WO2007049530A1

WO2007049530A1 - Die holding assembly, fabrication object holding assembly, microfabrication apparatus and method of mounting die

Info

Publication number: WO2007049530A1
Application number: PCT/JP2006/321009
Authority: WO
Inventors: Takahisa Kusuura; Hitoshi Tambo
Original assignee: Scivax Corporation
Priority date: 2005-10-24
Filing date: 2006-10-23
Publication date: 2007-05-03
Also published as: JPWO2007049530A1

Abstract

A die holding assembly for, in a microfabrication apparatus capable of applying pressure to die (100) with given pattern and fabrication object (200) to thereby transfer the pattern of the die to the fabrication object (200), holding the die (100), characterized in that the die holding assembly includes die holding substratum (21) of a rigid material and elastic member (22) interposed between the die holding substratum (21) and the die (100) and formed so as to have thickness (t1) satisfying the formula: (1) t1: THICKNESS OF ELASTIC MEMBER (22), λ1: EXTENT OF SWELL OF AT LEAST EITHER DIE (100) OR FABRICATION OBJECT (200), α: RATIO OF “DIFFERENCE OF MAX. PRESSURE MINUS MIN. PRESSURE” TO “AVE. PRESSURE” WITHIN PLANE OF CONTACT OF DIE (100) WITH FABRICATION OBJECT (200), E1: YOUNG’S MODULUS OF ELASTIC MEMBER (22), AND σ1: AVE. PRESSURE BETWEEN DIE (100) AND FABRICATION OBJECT (200).

Description

Specification

Technical field of mold holders, workpiece holders, microfabrication devices and mold mounting methods

TECHNICAL FIELD [0001] The present invention relates to a mold holder, a workpiece holder, a microfabrication apparatus, and a mold attachment method that can transfer a pattern of a mold uniformly and at high speed.

Background art

In order to form a fine circuit pattern typified by LSI (Large Scale Integrated Circuit) on a semiconductor substrate (hereinafter simply referred to as “substrate”), a technique called “photolithography” is generally used. However, in this method, the size of the pattern to be formed is reduced, the size of the apparatus is increased, and the cost is increased.

[0003] In addition, in order to obtain a fine molded product, a resin melted by heating is poured into a mold heated to a temperature lower than the glass transition temperature of the resin at high speed and high pressure, and solidified while controlling the pressure. Injection molding is also used. However, in this method, the supplied resin is solidified while taking heat away from the mold, so that it is not possible to form a fine shape in which the resin does not easily penetrate into the fine pattern of the mold. It was difficult. It is also conceivable to heat the mold and wait for the resin to enter the fine pattern, and then cool and mold the mold. However, in injection molding, it is necessary to pour resin into the mold at a high pressure, so a large mold that can withstand high pressure is required, and the heat capacity of the mold increases. There was a problem that it took S.

[0004] In recent years, as a solution to the above problems, nanoimprinting process technology for forming ultrafine patterns on a substrate has been attracting attention (for example, see Patent Document 1). This process is performed, for example, according to the following procedure.

[0005] First, a mold in which the formed pattern and pattern are formed on the surface is prepared, and a mold heated to a temperature higher than the glass transition temperature is pressed against a resin held at a temperature lower than the glass transition temperature. Then, the resin surface melts and flows, and the pattern of the mold is transferred to the resin. Next, the mold is cooled to solidify the resin, and the mold is released. Thereby, a pattern is formed in the resin.

[0006] This method does not require an expensive electron beam light source or optical system, and does not require a heater and a pre-heater. A simple structure based on a device can be used.

[0007] Further, in this method, the resin can be penetrated into the fine pattern of the mold without the problem that the resin is deprived of heat and solidified. In addition, since a large mold that can withstand high pressure, such as injection molding, is not required, the temperature can be raised and lowered at high speed, and there is no throughput problem.

[0008] In fact, by using the nanoimprinting process technology, various microchips and microchips such as optical devices such as diffraction gratings, photonic crystals, and waveguides, and fluid devices such as macrochannels and reactors are used. A situation where devices can also be manufactured is being realized.

[0009] However, as the pattern size of the mold becomes smaller, undulation (flatness) of the mold and the substrate to be processed (processing object such as resin) becomes a problem. This is because if the mold or the substrate has a undulation larger than the pattern size, the mold and the substrate cannot be uniformly pressed, and the pattern of the mold cannot be accurately transferred to the substrate.

[0010] In order to solve this, an elastic member such as silicon rubber is disposed between a press body made of a rigid body and a mold, and the mold is formed so as to follow the fine waviness and unevenness of the substrate. Yes (for example, see Patent Document 2).

[0011] Patent Document 1: US Pat. No. 5772905 (4th paragraph, lines 46-47)

Patent Document 2: JP-A-8-6027 (Page 3, Figure 1)

Disclosure of the invention

Problems to be solved by the invention

[0012] However, in the conventional transfer apparatus, the thickness of the elastic member is such that the swell size of the mold or the substrate (processing object), the Young's modulus of the elastic member, the mold and the substrate (processing object). It was not formed in consideration of the level of pressure during pressurization, and was still insufficient to accurately transfer the pattern of the mold to the substrate.

[0013] If the elastic member is thicker than necessary or the elastic member is made of a material having low thermal conductivity such as silicon rubber, the heating means or cooling means provided on the press substrate side may be used. The speed of raising and lowering the mold is very slow, which hinders throughput.

[0014] Further, in the method of simply disposing the elastic member between the mold and the press substrate, the mold and the elastic member, Alternatively, there is a problem that a gap is generated between the press base and the elastic member, and the speed of raising and lowering the mold is further slowed. This becomes a more prominent problem when a pattern of a mold is transferred to a substrate in a vacuum atmosphere.

Therefore, the present invention provides a mold holder, a workpiece holder, a microfabrication apparatus, and a mold attachment method capable of uniformly and rapidly transferring a pattern of a mold or a substrate (object to be processed). Objective.

Means for solving the problem

[0016] In order to achieve the above object, a mold holder according to the present invention presses a mold having a predetermined pattern and a workpiece to transfer the pattern of the mold onto the workpiece. In the apparatus, the mold holder is configured to hold the mold, and is disposed between the mold holding base made of a rigid body and the mold holding base and the mold, and the thickness satisfies the following formula (1): And an elastic member.

[0017] [Equation 1] t ≥ ^-· Equation (1) t: thickness of the elastic member

λ: The size of the swell of at least one of the mold and the workpiece a: “Difference between maximum pressure and minimum pressure” with respect to the “average pressure” in the contact surface between the mold and the workpiece Ratio

E: Young's modulus of inertia

σ: average pressure between the mold and the workpiece

In this case, the thickness t of the elastic member is preferably formed so as to satisfy the following formula (2).

1

Good.

