JPWO2006082867A1 - Hybrid contact / separation system - Google Patents

Abstract

Displacement means 5 that can adjust the relative position and displacement speed of the mold 100 and the workpiece 200, and a pressing means 6 that can press the mold 100 and the workpiece 200 and can adjust the pressing pressure. Position detecting means 51 capable of detecting the relative position between the mold 100 and the workpiece 200, pressure detecting means 61 for detecting the pressure of the pressing means 6, and information detected by the position detecting means 51 and the pressure detecting means 61 And a control means 300 for controlling the displacing means 5 and the pressing means 6.

Description

  The present invention relates to a hybrid contact / separation system for contacting and separating a mold and a workpiece.

  In order to form a fine circuit pattern typified by an LSI (Large Scale Integrated Circuit) on a semiconductor substrate (hereinafter simply referred to as a substrate), a technique called photolithography is generally used. However, this method has led to an increase in the size and cost of the apparatus as the pattern to be formed is miniaturized.

  In addition, in order to obtain a fine molded product, a resin melted by heating is poured into a mold heated to a temperature lower than the glass transition temperature of the resin at high speed and high pressure, and solidified while controlling the pressure. Molding is also used. However, in this method, since the supplied resin is solidified while taking heat away from the mold, it is difficult for the resin to enter the fine pattern of the mold, and it is difficult to form a fine shape. . It is also conceivable to heat the mold and wait for the resin to enter the fine pattern, and then cool and mold the mold. However, in the injection molding, since it is necessary to pour the resin into the mold at a high pressure, a large mold capable of withstanding the high pressure is required, and there is a problem that it takes time for heating and cooling.

  In recent years, attention has been paid to a nano-imprinting process technology for forming an ultrafine pattern on a substrate as a solution to the above problem (for example, see Non-Patent Document 1). This process is briefly described as follows. First, a mold in which a pattern to be formed is formed on the surface is prepared, and a mold heated to a temperature higher than the glass transition temperature is pressed against a resin held at a temperature lower than the glass transition temperature. Then, the resin surface is melted and fluidized, and the mold pattern is transferred to the resin. Next, the mold is cooled to solidify the resin, and the mold is released. Thereby, a pattern is formed in the resin.

  In this method, an expensive electron beam light source or optical system is not required, and a simple structure based on a heater and a press device can be used.

  Further, according to this method, the resin can penetrate into the fine pattern of the mold without the problem that the resin is deprived of heat and solidified. In addition, since a large mold that can withstand high pressure, such as injection molding, is unnecessary, the temperature can be raised and lowered at high speed, and the problem of throughput does not occur.

  In fact, it is possible to accurately transfer the shape formed in the mold as it is, and there is a report that a thin line having a line width of about 20 nm has already been formed by this method (for example, Non-Patent Document 2). reference.).

  Furthermore, by using such nanoimprinting process technology, various microchips and microdevices such as optical devices such as diffraction gratings, photonic crystals, and waveguides, and fluid devices such as macrochannels and reactors are used. The situation where it is possible to produce is now being realized.

G. M. Whitesides, J. C. Love, “New Technology for Creating Nanostructures”, “Nikkei Science”, Nikkei Inc., December 1, 2001, Vol. 31, No. 12, p. 30-41 C. M. Sotomayor, et. Al., “Nanoimprint lithography: an alternative nanofabrication approach”, “Materials Science & Engineering C”, Elsevier Science, 2002 (2002), 989, p. 1-9 International Publication Number WO2004 / 093171 (page 12, FIG. 2)

  By the way, in such a nano-imprinting process, the pattern transferability is affected by the amount of displacement and the displacement speed between the mold and the workpiece during pressing and releasing. It is becoming clear by study of. In particular, in order to mold micrometer and nanometer level patterns, it is necessary to control the relative displacement and displacement speed between the mold and the workpiece at the micrometer and nanometer levels.

  However, those using a fluid pressure mechanism such as hydraulic pressure or pneumatic pressure for contact and separation between the mold and the workpiece cannot accurately control the amount of displacement and the displacement speed between the mold and the workpiece. There was a problem. This is because the fluid pressure mechanism can control only the pressing force, so that the displacement speed changes due to increase or decrease in the adhesion force between the die and the workpiece when pressing or releasing.

  On the other hand, it is also possible to control the amount of displacement and the displacement speed between the mold and the workpiece using an electric servo motor. According to this, it is possible to accurately control the amount of displacement and the displacement speed between the mold and the workpiece. However, the electric servo motor has a small pressing force that can be output, and it is necessary to increase the size of the apparatus in order to process a substrate or the like with a large-area mold that requires a large pressing force.

  Therefore, an object of the present invention is to provide a machining apparatus that can output a large pressing force and can control a relative displacement amount and a displacement speed between a mold and a workpiece.

