JP2007276410A - Processing object holding device and microfabrication apparatus provided with the same, and processing object for microfabrication - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a holding device for a processing object and a microfabrication apparatus provided with the same, and a processing object for microfabrication. <P>SOLUTION: In the microfabrication apparatus for transferring a pattern of a mold 100 to the processing object 200 by pressing the mold 100 having a predetermined pattern to the object 200, the processing object holding device 12 for holding the processing object 200 is provided with a surface treating layer 122 comprising a material having a surface energy lower than that of Si such as a release agent or formed by an oxide film treatment or a nitride film treatment at the side holding the processing object 200. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a processing object holder having good releasability, a micro processing apparatus including the processing object holder, and a processing object for micro processing.

  In order to form a fine circuit pattern typified by an LSI (Large Scale Integrated Circuit) on a semiconductor substrate (hereinafter simply referred to as a substrate), a technique called photolithography is generally used. However, this method has led to an increase in the size and cost of the apparatus as the pattern to be formed is miniaturized.

  In addition, in order to obtain a fine molded product, a resin melted by heating is poured into a mold heated to a temperature lower than the glass transition temperature of the resin at high speed and high pressure, and solidified while controlling the pressure. Molding is also used. However, in this method, since the supplied resin is solidified while taking heat away from the mold, it is difficult for the resin to enter the fine pattern of the mold, and it is difficult to form a fine shape. . It is also conceivable to heat the mold and wait for the resin to enter the fine pattern, and then cool and mold the mold. However, in injection molding, it is necessary to pour the resin into the mold at a high pressure, so a large mold that can withstand the high pressure is required, and as a result, the heat capacity of the mold increases, and heating and cooling take time. there were.

  In recent years, a nanoimprinting process technique for forming an ultrafine pattern on a workpiece such as a substrate or a film has been attracting attention as a means for solving the above problem (for example, see Patent Document 1). This process is performed in the following procedure, for example.

  First, a mold in which a pattern to be formed is formed on the surface is prepared, and a mold heated to a temperature higher than the glass transition temperature is pressed against a resin held at a temperature lower than the glass transition temperature. Then, the resin surface melts and flows, and the pattern of the mold is transferred to the resin. Next, the mold is cooled to solidify the resin, and the mold is released. Thereby, a pattern is formed in the resin.

  In this method, an expensive electron beam light source or optical system is not required, and a simple structure based on a heater and a press device can be used.

  Further, in this method, the resin can be penetrated into the fine pattern of the mold without the problem that the resin is deprived of heat and solidified. In addition, since a large mold that can withstand high pressure, such as injection molding, is unnecessary, the temperature can be raised and lowered at high speed, and the problem of throughput does not occur.

  In fact, by using nanoimprinting process technology, various microchips and microdevices such as optical devices such as diffraction gratings, photonic crystals, and waveguides, and fluid devices such as macrochannels and reactors can be manufactured. A possible situation is being realized.

US Pat. No. 5,772,905 (4th paragraph, lines 46-47)

  However, as the pattern size of the mold becomes smaller, the object to be processed has a problem that elongation occurs at the time of mold release or resin residue is generated on the mold. This problem becomes more prominent as the area of the pattern forming surface of the mold increases. This is thought to be because different forces are applied on the mold side and the workpiece holder side of the workpiece due to the difference in thermal shrinkage between the mold and the workpiece holder.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a workpiece holder having good releasability, a fine machining apparatus having the same, and a workpiece for fine machining.

  In order to achieve the above object, a processing object holder according to the present invention is a micromachining apparatus that presses a mold having a predetermined pattern and a processing object to transfer the pattern of the mold to the processing object. A processing object holder for holding the processing object, wherein a surface treatment layer made of a material having a surface energy lower than that of Si is provided on the side that holds the processing object. .

  Further, the processing object holder of the present invention is a micromachining apparatus that presses a mold having a predetermined pattern and a processing object, and transfers the pattern of the mold to the processing object. A workpiece holding tool to be held, comprising a surface treatment layer made of a release agent.

  Further, the processing object holder of the present invention is a micromachining apparatus that presses a mold having a predetermined pattern and a processing object, and transfers the pattern of the mold to the processing object. A workpiece holding tool to be held, comprising a surface treatment layer formed by at least one of an oxide film treatment and a nitride film treatment.