[0018] [number _2] ≥ h≥. ... formula ₍₂₎

ασ ₁ α σ ₁

Further, it is preferable that the elastic member has a thermal conductivity of 0.17 (W / m′K) or more. [0019] Further, another mold holder of the present invention is a micromachining apparatus that presses a mold having a predetermined pattern and a workpiece to transfer the pattern of the mold to the workpiece. A mold holding base made of a rigid body, disposed between the mold holding base and the mold, and having a thermal conductivity of 0.17 (W / m'K) or more. And an elastic member to be formed.

[0020] Further, it is more preferable that the elastic member is made of a rubber-based adhesive. More preferably, the rubber-based adhesive is a processing temperature at which the mold and the workpiece are pressed. It is better to lose adhesion at higher temperatures. The elastic member may be formed to have a magnetic force. In this case, the mold holding base can be formed to include a magnet. The elastic member may have a groove for vacuum-sucking the mold.

[0021] The micromachining apparatus of the present invention is a micromachining apparatus that presses a mold having a predetermined pattern and a workpiece to transfer the pattern of the mold to the workpiece, and is a mold made of a rigid body. A mold holding unit that holds the mold and includes a holding base and an elastic member that is disposed between the mold holding base and the mold and has a thickness that satisfies the following formula (3): It is characterized by having a tool.

[0022] [Equation 3] t ≥ · · Equation (3) t: thickness of the elastic member

E: Young's modulus of inertia

σ: average pressure between the mold and the workpiece

In this case, the thickness t of the elastic member is preferably formed so as to satisfy the following formula (4).

1

Good.

[0023] [Equation 4] l ^ & _{≥ ≥} ^.… Equation ( ₄₎

ασ ₁ a σ _{1 Further} , it is preferable that the elastic member has a thermal conductivity of 0.17 (W / m′K) or more.

[0024] Further, another micromachining apparatus of the present invention is a micromachining apparatus that presses a mold having a predetermined pattern and a workpiece to transfer the pattern of the mold to the workpiece. A mold holding base made of a rigid body, and an elastic member disposed between the mold holding base and the mold and having a thermal conductivity of 0.17 (WZm'K) or more. It is characterized by comprising a mold holder for holding the mold.

[0025] The processing object holder according to the present invention is the above-described processing target in a micromachining apparatus that presses a mold having a predetermined pattern and the processing object to transfer the pattern of the mold to the processing object. A workpiece holding tool for holding a workpiece, which is disposed between a workpiece holding substrate made of a rigid body, the workpiece holding substrate and the workpiece, and a thickness t is expressed by the following formula: (5) an elastic member formed so as to satisfy

2

The

[0026] [Equation 5]

Equation (5) t: Thickness of the elastic member

2

λ: The size of the undulation of at least one of the mold and the workpiece

2

β: Ratio of “difference between maximum pressure and minimum pressure” to “average pressure” in the contact surface between the mold and the workpiece

Ε: Young's modulus of the inertia member

2

σ: average pressure between the mold and the workpiece

2

In this case, the thickness t of the elastic member is preferably formed so as to satisfy the following formula (6).

2

Good.

[0027] [Equation 6]

L2 / ^ E _{2 ≥} ^ _≥ ^ · ')

β σ ₉ β α _η Further, it is preferable that the elastic member has a thermal conductivity of 0.17 (W / m′K) or more.

[0028] Further, another processing object holder according to the present invention is a micro-processing apparatus that presses a mold having a predetermined pattern and a processing object to transfer the pattern of the mold to the processing object. A processing object holder for holding the processing object, the processing object holding base being made of a rigid body, and being disposed between the processing object holding base and the processing object, and having heat conduction And an elastic member formed at a rate of 0.17 (W / m'K) or more.

[0029] Further, it is more preferable that the elastic member is made of a rubber-based adhesive. More preferably, the rubber-based adhesive is a processing temperature at which the mold and the workpiece are pressed. It is better to lose adhesion at higher temperatures. The elastic member may be provided with a groove for vacuum-sucking the workpiece.

[0030] The micromachining apparatus of the present invention is a micromachining apparatus that presses a mold having a predetermined pattern and a workpiece to transfer the pattern of the mold to the workpiece, and is a machining made of a rigid body. An object holding base, and an elastic member that is disposed between the processing target holding base and the processing target and has a thickness that satisfies the following formula (7):

2

A workpiece holding tool for holding the workpiece is provided.

[0031] [Equation 7]

Equation (7) t: Thickness of the elastic member

2

λ: The size of the undulation of at least one of the mold and the workpiece

2

Ε: Young's modulus of the inertia member

2

σ: average pressure between the mold and the workpiece

2

In this case, the thickness t of the elastic member is preferably formed so as to satisfy the following formula (8).

2

Good. [0032] Garden

1¾¾ ≥ _f2 ≥ ^ 2¾. · 'Expression (8)

β σ _ζ β σ ₂ t: thickness of the elastic member

2

λ: The size of the undulation of at least one of the mold and the workpiece

2

Ε: Young's modulus of the inertia member

2

σ: average pressure in the contact surface between the mold and the workpiece

2

Further, it is preferable that the elastic member has a thermal conductivity of 0.17 (W / m′K) or more.

[0033] Further, another micromachining apparatus of the present invention is a micromachining apparatus that presses a mold having a predetermined pattern and a workpiece to transfer the pattern of the mold to the workpiece. A workpiece holding base made of a rigid body and an elastic member having a thermal conductivity of 0.17 (W / m'K) or more and disposed between the workpiece holding base and the workpiece. And a workpiece holding tool for holding the workpiece.

[0034] Further, the mold attachment method of the present invention is a method for holding a mold in a micromachining apparatus that presses a mold having a predetermined pattern and a workpiece to transfer the pattern of the mold to the workpiece. A method of attaching a mold to a mold holder, wherein the mold is attached to the mold holder using a rubber adhesive. In this case, it is preferable that the rubber-based adhesive loses adhesiveness at a temperature higher than the processing temperature when pressing the mold and the workpiece.

The invention's effect

[0035] According to the inventions described in claims 1, 9, 13, and 19, since the thickness of the elastic member is accurately calculated, the pressure between the mold and the workpiece can be made uniform. The mold pattern can be accurately transferred to the workpiece.

[0036] According to the inventions of claims 2, 10, 14, and 20, the thickness of the elastic member is set to be equal to that of the mold and the workpiece. Is formed as thin as possible with a thickness that can make the pressure between them uniform, so that the mold or workpiece can be heated quickly and throughput can be improved.

[0037] According to the invention described in claims 3, 4, 11, 12, 15, 16, 21, and 22, since the thermal conductivity of the elastic member is formed to be 0.17 (W / m * K) or more, The mold or workpiece can be heated quickly and the throughput can be improved.

[0038] According to the inventions of claims 5 and 17, since the elastic member is formed of a rubber-based adhesive, the mold holder and the mold can be reliably held without a gap. Can be heated quickly to improve the throughput. Moreover, the mold can be easily attached to the mold holder.