  In order to achieve the above object, a processing apparatus of the present invention is a processing apparatus that presses a mold having a predetermined pattern and a processing object, and transfers the pattern of the mold to the processing object. A displacement means capable of adjusting a relative position between the mold and the workpiece and a displacement speed for changing the position, and a press capable of pressing the mold and the workpiece, and adjusting the pressure to be pressed. And means.

  Further, another processing apparatus of the present invention is a processing apparatus that presses a mold having a predetermined pattern and an object to be processed, and transfers the pattern of the mold to the object to be processed. A displacement means capable of adjusting a relative position with respect to an object and a displacement speed for changing the position; a pressing means capable of pressing the mold and the object to be processed; and a pressure means capable of adjusting the pressing pressure; And displacing means and control means for controlling the pressing means.

  Furthermore, another processing apparatus of the present invention is a processing apparatus that presses a mold having a predetermined pattern and a processing object, and transfers the pattern of the mold to the processing object. A displacement means capable of adjusting a relative position with respect to a processing object and a displacement speed for changing the position; and a pressing means capable of adjusting the pressing pressure while pressing the mold and the processing object; Based on position detection means capable of detecting a relative position between the mold and the workpiece, pressure detection means for detecting the pressure of the pressing means, and information detected by the position detection means and the pressure detection means. And a control means for controlling the displacement means and the pressing means.

  Furthermore, another processing apparatus of the present invention is a processing apparatus that presses a mold having a predetermined pattern and a processing object, and transfers the pattern of the mold to the processing object. A displacement means capable of adjusting a relative position with respect to a processing object and a displacement speed for changing the position; and a pressing means capable of adjusting the pressing pressure while pressing the mold and the processing object; Position detecting means capable of detecting a relative position between the mold and the workpiece, pressure detecting means for detecting pressure of the pressing means, mold heating means for heating the mold, and cooling the mold Based on the information detected by the mold cooling means, the mold temperature detecting means for detecting the temperature of the mold, the position detecting means, the pressure detecting means and the mold temperature detecting means, the displacement means, the pressing means, Mold heating means and front Characterized by comprising control means for controlling the mold cooling means.

  Furthermore, another processing apparatus of the present invention is a processing apparatus that presses a mold having a predetermined pattern and a processing object, and transfers the pattern of the mold to the processing object. A displacement means capable of adjusting a relative position with respect to a processing object and a displacement speed for changing the position; and a pressing means capable of adjusting the pressing pressure while pressing the mold and the processing object; Position detecting means capable of detecting a relative position between the mold and the workpiece, pressure detecting means for detecting pressure of the pressing means, mold heating means for heating the mold, and cooling the mold Mold cooling means, mold temperature detecting means for detecting the temperature of the mold, processing object heating means for heating the processing object, processing object cooling means for cooling the processing object, and the processing object Workpiece temperature to detect the temperature of Based on information detected by the detection means, the position detection means, the pressure detection means, the mold temperature detection means, and the workpiece temperature detection means, the displacement means, the pressing means, the mold heating means, the mold And a control means for controlling the processing object heating means and the processing object cooling means.

  Furthermore, another processing apparatus of the present invention is a processing apparatus that presses a mold having a predetermined pattern and a processing object, and transfers the pattern of the mold to the processing object. While pressing the mold and the processing object, the displacement means capable of adjusting the relative position of the processing object with a displacement amount less than the size in the depth direction of the pattern formed on the mold, Pressing means capable of adjusting the pressing pressure.

  Furthermore, another processing apparatus of the present invention is a processing apparatus that presses a mold having a predetermined pattern and a processing object, and transfers the pattern of the mold to the processing object. While pressing the mold and the processing object, the displacement means capable of adjusting the relative position of the processing object with a displacement amount less than the size in the depth direction of the pattern formed on the mold, It comprises a pressing means capable of adjusting the pressing pressure, and a control means for controlling the displacement means and the pressing means.

  Furthermore, another processing apparatus of the present invention is a processing apparatus that presses a mold having a predetermined pattern and a processing object, and transfers the pattern of the mold to the processing object. While pressing the mold and the processing object, the displacement means capable of adjusting the relative position of the processing object with a displacement amount less than the size in the depth direction of the pattern formed on the mold, A pressing means capable of adjusting the pressing pressure; a position detecting means capable of detecting a relative position between the mold and the workpiece with a resolution equal to or less than a displacement amount adjustable by the displacement means; and the pressing means. And a control means for controlling the displacement means and the pressing means based on information detected by the position detection means and the pressure detection means.