  Further, the processing object holder of the present invention is a micromachining apparatus that presses a mold having a predetermined pattern and a processing object, and transfers the pattern of the mold to the processing object. A workpiece holding tool to be held, characterized in that it is made of a material whose surface energy is lower than that of Si.

  Further, the processing object holder of the present invention is a micromachining apparatus that presses a mold having a predetermined pattern and a processing object, and transfers the pattern of the mold to the processing object. A workpiece holding tool to be held, wherein the mold has a thermal expansion coefficient of 0.9α to 1.1α, where α is a thermal expansion coefficient of the mold.

  Further, the processing object holder of the present invention is a micromachining apparatus that presses a mold having a predetermined pattern and a processing object, and transfers the pattern of the mold to the processing object. A workpiece holding tool to be held, which is made of the same material as the mold.

  The processing object holder is preferably formed so that the flatness of the surface on which the processing object is placed is 1 μm or less.

  The micromachining apparatus of the present invention is a micromachining apparatus that presses a mold having a predetermined pattern and a workpiece to transfer the pattern of the mold to the workpiece, and holds the workpiece. In addition, a workpiece holding tool having a surface treatment layer made of a material whose surface energy is lower than the surface energy of Si is provided on the side holding the workpiece.

  The micromachining apparatus of the present invention is a micromachining apparatus that presses a mold having a predetermined pattern and a workpiece, and transfers the pattern of the mold to the workpiece. While holding, the processing object holding tool which has the surface treatment layer which consists of a mold release agent in the side which hold | maintains the said processing object is characterized by the above-mentioned.

  The micromachining apparatus of the present invention is a micromachining apparatus that presses a mold having a predetermined pattern and a workpiece, and transfers the pattern of the mold to the workpiece. A workpiece holding tool having a surface treatment layer formed by at least one of an oxide film treatment and a nitride film treatment is provided on the side of holding the workpiece and holding the workpiece.

  The micromachining apparatus of the present invention is a micromachining apparatus that presses a mold having a predetermined pattern and a workpiece to transfer the pattern of the mold to the workpiece, and has a surface energy of Si. It is made of a material lower than the surface energy, and comprises a processing object holder for holding the processing object.

  The micromachining apparatus of the present invention is a micromachining apparatus that presses a mold having a predetermined pattern and a workpiece to transfer the pattern of the mold to the workpiece, and the thermal expansion of the mold When the coefficient is α, a workpiece holding tool having a thermal expansion coefficient of 0.9α to 1.1α is provided.

  The micromachining apparatus of the present invention is a micromachining apparatus that presses a mold having a predetermined pattern and a workpiece to transfer the pattern of the mold to the workpiece, and is the same as the mold. A workpiece holding tool made of a material is provided.

  It is preferable that the processing object holder has a flatness of a surface on the side holding the processing object to be 1 μm or less.

  The processing object of the present invention is a processing object on which a pattern of the mold is transferred by being pressed by a mold having a predetermined pattern, and surface energy is applied to at least one surface of the processing object. A surface treatment layer made of a material lower than the surface energy of the material constituting the workpiece is formed.

  The processing object of the present invention is a processing object on which a pattern of the mold is transferred by being pressed by a mold having a predetermined pattern, and is a surface on which at least the pattern of the processing object is transferred A different surface is provided with a surface treatment layer composed of a release agent.

  Further, it is a processing object to which the pattern of the mold is transferred by being pressed by a mold having a predetermined pattern, and is made of a material having a surface energy of 30 mN / m or less.

  According to the first, fourth, eighth, eleventh, fifteenth, and seventeenth aspects of the present invention, since the object to be processed is difficult to adhere to the object holder, the object to be processed is thermally contracted in accordance with the heat shrinkage of the mold Therefore, an excessive force is not applied to the object to be processed, and the mold release unevenness can be reduced.

  According to invention of Claim 2,9,16, a surface treatment layer can be easily formed using a mold release agent.

  According to the inventions of claims 3 and 10, since the surface treatment layer is formed by at least one of the oxide film treatment and the nitride film treatment, it is longer than the case where the surface treatment layer is formed by a release agent. The duration effect can be sustained.

  According to the invention described in claims 5, 6, 12 and 13, by setting the thermal expansion coefficients of the mold and the workpiece holder to the same or close to each other, the mold side of the workpiece and the workpiece holder Since the difference in thermal expansion from the side can be reduced, an excessive force is not applied to the object to be processed, and the mold release unevenness can be reduced.