[0039] According to the sixth and seventh aspects of the present invention, the mold having a ferromagnetic force can be easily attached by applying a magnetic force to the mold holder.

[0040] According to the inventions of claims 8 and 18, since the groove for vacuum-sucking the mold or the workpiece is formed in the elastic member, the mold is attached to the mold holder or the workpiece holder The object to be added can be easily held.

[0041] According to the invention of claims 24, 25, and 26, the rubber adhesive loses adhesiveness at a temperature higher than the processing temperature when pressing the mold and the object to be processed. The mold and the elastic member can be easily removed by heating.

Brief Description of Drawings

FIG. 1 is a front view showing a microfabrication apparatus of the present invention.

FIG. 2 is a perspective view showing a mold holder of the present invention.

FIG. 3 is a front view for explaining the thickness of the elastic member according to the present invention.

FIG. 4 is a plan view showing another mold holder of the present invention.

FIG. 5 is a cross-sectional view of the mold holder as seen from the direction of the arrow 1_1 in FIG.

FIG. 6 is a plan view showing a processing object holder of the present invention.

FIG. 7 is a photograph of the thin film of Example 1.

FIG. 8 is a photograph of the thin film of Comparative Example 1.

FIG. 9 is a photograph of the thin film of Comparative Example 2.

Explanation of symbols [0043] 1 Microfabrication equipment

2 type holder

12 Workpiece holder

21 type holding substrate

22 Elastic member

23 groove

121 Substrate holding substrate

122 Elastic member

123 groove

100 type

200 Workpiece

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

As shown in FIG. 1, the microfabrication apparatus 1 of the present invention presses a mold 100 having a predetermined pattern and a workpiece 200 to transfer the pattern of the mold 100 to the cache object 200. The relative position of the mold 100 with respect to the workpiece 200 and the position of the mold holder 2 for holding the mold 100, the workpiece holder 12 for holding the workpiece 200, and the position thereof Displacement means 5 capable of adjusting the displacement speed to change the position, position detection means 7 for detecting the relative position of the mold 100 with respect to the workpiece 200, and the pressure between the mold 100 and the workpiece 200 are detected. The pressure detecting means 8, the mold heating means 3 for heating the mold 100, the mold cooling means 4 for cooling the mold 100, the mold temperature detecting means 31 for detecting the temperature of the mold 100, and the workpiece 200 are heated. Heating object heating means 13, Heating object cooling means 14 for cooling the heating object 200, and processing Based on the detection information of the processing object temperature detection means 131 for detecting the temperature of the object 200, the position detection means 7, the pressure detection means 8, the mold temperature detection means 31 and the processing object temperature detection means 131, the displacement means 5, a mold heating means 3, a mold cooling means 4, a heating object heating means 13 and a control means 300 for controlling the operation of the workpiece cooling means 14.

As shown in FIG. 2, the mold holder 2 includes a mold holding base 21 made of a rigid body, and the mold holding base 2 1 and an elastic member 22 disposed between the mold 100 and the mold 100.

[0047] The mold holding base 21 is formed of a material having high rigidity, for example, a metal such as Nikkenore or stainless steel. Further, the mold holding base 21 is formed with a flat surface on the side holding the mold 100. It is preferable that the flatness of this surface is formed as high as possible, for example, 1 zm or less, preferably lOOnm or less, more preferably 10 nm or less, and even more preferably lnm or less. Note that the mold holding base 21 can of course be formed in a curved surface or a roll shape on the side on which the mold 100 is held.

[0048] The elastic member 22 is a flat sheet disposed between the mold holding base 21 and the mold 100, and when the mold 100 and the workpiece 200 are pressed, the mold 100 and the workpiece It is intended to absorb the fine swells and irregularities of the object 200. Therefore, the elastic member 22 needs to be formed with a thickness that absorbs fine waviness and unevenness of the mold 100 or the workpiece 200 and realizes a uniform stress distribution.

[0049] Here, the Young's modulus of the elastic member 22 is E, the thickness of the elastic member 22 is t, and the workpiece 200 is

1 1

The swell size (flatness) is λ, the average pressure between the mold 100 and the workpiece 200 is σ,

1 1 The minimum value of deformation in the pressing direction of the elastic member 22 when pressed is Δ 、, and the pressure at that time is σ

11 1

The maximum deformation amount in the pressing direction of the elastic member 22 is At and the pressure at that time is σ (Fig.

1 12 12

3 See (a) and (b)}, from Hooke's law,

[0050] [Equation 9]

¾ ^ = σ _η · · 'Equation (9)

[0051] [Equation 10]

_{Ει σΐ2...} Equation (1 0) If the difference between the maximum value σ and the minimum value σ of the stress distribution is Δ σ (Δ σ = σ σ), Equation (9)

12 11 1 1 12 11

And from equation (10)

[0052] [Equation 11]

, _Τ t ₁₂ — Δ t ₁₁ ) .i ^ ₁ _, ι ι)

1 t ₁ t ₁ If the ratio of Δ σ to the average pressure σ is less than the predetermined value α, the mold 100 and the workpiece 200

1 1

The tolerance of the pressure distribution variation between)

[0053] [Equation 12] α≥ ^ = ^ '… Equation (1 2)

σι t ₁ a ₁

The equation (12) is transformed to the thickness t of the elastic member 22 and deformed.

[0054] [Equation 13] h≥ ··· (1 3) Therefore, the thickness t of the elastic member 22 is formed so as to satisfy at least the equation (13).

1

Is preferred. In the above description, the size (flatness) of the waviness of the workpiece 200 is

1 However, the swell size (flatness) of the mold 100 is larger than the swell size (flatness) of the workpiece 200. Degree) is good even if λ.

1

A value obtained by combining the swell size (flatness) of the workpiece 200 and the swell size (flatness) of the mold 100 may be set as I.

1

[0055] The pressure (σ) at which the material adheres and cannot be peeled is the upper limit of the pressure, and the processing temperature max

Therefore, the storage modulus of the molding material obtained from rheological data analysis, in other words, the minimum pressure (σ) at which the pattern can be transferred to the molding material is set to the lower limit of pressure and mm.

Then, a value satisfying the following equation (14) is used for at least hi.

[0056] [Equation 14] and "",, ■ 'Expression (1 4)

σι

The value of α actually used depends on the accuracy desired, but is preferably 100 or less, preferably 20 or less, more preferably 10 or less, and even more preferably 5 or less. 1 or less is good tool more preferably 1 X 10_ ² or less good tool more preferably 1 X 10_ 3 or less is good. The lower limit, a range that can be industrially management, preferably in IX 10_ ⁶ or more.

In addition, the mold 100 has the elastic member 22 (the mold holder 2) attached thereto by the mold heating means 3 or the mold cooling means 4. Therefore, if the thickness of the elastic member 22 is too large, the temperature raising / lowering rate (throughput) decreases. Therefore, the thickness t of the elastic member 22 is at least the following formula (15).

1

It is preferable to form it in a size that satisfies.