  Furthermore, another processing apparatus of the present invention is a processing apparatus that presses a mold having a predetermined pattern and a processing object, and transfers the pattern of the mold to the processing object. While pressing the mold and the processing object, the displacement means capable of adjusting the relative position of the processing object with a displacement amount less than the size in the depth direction of the pattern formed on the mold, A pressing means capable of adjusting the pressing pressure; a position detecting means capable of detecting a relative position between the mold and the workpiece with a resolution equal to or less than a displacement amount adjustable by the displacement means; and the pressing means. Pressure detecting means for detecting the pressure of the mold, mold heating means for heating the mold, mold cooling means for cooling the mold, mold temperature detecting means for detecting the temperature of the mold, the position detecting means, and the pressure The detecting means and the mold temperature detecting means Based on the information, it said displacement means, said pressing means, the processing apparatus characterized by comprising a control means for controlling said type heating means and the mold cooling means.

  Furthermore, another processing apparatus of the present invention is a processing apparatus that presses a mold having a predetermined pattern and a processing object, and transfers the pattern of the mold to the processing object. While pressing the mold and the processing object, the displacement means capable of adjusting the relative position of the processing object with a displacement amount less than the size in the depth direction of the pattern formed on the mold, A pressing means capable of adjusting the pressing pressure; a position detecting means capable of detecting a relative position between the mold and the workpiece with a resolution equal to or less than a displacement amount adjustable by the displacement means; and the pressing means. Pressure detecting means for detecting the pressure of the mold, mold heating means for heating the mold, mold cooling means for cooling the mold, mold temperature detecting means for detecting the temperature of the mold, and heating the workpiece. The processing object heating means and the processing object A workpiece cooling means for rejecting, a workpiece temperature detecting means for detecting the temperature of the workpiece, the position detecting means, the pressure detecting means, the mold temperature detecting means and the workpiece temperature detecting means. Control means for controlling the displacement means, the pressing means, the mold heating means, the mold cooling means, the workpiece heating means, and the workpiece cooling means based on the detected information. Features.

  In this case, the displacement means is preferably formed so as to be capable of adjusting a relative position between the mold and the workpiece and a displacement speed for changing the position.

  The displacement means and the pressing means are provided in parallel to the direction in which the mold and the workpiece are pressed, and the pressing force of the displacement means and the pressing force of the pressing means are It is preferable to form it so as to overlap with the workpiece.

  Further, it is preferable that the displacement means is constituted by an electric motor and a ball screw, and the pressing means is constituted by a hydraulic cylinder.

It is a schematic front view which shows the processing apparatus of this invention.

  Embodiments of the present invention will be described below in detail with reference to the drawings.

  As shown in FIG. 1, the processing apparatus 1 of the present invention presses the mold 100 and the workpiece 200 to process the workpiece 200 into a predetermined shape, and holds the mold 100. Part 2, work object holding part 12 for holding work object 200, displacement means 5 capable of adjusting a relative position between mold 100 and work object 200 and a displacement speed for changing the position, mold The pressing means 6 that can press the pressure 100 and the workpiece 200 and can adjust the pressing pressure, the mold heating means 3 that can heat the mold 100, the mold cooling means 4 that can cool the mold 100, and the processing target The workpiece heating means 13 capable of heating the workpiece 200, the workpiece cooling means 14 capable of cooling the workpiece 200, the amount of displacement of the displacement means 5, or the mold 100 and the workpiece 200 Detect relative position of The pressure output from the position detection means 51 and the pressure means 6 or the pressure detection means 61 for detecting the pressure between the mold 100 and the workpiece 200; and the mold temperature for detecting the temperature of the mold 100. The detection information of the detection means 31, the processing object temperature detection means 131 for detecting the temperature of the processing object 200, the position detection means 51, the pressure detection means 61, the mold temperature detection means 31, and the processing object temperature detection means 131 is included. Based on this, the displacement means 5, the pressing means 6, the mold heating means 3, the mold cooling means 4, the workpiece heating means 13, and the control means 300 for controlling the workpiece cooling means 14 are mainly configured.

  The mold 100 may be anything as long as it can press the workpiece 200 and process the workpiece 200. For example, a pattern surface in which irregularities as a predetermined pattern are formed on the lower surface thereof. 100a. The irregularities can be formed by forming the mold 100 from a metal such as nickel, ceramics, a carbon material such as glassy carbon, silicon, or the like, and subjecting the pattern surface 100a to precision machining. In addition, after a predetermined pattern is formed on a silicon substrate or the like used as a master disk of the mold 100 by a semiconductor micromachining technique such as etching, the surface of the silicon substrate or the like is metal-plated by an electroforming method, for example, a nickel plating method. And the metal plating layer is peeled off to form the mold 100 having irregularities. Of course, as long as the mold 100 can form a fine pattern, the material and the manufacturing method thereof are not particularly limited. Although the width of the unevenness depends on the type of the workpiece 200 to be used, it is formed to be 100 μm or less, preferably 10 μm or less, more preferably 1 μm or less, further preferably 100 nm or less, more preferably 10 nm or less. Since the mold 100 is heated and cooled by the mold heating means 3 and the mold cooling means 4, it is preferable to make the mold 100 as thin as possible and to reduce its heat capacity as much as possible.

