold or a substrate (processing object) can be transferred uniformly and at high speed.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

Cette invention concerne un ensemble porte-matrice destiné à maintenir une matrice (100) dans un dispositif de microfabrication permettant d’appliquer une pression à la matrice (100) avec une forme donnée et à un objet de fabrication (200) pour transférer la forme de la matrice à l’objet de fabrication (200). L’ensemble porte-matrice se caractérise en ce qu’il comprend un substrat de support de matrice (21) en matériau rigide et un élément élastique (22) interposé entre le substrat (21) et la matrice (100), l’élément étant formé pour présenter une épaisseur (t1) satisfaisant la formule : (1) t1 : EPAISSEUR DE L’ELEMENT ELASTIQUE (22), λ1 : ETENDUE DE RENFLEMENT D’AU MOINS LA MATRICE (100) OU L’OBJET DE FABRICATION (200), α : RAPPORT DE LA DIFFERENCE ENTRE LA PRESSION MAXIMALE ET LA PRESSION MINIMALE A LA PRESSION MOYENNE DANS UN PLAN DE CONTACT DE LA MATRICE (100) AVEC L’OBJET DE FABRICATION (200), E1 : MODULE D’YOUNG DE L’ELEMENT ELASTIQUE (22), ET σ1 : PRESSION MOYENNE ENTRE LA MATRICE (100) ET L’OBJET DE FABRICATION (200).
PCT/JP2006/321009 2005-10-24 2006-10-23 Ensemble porte-matrice, ensemble porte-objet de fabrication, dispositif de microfabrication et procede de montage de matrice WO2007049530A1 (fr)

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JP2009006620A (ja) * 2007-06-29 2009-01-15 Hitachi Industrial Equipment Systems Co Ltd インプリント用スタンパとその製造方法
WO2009081586A1 (fr) 2007-12-26 2009-07-02 Maruzen Petrochemical Co., Ltd. Dispositif d'impression et procédé d'impression
JP2009248503A (ja) * 2008-04-09 2009-10-29 Hitachi High-Technologies Corp 微細構造転写装置
WO2010001538A1 (fr) * 2008-06-30 2010-01-07 株式会社日立製作所 Structure fine et matrice permettant d’imprimer
JP2010036514A (ja) * 2008-08-07 2010-02-18 Hitachi High-Technologies Corp ナノインプリント用スタンパ及び該スタンパを使用する微細構造転写装置
JP2010265340A (ja) * 2009-05-12 2010-11-25 Nitta Ind Corp チャッキング用粘着シートおよびチャッキング用粘着テープ
JP2011001520A (ja) * 2009-06-22 2011-01-06 Nitta Corp モールド固定用粘着シートおよびモールド固定用粘着テープ
CN102126286A (zh) * 2009-12-15 2011-07-20 株式会社光成技术 用于三聚氰胺板成型的镍薄板的加压方法及加压装置
JP2012160635A (ja) * 2011-02-02 2012-08-23 Canon Inc 保持装置、それを用いたインプリント装置および物品の製造方法
JP2014522745A (ja) * 2011-06-29 2014-09-08 フエック レイニッシェ ゲーエムベーハー サンドイッチ構造を備えたプレスシート又はエンドレスベルト

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JP2004074770A (ja) * 2002-06-18 2004-03-11 Meiki Co Ltd プレス成形装置およびその制御方法
JP2004034300A (ja) * 2002-06-28 2004-02-05 Elionix Kk 微小型押成形装置
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JP2005178236A (ja) * 2003-12-22 2005-07-07 Matsushita Electric Works Ltd 微細形状物の成形方法及び成形機
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JP2006326927A (ja) * 2005-05-24 2006-12-07 Hitachi High-Technologies Corp インプリント装置、及び微細構造転写方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009006620A (ja) * 2007-06-29 2009-01-15 Hitachi Industrial Equipment Systems Co Ltd インプリント用スタンパとその製造方法
WO2009081586A1 (fr) 2007-12-26 2009-07-02 Maruzen Petrochemical Co., Ltd. Dispositif d'impression et procédé d'impression
JP2009248503A (ja) * 2008-04-09 2009-10-29 Hitachi High-Technologies Corp 微細構造転写装置
WO2010001538A1 (fr) * 2008-06-30 2010-01-07 株式会社日立製作所 Structure fine et matrice permettant d’imprimer
JP2010036514A (ja) * 2008-08-07 2010-02-18 Hitachi High-Technologies Corp ナノインプリント用スタンパ及び該スタンパを使用する微細構造転写装置
JP2010265340A (ja) * 2009-05-12 2010-11-25 Nitta Ind Corp チャッキング用粘着シートおよびチャッキング用粘着テープ
JP2011001520A (ja) * 2009-06-22 2011-01-06 Nitta Corp モールド固定用粘着シートおよびモールド固定用粘着テープ
CN102126286A (zh) * 2009-12-15 2011-07-20 株式会社光成技术 用于三聚氰胺板成型的镍薄板的加压方法及加压装置
JP2012160635A (ja) * 2011-02-02 2012-08-23 Canon Inc 保持装置、それを用いたインプリント装置および物品の製造方法
JP2014522745A (ja) * 2011-06-29 2014-09-08 フエック レイニッシェ ゲーエムベーハー サンドイッチ構造を備えたプレスシート又はエンドレスベルト

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