[0058] [Equation 15]

^^ ≥ _tl . · 'Formula (1 5) Further, it is preferable to form a size satisfying the following formula (16).

[0059] [Equation 16]

^^ ≥ _tl .. 'Formula (1 6)

a σ _{1 Further} , in order to improve the temperature raising / lowering rate (throughput), it is preferable to form the thermal conductivity of the elastic member 22 as high as possible. Specifically, it is better that the thermal conductivity is formed to be 0.17 (W / mK) or more, preferably 0.2 (W / m * K) or more, more preferably 0.3 (W / mK). / m'K) or better, more preferably l (W / m'K) or better, more preferably 2 (W / mK) or better, more preferably 4 (W / m · K) or better.

[0060] Further, since the elastic member 22 is disposed between the mold heating means 3 and the mold 100 heated by the heating means 3, it is necessary to have heat resistance at least equal to or higher than the processing temperature in the imprint process. . For example, in the case where the mold 100 is heated to the glass transition temperature of the cache object 200 or higher, the heat resistance temperature of the elastic member 22 must be at least the glass transition temperature (Tg) or higher, preferably the glass transition temperature. + 20 ° C (Tg + 20 ° C) or better, more preferably glass transition temperature + 40 ° C (Tg + 40 ° C) or better, more preferably glass transition temperature It should be formed at + 60 ° C (Tg + 60 ° C) or higher. Specifically, when the workpiece 200 is made of a cyclic olefin-based copolymer: COC (Cyclo Olefin Copolymer) (glass transition temperature 138 ° C), the heat resistance temperature of the elastic member 22 is set to 138 ° C or higher. Preferably, it is formed at 158 ° C or higher, more preferably 178 ° C or higher, and more preferably 198 ° C or higher.

[0061] There are various elastic members 22 having such thermal conductivity and heat-resistant temperature. For example, fluorinated rubber (perfluoroelastomer), nitrile rubber, urethane rubber, chloroprene rubber, butinole rubber, styrene rubber, natural rubber, ethylene propylene rubber, foaming resin such as acrylic foam, etc. Can be used. In order to improve the thermal conductivity, boron nitride (BN), silicon nitride (Si N), nitride

3 4 Use a mixture of ceramics such as aluminum (A1N) and alumina, a mixture of metals such as silver, copper, gold, and magnesium oxide, and a mixture of carbon compounds such as carbon black and carbon nanotubes. It is also possible.

[0062] The elastic member 22 may use a rubber-based adhesive so that the mold 100 can be securely held on the mold holding base 21. In this case, a rubber adhesive may be applied to at least one of the mold holding base 21 and the mold 100, and the mold holding base 21 and the mold 100 may be bonded together. Accordingly, the mold holding base 21 and the mold 100 can be reliably held without a gap, so that the heat transfer rate from the mold heating means 3 to the mold 100 can be improved. This effect becomes more remarkable in the imprint process under a vacuum atmosphere. Further, it is preferable that this rubber-based adhesive loses its adhesiveness at a temperature higher than the processing temperature when pressing the mold 100 and the workpiece 200. This is because the mold 100 and the elastic member 22 can be easily removed from the mold holding base 21 by heating the elastic member 22 to a temperature at which the adhesiveness is lost (hereinafter referred to as the peeling temperature). As such a rubber-based adhesive, an acrylic adhesive that is a thermoplastic resin, such as siloquinone AP (manufactured by Gyltech Co., Ltd.), siloxane TP (manufactured by Gieltech Co., Ltd.), or the like can be used. Of course, as long as the adhesiveness is lost at a temperature higher than the processing temperature when pressing the mold 100 and the workpiece 200, the present invention is not limited to these.

[0063] Further, the mold holder 2 may be formed so as to include a vacuum chuck capable of adsorbing the mold 100 so that the mold 100 can be easily removed. In this case, as shown in FIGS. 4 and 5, the elastic member 22 is formed with a vacuum suction groove 23 and a suction port 25 connected to a suction path 24 formed in the mold holding base 21. . The suction path 24 of the mold holding base 21 is connected to gas suction means 26 such as a vacuum pump. In this case, the groove 23 is formed outside the surface on which the pattern of the mold is formed (pattern surface 100a), and is sized to adsorb the portion outside the area occupied by the pattern formed on the mold. . As a result, the elastic member 22 also functions as a seal. As a result, the mold 100 can be reliably adsorbed and held.

[0064] The mold holder 2 can also be formed so as to have a magnetic force capable of attracting and holding a mold (mold 100) made of a ferromagnetic material. In this case, it is necessary to use a magnet material having a Curie point equal to or higher than the processing temperature in the imprint process. The magnet may be formed as a permanent magnet or an electromagnet, and all or part of the elastic member 22 or the mold holding base 22 may be formed as a magnet.

[0065] The mold 100 is made of, for example, "metal such as nickel", "ceramics", "carbon material such as glassy carbon", "silicon", or the like, and has a predetermined surface on one end surface (pattern surface 100a). Pattern is formed. This pattern can be formed by applying precision mechanical processing to the pattern surface 100a. In addition, after a predetermined pattern is formed on a silicon substrate or the like, which is the master of the mold 100, by a semiconductor micromachining technique such as etching, an electric fabrication (elect mouth forming) method such as a nickel plating method is performed on the surface of the silicon substrate. Thus, the metal plating can be applied, and the metal plating layer can be peeled off to form a pattern. Of course, the material and manufacturing method of the mold 100 are not particularly limited as long as a fine pattern can be formed. The width of this pattern (dimension in the plane direction of the workpiece 200) depends on the type of workpiece 200 used, but is 100 μΐη or less, 10 μΐη or less, 2 / im or less, 1 / im or less It is formed in various sizes such as lOOnm or less, 10nm or less. Furthermore, the depth of this pattern (vertical dimension of the workpiece 200) is 10 nm or more, 100 η m or more, 200 nm or more, 500 or more, Ι μ ΐη or more, ΙΟ μ ΐη or more, ΙΟΟ μ ΐη or more, etc. Formed in various sizes. In addition, there are various aspect ratios of this pattern such as 0.2 or more, 0.5 or more, 1 or more, 2 or more.

[0066] Further, when the mold 100 is pressed against the workpiece 100, the mold 100 has a thickness that can deform the undulations and irregularities of the mold 100 or the workpiece 200 toward the elastic member 22 side, for example, 0.001 to 2 mm. It is formed. In addition, since the mold 100 is heated and cooled during the imprint process, it is preferable to make the mold 100 as thin as possible and reduce its heat capacity.

[0067] As shown in Fig. 1, the mold heating means 3 is provided on the side facing the mold 100 with respect to the mold holder 2, and for example, a carbon heater having very good responsiveness is used. In addition, a single-bon heater (die heating means 3) is controlled by a control means 300 from a power source (not shown). Supply is controlled and mold 100 can be maintained at a predetermined constant temperature. For example, a heat transfer heater, ceramic heater, halogen heater, or IH heater can be used as the heater.