  Various objects can be used as the workpiece 200, for example, a resin such as polycarbonate and polyimide, a metal such as aluminum, a material such as glass, quartz glass, silicon, gallium arsenide, sapphire, and magnesium oxide. A molding material having a substrate shape as it is can be used. In addition, it is also possible to use a substrate body made of silicon, glass, or the like, on which a coating layer of a metal thin film such as resin, photoresist, or aluminum, gold, or silver for forming a wiring pattern is formed. Furthermore, the workpiece 200 may of course have a shape other than the substrate, such as a film.

  As shown in FIG. 1, the mold holding unit 2 is formed on a mold holding surface 2 a that holds the mold 100 so that the mold 100 can be fixed in surface contact with a fastener such as a screw or a clamp fitting. The structure of the mold holding unit 2 may be any structure as long as it holds the mold 100 on the mold holding surface 2a. For example, the structure that holds the mold 100 by electrostatic suction or vacuum suction on the mold holding surface 2a. It is also possible.

  Further, the mold holding unit 2 includes a mold heating unit 3 for heating the mold 100, for example, a heater. The operation of this heater is controlled by the controller so as to maintain the mold 100 at a predetermined constant temperature. As this heater, for example, a heat transfer heater or a ceramic heater can be suitably used.

  The mold holding unit 2 is provided with mold cooling means 4 for cooling the mold 100. As the mold cooling means 4, for example, a cooling channel capable of cooling the mold 100 by flowing a coolant or a cooling gas inside the mold holding unit 2 can be used.

  Further, the mold holding unit 2 is provided with a mold temperature detecting means 31 for detecting the temperature of the mold 100, for example, a thermocouple. The mold temperature detection means 31 is electrically connected to the control means 300 and is formed so as to transmit information regarding the detected temperature of the mold 100 to the control means 300.

  As illustrated in FIG. 1, the workpiece holding unit 12 holds the workpiece 200 in a substantially horizontal state, and includes a holding stage having a workpiece holding surface 12 a on the upper surface.

  In this holding stage, a large number of vacuum holes (not shown) are formed in the workpiece holding surface 12a, and a negative pressure is applied to the vacuum holes from a negative pressure source (not shown) to hold the workpiece. The workpiece 200 can be sucked and held on the surface 12a. The structure of the workpiece holding unit 12 may be anything as long as the workpiece 200 is held on the workpiece holding surface 12a. For example, the workpiece holding unit 12 may be held by a fastener such as a clamp fitting. Of course, it is also possible to adopt a structure that is fixed to the surface 12a or is held by suction by electrostatic attraction.

  Although not shown, a workpiece heating means 13 for heating the workpiece 200 held, for example, a heater is provided below the holding stage. The operation of the heater is controlled by the controller so as to maintain the workpiece 200 on the holding stage at a predetermined constant temperature. As this heater, for example, a heat transfer heater or a ceramic heater can be suitably used.

  Further, the processing object holding unit 12 may be provided with a processing object cooling means 14 for cooling the processing object 200. As the workpiece cooling means 14, for example, a cooling flow path that can cool the mold 100 by flowing a coolant or a cooling gas inside the workpiece holding unit 12 can be used.

  Further, the processing object holding unit 12 is provided with a processing object temperature detecting means 131 for detecting the temperature of the processing object 200, for example, a thermocouple. Further, the processing object temperature detecting means 131 is electrically connected to the control means 300 and is formed so as to transmit information regarding the detected temperature of the processing object 200 to the control means 300.

  The displacement means 5 is composed of, for example, a ball screw that is connected in the vertical direction and a motor that rotationally drives the ball screw. Moreover, the lower end part of the ball screw and the upper surface of the mold holding part 2 are connected via a bearing mechanism or the like. By configuring the displacing means 5 in this way, the mold holding portion 2 that holds the mold 100 is moved up and down to push the pattern surface 100a of the mold 100 into the workpiece 200 (displacement amount) and the pushing speed (displacement speed). Can be adjusted. Here, the case where the displacement means 5 is provided on the mold holding unit 2 side has been described, but it is of course possible to provide the displacement means 5 on the workpiece holding unit 12 side. The displacement means 5 is not limited to a ball screw and an electric motor as long as the relative displacement amount and displacement speed between the mold 100 and the workpiece 200 can be adjusted. An element, a magnetostrictive element, or the like can also be used.