  According to the invention of Claims 7 and 14, since the flatness of the surface on which the workpiece to be processed is placed is set to 1 μm or less, the workpiece to be processed is further a workpiece holding tool. Can be prevented from being adhered to each other, and the releasability can be improved.

  Embodiments of the present invention will be described below in detail with reference to the drawings.

  As shown in FIG. 1, the micromachining apparatus 1 of the present invention is a micromachining apparatus that presses a mold 100 having a predetermined pattern and a workpiece 200 to transfer the pattern of the mold 100 to the workpiece 200. The workpiece holder 12 that holds the workpiece 200, the mold holder 2 that holds the die 100, the relative position of the die 100 with respect to the workpiece 200, and the displacement speed that changes the position. Adjustable displacement means 5, position detection means 7 for detecting the relative position of the mold 100 with respect to the workpiece 200, pressure detection means 8 for detecting the pressure between the mold 100 and the workpiece 200, A mold heating means 3 for heating the mold 100, a mold cooling means 4 for cooling the mold 100, a mold temperature detecting means 31 for detecting the temperature of the mold 100, and a workpiece heating means 13 for heating the workpiece 200. Processing object cooling means 14 for cooling the processing object 200, processing object temperature detection means 131 for detecting the temperature of the processing object 200, position detection means 7, pressure detection means 8, mold temperature detection means 31, and processing Control means 300 for controlling the operation of the displacement means 5, the mold heating means 3, the mold cooling means 4, the workpiece heating means 13, and the workpiece cooling means 14 based on the detection information of the object temperature detection means 131; It is mainly composed of.

  The workpiece holder 12 according to the present invention minimizes the force imbalance in the planar direction of the workpiece 200 caused by the difference in thermal expansion between the mold 100 and the workpiece holder 12.

  Specifically, as shown in FIG. 2, the workpiece holder 12 of the present invention holds (or places) the workpiece 200, and on the side that holds the workpiece 200, A surface treatment layer 122 that makes it difficult to bond the workpiece 200 and the workpiece holder 12 is formed.

  When formed in this way, the workpiece holder 12 and the workpiece 200 are difficult to adhere. Therefore, the workpiece 200 slides against the workpiece holder 12, and the mold 100 and the workpiece 200 can be integrally heat-shrinked, and therefore an excessive force is applied to the workpiece 200. No unevenness in mold release can be reduced.

  In this case, it is preferable to form the surface treatment layer 122 made of a material lower than the surface energy of Si.

  The surface treatment layer 122 may be formed by, for example, applying a release agent applied between the mold 100 and the workpiece 200 to the surface of the workpiece holding base 121. In this case, any release agent may be used. For example, a fluorine-based release agent may be used. Further, the surface treatment layer 122 may be formed by one or both of oxide film treatment and nitride film treatment. Of course, the surface treatment layer 122 may be formed by any other method as long as it makes it difficult to bond the workpiece 200 and the workpiece holder 12.

  The workpiece holding base 121 is a hard material that is heat resistant to the machining process performed by the microfabrication apparatus 1 and may be any material as long as the surface treatment layer 122 can be formed. Metals such as copper, steel, tungsten, platinum, and titanium, inorganic materials such as ceramics (silicon, alumina, and the like), and organic materials such as fluorine resins can be used.

  Moreover, you may form the workpiece holding tool 12 with the material itself lower than the surface energy of Si. In this case, for example, a fluorine resin or a cyclic olefin resin can be used.

  Further, another workpiece holder 12 of the present invention is characterized in that it has a coefficient of thermal expansion of 0.9α to 1.1α, where α is the coefficient of thermal expansion of the mold 100. It is. In this case, the thermal expansion coefficient is preferably 0.95α or more and 1.05α or less, and more preferably the thermal expansion coefficient is the same as that of the mold 100. For example, the mold 100 and the workpiece holder 12 may be formed of the same material.

  Thereby, since the difference in thermal expansion between the mold 100 side of the workpiece 200 and the workpiece holder 12 side can be reduced, an unreasonable force is not applied to the workpiece 200 and the mold release is uneven. Can be reduced.

  Note that the surface treatment layer 122 described above may be further formed on the workpiece holder 12.