[0068] As shown in Fig. 1, the mold cooling means 4 is provided on the side facing the mold 100 with respect to the mold holder 2, and is formed of a metal having high thermal conductivity such as aluminum or copper, for example. A cooling flow path capable of cooling the mold 100 can be used by flowing a cooling liquid such as water or oil, or a cooling gas such as air or inert gas inside the container.

[0069] In the vicinity of the mold 100, for example, the mold holder 2 is provided with a mold temperature detecting means 31 for detecting the temperature of the mold 100, for example, a thermocouple. The mold temperature detecting means 31 is electrically connected to the control means 300 and is formed so as to transmit the detected information on the temperature of the mold 100 to the control means 300.

As shown in FIG. 6, the workpiece holder 12 includes a rigid workpiece holding base 121 and an elastic member disposed between the workpiece holding base 121 and the workpiece 200. It is composed of member 122.

[0071] The workpiece holding base 121 is made of a highly rigid material, for example, a metal such as nickel or stainless steel. Further, the workpiece holding base 121 has a flat surface on the side holding the workpiece 200. It is preferable that the flatness of this surface is formed as high as possible, for example, 1 μΐη or less, preferably lOOnm or less, more preferably 10 nm or less, and even more preferably lnm or less. Of course, the workpiece holding base 121 can be formed in a roll shape. Of course, the workpiece holding base 121 can be formed in a curved surface or a roll shape on the side on which the workpiece 200 is held.

[0072] The elastic member 122 is a flat sheet disposed between the workpiece holding base 121 and the workpiece 200, and when the die 100 and the workpiece 200 are pressed, Absorbs the fine swells and irregularities of 100 and 200 Caloe objects. Therefore, the elastic member 122 needs to be formed with a thickness that absorbs fine waviness and unevenness of the mold 100 or the workpiece 200 and realizes a uniform stress distribution.

Here, the Young's modulus of the elastic member 122 is E, the thickness of the elastic member 122 is t, and the workpiece 200 And the average pressure between the mold 100 and the workpiece 200 is σ,

2 2 The minimum amount of deformation in the pressing direction of the elastic member 22 when pressed is Δΐ, and the pressure at that time is

twenty one

σ, the maximum value of deformation in the pressing direction of the elastic member 122 Δΐ the pressure at that time σ

21 22 22 (not shown), the same as described for the thickness of the elastic member 22 of the mold holding base 2 [0074] [Equation 17]

Ε, ^ = σ-· · · Equation (1 7)

[0075] [Equation 18]

Ε, ^ = σ „·. '(18)

-If the difference between the maximum value σ and the minimum value σ of the stress distribution is Δ σ (Δ σ = σ σ), the equation (1

22 21 2 2 22 21

From 7) and formula (18)

[0076] [Equation 19]

_Δσ (At _i -At _li ) E ₌ x E _< ·, Equation (i ₉₎

"t then 2 t 2

The ratio of Δ σ to the average pressure σ is less than or equal to the predetermined value / 3 (/ 3 is the mold 100 and the Caloe object 200

twenty two

The tolerance of the pressure distribution variation between)

[0077] [Equation 20] β≥ ^ = · · Equation (2 0)

2 2 ° 2

The equation (20) is transformed to the thickness t of the elastic member 122 and deformed.

2

[0078] [Equation 21]

· 'Formula (2 1) Therefore, the thickness t of the elastic member 122 is formed so as to satisfy at least Formula (21).

2

Is preferred. In the above description, the swell size of the mold 100 is larger than the force S with the swell size (flatness) of the workpiece 200 as I; the force S and the swell size (flatness) of the workpiece 200 (flatness).

2

If the flatness is larger, the swell size (flatness) of the mold 100 may be λ . Alternatively, a value obtained by combining the swell size (flatness) of the workpiece 200 and the swell size (flatness) of the mold 100 may be used.

2

[0079] The pressure (σ) at which the material adheres and cannot be peeled is the upper limit of the pressure, and the processing temperature max

Then, a value satisfying the following equation (14) is used for at least / 3.

[0080] [Numerical equation 22] and “',” ■' Expression (2 2)

1

The value of β actually used depends on the desired accuracy, but is preferably 100 or less, preferably 20 or less, more preferably 10 or less, even more preferably 5 or less, and even more preferably 1 the following is a good tool and more preferably 1 X 10_ ² or less good tool more preferably 1 X 10_ 3 or less is good. The lower limit, a range that can be industrially management, preferably in IX 10_ ⁶ or more.

[0081] Further, the workpiece 200 is heated and cooled by the workpiece heating means 13 or the workpiece cooling means 14 via the elastic member 122 (workpiece holder 12). If the thickness of 122 is too large, the heating / cooling speed (throughput) will decrease. Therefore, it is preferable that the thickness t of the elastic member 122 be formed to a size satisfying at least the following formula (21).

2

That's right.

[0082] [Equation 21]

¾ ^ ≥ t _2- · · Equation (2 1)

β ₂

In addition, it is preferable to form a size satisfying the following formula (22).

[0083] [Equation 22]

¾ ^ ≥ t _2- ■ 'Formula (2 2)

β ο ₂

Further, in order to improve the temperature raising / lowering rate (throughput), it is preferable to form the thermal conductivity of the elastic member 122 as high as possible. Specifically, the thermal conductivity is 0.17 (W / m- K) or better, preferably 0.2 (W / m * K) or better, more preferably 0.3 (W / m'K) or better, more preferably l ( W / m'K) or better, more preferably 2 (W / m · K) or better, more preferably 4 (W / m · K) or better.

[0084] Further, since the elastic member 122 is disposed between the workpiece heating means 13 and the workpiece 200 to be heated, it is necessary to have heat resistance at least equal to or higher than the processing temperature in the imprint process. For example, when the workpiece 200 is heated in the vicinity of its glass transition temperature (Tg), the heat resistance temperature of the elastic member 122 needs to be at least equal to or higher than the glass transition temperature (Tg), preferably the glass transition temperature. + 20 ° C (Tg + 20 ° C) or better, more preferably glass transition temperature + 40 ° C (Tg + 40 ° C) or better, more preferably glass transition It should be formed at a temperature higher than + 60 ° C (Tg + 60 ° C). Specifically, when the workpiece 200 is made of a cyclic olefin-based copolymer: C ° C (Cyclo Olefin Copolymer) (glass transition temperature 138 ° C), the heat resistance temperature of the elastic member 122 is 138 ° C or higher. Preferably, it is formed at 158 ° C or higher, more preferably 178 ° C or higher, and more preferably 198 ° C or higher.