  In addition, it is preferable that the displacement amount of the displacement means 5 is adjustable at least below the size of the pattern of the mold 100 in the depth direction (the displacement direction of the displacement means 5). Specifically, it can be adjusted to 100 μm or less, preferably 10 μm or less, more preferably 1 μm or less, further preferably 100 nm or less, more preferably 10 nm or less, and further preferably 1 nm or less. What can be done is preferred.

  Further, the displacement speed of the displacing means 5 is preferably a speed that does not give permanent distortion as much as possible to the pattern transferred to the workpiece. Specifically, it can be adjusted at 100 μm / second or less, preferably 10 μm / second or less, more preferably 1 μm / second or less, further preferably 100 nm / second or less, more preferably 10 nm / second or less, and still more preferably. Those that can be adjusted at 1 nm / second or less are preferred.

  As the position detection unit 51, for example, a linear scale provided in the mold holding unit 2 can be used. Thereby, the position of the mold 100 and the displacement speed of the mold 100 can be detected. Further, the position detection means 51 is electrically connected to the control means 300 and is formed to transmit information on the detected position and displacement speed of the mold 100. Various types of position detecting means 51 can be used. For example, the position of the processing object 200 is measured using a laser length measuring device provided on the mold holding unit 2 side, or the processing target is detected. What is necessary is just to measure the position of the type | mold 100 using the laser length measuring machine provided in the thing holding | maintenance part 12 side. Alternatively, an encoder provided in the motor may be used to measure the amount of displacement of the displacement means 5 by calculation. The resolution of the position detecting means 51 is preferably one that can be detected at least below the size of the pattern of the mold 100 in the depth direction (displacement direction of the displacement means 5) or below the amount of displacement adjustable by the displacement means 5. Specifically, it can be detected at 100 μm or less, preferably 10 μm or less, more preferably 1 μm or less, further preferably 100 nm or less, more preferably 10 nm or less, more preferably 1 nm or less. What can be done is preferred.

  The pressing means 6 can be, for example, a hydraulic cylinder that is provided on the mold 100 side, rotates a hydraulic pump with a motor, and outputs a large pressure based on Pascal's principle. The pressing means 6 is provided in parallel with the displacement means 5 in the direction in which the mold 100 and the workpiece 200 are pressed, and the pressing force (pressure) of the displacement means 5 and the pressing (pressure) of the pressing means 6 Is configured to be superimposed between the mold 100 and the workpiece 200. As a result, the pressing means 6 can assist the output of the displacing means 5 when molding with a large area mold 100 that requires a pressing force (pressure) greater than the output of the displacing means 5. Further, the pressure applied between the mold 100 and the workpiece 200 can be controlled and applied. The pressing means 6 may be anything as long as it can output a pressure between the mold 100 and the workpiece 200, and a means using fluid pressure such as pneumatic pressure can be applied.

  The pressure detection means 61 detects the pressure between the mold 100 and the workpiece 200. When a hydraulic cylinder is used as the pressing means 6, for example, a hydraulic gauge that detects the hydraulic pressure in the hydraulic cylinder is used. be able to. Moreover, the pressure detection means 61 is electrically connected to the control means 300, and is formed so as to transmit information regarding the detected pressure.

  The control means 300 is based on the detection information of the position detection means 51, the pressure detection means 61, the mold temperature detection means 31, and the workpiece temperature detection means 131, the displacement means, the pressing means 6, the mold heating means 3, and the mold cooling means. 4. Controls the workpiece heating means 13 and the workpiece cooling means 14, and for example, a computer can be used.

Next, an example of control by the control unit 300 will be described. The control means 300 controls the processing apparatus 1 in the following order from Step 1 to Step 6.
<Step 1>
Based on the temperature of the mold 100 detected by the mold temperature detection means 31, the mold heating means 3 is controlled so as to hold the mold 100 at, for example, the glass transition temperature of the workpiece. Further, based on the temperature of the processing object 200 detected by the processing object temperature detection means 131, the processing object heating means 13 is controlled so as to keep the processing object 200 below, for example, the glass transition temperature of the processing object. To do.
<Step 2>
Based on the pressure between the mold 100 and the workpiece 200 detected by the pressure detection means 61, the mold 100 is pressed against the workpiece 200 with a predetermined pressure (stress) that does not give permanent deformation to the workpiece 200. Next, the pressing means 6 is controlled. At this time, the heat of the mold 100 is transferred to the workpiece 200, and the temperature of the surface of the workpiece 200 is heated to the glass transition temperature or higher.
<Step 3>
Based on the relative position between the mold 100 and the workpiece 200 detected by the position detector 51, the displacement means 5 is pushed so as to push the mold 100 into the workpiece 200 at a predetermined displacement speed and a predetermined displacement amount. Control. As a result, the workpiece 200 can be sufficiently penetrated into the pattern of the mold 100 and reliable molding can be performed.
<Step 4>
After a predetermined time has passed with the displacement of the displacement means 5 maintained, the mold 100 is cooled so that the mold 100 reaches a predetermined temperature, for example, below the glass transition temperature, based on the temperature of the mold 100 detected by the mold temperature detection means 31. Control means 4.
<Step 5>
Based on the pressure between the mold 100 and the workpiece 200 detected by the pressure detecting means 61, the pressure between the mold 100 and the workpiece 200 is a predetermined value at which the mold 100 and the workpiece 200 do not release. The pressing means 6 is controlled so that the pressure is reduced.
<Step 6>
Based on the relative position between the mold 100 and the workpiece 200 detected by the position detector 51, the displacement means 5 is controlled so as to release the mold 100 from the workpiece 200 at a predetermined displacement speed. Thereby, it can prevent that the pattern transcribe | transferred to the workpiece 200 collapses when releasing.