  Moreover, it is better to form the workpiece holding tool 12 as high as possible in the flatness of the surface on which the workpiece 200 is placed, for example, 1 μm or less, preferably 100 nm or less, more preferably 10 nm or less, Preferably, it is better to form it to 1 nm or less.

  Further, the processing object holder 12 may be formed so as to include a vacuum chuck that vacuum-sucks the processing object 200 or an electrostatic chuck that electrostatically attracts the processing object 200 so that the processing object 200 can be easily removed. good. For example, when using a vacuum chuck, the workpiece holder 12 is formed with a vacuum suction groove and a suction port connected to a suction path formed in the workpiece holding base 121 (not shown). ). The suction path of the workpiece holding base 121 is connected to gas suction means such as a vacuum pump. Accordingly, the vacuum chuck suction is turned off during molding, and the workpiece 200 can be thermally contracted when heated or cooled, and the vacuum chuck suction is turned on at the time of mold release, so that the workpiece 100 can be processed. The object 200 can be released. In addition, it is also possible to use a separate means for releasing, for example, a robot that holds the workpiece 200 and releases it.

  Various objects can be used as the processing object 200, for example, polycarbonate, polyimide, polytetrafluoroethylene (PTFE), polyethylene, polystyrene, polypropylene, paraffin, cyclic olefin-based thermoplastic resin, aluminum, and the like. A material in which a material such as glass, quartz glass, silicon, gallium arsenide, sapphire, magnesium oxide, or the like forms a sheet or a film can be used. In this case, the effects of the present invention become more prominent as the thickness decreases to 1 mm or less, 500 μm or less, 100 μm or less, 50 μm or less, or 40 μm or less. Further, the workpiece 200 may have a substrate shape. In this case, the surface energy of the workpiece 200 should be low so as not to adhere to the workpiece holder 12. For example, the surface energy is 30 mN / m or less, preferably 25 mN / m or less, more preferably 20 mN / m. m is good.

  Further, at least one surface of the workpiece 200 (at least the surface opposite to the surface 200a on which the pattern is formed) is made of a material whose surface energy is at least lower than the surface energy of the material constituting the workpiece 200. A surface treatment layer may be formed. For example, a material having a surface energy of 30 mN / m or less, preferably 25 mN / m or less, and more preferably 20 mN / m may be used. Specifically, a mold release agent that is applied between the mold 100 and the workpiece 200 can be applied to at least the surface of the workpiece 200 on the workpiece holder 12 side. Further, any release agent may be used, and for example, a fluorine-based release agent can be used.

  Further, a processing object heating means 13 for heating the processing object 200, for example, a very responsive carbon heater is provided below the processing object holder 12. The carbon heater is controlled by the control means 300 to supply current from a power source (not shown), and can maintain the workpiece 200 on the holding stage at a predetermined constant temperature. As the heater, for example, a heat transfer heater, a ceramic heater, a halogen heater, an IH heater, or the like can be used.

  Further, a workpiece cooling means 14 for cooling the workpiece 200 can be provided below the holding stage. As the processing object cooling means 14, for example, cooling of water, oil or the like cooling liquid, air, inert gas, etc. inside the processing object holder 12 formed of a metal having high thermal conductivity such as aluminum or copper. The cooling flow path which can cool the workpiece 200 can be used by flowing gas.

  Further, a processing object temperature detecting means 131 for detecting the temperature of the processing object 200, for example, a thermocouple, can be provided in the vicinity of the processing object 200, for example, the processing object holder 12. In this case, the processing object temperature detection means 131 is electrically connected to the control means 300 and is formed so as to transmit information regarding the detected temperature of the processing object 200 to the control means 300.

  Although not shown in the drawings, the mold holder 2 holds the mold 100 on the mold holding surface 2a and may be anything as long as it can hold the mold 100. For example, it is composed of a rigid mold holding base and an elastic member disposed between the mold holding base and the mold 100.

  The mold holding base is formed of a highly rigid material, for example, a metal such as nickel or stainless steel. Further, the mold holding base has a flat surface on the side for holding the mold 100. The flatness of this surface is preferably formed as high as possible, for example, 1 μm or less, preferably 100 nm or less, more preferably 10 nm or less, and further preferably 1 nm or less. Of course, the mold holding base can be formed in a curved surface or a roll shape on the side on which the mold 100 is held.