[0085] There are various elastic members 122 having such thermal conductivity and heat-resistant temperature, and force that can be freely selected, for example, fluorine-based rubber (perfluoroelastomer), nitrile rubber, urethane, etc. Rubber, chloroprene rubber, butyl rubber, styrene rubber, natural rubber, ethylene propylene rubber, foaming resins such as acrylic foam, and the like can be used. In order to improve the thermal conductivity, boron nitride (BN), silicon nitride (Si N), nitrogen

3 4 Use a mixture of ceramics such as aluminum nitride (A1N) and alumina, a mixture of metals such as silver, copper, gold, magnesium oxide, and a mixture of carbon compounds such as carbon black and carbon nanotubes. It is also possible.

[0086] The elastic member 122 may use a rubber adhesive so as to be securely held by the workpiece holding base 121. As a result, the workpiece holding base 121 and the elastic member 122 can be formed without gaps, so that the heat transfer rate from the workpiece heating means 13 to the workpiece 200 can be improved. This effect becomes more remarkable in the imprint process under a vacuum atmosphere. In addition, this rubber-based adhesive It is preferable that the adhesive loses its adhesiveness at a temperature higher than the processing temperature when pressing the object 200. This is because the elastic member 122 can be easily detached from the workpiece holding base 121 by heating the elastic member 122 to a temperature at which the adhesiveness is lost (hereinafter referred to as a peeling temperature). As such a rubber adhesive, an acrylic adhesive which is a thermoplastic resin, such as siloquinone AP (manufactured by Gyltech Co., Ltd.) or siloquinone TP (manufactured by Gyltech Co., Ltd.) can be used. Of course, it is not limited to these as long as the adhesiveness is lost at a temperature higher than the processing temperature when pressing the mold 100 and the workpiece 200.

[0087] Various objects can be used as the processing object 200. For example, in addition to resins such as polycarbonate and polyimide, metals such as aluminum, glass, quartz glass, silicon, gallium arsenide, sapphire, and magnesium oxide A material in which the molding material is in the shape of a substrate as it is can be used. Also, the surface of the substrate body made of silicon, glass, etc., with a coating layer such as “resin”, “photoresist”, or “metal such as aluminum, gold, or silver for forming the wiring pattern” It can also be used. Furthermore, the object to be processed 200 may of course have a shape other than the substrate, such as a film.

[0088] Further, the workpiece holder 12 may be formed to include a vacuum chuck capable of attracting the workpiece 200 so that the workpiece 200 can be easily removed. In this case, as shown in FIG. 6, the elastic member 122 is formed with a vacuum suction groove 123 and a suction port 125 connected to a suction path formed in the workpiece holding base 121. The suction path of the workpiece holding base 121 is connected to gas suction means such as a vacuum pump. As a result, the elastic member 122 also serves as a seal, and the force S that reliably holds the workpiece 200 by suction can be achieved.

In addition, a workpiece heating means 13 for heating the workpiece 200 to be held, for example, a very responsive carbon heater is provided below the holding stage. The carbon heater is controlled by the control means 300 to supply a current from a power source (not shown), and can maintain the workpiece 200 on the holding stage at a predetermined constant temperature. As the heater, for example, a heat transfer heater, a ceramic heater, a halogen heater, an IH heater, or the like can be used. In addition, the workpiece holder 12 can be provided with a workpiece cooling means 14 for cooling the workpiece 200. The workpiece cooling means 14 includes, for example, a coolant such as water or oil, air or an inert gas in the inside of the cage holder 12 formed of a metal having high thermal conductivity such as aluminum or copper. A cooling flow path capable of cooling the workpiece 200 can be used by flowing a cooling gas such as.

Further, in the vicinity of the workpiece 200, for example, the workpiece holder 12 is provided with an object temperature detector 131 for detecting the temperature of the workpiece 200, for example, a thermocouple. Further, the workpiece temperature detection means 131 is electrically connected to the control means 300 and is configured to transmit information regarding the detected temperature of the workpiece 200 to the control means 300.

As shown in FIG. 1, the displacing means 5 includes, for example, a ball screw 51 arranged in the vertical direction and an electric motor 52 that rotationally drives the ball screw 51. Further, the lower end portion of the ball screw 51 and the upper surface of the mold holder 2 are connected via a pressing portion 53 and a bearing mechanism 54. Then, by rotating the ball screw 51 with the electric motor 52, the pressing portion 53 is placed on the mold 100 and the workpiece 200 against a plurality of, for example, four columns 56 provided between the base 50 and the upper base 55. Can be displaced in the direction of contact / separation (hereinafter referred to as the Z direction). As the electric motor 52, various types such as a DC motor, an AC motor, a stepping motor, and a servo motor can be used. Here, it is preferable that the displacing means 5 can adjust the position of the mold 100 relative to the workpiece 200 by a displacement amount not more than the depth of the pattern of the mold 100. Specifically, it is preferable that the amount of displacement can be adjusted to 100 μΐη or less, preferably 10 / im or less, more preferably 1 / im or less, more preferably lOOnm or less, more preferably 10 nm or less, More preferably, one that can be adjusted to 1 nm or less is preferred.

Further, it is preferable that the displacement means 5 is capable of adjusting the displacement speed of the mold 100 with respect to the workpiece 200. Specifically, those that can be adjusted at 100 xm / sec or less are preferable, preferably 10 z mZ seconds or less, more preferably seconds or less, more preferably lOOnmZ seconds or less, more preferably 1 OnmZ seconds or less, more preferably lnm. Things that can be adjusted in less than / second are good. This is because the control means 300 detects the displacement based on the information detected by the pressure detection means 8. The force that controls the operation of stage 5 and adjusts the pressure between the mold 100 and the workpiece 200 It takes some time to feed back the information detected by the pressure detection means 8 to the displacement means 5. . Therefore, if the displacement speed is too high, feedback of the information detected by the pressure detection means 8 to the displacement means 5 is delayed, and the actual pressure between the mold 100 and the workpiece 200 can be accurately controlled. Because it disappears.

Here, the case where the displacing means 5 is provided on the mold holder 2 side has been described, but it is of course possible to provide the displacement means 5 on the calorie object holder 12 side. The displacement means 5 is not limited to a ball screw and an electric motor as long as the relative displacement amount and displacement speed between the mold 100 and the workpiece 200 can be adjusted. It is also possible to use a piezoelectric element that can change the size (dimension) by adjusting, and a magnetostrictive element that can change the size (dimension) by adjusting the magnetic field. Of course, it is possible to use both a ball screw and an electric motor and a piezoelectric element or a magnetostrictive element. In this case, a ball screw and an electric motor are applied when the mold 100 and the workpiece 200 are largely displaced, and a piezoelectric element or a magnetostrictive element is used when the mold 100 and the workpiece 200 are displaced by a small amount. Can be used. Further, it is of course possible to use a hydraulic type or a pneumatic type.

By configuring the displacing means 5 in this way, the mold holder 2 that holds the mold 100 is moved up and down, and the pattern surface of the mold 100 is moved with respect to the workpiece 200 that is held by the workpiece holder 12. 100a can be closely approached, pressed and separated.