  In the above description, it has been described that the displacement means 5 is controlled by adjusting the displacement means 5 at the time of molding. However, since the process that is particularly important when forming a fine pattern is mold release, the displacement means only at the time of mold release. 5 may be controlled.

  Moreover, although the said description demonstrated the case where the displacement means 5 and the press means 6 were arrange | positioned in parallel with respect to the direction which presses the type | mold 100 and the workpiece 200, it does not restrict to this but the type | mold 100 and a process target. It is also possible to arrange the object 200 in series with respect to the pressing direction. In this case, since the pressing force of the displacement means 5 cannot be assisted by the pressing means 6, the displacement amount and the displacement speed cannot be controlled by the displacement means 5 at the time of pressing. However, at the time of mold release, after the pressure between the mold 100 and the workpiece 200 is reduced to a predetermined value that does not cause the mold 100 and the workpiece 200 to be released, the displacement means 5 controls the displacement amount and the displacement speed. And can be molded. Further, the order of disposing the displacement means 5 and the pressing means 6 is arbitrary. Even if the disposing means 5, the pressing means 6, and the mold 100 are disposed in this order, the disposing means 5, the displacing means 5, and the mold 100 are disposed in this order. May be.

  In the above description, the case where the displacing means 5 and the pressing means 6 are disposed on the mold 100 side has been described. However, the present invention is not limited to this, and the displacing means 5 and the pressing means 6 are disposed on the workpiece 200 side. It is also possible to arrange. Of course, it is possible to dispose the displacement means 5 on the mold 100 side and the pressing means 6 on the workpiece 200 side, or to dispose the displacement means 5 on the workpiece 200 side and the pressing means 6 on the mold 100 side. .

  It is also possible to provide a vibration means that can apply ultrasonic vibration to the mold or the workpiece. According to this, while adjusting the pressure (pressing force), displacement amount, displacement speed, etc. between the mold and the workpiece during mold release, ultrasonic vibration is applied between the mold and the workpiece to separate it. The moldability can be improved.

  According to the first aspect of the present invention, the relative position between the mold and the workpiece and the displacement means capable of adjusting the displacement speed for changing the position, and the mold and the workpiece are pressed and pressed. Since the pressure means can adjust the pressure, the pressure applied by the displacement means to the mold and the workpiece can be assisted by the pressure means, and even when processing a large area, it can be accurately molded Can do. Moreover, the mold can be released at a speed that minimizes permanent distortion applied to the pattern transferred to the workpiece.

  According to the second aspect of the invention, since the control means for controlling the displacing means and the pressing means is provided, molding and mold release can be easily controlled.

  According to the invention described in claim 3, since it has the position detecting means capable of detecting the relative position between the mold and the workpiece and the pressure detecting means for detecting the pressure of the pressing means, it is accurately molded. Mold release can be controlled.

  According to invention of Claim 4, since it has a mold heating means for heating the mold, a mold cooling means for cooling the mold, and a mold temperature detecting means for detecting the temperature of the mold, the temperature of the mold and the molding, The workpiece can be reliably processed by controlling the timing of mold release.

  According to the invention described in claim 5, the processing object heating means for heating the processing object, the processing object cooling means for cooling the processing object, and the processing object temperature detection means for detecting the temperature of the processing object. Therefore, it is possible to perform molding and release more reliably by controlling the temperature of the mold.

  According to invention of Claim 6, the displacement means which can adjust the relative position of a type | mold and a workpiece with the displacement amount below the magnitude | size of the depth direction of the pattern formed in the type | mold, A type | mold, Since the pressing means can press the workpiece and adjust the pressing pressure, the pressure applied by the displacing means to the mold and the workpiece can be assisted by the pressing means. Even an object can be molded by accurately adjusting the amount of displacement.