  The elastic member is a flat sheet disposed between the mold holding base and the mold 100, and when the mold 100 and the workpiece 200 are pressed, the mold 100 and the workpiece 200 are fine. It is for absorbing swells and irregularities. Therefore, the elastic member is preferably formed with a thickness that absorbs fine waviness and unevenness of the mold 100 or the workpiece 200 and realizes a uniform stress distribution.

  Further, in order to improve the temperature raising / lowering speed (throughput), it is preferable to form the thermal conductivity of the elastic member as high as possible. Specifically, it is better that the thermal conductivity is 0.17 (W / m · K) or more, preferably 0.2 (W / m · K) or more, more preferably 0.3. (W / m · K) or higher, more preferably 1 (W / m · K) or higher, more preferably 2 (W / m · K) or higher, and further preferably 4 (W / m · K).・ K) or better.

  In addition, since the elastic member is disposed between the mold heating unit 3 and the mold 100 heated by the mold heating unit 3, it is necessary to have heat resistance at least equal to or higher than the processing temperature in the imprint process. For example, when the mold 100 is heated to a temperature higher than the glass transition temperature of the workpiece 200, the heat resistance temperature of the elastic member needs to be at least equal to or higher than the glass transition temperature (Tg). Tg + 20 ° C.) or higher, more preferably glass transition temperature + 40 ° C. (Tg + 40 ° C.) or higher, more preferably glass transition temperature + 60 ° C. (Tg + 60 ° C.) or higher. . Specifically, when the workpiece 200 is made of a cyclic olefin copolymer: COC (Cyclo Olefin Copolymer) (glass transition temperature 138 ° C.), the heat resistant temperature of the elastic member is formed to be 138 ° C. or higher. Preferably, it is formed at 158 ° C or higher, more preferably 178 ° C or higher, more preferably 198 ° C or higher.

  Further, the mold holder 2 may be formed to include a vacuum chuck capable of attracting the mold 100 so that the mold 100 can be easily removed. In this case, the elastic member is formed with a vacuum suction groove and a suction port connected to a suction path formed in the mold holding base. The suction path of the mold holding base is connected to gas suction means such as a vacuum pump. In this case, the groove is formed to a size that adsorbs a portion outside the surface (pattern surface 100a) on which the pattern of the mold is formed and outside the region occupied by the pattern formed on the mold. As a result, the elastic member also serves as a seal, and the mold 100 can be securely held by suction.

  The mold holder 2 can also be formed to have a magnetic force capable of attracting and holding a mold (mold 100) made of a ferromagnetic material. In this case, it is necessary to use a magnet material having a Curie point equal to or higher than the processing temperature in the imprint process. The magnet may be formed as a permanent magnet or an electromagnet, and all or a part of the elastic member or the mold holding base may be formed as a magnet.

  The mold 100 is formed of, for example, “metal such as nickel”, “ceramics”, “carbon material such as glassy carbon”, “silicon”, and the like, and a predetermined pattern is formed on one end surface (pattern surface 100a). Has been. This pattern can be formed by subjecting the pattern surface 100a to precision machining. In addition, after a predetermined pattern is formed on a silicon substrate or the like used as a master disk of the mold 100 by a semiconductor micromachining technique such as etching, the surface of the silicon substrate or the like is subjected to metal plating by an electroforming method, for example, a nickel plating method. The metal plating layer can be peeled off to form a pattern. Of course, the material and manufacturing method of the mold 100 are not particularly limited as long as a fine pattern can be formed. The width of this pattern (dimension in the planar direction of the workpiece 200) depends on the type of the workpiece 200 used, but is various, such as 100 μm or less, 10 μm or less, 2 μm or less, 1 μm or less, 100 nm or less, 10 nm or less. Formed in size. Furthermore, the depth of this pattern (the vertical dimension of the workpiece 200) is formed in various sizes such as 10 nm or more, 100 nm or more, 200 nm or more, 500 nm or more, 1 μm or more, 10 μm or more, 100 μm or more. The aspect ratio of this pattern includes various patterns such as 0.2 or more, 0.5 or more, 1 or more, 2 or more.