The position detecting means 7 is formed by a linear scale arranged on the mold holder 2, for example. Using this linear scale, the distance between the workpiece 200 and the mold holder 2 is measured, and the value force is also detected by calculating the relative position and displacement speed of the mold 100 with respect to the workpiece 200. Power S can be. Further, the position detection means 7 is electrically connected to the control means 300, and is formed so as to transmit information on the detected position and displacement speed of the mold 100. The position detection means 7 is not limited to a linear scale, and various types can be used. For example, the position of the workpiece 200 can be determined using a laser length measuring device provided on the mold holder 2 side. Measurement may be performed or the position of the mold 100 may be measured using a laser length measuring device provided on the workpiece holder 12 side. Also, an encoder provided in the electric motor , And may be measured by calculation from the displacement amount of the displacement means 5. The resolution of the position detection means 7 is preferably one that can be detected with a value that is at least the size of the pattern of the mold 100 in the depth direction (Z direction) or less than the amount of displacement that the displacement means 5 can adjust. Specifically, those that can be detected at 100 zm or less are preferable, preferably 10 zm or less, more preferably 1 μπι or less, more preferably lOOnm or less, more preferably 10 nm or less, more preferably lnm or less. Those that can be detected by are preferable.

[0096] By configuring the position detecting means 7 in this way, the position of the pattern surface 100a of the mold 100 relative to the workpiece 200 according to the size of the pattern and the pressure between the mold 100 and the workpiece 200. Can be precisely adjusted, so that the pattern transferability and releasability can be improved.

[0097] The pressure detecting means 8 detects the pressure between the mold 100 and the workpiece 200. For example, a load cell that measures the load between the mold 100 and the workpiece 200 may be used. it can. As a result, if the load is measured and divided by the area of the pattern surface 100a of the mold 100, the pressure between the mold 100 and the workpiece 200 can be detected. Further, the pressure detection means 8 is electrically connected to the control means 300, and is configured to transmit information on the detected pressure.

[0098] Based on the detection information of the position detection means 7, the pressure detection means 8, the mold temperature detection means 31, and the object temperature detection means 131, the control means 300 is based on the displacement means 5, the pressing means 6, and the mold heating. For controlling the operation of the means 3, the mold cooling means 4, the workpiece heating means 13, and the workpiece cooling means 14, for example, a computer can be used.

Example

[0099] Examples of the present invention will be described below, but the present invention is not limited to these examples.

[0100] Imprinting is performed by using SCIVAX imprinting equipment (VX-2000N-US), heating the mold and workpiece to 145 ° C, and pressing at 2.5 MPa for 10 seconds. went. The mold is made of nickel with a pattern that allows the honeycomb structure to be transferred to the workpiece (a pattern in which the honeycomb structure is reversed) when transferred to the workpiece, and the transferable area is 50mm x 50mm ( (The outer shape of the mold is 55mm x 55mm): Mold with a square area of 2500mm ² Was used. The honeycomb structure has a line width of 250 nm, a line height of 380 nm (aspect ratio of about 1.5), and a single cell (hexagon) with a maximum inner diameter of 2μΐη (that is, a maximum outer diameter including the line width). 2.5 μΐη) was used. In addition, a silicon substrate on which a thin film having a thickness of about 1 μm made of a cyclic olefin-based copolymer: COC (Cyclo Olefin Copolymer) was used was used as a workpiece. At this time, a sheet-like elastic member made of polyimide having a thickness satisfying the formula (13) was disposed between the mold holding base and the mold (Example 1).

Here, when the surface of the silicon substrate on which the thin film was formed was measured using a roughness meter, the size of the waviness (λ 2) was about 2.4 × m (2.4 × 10 ⁶ m).

1

[0102] In addition, the value of the force was calculated using the formula (14) force. In other words, when the maximum pressure (σ) necessary for derivation of the string is pressed against this mold and the film made of COC, the two do not peel off.

max

Let lOMPa be the possible pressure (σ), and let the minimum pressure (σ) required to

Substituting into Equation (14) as the IMPa of the theoretical value derived from the max mm logic data,

[0103] [Equation 23]

^ Bi-bi, = 1 0- 1 ₌ 3.6

σ, 2.5. Therefore, 3.6 was used for the value of chick.

Further, when the equation (13) is calculated with the Young's modulus of polyimide (= 2) = 2.5 GPa and H = 3.6,

1

[0104] [Equation 24]

^ ≥0.6 6 7 x10 " ^β . That is, when the thickness (t) of the elastic member is 0 · 667 10 ^_6 111 or more (667 111 or more), Equation (13) is satisfied. In the example, the thickness of the elastic member was 680 / m

[0105] Further, as comparative examples, a sheet-like elastic member made of polyetherimide having a thickness of 200 μΐη that does not satisfy the formula (13) is arranged (Comparative Example 1) and an elastic member that does not use an elastic member (ratio) Comparative Example 2) was also evaluated for imprints.

FIGS. 7 to 9 show photographs of the thin film on the silicon substrate after the transfer, respectively.

In the thin film of Example 1, the pattern of the mold is almost 100% transferred (see FIG. 7). In contrast, only about 40% of the mold pattern was transferred to the thin film of Comparative Example 1 (see Fig. 8). See). In the thin film of Comparative Example 2, most of the pattern of the mold was not transferred except for the outer peripheral portion (see FIG. 9).

[0107] From the above, it has become clear that the present invention can transfer a pattern uniformly and at high speed.

Industrial applicability

According to the present invention, a pattern of a mold or a substrate (processing object) can be transferred uniformly and at high speed.

Claims

Claims [1] In a micro-machining apparatus that presses a mold having a predetermined pattern and an object to be processed and transfers the pattern of the mold to the object to be processed, a mold holder that holds the mold. A mold holding base made of a rigid body, and an elastic member that is disposed between the mold holding base and the mold and has a thickness that satisfies the following formula (1): Mold holder to do.

[Equation 1] ≥ · 'Expression (1) t: Thickness of the elastic member

E: Young's modulus of inertia

σ: average pressure between the mold and the workpiece

[2] In a microfabrication apparatus that presses a mold having a predetermined pattern and a workpiece to transfer the pattern of the mold to the workpiece, a mold holder for holding the mold, from a rigid body A mold holding substrate,

An elastic member disposed between the mold holding substrate and the mold and having a thickness satisfying the following formula (2):

A mold holder characterized by comprising:

[Equation 2] ... Formula ( ₂₎

t: thickness of the elastic member λ Waviness of at least one of the mold and the workpiece a: ratio of “difference between maximum pressure and minimum pressure” to “average pressure” in the contact surface between the mold and the workpiece

E: Young's modulus of inertia

σ: average pressure between the mold and the workpiece

[3] The mold holder according to claim 1 or 2, wherein the elastic member has a thermal conductivity of 0.17 (W / m'K) or more.