  According to the seventh aspect of the invention, since the control means for controlling the displacing means and the pressing means is provided, molding and mold release can be easily controlled.

  According to the eighth aspect of the present invention, the position detecting means capable of detecting the relative position of the mold and the workpiece with a resolution equal to or less than the amount of displacement that can be adjusted by the displacement means, and the pressure for detecting the pressure of the pressing means. And detecting means, so that molding and mold release can be accurately controlled.

  According to the invention described in claim 9, since the mold heating means for heating the mold, the mold cooling means for cooling the mold, and the mold temperature detection means for detecting the temperature of the mold, The workpiece can be reliably processed by controlling the timing of mold release.

  According to the invention described in claim 10, the processing object heating means for heating the processing object, the processing object cooling means for cooling the processing object, and the processing object temperature detection means for detecting the temperature of the processing object. Therefore, it is possible to perform molding and release more reliably by controlling the temperature of the mold.

  According to the eleventh aspect of the present invention, the displacement means is formed so as to be able to adjust the relative position between the mold and the workpiece and the displacement speed for changing the position, so that the pattern transferred to the workpiece is transferred. The mold can be released at a speed that minimizes the permanent distortion applied to the.

  According to the invention of claim 12, the displacing means and the pressing means are provided in parallel to the direction of pressing the mold and the workpiece, and the pressing force of the displacing means and the pressing force of the pressing means are Since it is formed so as to be superimposed on the workpiece, the pressure applied by the displacing means to the mold and the workpiece can be assisted by the pressing means, even if the workpiece has a large area. It can be molded accurately.

  According to the thirteenth aspect of the present invention, since the displacement means is constituted by an electric motor and a ball screw, and the pressing means is constituted by a hydraulic cylinder, the pressure (pressing force) is assisted by the hydraulic cylinder. The displacement amount and the displacement speed can be accurately adjusted by the electric motor and the ball screw, and even a large-area workpiece can be accurately molded. Moreover, the mold can be released at a speed that minimizes permanent distortion applied to the pattern transferred to the workpiece.

Claims (13)