  In addition, the mold 100 is formed to have a thickness that allows the undulation and unevenness of the mold 100 or the workpiece 200 to be deformed toward the elastic member when the mold 100 and the workpiece 200 are pressed, for example, 0.001 to 2 mm. Further, since the mold 100 is heated and cooled during the imprint process, it is preferable to make the mold 100 as thin as possible and reduce its heat capacity.

  As shown in FIG. 1, the mold heating means 3 is provided on the side facing the mold 100 with respect to the mold holder 2, and for example, a carbon heater having very good responsiveness is used. The carbon heater (die heating means 3) is controlled by the control means 300 to supply current from a power source (not shown), and can maintain the die 100 at a predetermined constant temperature. As the heater, for example, a heat transfer heater, a ceramic heater, a halogen heater, an IH heater, or the like can be used.

  As shown in FIG. 1, the mold cooling means 4 is provided on the side facing the mold 100 with respect to the mold holder 2, and is a container made of a metal having high thermal conductivity such as aluminum or copper. A cooling channel capable of cooling the mold 100 can be used by flowing a cooling liquid such as water or oil, or a cooling gas such as air or inert gas inside.

  Further, in the vicinity of the mold 100, for example, the mold holder 2, a mold temperature detecting means 31, for example, a thermocouple, for detecting the temperature of the mold 100 is provided. The mold temperature detection means 31 is electrically connected to the control means 300 and is formed so as to transmit information regarding the detected temperature of the mold 100 to the control means 300.

  As shown in FIG. 1, the displacing means 5 includes, for example, a ball screw 51 arranged in the vertical direction and an electric motor 52 that rotationally drives the ball screw 51. Further, the lower end portion of the ball screw 51 and the upper surface of the mold holder 2 are connected via a pressing portion 53 and a bearing mechanism 54. Then, the ball screw 51 is rotationally driven by the electric motor 52, so that the pressing portion 53 is placed on the mold 100 and the workpiece 200 with respect to a plurality of, for example, four columns 56 provided between the base 50 and the upper base 55. Can be displaced in the direction of contact / separation (hereinafter referred to as the Z direction). As the electric motor 52, various types such as a direct current motor, an alternating current motor, a stepping motor, and a servo motor can be used. Here, it is preferable that the displacement means 5 can adjust the position of the mold 100 with respect to the workpiece 200 by a displacement amount equal to or less than the depth of the pattern of the mold 100. Specifically, it is preferable that the amount of displacement can be adjusted to 100 μm or less, preferably 10 μm or less, more preferably 1 μm or less, more preferably 100 nm or less, more preferably 10 nm or less, more preferably 1 nm or less. What can be done is preferred.

  Further, the displacement means 5 is preferably one that can adjust the displacement speed of the mold 100 relative to the workpiece 200. Specifically, it can be adjusted at 100 μm / second or less, preferably 10 μm / second or less, more preferably 1 μm / second or less, further preferably 100 nm / second or less, more preferably 10 nm / second or less, and still more preferably. Those that can be adjusted at 1 nm / second or less are preferable. This is because the control means 300 controls the operation of the displacement means 5 based on the information detected by the pressure detection means 8 and adjusts the pressure between the mold 100 and the workpiece 200, but the pressure detection means 8 It takes some time to feed back the detected information to the displacement means 5. Therefore, if the displacement speed is too high, the information detected by the pressure detection means 8 is delayed from being fed back to the displacement means 5, and the actual pressure between the mold 100 and the workpiece 200 cannot be accurately controlled. Because.

  Here, the case where the displacement means 5 is provided on the mold holder 2 side has been described, but it is of course possible to provide it on the workpiece holder 12 side. Further, the displacement means 5 is not limited to one constituted by a ball screw and an electric motor as long as the relative displacement amount and displacement speed between the mold 100 and the workpiece 200 can be adjusted. It is also possible to use a piezoelectric element that can change the size (dimension) by adjusting, and a magnetostrictive element that can change the size (dimension) by adjusting the magnetic field. It is of course possible to use both a ball screw and an electric motor and a piezoelectric element or a magnetostrictive element. In this case, a ball screw and an electric motor are applied when the mold 100 and the workpiece 200 are largely displaced, and a piezoelectric element or a magnetostrictive element is used when the mold 100 and the workpiece 200 are displaced by a small amount. be able to. Further, it is of course possible to use a hydraulic type or a pneumatic type.