[4] In a microfabrication apparatus that presses a mold having a predetermined pattern and an object to be processed and transfers the pattern of the mold to the object to be processed, a mold holder for holding the mold, A mold holding substrate,

An elastic member disposed between the mold holding base and the mold and having a thermal conductivity of 0.17 (W / m-K) or more;

A mold holder characterized by comprising:

[5] The mold holder according to any one of claims 1 to 4, wherein the elastic member is made of a rubber adhesive.

6. The elastic member is formed so as to have a magnetic force.

The mold holder as described in 5).

7. The mold holder according to any one of claims 1 to 6, wherein the mold holding base includes a magnet.

8. The mold holder according to claim 1, wherein the elastic member is formed with a groove for vacuum-sucking the mold.

[9] In a microfabrication apparatus that presses a mold having a predetermined pattern and a workpiece to transfer the pattern of the mold to the workpiece.

A mold holding base made of a rigid body, and an elastic member that is disposed between the mold holding base and the mold and has a thickness t satisfying the following formula (3). Hold

1

A fine processing apparatus comprising a mold holder.

[Equation 3] r _t ≥ ^-··· Equation (3) t _i: Thickness of the elastic member

λ Waviness of at least one of the mold and the workpiece a: ratio of “difference between maximum pressure and minimum pressure” to “average pressure” in the contact surface between the mold and the workpiece

E: Young's modulus of inertia

σ: average pressure between the mold and the workpiece

[10] In a microfabrication apparatus that presses a mold having a predetermined pattern and a workpiece to transfer the pattern of the mold to the workpiece.

A mold holding base made of a rigid body, and an elastic member that is disposed between the mold holding base and the mold and has a thickness t satisfying the following formula (4). Hold

1

A fine processing apparatus comprising a mold holder.

[Equation 4] ... Formula ( ₄₎

t: thickness of the elastic member

The size of the swell of at least one of the mold and the workpiece a: ratio of the “difference between the maximum pressure and the minimum pressure” to the “average pressure” in the contact surface between the mold and the workpiece

E: Young's modulus of inertia

σ: average pressure between the mold and the workpiece

11. The microfabrication apparatus according to claim 9, wherein the elastic member has a thermal conductivity of 0.17 (W / m * K) or more.

[12] In a microfabrication apparatus that presses a mold having a predetermined pattern and a workpiece to transfer the pattern of the mold to the workpiece.

A mold holding base composed of a rigid body, and an elastic member disposed between the mold holding base and the mold and having a thermal conductivity of 0.17 (W / m'K) or more, Hold the mold A microfabrication apparatus comprising a mold holder.

[13] In a fine processing apparatus that presses a mold having a predetermined pattern and a workpiece to transfer the pattern of the mold to the processing object, the processing object that holds the processing object A holding tool,

A workpiece holding substrate made of a rigid body;

It is disposed between the workpiece holding base and the workpiece, and the thickness is

2 an elastic member formed to satisfy the following formula (5);

A workpiece holding tool characterized by comprising:

[Equation 5] r ₂ ≥ · '(5) t: thickness of the elastic member

2

λ: The size of the undulation of at least one of the mold and the workpiece

2

Ε: Young's modulus of the inertia member

2

σ: average pressure between the mold and the workpiece

2

[14] In a fine processing apparatus that presses a mold having a predetermined pattern and an object to be processed to transfer the pattern of the mold to the object to be processed, the object to be processed that holds the object to be processed A holding tool,

A workpiece holding substrate made of a rigid body;

2 an elastic member formed to satisfy the following formula (6);

A workpiece holding tool characterized by comprising:

[Equation 6]

≥ _f2 ≥ fe.. 'Equation (6)

β σ _ζ β σ ₂ t: thickness of the elastic member λ: The size of the undulation of at least one of the mold and the workpiece

2

i3: Ratio of “difference between maximum pressure and minimum pressure” to “average pressure” in the contact surface between the mold and the workpiece

E: Young's modulus of inertia

2

σ: average pressure between the mold and the workpiece

2

15. The workpiece holding tool according to claim 13 or 14, wherein the elastic member has a thermal conductivity of 0.17 (W / m′K) or more.

[16] In a fine processing apparatus that presses a mold having a predetermined pattern and an object to be processed to transfer the pattern of the mold to the object to be processed, the object to be processed that holds the object to be processed A holding tool,

A workpiece holding substrate made of a rigid body;

An elastic member disposed between the workpiece holding substrate and the workpiece and having a thermal conductivity of 0.17 (W / m * K) or more;

A workpiece holding tool characterized by comprising:

17. The workpiece holder according to claim 13, wherein the elastic member is made of a rubber adhesive.

18. The processing object holder according to any one of claims 13 to 17, wherein the elastic member is formed with a groove for vacuum-sucking the processing object.

[19] In a micromachining apparatus that presses a mold having a predetermined pattern and a workpiece to transfer the pattern of the mold to the workpiece.

A processing object holding base made of a rigid body, and an elastic portion that is disposed between the processing object holding base and the processing target and has a thickness that satisfies the following formula (7):

2

And a processing object holder for holding the processing object.

[Equation 7] 2≥ · · Equation (7)

&. 2

t: thickness of the elastic member λ: The size of the undulation of at least one of the mold and the workpiece

2

Ε: Young's modulus of the inertia member

2

σ: average pressure between the mold and the workpiece

2

[20] In a microfabrication apparatus that presses a mold having a predetermined pattern and a workpiece to transfer the pattern of the mold to the workpiece.

A workpiece holding base made of a rigid body, and an elastic portion that is disposed between the workpiece holding base and the workpiece and has a thickness that satisfies the following formula (8):

2

And a processing object holder for holding the processing object.

[Equation 8].. Formula (8)

t: thickness of the elastic member

2

λ: The size of the undulation of at least one of the mold and the workpiece

2

Ε: Young's modulus of the inertia member

2

σ: average pressure between the mold and the workpiece

2

21. The microfabrication apparatus according to claim 19, wherein the elastic member has a thermal conductivity of 0.17 (W / m′K) or more.

[22] In a microfabrication apparatus that presses a mold having a predetermined pattern and a workpiece to transfer the pattern of the mold to the workpiece.

A workpiece holding base made of a rigid body and an elastic member having a thermal conductivity of 0.17 (W / m * K) or more and disposed between the workpiece holding base and the workpiece. And a processing target object holder for holding the processing target object.

[23] In a micromachining apparatus that presses a mold having a predetermined pattern and a workpiece to transfer the pattern of the mold to the workpiece, the mold is attached to a mold holder that holds the mold A method,

A mold attaching method, wherein the mold is attached to the mold holder using a rubber adhesive.

24. The mold holder according to claim 5, wherein the rubber-based adhesive loses adhesiveness at a temperature higher than a processing temperature when pressing the mold and the workpiece. .

[25] The processing object according to claim 17, wherein the rubber-based adhesive loses adhesiveness at a temperature higher than a processing temperature when pressing the mold and the processing object. Holding equipment.

26. The mold attachment method according to claim 23, wherein the rubber adhesive loses adhesiveness at a temperature higher than a processing temperature when pressing the mold and the workpiece. .