In a processing apparatus for pressing a mold having a predetermined pattern and an object to be processed and transferring the pattern of the mold to the object to be processed,
A displacement means capable of adjusting a relative position between the mold and the workpiece and a displacement speed for changing the position;
A pressing means capable of pressing the mold and the workpiece and adjusting the pressing pressure;
A processing apparatus comprising: In a processing apparatus for pressing a mold having a predetermined pattern and an object to be processed and transferring the pattern of the mold to the object to be processed,
A displacement means capable of adjusting a relative position between the mold and the workpiece and a displacement speed for changing the position;
A pressing means capable of pressing the mold and the workpiece and adjusting the pressing pressure;
Control means for controlling the displacement means and the pressing means;
A processing apparatus comprising: In a processing apparatus for pressing a mold having a predetermined pattern and an object to be processed and transferring the pattern of the mold to the object to be processed,
A displacement means capable of adjusting a relative position between the mold and the workpiece and a displacement speed for changing the position;
A pressing means capable of pressing the mold and the workpiece and adjusting the pressing pressure;
Position detecting means capable of detecting a relative position between the mold and the workpiece;
Pressure detecting means for detecting the pressure of the pressing means;
Control means for controlling the displacement means and the pressing means based on information detected by the position detection means and the pressure detection means;
A processing apparatus comprising: In a processing apparatus for pressing a mold having a predetermined pattern and an object to be processed and transferring the pattern of the mold to the object to be processed,
A displacement means capable of adjusting a relative position between the mold and the workpiece and a displacement speed for changing the position;
A pressing means capable of pressing the mold and the workpiece and adjusting the pressing pressure;
Position detecting means capable of detecting a relative position between the mold and the workpiece;
Pressure detecting means for detecting the pressure of the pressing means;
Mold heating means for heating the mold;
Mold cooling means for cooling the mold;
Mold temperature detecting means for detecting the temperature of the mold;
Control means for controlling the displacement means, the pressing means, the mold heating means and the mold cooling means based on the information detected by the position detection means, the pressure detection means and the mold temperature detection means;
A processing apparatus comprising: In a processing apparatus for pressing a mold having a predetermined pattern and an object to be processed and transferring the pattern of the mold to the object to be processed,
A displacement means capable of adjusting a relative position between the mold and the workpiece and a displacement speed for changing the position;
A pressing means capable of pressing the mold and the workpiece and adjusting the pressing pressure;
Position detecting means capable of detecting a relative position between the mold and the workpiece;
Pressure detecting means for detecting the pressure of the pressing means;
Mold heating means for heating the mold;
Mold cooling means for cooling the mold;
Mold temperature detecting means for detecting the temperature of the mold;
A processing object heating means for heating the processing object;
A workpiece cooling means for cooling the workpiece,
Processing object temperature detection means for detecting the temperature of the processing object;
Based on the information detected by the position detection means, the pressure detection means, the mold temperature detection means, and the workpiece temperature detection means, the displacement means, the pressing means, the mold heating means, the mold cooling means, Control means for controlling the workpiece heating means and the workpiece cooling means;
A processing apparatus comprising: In a processing apparatus for pressing a mold having a predetermined pattern and an object to be processed and transferring the pattern of the mold to the object to be processed,
A displacement means capable of adjusting a relative position between the mold and the object to be processed by a displacement amount equal to or less than a size in a depth direction of a pattern formed on the mold;
A pressing means capable of pressing the mold and the workpiece and adjusting the pressing pressure;
A processing apparatus comprising: In a processing apparatus for pressing a mold having a predetermined pattern and an object to be processed and transferring the pattern of the mold to the object to be processed,
A displacement means capable of adjusting a relative position between the mold and the object to be processed by a displacement amount equal to or less than a size in a depth direction of a pattern formed on the mold;
A pressing means capable of pressing the mold and the workpiece and adjusting the pressing pressure;
Control means for controlling the displacement means and the pressing means;
A processing apparatus comprising: In a processing apparatus for pressing a mold having a predetermined pattern and an object to be processed and transferring the pattern of the mold to the object to be processed,
A displacement means capable of adjusting a relative position between the mold and the object to be processed by a displacement amount equal to or less than a size in a depth direction of a pattern formed on the mold;
A pressing means capable of pressing the mold and the workpiece and adjusting the pressing pressure;
Position detecting means capable of detecting a relative position between the mold and the workpiece with a resolution equal to or less than a displacement amount adjustable by the displacement means;
Pressure detecting means for detecting the pressure of the pressing means;
Control means for controlling the displacement means and the pressing means based on information detected by the position detection means and the pressure detection means;
A processing apparatus comprising: In a processing apparatus for pressing a mold having a predetermined pattern and an object to be processed and transferring the pattern of the mold to the object to be processed,
A displacement means capable of adjusting a relative position between the mold and the object to be processed by a displacement amount equal to or less than a size in a depth direction of a pattern formed on the mold;
A pressing means capable of pressing the mold and the workpiece and adjusting the pressing pressure;
Position detecting means capable of detecting a relative position between the mold and the workpiece with a resolution equal to or less than a displacement amount adjustable by the displacement means;
Pressure detecting means for detecting the pressure of the pressing means;
Mold heating means for heating the mold;
Mold cooling means for cooling the mold;
Mold temperature detecting means for detecting the temperature of the mold;
Control means for controlling the displacement means, the pressing means, the mold heating means and the mold cooling means based on the information detected by the position detection means, the pressure detection means and the mold temperature detection means;
A processing apparatus comprising: In a processing apparatus for pressing a mold having a predetermined pattern and an object to be processed and transferring the pattern of the mold to the object to be processed,
A displacement means capable of adjusting a relative position between the mold and the object to be processed by a displacement amount equal to or less than a size in a depth direction of a pattern formed on the mold;
A pressing means capable of pressing the mold and the workpiece and adjusting the pressing pressure;
Position detecting means capable of detecting a relative position between the mold and the workpiece with a resolution equal to or less than a displacement amount adjustable by the displacement means;
Pressure detecting means for detecting the pressure of the pressing means;
Mold heating means for heating the mold;
Mold cooling means for cooling the mold;
Mold temperature detecting means for detecting the temperature of the mold;
A processing object heating means for heating the processing object;
A workpiece cooling means for cooling the workpiece,
Processing object temperature detection means for detecting the temperature of the processing object;
Based on the information detected by the position detection means, the pressure detection means, the mold temperature detection means, and the workpiece temperature detection means, the displacement means, the pressing means, the mold heating means, the mold cooling means, Control means for controlling the workpiece heating means and the workpiece cooling means;
A processing apparatus comprising: 11. The machining according to claim 6, wherein the displacement means is formed so as to be capable of adjusting a relative position between the mold and the workpiece and a displacement speed for changing the position. apparatus. The displacement means and the pressing means are provided in parallel to the direction in which the mold and the workpiece are pressed, and the pressing force of the displacement means and the pressing force of the pressing means are the mold and the processing object. The processing apparatus according to claim 1, wherein the processing apparatus is formed so as to overlap with an object. The processing apparatus according to any one of claims 1 to 12, wherein the displacing unit includes an electric motor and a ball screw, and the pressing unit includes a hydraulic cylinder.

Images