  By configuring the displacing means 5 in this way, the mold holder 2 that holds the mold 100 is moved up and down, and the pattern surface 100 a of the mold 100 is precisely set against the workpiece 200 held by the workpiece holder 12. Can be approached, pressed, and separated.

  The position detecting means 7 is formed by, for example, a linear scale arranged on the mold holder 2. Using this linear scale, the distance between the workpiece 200 and the mold holder 2 can be measured, and the relative position and displacement speed of the mold 100 with respect to the workpiece 200 can be calculated and detected from the measured value. . Further, the position detection means 7 is electrically connected to the control means 300 and is formed to transmit information on the detected position and displacement speed of the mold 100. The position detection means 7 is not limited to a linear scale, and various types can be used. For example, the position of the workpiece 200 is measured using a laser length measuring device provided on the mold holder 2 side. Alternatively, the position of the mold 100 may be measured using a laser length measuring machine provided on the workpiece holder 12 side. Alternatively, an encoder provided in the electric motor may be used to measure the amount of displacement of the displacement means 5 by calculation. The resolution of the position detection means 7 is preferably one that can be detected with a value that is at least smaller than the size of the pattern of the mold 100 in the depth direction (Z direction) or less than the amount of displacement that the displacement means 5 can adjust. Specifically, it can be detected at 100 μm or less, preferably 10 μm or less, more preferably 1 μm or less, further preferably 100 nm or less, more preferably 10 nm or less, and further preferably 1 nm or less. What can be done is preferred.

  By configuring the position detecting means 7 in this way, the position of the pattern surface 100a of the mold 100 with respect to the workpiece 200 is precisely adjusted according to the size of the pattern and the pressure between the mold 100 and the workpiece 200. Therefore, the pattern transfer property and mold release property can be improved.

  The pressure detection unit 8 detects a pressure between the mold 100 and the workpiece 200, and for example, a load cell that measures a load between the mold 100 and the workpiece 200 can be used. Thus, if the load is measured and divided by the area of the pattern surface 100a of the mold 100, the pressure between the mold 100 and the workpiece 200 can be detected. Moreover, the pressure detection means 8 is electrically connected to the control means 300, and is configured to transmit information regarding the detected pressure.

  Based on the detection information of the position detecting means 7, the pressure detecting means 8, the mold temperature detecting means 31, and the workpiece temperature detecting means 131, the control means 300 is based on the displacement means 5, the pressing means 6, the mold heating means 3, the mold cooling. For controlling the operation of the means 4, the workpiece heating means 13, and the workpiece cooling means 14, for example, a computer can be used.

  EXAMPLES Hereinafter, although an Example demonstrates this invention, this invention is not limited to an Example.

  A film made of cycloolefin polymer (COP) was used as the object to be processed, and an imprint apparatus (VX-2000N-US) manufactured by SCIVAX was used for pattern formation on the film. As the mold, a 30 mm × 30 mm nickel (Ni) mold was used. The shape of the pattern is a continuous rectangle with a side of 2 μm (the length of the side including the line width is 2.5 μm), the line width is 250 nm, and the height of the line is 380 nm (with an aspect ratio of about 1.). 5) was used.

As processing object holder,
(1) silicon (Si),
(2) Using a silicon substrate as the workpiece holding base 121 and using a release agent (NOVEC: registered trademark) as the surface treatment layer 122,
(3) A material made of nickel (Ni), which is the same material as the mold,
The following three types were used. The surface treatment layer 122 of (2) was formed by immersing a silicon substrate (processing object holding base 121) in a release agent and rinsing, followed by heat treatment at 90 ° C. in a furnace.

  The above film was placed on these workpiece holders, and after pressing the mold 100 heated to the glass transition temperature or higher of the film, the experiment was performed by cooling to the glass transition temperature or lower and releasing the mold. . Photographs of the film on which the pattern is formed are shown in FIGS.

  In the case of the workpiece holder (1), peeling or the like occurred on the film surface (see FIG. 3). On the other hand, in the case of the workpiece holders of (2) and (3), the film surface was not peeled off and could be released cleanly (see FIGS. 4 and 5).

It is a front view which shows the microfabrication apparatus of this invention. It is a schematic sectional drawing which shows the processing target object holder of this invention. It is a photograph at the time of transferring a pattern to a film with the conventional workpiece holder. It is a photograph at the time of transferring a pattern to a film using the processing object holder of the present invention. It is a photograph at the time of transferring a pattern to a film using another processing object holder of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Fine processing apparatus 12 Processing object holder 122 Surface treatment layer 100 Type 200 Processing object

Claims (17)

In a micromachining apparatus that presses a mold having a predetermined pattern and a workpiece and transfers the pattern of the mold to the workpiece, a workpiece holding tool that holds the workpiece.
A processing object holder, comprising a surface treatment layer made of a material having a surface energy lower than that of Si on a side for holding the processing object. In a micromachining apparatus that presses a mold having a predetermined pattern and a workpiece and transfers the pattern of the mold to the workpiece, a workpiece holding tool that holds the workpiece.
A workpiece holder comprising a surface treatment layer made of a release agent. In a micromachining apparatus that presses a mold having a predetermined pattern and a workpiece and transfers the pattern of the mold to the workpiece, a workpiece holding tool that holds the workpiece.
A workpiece holder comprising a surface treatment layer formed by at least one of an oxide film treatment and a nitride film treatment. In a micromachining apparatus that presses a mold having a predetermined pattern and a workpiece and transfers the pattern of the mold to the workpiece, a workpiece holding tool that holds the workpiece.
A workpiece holder, characterized by comprising a material having a surface energy lower than that of Si. In a micromachining apparatus that presses a mold having a predetermined pattern and a workpiece and transfers the pattern of the mold to the workpiece, a workpiece holding tool that holds the workpiece.
A workpiece holder having a thermal expansion coefficient of 0.9α to 1.1α, where α is the thermal expansion coefficient of the mold. In a micromachining apparatus that presses a mold having a predetermined pattern and a workpiece and transfers the pattern of the mold to the workpiece, a workpiece holding tool that holds the workpiece.
A workpiece holder made of the same material as the mold.   The processing object holder according to claim 1, wherein a flatness of a surface on which the processing object is placed is formed to be 1 μm or less. A micromachining device that presses a mold having a predetermined pattern and a workpiece, and transfers the pattern of the mold to the workpiece,
A fine object comprising: a workpiece holding tool having a surface treatment layer made of a material having a surface energy lower than that of Si on the side holding the workpiece and holding the workpiece. Processing equipment. A micromachining device that presses a mold having a predetermined pattern and a workpiece, and transfers the pattern of the mold to the workpiece,
A fine processing apparatus comprising a processing object holder having a surface treatment layer made of a release agent on the side of holding the processing object and holding the processing object. A micromachining device that presses a mold having a predetermined pattern and a workpiece, and transfers the pattern of the mold to the workpiece,
A workpiece holding tool having a surface treatment layer formed by at least one of an oxide film treatment and a nitride film treatment on the side holding the workpiece and holding the workpiece. A featured microfabrication device. A micromachining device that presses a mold having a predetermined pattern and a workpiece, and transfers the pattern of the mold to the workpiece,
A fine processing apparatus comprising a processing object holder made of a material having a surface energy lower than that of Si, and holding the processing object. A micromachining device that presses a mold having a predetermined pattern and a workpiece, and transfers the pattern of the mold to the workpiece,
A fine processing apparatus comprising a workpiece holder having a thermal expansion coefficient of 0.9α to 1.1α, where α is a thermal expansion coefficient of the mold. A micromachining device that presses a mold having a predetermined pattern and a workpiece, and transfers the pattern of the mold to the workpiece,
A fine processing apparatus comprising a processing object holder made of the same material as the mold.   The fine processing apparatus according to any one of claims 8 to 13, wherein the processing object holder has a flatness of a surface of the processing object holding side of 1 µm or less. A workpiece to be processed, which is pressed by a mold having a predetermined pattern and the pattern of the mold is transferred to the workpiece.
A processing object, wherein a surface treatment layer made of a material having a surface energy lower than that of a material constituting the processing object is formed on at least one surface of the processing object. A workpiece to be processed, which is pressed by a mold having a predetermined pattern and the pattern of the mold is transferred to the workpiece.
A processing object comprising a surface treatment layer made of a release agent on at least a surface of the processing object which is different from a surface onto which a pattern is transferred. A workpiece to be processed, which is pressed by a mold having a predetermined pattern and the pattern of the mold is transferred to the workpiece.
A processing object comprising a material having a surface energy of 30 mN / m or less.

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